Abstract: Flexible devices including conductive traces with enhanced stretchability, and methods of making and using the same are provided. The circuit die is disposed on a flexible substrate. Electrically conductive traces are formed in channels on the flexible substrate to electrically contact with contact pads of the circuit die. A first polymer liquid flows in the channels to cover a free surface of the traces. The circuit die can also be surrounded by a curing product of a second polymer liquid.

Abstract: An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

Abstract: An optical module includes: an optical sub-assembly; and a flexible substrate including an insulating film, an interconnection pattern, and a spacer layer, the flexible substrate being connected to the optical sub-assembly. The insulating film has some projections, the projections protruding from a basic area in a first direction, the projections being arranged in a second direction perpendicular to the first direction, the insulating film having a flat shape with a recess between an adjacent pair of the projections. The interconnection pattern includes some pads in the basic area on a first surface of the insulating film, the pads being arranged in the second direction. The pads include some first pads adjacent to the respective projections, the pads including at least one second pad adjacent to the recess. The spacer layer is on the first surface and at each of the protrusions.

Abstract: A stretchable substrate according to an embodiment of the present invention comprises a first modulus region which has a first modulus, a second modulus region which is located in a plane direction with respect to the first modulus region and has a second modulus higher than the first modulus, and a third modulus region which is located between the first modulus region and the second modulus region and has an interface modulus which gradually changes between the first modulus and the second modulus, wherein the interface modulus of the third modulus region may be constant in the thickness direction thereof.

Abstract: One embodiment of a camera module may comprise: a lens barrel provided with at least one lens; a holder to which the lens barrel is coupled; a printed circuit board coupled on the bottom of the holder to face the lens; an adhering portion coupling the holder and the printed circuit board; an opening portion opening a portion of a first space formed through the coupling of the printed circuit board and the holder; and a housing coupled with the holder, wherein a second space separated from the first space may be formed through the coupling of the holder and the housing, and the opening portion may communicate the first space with the second space.

Abstract: A multilayer board includes a flexible substrate including insulating layers stacked and a pair of through-holes penetrating the insulating layers, and an interlayer connecting conductor in an opposing region in which the pair of through-holes opposes each other in a plan view of the insulating layers viewed from a stacking direction. A cross section of the flexible substrate taken in a lateral direction passing through the pair of through-holes and the interlayer connecting conductor and the stacking direction has a U or S shape. In the cross section, a curvature radius of an inner region located between the pair of through-holes is larger than a curvature radius of an outer region adjacent to the pair of through-holes on an outer side thereof.

Abstract: A flexible substrate includes a base substrate layer; and two patter layers laminated together on the front- and back-sides of the flexible substrate, on which electric circuit lines are printed each. In order to reduce a stress generated in the flexible substrate when it is folded and soldered to an optical communication semiconductor package, the flexible substrate has a thickness-wise concavely deformed portion in a lengthwise middle portion thereof. Also to reduce the stress, the flexible substrate having the deformed portion further has end sections and a middle section formed in its longitudinal direction, and the widths of the end sections are larger than that of the middle section, and the flexible substrate having the deformed portion further has holes and holes respectively formed near the side edges of a lengthwise middle section thereof.

Abstract: Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

Abstract: An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.

Abstract: A method for producing a wiring circuit board includes a first step of preparing a wiring circuit board assembly sheet including a support sheet, a plurality of wiring circuit boards supported by the support sheet, and a joint connecting the support sheet to the plurality of wiring circuit boards, having flat-shaped one surface and the other surface facing one surface at spaced intervals thereto in a thickness direction, and having a thin portion in which the other surface is recessed toward one surface and a second step of forming a burr portion protruding toward the other side in the thickness direction and cutting the thin portion.

Abstract: The present description relates to flexible hinges and hinged devices. One example device includes a first portion and a second portion. The example also includes a relieved flexible hinge rotatably securing the first and second portions.

Abstract: A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

Abstract: A PCB assembly includes a second PCB disposed adjacent to a first PCB and have a second hole facing a first hole, an upper plate disposed at an upper of the first and second hole and have a third hole disposed at the upper of the first hole and a fourth hole disposed at the upper of the second hole, a holder disposed at a lower of the first and second hole and have a lower plate having a fifth hole disposed at the lower of the first hole and a sixth hole disposed at the lower of the second hole, a first fixing screw penetrating through the third first, and fifth hole, and a second fixing screw penetrating through the fourth, second and sixth hole, and the lower plate includes a protrusion penetrating through the second PCB coupling the first PCB and the second PCB.

Abstract: A FPC board and a method for manufacturing the same and an OLED display device are provided. The FPC board includes a substrate, a first wire layer disposed on one side of the substrate, a circuit board terminal disposed at an edge on one side of the substrate and connected to the first wire layer, and a first protective layer covering the first wire layer. The thickness of the circuit board terminal is larger than the sum of the thicknesses of the first wire layer and the first protective layer. When the FPC board is connected to the OLED panel, one side of the base substrate on which the panel terminal is provided is opposite to one side of the substrate on which the circuit board terminal is provided, such that the base substrate overlaps with the substrate to connect the circuit board terminal and the panel terminal.

Abstract: A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively.

Abstract: A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

Abstract: A flexible printed circuit and a manufacture method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a transfer sub-circuit board. The main sub-circuit board includes a first transfer terminal, a first wiring portion and a second wiring portion; and the transfer sub-circuit board includes a second transfer terminal and a third wiring portion, and the third wiring portion electrically connects a first group of second contact pads with a second group of second contact pads of the second transfer terminal. The transfer sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the first group of second contact pads to the first group of first contact pads and electrically connecting the second group of second contact pads to the second group of first contact pads.

Abstract: Methods are provided for manufacturing flat devices to be used for forming a shape-retaining non-flat device by deformation of the flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.

Abstract: LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.

Abstract: A device that includes a flexible printed circuit board (PCB), a package coupled to the flexible PCB, a first antenna device coupled to the flexible PCB, and a second antenna device coupled to the flexible PCB. The first antenna device is configured to transmit and receive a first signal having a first frequency. The second antenna device is configured to transmit and receive a second signal having a second frequency. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to the second surface of the flexible PCB. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to a first surface of the flexible PCB.

Abstract: A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.

Abstract: A display device includes: a bending region including a bending peripheral opening passing through the first interlayer insulating film and the first gate insulating film and a bending opening in the bending peripheral opening and passing through the second interlayer insulating film and the buffer layer to expose the substrate, a first sidewall of the bending peripheral opening includes a side surface of the first interlayer insulating film and a side surface of the first gate insulating film, the second interlayer insulating film covers the first sidewall of the bending peripheral opening, the bending opening includes a second sidewall including a side surface of the buffer layer and a portion of a side surface of the second interlayer insulating film arranged with the side surface of the buffer layer, and the first via layer fills the bending opening.

Abstract: The instant disclosure includes an implanting apparatus and a method thereof. The implanting apparatus has a chuck configured to carry a substrate is rotated a number of times at an angle during ion implantation. In this way, masks used during semiconductor fabrication is reduced.

Abstract: A display unit includes: a display section (11) having flexibility; and a bending control section (12a, 12b) configured to limit a movable shaft in bending the display section (11) to one direction in a display surface and allowed to maintain the display section (11) in an arbitrary bending state.

Abstract: A power delivery device includes a printed circuit board (PCB), a package device, and a chip connecting device. The PCB is configured to receive a first reference voltage and a second reference voltage. The package device is coupled to the PCB, and includes a bump array. The chip connecting device is coupled to the bump array of the package device, and configured to output a first supply voltage and a second supply voltage. The bump array includes first bumps and second bumps. The first bumps are configured to transmit the first reference voltage. The second bumps are configured to transmit the second reference voltage. The first bumps and the second bumps are disposed in parallel.

Abstract: The present invention relates to a polyamideimide copolymer and a colorless and transparent polyamideimide copolymer film. The polyamideimide copolymer according to the present invention enables to provide a polyamideimide film having improved UV shielding function while exhibiting excellent scratch resistance and mechanical properties.

Abstract: Disclosed herein are a polyamide-imide film which is transparent and exhibits superior mechanical properties such as surface hardness, etc. and a method of preparing the same. The polyamide-imide film a copolymer of an aromatic diamine, an aromatic dianhydride, and an aromatic dicarbonyl compound, wherein the aromatic diamine and the aromatic dianhydride forms an imide unit; the aromatic diamine and the aromatic dicarbonyl compound forms an amide unit; and the amide unit accounts for 50-70 mol % of 100 mol % of the units of the copolymer, thereby exhibiting transparency and superior mechanical properties including surface hardness.

Abstract: Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.

Abstract: A component carrier with a rigid portion, a flexible portion, a cavity defining the flexible portion next to the rigid portion, and at least one step in a transition portion between the rigid portion and the flexible portion in the cavity is disclosed.

Abstract: A touch panel includes a substrate having an operation face, a sensor part provided at a sensor face of the substrate, and a wire led out from the sensor part to the sensor face to be connected to an external connection part. The sensor part and the wire are covered by an insulation layer. A cutout is provided to the insulation layer to expose a part of the wire to which the external connection part is connected. An insulation part is provided to cover the external connection part, the insulation layer and the wire located at the cutout. The touch panel can reliably prevent static electricity generated at the operation face during panel operation from entering the sensor part via the wire and the external connection part and causing electrostatic destruction of a bridge and such of the sensor part.

Abstract: The present disclosure provides an electrical connector comprising an electrical connector body, a conductive adhesive layer, and a connecting cable. The electrical connector body comprises a plurality of electrical connecting conductors. The conductive adhesive layer covers the plurality of electrical connecting conductors. The connecting cable comprises a plurality of cables. One end of each of the cables comprises a conductive pin. The conductive pin of each of the cables is disposed on the conductive adhesive layer. The conductive pin of each of the cables forms an electrical connection path with the corresponding electrical connecting conductor. The plurality of electrical connection paths is individually separated.

Abstract: A cable includes an insulating part and one or more conducting parts disposed inside the insulating part. The insulating part includes a polymer resin layer with a product of shrinkage ratios CMD*TD, which is expressed as a product of a longitudinal shrinkage ratio and a transverse shrinkage ratio, of less than 0.24.

Abstract: Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Abstract: A display device includes: a display module including a display area and a non-display area; a protective layer on a lower surface of the display module and including an opening area overlapping with the display area; a sensor unit overlapping with the display area, covering the opening area, and arranged on the protective layer; and an adhesive member adhering the sensor unit and the protective layer.

Abstract: A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.

Abstract: A method for manufacturing a multilayer printed wiring board includes: preparing a first wiring board that includes a circuit region formed with one or more signal lines on a main surface of a first insulating substrate; preparing a second wiring board that includes an electrically conductive layer on a main surface of a second insulating substrate; disposing a spacer at a position spaced apart from an outer edge of the circuit region by a predetermined distance along at least a part of the outer edge; disposing an adhesive layer on the circuit region so that a space is provided between the adhesive layer and the spacer; and laminating the first wiring board and the second wiring board for thermocompression bonding.

Abstract: A light emitting device includes: a substrate including: a flexible base member, a first wiring pattern located on the upper surface of the base member, the first wiring pattern including: a first component-side conductive portion, and a second component-side conductive portion, and a plurality of reinforcing lands located on the upper surface of the base member, the plurality of reinforcing lands including: a first reinforcing land, and a second reinforcing land; and a plurality of light emitting elements mounted on the substrate, each light emitting element being electrically connected to the first component-side conductive portion and the second component-side conductive portion.

Abstract: A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.

Abstract: A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.

Abstract: According to certain embodiments, an electronic device comprises a first electrical structure disposed in an internal space of the electronic device; and a flexible printed circuit board (FPCB) comprising a first fastening area and an extension area extended from the first fastening area, the first fastening area electrically connected to the first electrical structure, wherein the FPCB further comprises: a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the first electrical structure; a first conductive layer disposed on the first surface of the dielectric substrate; and a first protective layer stacked on the first conductive layer, in the extension area and terminating in the first fastening area; wherein the first fastening area comprises a screw through hole for screw fastening, and at least one conductive via disposed at a periphery of the screw through hole extending from the dielectric substrate to the first co

Abstract: A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.

Abstract: A flexible printed circuit board including: a base film; an electrode pad disposed on one side of the base film; a circuit pattern connected with the electrode pad; a coverlay that overlaps at least a part of the circuit pattern; and a cover resin that overlaps the circuit pattern and at least a part of the coverlay. The coverlay includes a body portion and a protrusion protruded from the body portion.

Abstract: The present disclosure relates to a printed circuit board including a first insulating layer; and a plurality of connection pads disposed on one surface of the first insulating layer, wherein the first insulating layer has a groove portion penetrating a portion of the first insulating layer in respective regions between the plurality of connection pads, and a display module including the same.

Abstract: A polyamideimide resin having isocyanate groups at the terminals, wherein at least a portion of the isocyanate groups are blocked with an ether group-containing cyclic amine.

Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

Abstract: An intelligent wearable device includes a housing (1) and a display unit (2) mounted on the housing (1). The display unit (2) includes a first display screen (21) and a second display screen (22). The first display screen (21) is a flexible display screen, and the first display screen (21) includes a first display area (211), a bendable area (212) and a second display area (213) which are sequentially connected, wherein the first display area (211) and the second display area (213) are foldably connected to each other by means of the bendable area (212), and a back face of the first display area (211) is connected to the housing (1). The second display screen (22) is an electronic ink screen, and a back face of the second display screen (22) is connected to a back face of the second display area (213) in a laminated manner.

Abstract: Provided is an FPC, including a first row of gold fingers and a second row of gold fingers disposed on a same layer, and multiple first connection lines. The first row of gold fingers includes multiple first gold fingers extending in a first direction and arranged in a second direction. The second row of gold fingers includes multiple second gold fingers extending in the first direction and arranged in the second direction. The multiple first connection lines are disposed in a different layer from the second row of gold fingers, electrically connected to the multiple first gold fingers, and insulated from the multiple second gold fingers and extend to an area where the second row of gold fingers is located. The first connection line includes a first wire and a second wire. The first wire includes a first portion, a second portion and a third portion connected in sequence.

Abstract: In various embodiments, laser apparatuses include thermal bonding layers between various components and creep-mitigation systems for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.