Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal. A pressure interrupter cover assembly is sealingly secured to the open end of case for the elements and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitor section to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals.

Abstract: A semiconductor device includes a package substrate, a semiconductor chip and a solder bump. The semiconductor chip is disposed on the package substrate. The package substrate includes a first electrode pad, and a first insulating film formed such that the first insulating film exposes a first portion of a surface of the first electrode pad. The semiconductor chip includes a second electrode pad and a second insulating film formed such that the second insulating film exposes a second portion of a surface of the second electrode pad. The second electrode pad is formed on the first electrode pad through the solder bump. L2/L1 is 0.63 or more in a cross section passing through the first electrode pad, the solder bump and the second electrode pad. A first length of the first portion and a second length of the second portion are defined as L1 and L2, respectively.

Abstract: An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals.

Abstract: An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable cover mountable to the case, and, a common cover terminal having a contact extending from the cover. The cover assembly also includes at least three capacitor cover terminals, each of the at least three capacitor cover terminals having at least one contact extending from the deformable cover. The deformable cover is configured to displace at least one of the at least three capacitor cover terminals upon an operative failure of at least one of the plurality of the capacitive elements. The cover assembly also includes at least four insulation structures. One of the four insulation structures is associated with one of the at least three capacitor cover terminals.

Abstract: An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.

Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.

Abstract: A light-emitting device mounting package includes a substrate, a frame extending upward from the substrate and surrounding a mounting portion, a lead plate supported on the frame, and a ceramic plate having a facing front surface and a facing back surface on the opposite side. The frame has a first through hole through which the lead terminal extends. The ceramic plate has a second through hole, and a metalized layer formed on the facing front surface such that the metalized layer is spaced from an opening of the second through hole. The lead plate penetrates the first and second through holes and is fixed, via a collar portion, to a region of the facing back surface around an opening of the second through hole on the facing back surface side. The insulating member is fixed to a region around the first through hole via the metalized layer.

Abstract: An outer case in an electronic circuit unit is injection molded by setting the circuit board in a die and injection molding of the outer case by filling molten resin into a cavity in the die, in pressing at least a part of a front surface side of the mold exclusion part facing a non-cavity space by press member toward a rear surface side.

Abstract: In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.

Abstract: An electrical connector includes an insulating body, multiple terminals and a metal member. The insulating body has a base and side walls. The base is provided with receiving slots. The side walls are higher than the base, and encircled to form an accommodating space for accommodating a chip module. The terminals are received in the receiving slots. Each terminal has a contacting portion lower than a top surface of the side walls. The contacting portions electrically connect with the chip module. The metal member is injection molded at the side walls and the base to reinforce the structure of the side walls and the base, and preventing the insulating body from warping at a high temperature.

Abstract: Provided are amorphous silica particles for application to industrial fields where there are increasing desires for high purity and colorlessness. The amorphous silica particles are produced through the steps of hydrolysis of an alkoxide, vacuum drying, and firing. The amorphous silica particles have been reduced in coloration and in Fe content, which is causative of coloration of the silica, and can meet the desires. The amorphous silica is characterized by having an Fe content of 20 ppm or less.

Abstract: A radio frequency module may include a transceiver positioned on a circuit board, a crystal positioned on the circuit board, an antenna positioned on the circuit board, and a shield positioned over the transceiver and crystal. The shield may include an upper surface and a plurality of legs coupling the upper surface to the circuit board.

Abstract: An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material.

Abstract: The present disclosure relates to a transponder for object identification comprising at least one semiconductor component (36) for storing information and at least one antenna (11) for communicating the information with an external unit, the antenna (11) being formed by a conductor on a circuit board (7) and the semiconductor component (36) being mounted on the circuit board (7), the circuit board (7) being included in a housing (2), and it relates to a fabrication method of a generic kind. In order to improve the resistance of the transponder against harmful external influences, such as high temperatures, and to prolong its life cycle, the invention suggests that the semiconductor component (36) is included in an enclosure (18) that is hermetically sealed and fixed on a surface (12, 13) of the circuit board.

Abstract: One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode formed on the mounting surface and another side face in the plurality of side faces, and an oxide film covering at least a part of surfaces of side face parts of the first and second terminal electrodes formed on the side faces; wherein mounting parts of the first and second terminal electrodes formed on the mounting surface are joined to the board with the solder.

Abstract: A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

Abstract: A protection circuit board resulting in a compact battery pack having a higher capacity than a conventional battery pack of the same size, a battery pack including the protection circuit board and a method of fabricating the protection circuit board includes: a first lead terminal disposed on a first side of the protection circuit board; and a first aperture for exposing the first lead terminal to a second side of the protection circuit board. The battery pack also includes: a bare cell including an electrode terminal; a second lead terminal arranged over the electrode terminal; and a protection circuit board electrically connected to the second lead terminal and the bare cell, and having an aperture for exposing the second lead terminal arranged the first side of the protection circuit board to the second side of the protection circuit board.

Abstract: A seal cover includes a cover main body (10) shaped to cover an opening of a case and to be attached to a surface of the case. A seal ring holder (20A) is on the underside of the cover main body (10) and is arranged to fit into the opening. A seal ring (25) is on the outer peripheral surface of the seal ring holder (20A) and closely contacts the inner peripheral surface of the opening. An interlock connector (40) projects from the seal ring holder (20A) for connecting to the waiting connector and sets an energizing circuit in an energized state or a non-energized state upon being connected to or separated from the waiting connector. The interlock connector (40) is mounted on the seal ring holder (20A) to be movable in a direction perpendicular to a connecting direction to the waiting connector.

Abstract: According to one embodiment, a semiconductor device includes a housing including a first wall and a second wall opposite to the first wall, a board in the housing, a first supporter provided on the first wall and configured to support an end of the board in a direction substantially parallel to the first wall, a stopper in the housing, the stopper configured to support the board, and a second supporter provided on the second wall and configured to support the stopper.

Abstract: The embodiments described herein provide for a packaging configuration that provides leads or connections for a packaging substrate from opposing surfaces of a package. Through silicon vias (TSV) are provided in order to accommodate additional input/output (I/O) pins that smaller dies are supporting. Various combinations of packages are enabled through the embodiments provided.

Abstract: Methods and systems are provided for a dry silicone gel in a closure or interconnect system. The dry silicone gel may be made by reacting a crosslinker, a chain extender, and a vinyl-terminated polydimethylsiloxane. The reaction may be conducted in the presence of a catalyst. In certain embodiments, the dry silicone gel may comprise: (1) a hardness between 100 g and 300 g, (2) a stress relaxation between 30% and 60% when subjected to a deformation of 50% of the original size of the gel, (3) a compression set between 4% and 20% after 50% strain has been applied to the gel for 1000 hours at 70° C., and/or (4) less than 10% oil bleed out under compression of 1.2 atm after 60 days at 60° C.

Abstract: A surface-mountable device (100) is specified, having a mounting side (101), a top side (102) lying opposite the mounting side (101), an electrically insulating carrier plate (1), an electrical component (2) and a housing (3). The carrier plate (1) terminates the device (100) toward the mounting side (101). Furthermore, the carrier plate (1) has a fixing side (103) lying opposite the mounting side (101). For the purpose of making electrical contact with the component (2), the carrier plate (1) has conductor tracks (4) arranged on the fixing side (103), contact areas (5) arranged on the mounting side (101), and openings (6), wherein in each case a contact area (5) is electrically conductively connected to a conductor track (4) by an opening (6). The component (2) is enclosed by the housing (3), wherein at least one opening (6) is arranged below the component (2). The housing (3) and the carrier plate (1) are arranged flush with one another in a plan view of the carrier plate (1).

Abstract: A ready to use tracer wire connector kit comprising a pod and cover that can be mated together around a tracer wire connector that can be retained in the pod or removed from the pod as the tracer wires are joined therein with the pod and cover encapsulating and protecting the junction of tracer wires in the tracer wire connector and a method and system wherein underground difficult to detect devices and systems can be indirectly located.

Abstract: A ceramic electronic component includes a ceramic element, a first inner electrode, a second inner electrode, an outer electrode, and a first auxiliary electrode. The first auxiliary electrode extends to a first surface of the ceramic element. The first inner electrode extends along a first direction on the first surface. The first auxiliary electrode extends outward from the region where the first inner electrode is disposed in the first direction on the first surface. The outer electrode covers the first inner electrode and the first auxiliary electrode.

Abstract: A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around the common ground and an at least one structural member secured to the encapsulation layer and at least one of the plurality of circuit paths, the structural member providing rigidity to the pre-mold; and a plurality of locating features extending from at least one of the encapsulation layer and the structural member.

Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.

Abstract: A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.

Abstract: A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C. or lower, a circuit portion and a non-circuit potion having a linear expansion coefficient of 10 ppm per degree C. or higher and 35 ppm per degree C.

Abstract: An electronic device includes at least one terminal formed on the electronic device. The electronic device also includes at least one of a semiconductor device, an integrated circuit chip, and a computer. A seamless conductive mesh is formed on at least one surface of the electronic device. The conductive mesh is in electrical contact with the terminal. The terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit. The electronic device also may include a pattern having traces formed on at least two surfaces where each of the traces includes a continuous loop of conductive material is formed on at least two surfaces. The electronic device also may include a first plurality of conductive loops formed on the electronic device that are continuous and surround the electronic device in a first direction and a second plurality of conductive loops formed on the electronic device that are continuous and surround the electronic device in a second direction.

Abstract: In order not to damage encased circuits under temperature expansion, they are encased in an external encasement mold, wherein the encasement body thus created comprises singular or line shaped rises on its exterior surface, and is supported at said rises after insertion into the external housing. The free spaces then remaining between the encasement body and the housing are available for expansion.

Abstract: In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.

Abstract: The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.

Abstract: Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside.

Abstract: A method and apparatus for protecting a heat sensitive component from high temperature, mechanical shock and moisture are provided. An enclosure includes an outer housing surrounding an inner cavity configured to receive a heat sensitive component therein, a cover configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material.

Abstract: An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.

Abstract: A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.

Abstract: A method and apparatus for protecting a heat sensitive component from high temperature, mechanical shock and moisture are provided. An enclosure includes an outer housing surrounding an inner cavity configured to receive a heat sensitive component therein, a cover configured to matingly engage the outer housing such that the inner cavity is sealed from an environment external to the enclosure, wherein at least one of the outer housing and the cover are formed from a ceramic material.

Abstract: An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.

Abstract: A semiconductor device according to the present invention includes first through fourth internal terminals placed along the perimeter of a substrate, a circuit coupled to the first internal terminal, a first external terminal coupled to the second internal terminal, a second external terminal coupled to the third internal terminal, and a third external terminal coupled to the fourth internal terminal. The circuit outputs a signal indicative of a connection state the first internal terminal and the first external terminal. A distance between centers of the first and second internal terminals is L1 in a direction parallel to one side of the substrate beside which the first external terminal is placed. A distance between centers of the third and fourth internal terminals is L2 in a direction parallel to one side of the substrate beside which the second and third external terminals are placed. The distance L1 is set smaller than the distance L2.

Abstract: A transmission controller includes a printed circuit board that mechanically supports and electrically connects circuitry of the transmission controller to a vehicle bus. The printed circuit board includes a lower layer of carbon composite and an upper layer of high temperature substrate. A flex circuit is laminated on the printed circuit board to provide an interconnect between the circuitry of the transmission controller and the vehicle bus. The circuitry is encased within a cover. The cover can formed by an overmolding process that encapsulates the circuitry on the upper layer of high temperature substrate or by lamination. The transmission controller can then be attached at a desired location within or on an outer surface of a transmission.

Abstract: An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.

Abstract: A power distribution module includes a housing having a component chamber configured to house an electrical component therein. The housing includes at least a portion thereof defining a shield interface. A header assembly is coupled to the housing. The header assembly includes a header body including an inner body portion and an outer body portion, and the header assembly further includes a header shield positioned between the inner and outer body portions. The header shield engages the shield interface of the housing when the header assembly is coupled to the housing.

Abstract: In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member are placed in the center of the transfer-mold structure to make thermal stresses symmetrical and thus suppress strains.

Abstract: According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the first molding die with resin with a first end electrode of the chip component exposed; a peeling step of peeling the first molding die at a side of inserting the chip component; a secondary molding step of filling a second molding die with resin with a second end electrode of the chip component; and a forming step of forming a circuit wiring on one side or both sides of a molded element molded with resin, wherein the chip component is disposed according to a specified rule, and the chip component is molded with the resin.

Abstract: A printed circuit board having fuse housings that is mounted in an electric junction box for a vehicle, includes a fuse case that has fuse housings provided in a plurality of parallel tiers; output terminals that are formed of L-shaped terminals connected to and projecting from a printed conductor of the printed circuit board, and that project inside each of the fuse housing tiers; input terminals that are formed of L-shaped terminals branching from bus bars, and that project inside at least one of the fuse housing tiers; and a base that is mounted on a rear surface side of the fuse case and that holds the input and output terminals that are passed through the base.