Material Patents (Class 174/388)
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Publication number: 20140090884Abstract: An elastic conductive material includes a matrix and a conductor dispersed in the matrix. The matrix is formed by crosslinking a first polymer that is one or more selected from polymers of General Formulae (1) to (4) below and has a function of dispersing the conductor, and a second polymer crosslinkable with the first polymer. [In Formulae (1) to (4), X is a substituent crosslinkable with the second polymer; Y is a functional group having an affinity for the conductor; constitutional units A, B, and C each are one kind selected from acrylic acid, methacrylic acid, salts of acrylic acid and methacrylic acid, esters, polybutadiene, polyisoprene, urethane prepolymer, polyether, polyetheramine, polyamine, polyol, and polythiol; and l, m, and n each are an integer equal to or greater than one.Type: ApplicationFiled: December 3, 2013Publication date: April 3, 2014Applicant: TOKAI RUBBER INDUSTRIES, LTD.Inventors: Jun KOBAYASHI, Yutaro TAGUCHI, Hitoshi YOSHIKAWA
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Patent number: 8598690Abstract: A semiconductor device is made by mounting a plurality of semiconductor die to a substrate, depositing an encapsulant over the substrate and semiconductor die, forming a shielding layer over the semiconductor die, creating a channel in a peripheral region around the semiconductor die through the shielding layer, encapsulant and substrate at least to a ground plane within the substrate, depositing a conductive material in the channel, and removing a portion of the conductive material in the channel to create conductive vias in the channel which provide electrical connection between the shielding layer and ground plane. An interconnect structure is formed on the substrate and are electrically connected to the ground plane. Solder bumps are formed on a backside of the substrate opposite the semiconductor die. The shielding layer is connected to a ground point through the conductive via, ground plane, interconnect structure, and solder bumps of the substrate.Type: GrantFiled: January 27, 2012Date of Patent: December 3, 2013Assignee: STATS ChipPAC, Ltd.Inventors: Harry Chandra, Flynn Carson
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Patent number: 8598470Abstract: An electromagnetic-wave-absorbing film comprising a plastic film, and a single- or multi-layer, thin metal film formed on at least one surface of the plastic film, the thin metal film being provided with large numbers of substantially parallel, intermittent, linear scratches with irregular widths and intervals.Type: GrantFiled: June 26, 2009Date of Patent: December 3, 2013Inventor: Seiji Kagawa
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Publication number: 20130308284Abstract: An electronic device includes a chassis and a printed circuit board secured to the chassis. The printed circuit board includes a base plate, a bottom layer located above the base plate, and a ground plane located above the bottom layer. The bottom layer is located between the base plate and the ground plane; a plurality of copper pins are electrically connected to the base plate and the ground plane through the bottom layer; and the plurality of copper pins, the base plate, and the ground plane cooperatively define a faraday cage and shield the bottom layer from electromagnetic interference.Type: ApplicationFiled: January 12, 2013Publication date: November 21, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventor: GUANG-FENG OU
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Publication number: 20130284511Abstract: A near-field noise suppression sheet comprising a pair of plastic films each having a thin metal film on one surface, the plastic films being adhered by a conductive adhesive with the thin metal films inside, each thin metal film being made of a magnetic metal, and having a controlled thickness such that a pair of the adhered thin metal films have surface resistance of 20-150 ?/square.Type: ApplicationFiled: November 14, 2011Publication date: October 31, 2013Inventor: Seiji Kagawa
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Publication number: 20130248218Abstract: Compositions, devices, and methods for providing shielding communications cables are provided. In some embodiments, compositions including electrically conductive elements are disclosed. In other embodiments, cable separators, tapes, and nonwoven materials including various electrically conductive elements are disclosed.Type: ApplicationFiled: March 12, 2013Publication date: September 26, 2013Inventors: Charles A. Glew, David Braun
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Publication number: 20130248241Abstract: In accordance with the present invention, there is provided an electromagnetic shielding composition. The electromagnetic shielding composition in accordance with the broad aspects of the present invention includes from about 40% to 60% by volume of a sheet molding composition filled with an effective amount of carbon fibers for shielding of electromagnetic radiation from the electrical systems in an at least partially electrically driven vehicle.Type: ApplicationFiled: March 26, 2013Publication date: September 26, 2013Applicant: Magna International Inc.Inventor: William Joseph John Harney
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Publication number: 20130248240Abstract: Compositions, devices, and methods for providing shielding communications cables are provided. In some embodiments, compositions including electrically conductive elements are disclosed. In other embodiments, cable separators, tapes, and nonwoven materials including various electrically conductive elements are disclosed.Type: ApplicationFiled: March 12, 2013Publication date: September 26, 2013Inventors: Charles A. Glew, David Braun
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Patent number: 8520406Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect. An electromagnetic interference shielded apparatus and a method for shielding an electrical circuit from electromagnetic interference is provided.Type: GrantFiled: December 10, 2012Date of Patent: August 27, 2013Assignee: Florida State University Research Foundation, Inc.Inventors: Zhiyong Liang, Ben Wang, Chun Zhang, Jin Gyu Park
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Publication number: 20130199835Abstract: A receptacle assembly includes a hollow conductive cage with a front end and an opening to an interior portion of the cage. The opening is configured to receive a module assembly therein. The cage has a bottom with a bottom opening communicating with the interior portion, and the bottom is configured to be joined to a circuit board. A layered EMI shield member is provided between the bottom of the cage and the circuit board and the shield member extends completely around the bottom opening of the cage. The EMI shield member is formed as a flexible, low-cost assembly that utilizes a pair or insulative layers that flank a conductive layer.Type: ApplicationFiled: May 19, 2011Publication date: August 8, 2013Applicant: MOLEX INCORPORATEDInventors: Kenneth F. Janota, Eran J. Jones, Marlon C. Daniels, Michael Alan Johnston
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Patent number: 8461667Abstract: A semiconductor device includes a semiconductor chip, and a guard ring made of an electrically conductive material and arranged between electrodes on the semiconductor chip and side edges of the semiconductor chip, the guard ring being divided by isolating sections on the semiconductor chip.Type: GrantFiled: January 21, 2010Date of Patent: June 11, 2013Assignee: Sumitomo Electric Device Innovations, Inc.Inventors: Takeshi Hishida, Tsutomu Igarashi
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Publication number: 20130133942Abstract: Disclosed herein are example embodiments of electromagnetic interference (EMI) shields and method of making EMI shields. In an exemplary embodiment, a method generally includes coating at least part of a core member with metallic material, and coating at least part of the metallic material with a polymer to thereby inhibit separation of the metallic material from the core member. An example EMI shield generally includes a core member, a metallic coating covering at least part of the core member, and a polymeric coating covering at least part of the metallic coating to inhibit separation of the metallic coating from the core member.Type: ApplicationFiled: January 25, 2013Publication date: May 30, 2013Applicant: Laird Technologies, Inc.Inventors: Shalini Kandoor, Bambore Lokeshwarappa Santhosh Kumar, Sreejith Valiavalappil, Bukkinakere Kapanipathaiya Chandrasekhar
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Publication number: 20130133941Abstract: Disclosed herein are various exemplary embodiments of electromagnetic interference (EMI) shielding heat shrinkable materials and articles (e.g., tapes, etc.). In an exemplary embodiment, an EMI shielding heat shrinkable tape includes a heat shrinkable layer and an EMI shielding layer. When heated to a shrink temperature of the heat shrinkable layer, the tape may shrink lengthwise.Type: ApplicationFiled: January 22, 2013Publication date: May 30, 2013Applicant: Laird Technologies, Inc.Inventors: Kelly G. Cook, Larry D. Creasy, JR.
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Patent number: 8436258Abstract: An electromagnetic shielding article includes a plastic substrate; a nickel vanadium layer deposited on the plastic substrate; an electromagnetic shielding layer deposited on the plastic substrate; and a protection layer deposited on the electromagnetic shielding layer. A method for manufacturing the electromagnetic shielding article comprising steps of: providing a plastic substrate; depositing a nickel vanadium layer on the plastic substrate by radio-frequency induction plasma spraying process; depositing an electromagnetic shielding layer on the nickel vanadium layer; and depositing a protection layer on the electromagnetic shielding layer.Type: GrantFiled: February 23, 2011Date of Patent: May 7, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Chuang Ma
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Patent number: 8436257Abstract: An electromagnetic shielding article includes a plastic substrate, a silicon dioxide layer deposited on the plastic substrate, an electromagnetic shielding layer deposited on the plastic substrate, and a protection layer deposited on the electromagnetic shielding layer.Type: GrantFiled: February 23, 2011Date of Patent: May 7, 2013Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Chuang Ma
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Publication number: 20130105215Abstract: An electromagnetic shielded sleeve containing a multilayer composite material formed in such a way as to define at least one longitudinal channel configured to enclose and carry a cable. The multilayer composite material contains a first textile, an electromagnetic shielding material, and a second textile, where the electromagnetic shielding material is located between the first textile and the second textile.Type: ApplicationFiled: October 28, 2011Publication date: May 2, 2013Inventors: David Drew Morris, Cheryl J. Brickey
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Publication number: 20130081871Abstract: A conductive plastic article (31) is disclosed suited for a housing that offers improved shielding against electro-magnetic interference or that offers improved electrostatic discharge properties. The plastic article is made by means of low pressure injection moulding. The article (31) comprises at least 0.25 volume per cent of electrically conductive additives (38). The article (31) comprises a cellular structure. The cellular structure is created by the use of a blowing or foaming agent. At least 0.25 weight percent of blowing or foaming agent is used in the production of the conductive plastic article (31).Type: ApplicationFiled: May 26, 2011Publication date: April 4, 2013Inventors: Rik Dewitte, Wim Verbrugge
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Publication number: 20130068521Abstract: The present application relates to a method for shielding electromagnetic waves by using graphene inside or outside an electromagnetic wave generating source and/or by using graphene formed on a substrate, and an electromagnetic shielding material including the graphene.Type: ApplicationFiled: March 4, 2011Publication date: March 21, 2013Applicant: SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATIONInventors: Byung Hee Hong, Jea-Boong Choi, Young Jin Kim, Hyeongkeun Kim, Sukang Bae, Junmo Kang
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Publication number: 20130056258Abstract: The invention provides an electromagnetic shielding adhesive tape, comprising: a resin film layer; and an electromagnetic interference shielding layer with a sandwiched structure, which is laminated with the resin film layer and comprises: a first adhesive layer bonded to one side of the resin film layer; a second adhesive layer; and a conductive metal layer provided between the first adhesive layer and the second adhesive layer.Type: ApplicationFiled: May 10, 2011Publication date: March 7, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Wen Jie Zhang, Rong Wu
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Publication number: 20130056257Abstract: A radiation-proof laminate for electronic devices has: a substrate layer consisting of an electrically conductive material, and a first radiation barrier layer formed on the substrate layer, wherein the first radiation barrier layer comprises 50 wt % to 70 wt % of rubber-based heat-bonding adhesive compound in the form of powder or liquid, 5 wt % to 20 wt % of aluminum powder, 5 wt % to 20 wt % of copper powder, and 5 wt % to 20 wt % of silver powder; wherein the aluminum, copper, and silver powder are mediated by the rubber-based heat-bonding adhesive compound to disperse and form a mesh-like distribution. The radiation-proof laminate can absorb electromagnetic radiation from the electronic device and redirect RF radiation while maintaining the RF signal strength not to be substantially affected or attenuated by the radiation-proof laminate, to maintain the network connection performance of the electronic device.Type: ApplicationFiled: August 21, 2012Publication date: March 7, 2013Applicant: TREND POWER LIMITEDInventor: Kok Tshun CHUA
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Publication number: 20130048370Abstract: An article for providing protection from electromagnetic energy, and an associated method for provision of such. The article includes conductive fibers extending within the article, varistor material dispersed and secured within the article, and ferrite material dispersed and secured within the article.Type: ApplicationFiled: August 26, 2011Publication date: February 28, 2013Applicant: BHA GROUPInventors: Daniel Qi Tan, Patricia Chapman Irwin, Wei Zhang
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Publication number: 20130027897Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.Type: ApplicationFiled: October 1, 2012Publication date: January 31, 2013Applicant: Apple Inc.Inventor: Apple Inc.
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Publication number: 20130014984Abstract: Provided is an electromagnetic wave absorber, including a base material and a porous carbon material containing, as a raw material, a plant-based material having a silicon content of 5% by mass or more, in which the porous carbon material has a specific surface area value as measured by the nitrogen BET method of 400 m2/g or more, a silicon content of 1% by mass or less, a pore volume as measured by the BJH method of 0.2 cm3/g or more, and a pore volume as measured by the MP method of 0.2 cm3/g or more, or a total pore volume of pores each having a diameter in the range from 1×10?9 m to 5×10?7 m as measured by the Non Localized Density Functional Theory of 1.0 cm3/g or more.Type: ApplicationFiled: June 28, 2012Publication date: January 17, 2013Applicant: SONY CORPORATIONInventors: Hironori Iida, Shun Yamanoi, Machiko Minatoya, Seiichiro Tabata, Shinichiro Yamada, Masayoshi Kanno, Masakazu Mitsugi, Yoshihiro Kato
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Publication number: 20130000970Abstract: An electromagnetic shield includes a base layer, a wire mesh, and two ground wires. The wire mesh is embedded in the base layer, and includes a number of first wires and a number of second wires intersecting with the first wires to form a number of cells. The first and second wires are made of conductive material. The ground wires are respectively arranged on two opposite sides of the wire mesh and connected to the first and second wires.Type: ApplicationFiled: December 9, 2011Publication date: January 3, 2013Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: TEN-CHEN HO
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Publication number: 20120320558Abstract: Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.Type: ApplicationFiled: June 4, 2012Publication date: December 20, 2012Inventors: James H. Foster, James W. Bilanski, Amir Salehi, Ramamurthy Chandhrasekhar, Nicholas Unger Webb
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Publication number: 20120287588Abstract: An RF interference suppressor for satellite receivers and more specifically those that employ the MOCA standard is provided. The RF interference suppressor shields the connection point of the center conductor of the F-connector to the PC board from spurious signals emanating from the high speed digital portions of the receiver. In addition, the RF interference suppressor shield includes a tab portion that encompasses the threaded portion of the F-connector and operates to shield the path for RF interference resulting from the gap between the F-connector body and the inner shield wall of the receiver.Type: ApplicationFiled: January 20, 2011Publication date: November 15, 2012Inventors: Max Ward Muterspaugh, William John Testin, Darin Bradley Ritter, Mickey Jay Hunt
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Publication number: 20120261182Abstract: A polymeric composition including a blend of poly(vinylidine fluoride) (PVDF), poly(methyl methacrylate) (PMMA), carbon nanofibers, and poly(tetrafluoroethylene) (PTFE) particles is described and claimed. The polymeric composition may be coated onto a substrate and dried to form a film adhered to the substrate. The film optionally exhibits an electrical conductivity of about 10 Siemens per meter (S/m) to about 310 S/m and an electromagnetic interference shielding of about 32 decibels. Further, a coated substrate is provided including a substrate and a film adhered to the substrate, where the film includes a polymeric composition comprising a blend of PVDF, PMMA, carbon nanofibers, and PTFE particles.Type: ApplicationFiled: June 9, 2011Publication date: October 18, 2012Applicant: The Board of Trustees of the University of IllinoisInventors: Constantine M. Megaridis, Ilker S. Bayer, Manish K. Tiwari, Arindam Das
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Publication number: 20120181080Abstract: Electromagnetic interference (“EMI”) absorbing particulate filler for EMI shielding formed of particles of one of a ceramic or glass material which are encapsulated by the other one of the materials, and EMI shielding materials and assemblies formed thereof.Type: ApplicationFiled: June 24, 2008Publication date: July 19, 2012Inventor: William G. Lionetta
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Publication number: 20120118627Abstract: An electromagnetic shielding article includes a plastic substrate; an aluminum layer deposited on the plastic substrate; an electromagnetic shielding layer deposited on the aluminum layer; and a protection layer deposited on the electromagnetic shielding layer.Type: ApplicationFiled: February 23, 2011Publication date: May 17, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CHUANG MA
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Publication number: 20120111627Abstract: Disclosed is an electromagnetic shielding sheet that has a smaller increase in the thickness of a base after the formation of a metal coating film when compared with conventional electromagnetic shielding sheets, and which has excellent electromagnetic wave shielding properties despite a small amount of adhered metal. According to the present invention, the electromagnetic shielding sheet can endure metal working processes and has high electromagnetic wave shielding properties, resulting in a thin, very flexible fabric sheet. Specifically disclosed is an electromagnetic shielding sheet which is composed of a laminated non-woven fabric that has at least a first layer and a second layer, and which is characterized in that the first layer is a layer of thermoplastic synthetic fibers having a fiber diameter of 6 ?m to 50 ?m, the second layer is a layer of ultrafine fibers having a fiber diameter of 0.1 ?m to 5.0 ?m, and a metal is adhered to at least one surface of the sheet.Type: ApplicationFiled: July 22, 2010Publication date: May 10, 2012Inventors: Kazufumi Kato, Kazuaki Shikata, Rumina Obi, Ikuo Ueno
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Publication number: 20120090887Abstract: An electromagnetic shielding material 50 comprising a plurality of copper foil composites 10 connected together in a longitudinal direction L, the composite having a copper foil 2 and a resin film 4 which are laminated, wherein an overlapped part 50k of the copper foil composites is adhered with an epoxy based adhesive 6 comprising as main components an epoxy resin and one or more of flexibility providing resins selected from the group consisting of nitrile butadiene rubber, natural rubber, styrene butadiene rubber, butadiene rubber, ethylene propylene rubber, isoprene rubber, urethane rubber and acrylic rubber, and wherein the epoxy based adhesive disposed at the overlapped part of the copper foil composites has a length LA in the longitudinal direction of 1 to 6 mm.Type: ApplicationFiled: October 16, 2009Publication date: April 19, 2012Inventor: Kazuki Kanmuri
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Publication number: 20120080209Abstract: A shielding for a cable component that comprises a base material that is non-conductive and a plurality of conductive particles suspended in or disposed on an outer surface of the base material. The conductive particles are at least one of substantially the same size, the same shape, the same conductive material, different sizes, different shapes, and different conductive materials, such that selection of the conductive particles tunes the frequency bandwidth for effective shielding.Type: ApplicationFiled: September 27, 2011Publication date: April 5, 2012Applicant: GENERAL CABLE TECHNOLOGIES CORPORATIONInventors: Matthew S. MCLINN, Jared D. WEITZEL, David P. CAMP, II, Scott M. BROWN
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Publication number: 20120061135Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of EMI shielding, thermally-conductive interface assemblies. In various exemplary embodiments, an EMI shielding, thermally-conductive interface assembly includes a thermal interface material and a sheet of shielding material, such as an electrically-conductive fabric, mesh, foil, etc. The sheet of shielding material may be embedded within the thermal interface material and/or be sandwiched between first and second layers of thermal interface material.Type: ApplicationFiled: September 14, 2010Publication date: March 15, 2012Applicant: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Publication number: 20120061134Abstract: A storage system and devices are provided for containing items and shielding the items from electromagnetic radiation, in particular, RF radiation, and holding the items in a waterproof environment. The storage system includes a first storage component which is constructed from a fabric having shieldable properties and is configured to envelope contents held therein in a shielded environment, and a second storage component which is constructed to receive the first storage component therein and provide waterproof storage for the contents. The storage system protects contents from unauthorized or surreptitious reads of stored data that may be carried on the content items by readers. The storage components of the storage system may be used independently of each other or together, as needed or desired.Type: ApplicationFiled: July 13, 2011Publication date: March 15, 2012Inventor: Linda Kennedy
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Publication number: 20120020039Abstract: A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.Type: ApplicationFiled: June 17, 2011Publication date: January 26, 2012Applicant: STMICROELECTRONICS (GRENOBLE) SASInventors: Romain Coffy, Jean-François Sauty
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Publication number: 20120012382Abstract: According to various aspects, exemplary embodiments are provided of EMI shielding materials. In one exemplary embodiment, an EMI shielding material generally includes a conductive metal layer disposed on a thin carrier film. The EMI shielding material may be sufficiently compliant such that the conductive metal layer and thin carrier film are capable of conforming to an irregular surface when the EMI shielding material is applied to the irregular surface.Type: ApplicationFiled: September 23, 2011Publication date: January 19, 2012Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Douglas McBain, Richard F. Hill
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Patent number: 8017306Abstract: A conductive film producing method includes a metallic silver forming step of exposing and developing a photosensitive material having a 95-?m-thick long support and thereon a silver salt-containing emulsion layer, thereby forming a metallic silver portion to prepare a conductive film precursor, and a smoothing treatment step of subjecting the conductive film precursor to a smoothing treatment to produce a conductive film. In the smoothing treatment, the conductive film precursor is pressed by first and second calender rolls facing each other, and the first calender roll is a resin roll to be brought into contact with the support. The method satisfies the condition of 1/2?P1/P2?1, wherein P1 represents a conveying force applied when the conductive film precursor is introduced to an area where the smoothing treatment step is conducted, and P2 represents a conveying force applied when the smoothing-treated conductive film is discharged from the area.Type: GrantFiled: January 29, 2010Date of Patent: September 13, 2011Assignee: Fujifilm CorporationInventors: Tsukasa Tokunaga, Hiroshi Sakuyama
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Publication number: 20110168424Abstract: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.Type: ApplicationFiled: March 22, 2011Publication date: July 14, 2011Inventors: Thomas F. Burke, James E. Haller
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Publication number: 20110073361Abstract: Attenuating, while in or on a body of water, one's own emanated electromagnetic field by wearing apparel that includes an electromagnetically shielding fabric. The shielding fabric comprises a substantially continuous system of conductive fibers combined with non-conductive fabric. Or attenuating, while a person is in or on a body of water, the electromagnetic field emanated by the person, by (i) providing to the person apparel that includes the electromagnetically shielding fabric, and (ii) instructing the person to wear it while in or on the water. The attenuation of the emanated electromagnetic field decreases the likelihood of a person being located in the body of water by a water-borne predator detecting that person's emanated electromagnetic field.Type: ApplicationFiled: August 28, 2009Publication date: March 31, 2011Inventors: Michael D. Slinkard, John M. Maupin
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Publication number: 20110067918Abstract: Corrosion-resistant electromagnetic interference (“EMI”) shielding material. The material is provided as an admixture of an elastomeric polymeric component and a filler component. The filler component is provided as glass or aluminum particles which are electrolessly-plated with a plating of a nickel-phosphorous alloy.Type: ApplicationFiled: November 30, 2010Publication date: March 24, 2011Inventors: Junhua Whu, Gerard Brown, George Watchko, Robert Steeves, Francis Richard, William G. Lionetta
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Publication number: 20110057127Abstract: Attenuating, while handling an animal, one's own emanated electromagnetic field by wearing apparel that includes an electromagnetically shielding fabric. The shielding fabric comprises a substantially continuous system of conductive fibers combined with non-conductive fabric. Or attenuating, while a handler is handling an animal, the electromagnetic field emanated by the handler, by (i) providing to the handler apparel that includes the electromagnetically shielding fabric, and (ii) instructing the handler to wear it while handling an animal, respectively. The attenuation of the emanated electromagnetic field decreases the likelihood of the animal reacting to the emanated electromagnetic field.Type: ApplicationFiled: April 23, 2009Publication date: March 10, 2011Inventors: Michael D. Slinkard, John M. Maupin
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Publication number: 20110042135Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.Type: ApplicationFiled: October 29, 2010Publication date: February 24, 2011Applicant: Kabushiki Kaisha Kobe Seiko Sho(Kobe Steel, Ltd.)Inventors: Yuuki TAUCHI, Katsutoshi Takagi, Junichi Nakai, Toshiki Sato
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Publication number: 20110021360Abstract: The superconductive nanocomposite is a composition formed by nanoparticles of a high temperature superconductor blended with a polymer matrix containing natural rubber and polyethylene. The high temperature superconductor is preferably a bismuth-based superconductor (BSCCO) having a particle size of about 21 nm, but may be any other high temperature or Type II ceramic, metal oxide superconductor. The superconductor nanoparticles comprise about 15% of the weight of natural rubber in the composition. The polyethylene is preferably low density polyethylene and may comprise between 0% up to about 40% of the weight of natural rubber in the composition. The nanocomposite may be prepared by blending the components and roll milling the rubber.Type: ApplicationFiled: July 22, 2009Publication date: January 27, 2011Inventors: Ahmed Abdullah S. Al-Ghamdi, El-Sayed El-Badaway H. El-Mossalamy, Farid Mahmoud El-Tantawy, Nadia Abdel Aal
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Publication number: 20100300744Abstract: A shielding article includes a first conductive layer and a second conductive layer spaced apart from the first conductive layer by a non-conductive polymeric layer defining a separation distance. The first conductive layer and the second conductive layer cooperatively provide a first shielding effectiveness. The first conductive layer, the second conductive layer, and the separation distance cooperatively provide a second shielding effectiveness that is greater than the first shielding effectiveness.Type: ApplicationFiled: May 19, 2010Publication date: December 2, 2010Inventors: Walter R. Romanko, Jeffrey A. Lim, Sywong Ngin, Eugene P. Janulis, JR.
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Publication number: 20100288553Abstract: A cooling pad capable of absorbing electromagnetic interference (EMI) is used to be connected between a cooling device and an electronic component. The cooling pad conducts heat generated by the electronic component to the cooling device, thereby to cool the electronic component. The cooling pad includes an EMI absorbing net made of electromagnetic absorbing material. Therefore, the cooling pad is capable of absorbing EMI generated by the electronic component.Type: ApplicationFiled: August 12, 2009Publication date: November 18, 2010Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: WEN-KAI CHIANG
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Publication number: 20100282505Abstract: A method for producing a conductive film, which comprises: exposing and developing a light-sensitive material comprising a support and thereon an emulsion layer containing a silver salt emulsion to form a metallic silver; and then subjecting the light-sensitive material to a smoothing treatment (such as a calender treatment).Type: ApplicationFiled: April 2, 2008Publication date: November 11, 2010Applicant: FUJIFILM CorporationInventors: Akira Ichiki, Joh Kumura, Tadashi Kuriki, Tsukasa Tokunaga
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Publication number: 20100258344Abstract: An example electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive may include halogen-free flame retardant.Type: ApplicationFiled: June 23, 2010Publication date: October 14, 2010Applicant: LAIRD TECHNOLOGIES, INC.Inventor: Larry D. Creasy, JR.
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Publication number: 20100224402Abstract: A shielding article includes a polymeric conductive layer and a protective layer disposed adjacent the polymeric conductive layer. The polymeric conductive layer provides electromagnetic shielding characteristics so as to prevent receipt of data from a radio frequency information component by an external device when the component is located between the external device on one side and the polymeric conductive and protective layers on the other side. The shielding article may be shaped to substantially surround the radio frequency information component.Type: ApplicationFiled: December 17, 2008Publication date: September 9, 2010Inventors: Jeffrey A. Lim, Sywong Ngin, Robert L. Lambert, JR.
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Publication number: 20100212952Abstract: An electromagnetic protection sheath made of textile (10) is formed by conductive filaments extending in a first direction (X) and non-conductive filaments interlaced with the conductive filaments. Use in particular for shielding cables in aeronautical applications.Type: ApplicationFiled: May 7, 2008Publication date: August 26, 2010Applicant: FEDERAL MOGUL SYSTEMS PROTECTIONInventors: Rafik Abdelmoula, Patrick Thomas, Lucia Della Putta, Thierry Rodrigues, Amelie Simoens
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Publication number: 20100214713Abstract: Disclosed is a laminate sheet including a polymer resin layer; and at least one metal foil layer laminated on one surface or both surfaces of the polymer resin layer, which is applied to shield electromagnetic waves, and/or to ground static electricity.Type: ApplicationFiled: April 24, 2008Publication date: August 26, 2010Applicant: Nano Interface TechnologyInventor: Jin-Ho Song