Leads Patents (Class 174/528)
  • Patent number: 10606399
    Abstract: A flexible display device according to an exemplary embodiment includes: a substrate; a touch panel on the substrate; a window layer on the touch panel; a flexible printed circuit (FPC) attached to an outer side of the window layer at a non-display area and comprising a driver integrated circuit (IC) configured to transfer a driving voltage to the touch panel and the substrate; a flexible printed circuit board (FPCB) attached to the FPC and configured to transfer a driving signal to the driver IC; and a bridge electrode at an outer side of the window layer at the non-display area and connecting the touch panel, the substrate, and the FPC.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 31, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae Sik Kim, Young Min You, Dong Suk Choi
  • Patent number: 10574114
    Abstract: An electric motor built for exposure to high pressure fluid includes a unitary metal sleeve that provides a fluid barrier between the rotor and the stator. An overmolded resin encapsulates the stator windings and reinforces the sleeve to minimize deformation of the sleeve under high fluid pressures. The overmolded resin also fixes the positions of insulation displacement connectors connected to the stator windings, thereby avoiding mechanical brackets and fasteners for holding the insulation displacement connectors in position.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: February 25, 2020
    Assignee: Moog Inc.
    Inventors: Matthew Allen Carroll, Lee L. Snider, Mohammad Khandan-Barani, Ronald G. Flanary, Allen Duncan, Travis S. King
  • Patent number: 10417459
    Abstract: An apparatus that includes a substrate and a first plurality of circuit components mounted on the substrate, which is associated with a protected area. The apparatus includes a connector formed on the substrate to at least partially circumscribe the protected area and a second plurality of circuit components mounted on the substrate to at least partially circumscribe the connector to form a security barrier to physically inhibit a penetration attack into the protected area.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: September 17, 2019
    Assignee: UTIMACO, INC.
    Inventors: John M. Lewis, Alvin H. Diep
  • Patent number: 10340225
    Abstract: Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, A radio-frequency (RF) module comprises a lead-frame package with a plurality of pins and at least one pin exposed from overmold compound. The module further includes a metal-based covering over a portion of the lead-frame package. Additionally, the metal-based covering can be in contact with the at least one pin.
    Type: Grant
    Filed: July 7, 2018
    Date of Patent: July 2, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventor: Howard E. Chen
  • Patent number: 10275701
    Abstract: The invention relates to a method for producing portable data carriers (10, 11), wherein first there are provided a module carrier band (20), on which are arranged chip modules (26) with contact surfaces (21) arranged on one side of the module carrier band (20), and at least one substrate foil (31, 32, 33), respectively as rolled goods. The module carrier band (20) and the at least one substrate foil (31, 32, 33) are unrolled from the respective roll (51, 52, 53) and continuously brought together. Then, the module carrier band (20) is permanently connected with the at least one substrate foil (31, 32, 33) in such a way that the contact surfaces (21) of the chip modules (26) point outward. From the composite (40) there can be detached in particular portable data carriers in the format ID-000 (10) or mini-UICC (11).
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: April 30, 2019
    Assignee: GIESECKE+DEVRIENT MOBILE SECURITY GMBH
    Inventors: Thomas Tarantino, Thomas Gotz, Marc Elsasser, Robert Griesmeier
  • Patent number: 10163743
    Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: December 25, 2018
    Assignee: MATERION CORPORATION
    Inventors: Richard J. Koba, Chee Kong Lee, Wei Chuan Goh, Sin Yee Chin
  • Patent number: 10151328
    Abstract: An alternating-current permanent magnet drainage pump includes a pump cover, a pump body, a magnetic core, a rotating shaft, a stator core and coils. The coils are wound around a coil former, and the stator core is assembled to the coils. The pump body is a shell formed by surrounding a contour of the coils, the coil former, and the stator core which have been assembled to perform an integrated injection molding. The shell defines a magnetic core accommodating space used for accommodating the magnetic core and having an opening at a top portion. The magnetic core accommodating space extends from the opening to a center of the pump body. A supporting member is arranged in the opening at the top portion of the magnetic core accommodating space for supporting a bearing of the rotating shaft.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: December 11, 2018
    Assignee: JANGMEN IDEAR HANYU ELECTRICAL JOINT-STOCK CO., LTD.
    Inventors: Hongbiao Wang, Changjian Li, Fei Xu
  • Patent number: 10103108
    Abstract: A nanostructured chip includes a substrate and a nanostructured layer, wherein the substrate has a first surface and a second surface on which the nanostructured layer is formed. A method of producing the nanostructured chip includes the step of forming the nanostructured layer on the second surface of the substrate. Whereby, the nanostructured layer effectively disperses a stress to increase the flexural strength of the nanostructured chip. Therefore, during the subsequent procedures to form an epitaxial layer on the first surface, the nanostructured layer is helpful to prevent the epitaxial layer from generating cracks, and prevent the substrate from bowings, or fragments.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: October 16, 2018
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Jer-Liang Yeh, Chih-Yuan Chuang, Chun-I Fan, Chien-Jen Sun, Ying-Ru Shih, Wen-Ching Hsu
  • Patent number: 10057981
    Abstract: A stretchable circuit board has stretchability as well as flexibility of the flexible substrate and retains mechanical and electrical properties even under larger deformation such as bending, twisting, etc. The liquid metal pattern can exhibit stretchability almost the same as that of the polymer substrate due to the liquid metal being fully wetted on the substrate with metal patterns based on the wetting behavior of the liquid metal. Therefore, the stretchable circuit board can achieve both mechanical and electrical properties even under physical deformation such as bending, stretching and twisting. It is demonstrated that the stretchable circuit board can be effectively applied to wearable tactile interfaces, stretchable solar cell arrays, stretchable displays, and wearable electronic devices.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: August 21, 2018
    Assignee: Industry Foundation of Chonnam National University
    Inventors: Dong-Weon Lee, Guangyong Li
  • Patent number: 10043763
    Abstract: Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, A radio-frequency (RF) module comprises a lead-frame package with a plurality of pins and at least one pin exposed from overmold compound. The module further includes a metal-based covering over a portion of the lead-frame package. Additionally, the metal-based covering can be in contact with the at least one pin.
    Type: Grant
    Filed: December 18, 2016
    Date of Patent: August 7, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventor: Howard E. Chen
  • Patent number: 10032653
    Abstract: The invention relates to a mold for encapsulating electronic components mounted on a carrier, with at least two mold parts which are displaceable relative to each other for engaging with a mold cavity round electronic components, and at least one feed for encapsulating material recessed into the mold parts and connecting to the mold cavity. The invention also relates to a carrier with encapsulated electronic components. The invention further relates to a method for encapsulating electronic components and to the thus manufactured encapsulated separated components. The carrier is provided with a plurality of recessed through-openings located at a distance from the electronic components and an encapsulation arranged round the electronic components, wherein through-openings are recessed into the encapsulating material and wherein some of the through-openings recessed into the carrier coincide at least partially with the through-openings recessed into the encapsulating material.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: July 24, 2018
    Assignee: Besi Netherlands B.V.
    Inventor: Michel Hendrikus Lambertus Teunissen
  • Patent number: 9941197
    Abstract: A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: April 10, 2018
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Eckhard Ditzel, Siegfried Walter, Michael Benedikt, Udo Becker
  • Patent number: 9852929
    Abstract: A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: December 26, 2017
    Assignee: MITSUI HIGH-TEC, INC.
    Inventor: Takahiro Ishibashi
  • Patent number: 9848505
    Abstract: A housing for storing therein a circuit board, includes: a through hole; an electrically conductive pattern passing through inner walls of the through hole so as to be stretched from the outside surface of the housing to the inside surface of the housing, and being electrically connected to the circuit board; and a plug member with which the through hole is filled, the through hole having openings on the outside and the inside, respectively, of the housing, and the opening on the outside of the housing being larger than the opening on the inside of the housing.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: December 19, 2017
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Nozomu Hikino
  • Patent number: 9799580
    Abstract: A method of manufacturing a packaged semiconductor device includes forming an assembly by placing a semiconductor die over a substrate with a die attach material between the semiconductor die and the substrate. A conformal structure which includes a pressure transmissive material contacts at least a portion of a top surface of the semiconductor die. A pressure is applied to the conformal structure and in turn, the pressure is transmitted to the top surface of the semiconductor die by the pressure transmissive material. While the pressure is applied, concurrently encapsulating the assembly with a molding compound and exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: October 24, 2017
    Assignee: NXP USA, INC.
    Inventors: Li Li, Jaynal A. Molla, Lakshminarayan Viswanathan
  • Patent number: 9578398
    Abstract: A wireless vibration sensor suitable for connection to a distributed industrial control system arranged with a wireless network for communication of process data or control information. The wireless vibration sensor includes at least one sensor, a wireless radio transmitter, and a base part for mounting it firmly on equipment or a structure. The wireless sensor is arranged with a battery and a power storage device. A method for powering up the wireless sensor during active cycles is also described.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: February 21, 2017
    Assignee: ABB AS
    Inventors: Geir Svoen, Tor Ole Bang-Steinsvik, Kenneth Juul, Sverre Froystein, Orjan Lag
  • Patent number: 9494660
    Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: November 15, 2016
    Assignee: Allegro Microsystems, LLC
    Inventors: Paul David, William P. Taylor, P. Karl Scheller, Ravi Vig, Andreas P. Friedrich
  • Patent number: 9460593
    Abstract: A container breach detector system to monitor breaches of a transportation container. A self-contained container breach detector provides activation, status, and/or breach event date and time stamp data and a unique identification number of a communication tower, for a user to determine when and where authorized and/or unauthorized breaches of the transportation container occurred. Furthermore, the self-contained container breach detector serves as a recording device to record the activation, status, and/or breach event date and time stamp data; and communicates via various communication means including text via short message service, SMS, and/or e-mail. A container breach detector is intended for a one-time use only, to be discarded at destination. Each container breach detector has individual serial numbers.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 4, 2016
    Assignee: Container Seal Project Partners, LLC
    Inventor: Enrique Acosta
  • Patent number: 9224716
    Abstract: Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: December 29, 2015
    Assignee: IRIDIUM MEDICAL TECHNOLOGY CO., LTD.
    Inventor: Long-Sheng Fan
  • Patent number: 9219025
    Abstract: A molded flip-chip semiconductor package includes a leadframe having opposing first and second main surfaces, a first metallization on the first main surface, a second metallization on the second main surface, recessed regions which extend from the second main surface toward the first main surface, and spaced apart leads chemically etched into the leadframe between gaps in the first metallization. The package further includes a semiconductor die having a plurality of pads facing and attached to the leads of the leadframe, a first molding compound that fills the recessed regions, and a second molding compound that encases the semiconductor die and fills the space between the leads such that the second molding compound abuts the first molding compound. A is the overall thickness of the leadframe, B is the spacing between adjacent ones of the leads, and B/A<1.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: December 22, 2015
    Assignee: Infineon Technologies AG
    Inventors: Swee Kah Lee, Chee Hong Fang, Mei Chin Ng
  • Patent number: 9035189
    Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: May 19, 2015
    Assignee: EPCOS AC
    Inventors: Wolfgang Pahl, Hans Krueger, Peter Demmer
  • Patent number: 8969730
    Abstract: Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: March 3, 2015
    Assignee: Apple Inc.
    Inventors: Anthony S. Montevirgen, Emery A. Sanford, Stephen Brian Lynch
  • Publication number: 20140284097
    Abstract: A field device with a housing for accommodating an electronics unit. The housing is pot shaped and composed of a non-conductive material, wherein at least one line guide passageway with a screw thread is provided on the housing, wherein the line guide passageway is provided with a conductive coating in the region of the thread, and wherein the screw thread has at least one groove in at least one region extending in the axial direction of the line guide passageway.
    Type: Application
    Filed: November 9, 2012
    Publication date: September 25, 2014
    Applicant: Endress + Hause GmbH + Co. KG
    Inventor: Ioan Mircea Pol
  • Patent number: 8796560
    Abstract: A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: August 5, 2014
    Assignee: Power Integrations, Inc.
    Inventors: Balu Balakrishnan, Brad L. Hawthorne, Stephan Bäurle
  • Patent number: 8693167
    Abstract: An electronic component includes a lead wire, a functional element, and an outer housing. The lead wire includes a leader electrode made of metal containing aluminum, a metal wire containing tin, and a welded section formed by welding a first end of the metal wire to a first end of the leader electrode. A second end of the leader electrode is connected to the functional element. The outer housing seals the functional element therein such that a second end of the metal wire is led out therefrom. The lead wire further includes a resin film coating the welded section at least at a portion not covered with the outer housing. Resin material for the resin film has pierce strength of 0.05 MPa/?m per unit thickness or greater and an elastic coefficient of 10 GPa or less.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: April 8, 2014
    Assignee: Panasonic Corporation
    Inventors: Yasuhiro Yano, Douyuu Hachisu, Junji Yamane
  • Patent number: 8426752
    Abstract: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: April 23, 2013
    Assignees: Sumitomo Wiring Systems, Ltd., Autonetworks Technologies, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Manabu Hashikura, Mitsuaki Kohsaka, Tatsuya Shimizu
  • Patent number: 8389874
    Abstract: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: March 5, 2013
    Assignees: Sumitomo Wiring Systems, Ltd., Autonetworks Technologies, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Manabu Hashikura, Mitsuaki Kohsaka, Tatsuya Shimizu
  • Patent number: 8217281
    Abstract: The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact pads in the die attach area has a first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: July 10, 2012
    Assignee: NXP B.V.
    Inventors: Leonardus A. E. Van Gemert, Marcus F. Donker
  • Patent number: 8207455
    Abstract: A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: June 26, 2012
    Assignee: Power Integrations, Inc.
    Inventors: Balu Balakrishnan, Brad L. Hawthorne, Stefan Bäurle
  • Patent number: 8153478
    Abstract: A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: April 10, 2012
    Assignee: STATS ChipPAC Ltd.
    Inventors: Guruprasad Badakere Govindaiah, Arnel Trasporto
  • Patent number: 8153232
    Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: April 10, 2012
    Assignee: W.C. Heraeus GmbH
    Inventors: Eckhard Ditzel, Siegfried Walter, Manfred Gresch
  • Patent number: 8031473
    Abstract: A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting track carrier electrically coupled to the circuit carrier. The base plate has a continuous recess that is configured and arranged for feeding a casting compound into the cavity between the base plate and the cover plate. The casting compound is embodied to at least partly enclose the circuit carrier and/or the conducting track carrier in a vibration-damping manner.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: October 4, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Stefan Beer, Josef Loibl, Hermann-Josef Robin, Karl Smirra
  • Patent number: 7989931
    Abstract: An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: August 2, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Guruprasad Badakere Govindaiah, Arnel Trasporto
  • Patent number: 7957158
    Abstract: A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: June 7, 2011
    Assignees: Sanyo Electric Co., Ltd., Sanyo Semiconductor Co., Ltd.
    Inventors: Sadamichi Takakusaki, Noriaki Sakamoto, Katsuyoshi Mino
  • Patent number: 7948767
    Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: May 24, 2011
    Assignee: Neobulb Technologies, LLP.
    Inventor: Jen-Shyan Chen
  • Patent number: 7863527
    Abstract: An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: January 4, 2011
    Assignee: Continental Automotive Systems US, Inc.
    Inventor: Gaetan Vich
  • Publication number: 20100332074
    Abstract: Remote sensor units for a vehicle are described. A remote sensor unit may comprise an electronic assembly. The electronic assembly may comprise an electronic component. The electronic assembly may comprise one or more signal terminals coupled to the electronic component. The electronic assembly may comprise a protective enclosure arranged to encapsulate the electronic component. The protective enclosure is arranged to isolate the electronic component from thermal energy, pressure or residual material stress associated with one or more satellite housings. Other embodiments are described and claimed.
    Type: Application
    Filed: June 26, 2009
    Publication date: December 30, 2010
    Applicant: AUTOLIV ASP, INC.
    Inventors: Dario G. Brisighella, JR., Stephen Bogdan, William M. Leach, Jeffrey T. Kida, Richard Rakes, JR.
  • Patent number: 7795545
    Abstract: A hot melt water-resistant structure includes: an object to be protected from water; and a resin cover for covering an outside of the object and made of hot melt resin. The object includes an exposed surface and a side surface with a sidewall. The exposed surface is exposed from the resin cover. The side surface surrounds the exposed surface. The sidewall protrudes from the side surface continuously or intermittently. The resin cover covers and contacts the side surface with the sidewall.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: September 14, 2010
    Assignee: Denso Corporation
    Inventors: Shouichi Yamanaka, Hiroyuki Ito, Takayuki Kondo
  • Patent number: 7781683
    Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: August 24, 2010
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Matthew I. Haller, Tom Xiahoai He, Jay Daulton
  • Patent number: 7765687
    Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: August 3, 2010
    Assignee: SynQor, Inc.
    Inventors: Lennart Pitzele, Abram P. Dancy, Leif E. LaWhite, Rene Hemond, Martin F. Schlecht
  • Patent number: 7712211
    Abstract: A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: May 11, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Eng Meow Koon, Swee Kwang Chua
  • Patent number: 7709754
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and substrate having a first surface in which is disposed one or more magnetic field transducers, with the first surface being proximate the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit relative to a conventional orientation. With this arrangement, a current sensor is provided for which the one or more magnetic field transducers are very close to the current conductor portion, resulting in a current sensor having improved sensitivity.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: May 4, 2010
    Assignee: Allegro Microsystems, Inc.
    Inventors: Michael Doogue, Richard Dickinson, Jay Gagnon
  • Patent number: 7615712
    Abstract: An electronic assembly for use in a downhole tool includes a damming boot deployed about at least one integrated circuit component on a circuit board. The boot is disposed to house the integrated circuit leads and solder joints in a substantially sealed cavity between the circuit board, the integrated circuit body, and an inner surface of the damming boot. The boot is also disposed to support the integrated circuit body and thereby improve the shock and vibration resistance of various electronic assemblies used in downhole tools. The invention also tends to improve the reworkability of downhole electronic assemblies.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: November 10, 2009
    Assignee: Smith International, Inc.
    Inventor: Hugh Patton Hanley
  • Patent number: 7476816
    Abstract: An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The lead frame also includes a shunt conductor portion formed as a coupling of the at least two leads.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: January 13, 2009
    Assignee: Allegro Microsystems, Inc.
    Inventors: Michael C. Doogue, Vijay Mangtani, William P. Taylor
  • Patent number: 7473845
    Abstract: A structural unit having a frame, a connecting face that surrounds an opening and a cover that is attached to the connecting face to cover the opening. The frame and the cover are formed of materials with different coefficients of thermal expansion, and the connecting face has a channel that opens towards the cover. At least one duct communicates with the channel so that when a filling compound is injected into the duct it is received in the channel. The filling compound thereby attaches the cover to the frame and provides a seal therebetween.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: January 6, 2009
    Assignee: Tyco Electronics Pretema GmbH & Co. KG
    Inventors: Lorenz Berchtold, Karlheinz Glaser, Dietmar Kurzeja
  • Patent number: 7439452
    Abstract: In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member are placed in the center of the transfer-mold structure to make thermal stresses symmetrical and thus suppress strains.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: October 21, 2008
    Assignee: Hitachi, Ltd.
    Inventor: Mitsuhiro Masuda
  • Patent number: 7434310
    Abstract: A process for reforming a plastic packaged integrated circuit die (100) includes grinding away (305) a bottom side (210) of a plastic package (205) and portions of a set of leads (110) that are in the plane of the grinding until a bottom surface (240) of an inner portion (230) of the set of leads is exposed at a peripheral region (235) of the inner portion, cutting (310) approximately perpendicularly to the top and bottom sides to remove portions of the plastic package and the set of leads that are outside the inner portion of the set of leads, and adapting (320) the bottom surfaces of the inner portion of the set of leads for reliable electrical connections.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: October 14, 2008
    Assignee: Motorola, Inc.
    Inventors: Timothy B. Dean, Bruce C. Deemer, Daniel T. Rooney