Abstract: A semiconductor device according to an embodiment of the disclosure includes a base, a semiconductor element, a first conductor, and a second conductor. The base has an outer edge including a first part, a second part, and a third part. The first part and the second part are substantially parallel to each other. The third part extends in a direction that intersects both of the first part and the second part. The semiconductor element is covered with the base. The first conductor is coupled to the semiconductor element, and protrudes to an outside of the base from the first part of the outer edge. The second conductor is coupled to the semiconductor element, and protrudes to the outside of the base from the third part of the outer edge.

Abstract: An arrangement for high voltage components located in a motor vehicle, which has a housing for receiving the high voltage components, is completely lockable, conductive and suitable for electromagnetically screening the high voltage components. The housing has openings for electromagnetically compatibly connecting electrical lines to the high voltage components. The housing consists of plastic material which has been rendered electrically conductive by the addition of metallic particles, and has at least on one of its walls at least one support element for the same. The housing is manufactured of the plastic material filled with metallic particles by injection molding, in the shape being adapted to the spatial configurations of the location of mounting in the motor vehicle.

Abstract: An electronic circuit unit (1) comprising at least one electrical or electronic device (8) with at least one terminal contact (101), the at least one terminal contact (101) being connected in an electrically conducting manner to at least one terminal pad (100), at least one terminal contact (101) and at least one terminal pad (100) are surrounded in the region of the electrical point of contact by an electrically insulating compound (9), the electrical or electronic device (8) being arranged outside the electrically insulating compound (9).

Abstract: An electronic device package 100 comprising a lead frame 150 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.