Abstract: A semiconductor package includes: a lead frame having a plurality of blocks of uniform size and laterally spaced apart from one another with uniform spacing; a first semiconductor die attached to a first group of the blocks; electrical conductors connecting a plurality of input/output (I/O) terminals of the first semiconductor die to a second group of the blocks, at least some blocks of the second group being laterally spaced outward from the blocks of the first group; and a mold compound encapsulating the first semiconductor die and the electrical conductors. Corresponding methods of producing the semiconductor package are also described.

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.

Abstract: In a semiconductor device (4), a semiconductor chip (10) is mounted on a die pad (6) which has a die pad overhang portion (6a) and leads (9) are arranged around and apart from the die pad (6). The leads (9) and the semiconductor chip (10) are electrically connected and are covered with a sealing resin (8). A concave portion (7e) is formed on the outer side of each lead (9), i.e., the far side from the die pad. A lead concave surface (7d) facing the concave portion (7e) includes a forward-tapered lead slope surface (7h). Side surface of the sealing resin (8) has a step of a staircase shape formed from the first and the second resin side surfaces (8a and 8b). A tip of the lead (9) protrudes past the first resin side surface (8a).

Abstract: Leadframes, integrated circuit packaging with wettable flanks, and methods of manufacturing the same are disclosed. An example packaged device having a leadframe includes a die pad and a lead spaced apart from the die pad. The lead has a proximal end adjacent the die pad and a distal end extending away from the die pad. The lead has a thickness at the distal end that is less than a full thickness of the leadframe between a first outer surface on a die attach side of the leadframe and a second outer surface on a mounting side of the leadframe.

Abstract: An apparatus that includes a substrate and a first plurality of circuit components mounted on the substrate, which is associated with a protected area. The apparatus includes a connector formed on the substrate to at least partially circumscribe the protected area and a second plurality of circuit components mounted on the substrate to at least partially circumscribe the connector to form a security barrier to physically inhibit a penetration attack into the protected area.

Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

Abstract: A semiconductor device includes a first chip pad, a power semiconductor chip arranged on the first chip pad and including at least a first and a second power electrode, and a clip connected to the first power electrode. In this case, an integral part of the clip forms a shunt resistor and a first contact finger of the shunt resistor is embodied integrally with the clip.

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

Abstract: A portable fleet management system enables an operator to efficiently manage a fleet of drones in the field. The portable fleet management system may a comprise a portable housing that houses a charging system for charging batteries of the drones, a storage system for storing images, video, or other sensor data captured by the drones, and various other control, input/output, and processing elements for enabling efficient management of a drone fleet. The charging system is beneficially configured to enable charging of multiple different makes and models of drone batteries that may have different form factors and charging requirements. Furthermore, the storage system may enable efficient offloading, processing, sorting, and backup storage of images or video captured by the drones.

Abstract: Flush mount sensor packages and packaging methods for micromachined transducers, which can be used for fluid flow measurements, are provided. A sensor package can include a substrate, a sensor mounted on a front side of the substrate, a wire bond coupled to the sensor and passing through the substrate, and a shim cap positioned around the sensor. The wire bond does not protrude above the topside of the sensor, and the shim cap and the sensor can be substantially flush.

Abstract: An inductor includes a magnetic body including a magnetic substance; a substrate disposed within the magnetic body; and an internal electrode disposed on at least one of an upper surface and a lower surface of the substrate. The substrate is disposed on an inclined with respect to at least one surface of the magnetic body.

Abstract: A flexible display device according to an exemplary embodiment includes: a substrate; a touch panel on the substrate; a window layer on the touch panel; a flexible printed circuit (FPC) attached to an outer side of the window layer at a non-display area and comprising a driver integrated circuit (IC) configured to transfer a driving voltage to the touch panel and the substrate; a flexible printed circuit board (FPCB) attached to the FPC and configured to transfer a driving signal to the driver IC; and a bridge electrode at an outer side of the window layer at the non-display area and connecting the touch panel, the substrate, and the FPC.

Abstract: An electric motor built for exposure to high pressure fluid includes a unitary metal sleeve that provides a fluid barrier between the rotor and the stator. An overmolded resin encapsulates the stator windings and reinforces the sleeve to minimize deformation of the sleeve under high fluid pressures. The overmolded resin also fixes the positions of insulation displacement connectors connected to the stator windings, thereby avoiding mechanical brackets and fasteners for holding the insulation displacement connectors in position.

Abstract: An apparatus that includes a substrate and a first plurality of circuit components mounted on the substrate, which is associated with a protected area. The apparatus includes a connector formed on the substrate to at least partially circumscribe the protected area and a second plurality of circuit components mounted on the substrate to at least partially circumscribe the connector to form a security barrier to physically inhibit a penetration attack into the protected area.

Abstract: Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, A radio-frequency (RF) module comprises a lead-frame package with a plurality of pins and at least one pin exposed from overmold compound. The module further includes a metal-based covering over a portion of the lead-frame package. Additionally, the metal-based covering can be in contact with the at least one pin.

Abstract: The invention relates to a method for producing portable data carriers (10, 11), wherein first there are provided a module carrier band (20), on which are arranged chip modules (26) with contact surfaces (21) arranged on one side of the module carrier band (20), and at least one substrate foil (31, 32, 33), respectively as rolled goods. The module carrier band (20) and the at least one substrate foil (31, 32, 33) are unrolled from the respective roll (51, 52, 53) and continuously brought together. Then, the module carrier band (20) is permanently connected with the at least one substrate foil (31, 32, 33) in such a way that the contact surfaces (21) of the chip modules (26) point outward. From the composite (40) there can be detached in particular portable data carriers in the format ID-000 (10) or mini-UICC (11).

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

Abstract: An alternating-current permanent magnet drainage pump includes a pump cover, a pump body, a magnetic core, a rotating shaft, a stator core and coils. The coils are wound around a coil former, and the stator core is assembled to the coils. The pump body is a shell formed by surrounding a contour of the coils, the coil former, and the stator core which have been assembled to perform an integrated injection molding. The shell defines a magnetic core accommodating space used for accommodating the magnetic core and having an opening at a top portion. The magnetic core accommodating space extends from the opening to a center of the pump body. A supporting member is arranged in the opening at the top portion of the magnetic core accommodating space for supporting a bearing of the rotating shaft.

Abstract: A nanostructured chip includes a substrate and a nanostructured layer, wherein the substrate has a first surface and a second surface on which the nanostructured layer is formed. A method of producing the nanostructured chip includes the step of forming the nanostructured layer on the second surface of the substrate. Whereby, the nanostructured layer effectively disperses a stress to increase the flexural strength of the nanostructured chip. Therefore, during the subsequent procedures to form an epitaxial layer on the first surface, the nanostructured layer is helpful to prevent the epitaxial layer from generating cracks, and prevent the substrate from bowings, or fragments.

Abstract: A stretchable circuit board has stretchability as well as flexibility of the flexible substrate and retains mechanical and electrical properties even under larger deformation such as bending, twisting, etc. The liquid metal pattern can exhibit stretchability almost the same as that of the polymer substrate due to the liquid metal being fully wetted on the substrate with metal patterns based on the wetting behavior of the liquid metal. Therefore, the stretchable circuit board can achieve both mechanical and electrical properties even under physical deformation such as bending, stretching and twisting. It is demonstrated that the stretchable circuit board can be effectively applied to wearable tactile interfaces, stretchable solar cell arrays, stretchable displays, and wearable electronic devices.

Abstract: Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, A radio-frequency (RF) module comprises a lead-frame package with a plurality of pins and at least one pin exposed from overmold compound. The module further includes a metal-based covering over a portion of the lead-frame package. Additionally, the metal-based covering can be in contact with the at least one pin.

Abstract: The invention relates to a mold for encapsulating electronic components mounted on a carrier, with at least two mold parts which are displaceable relative to each other for engaging with a mold cavity round electronic components, and at least one feed for encapsulating material recessed into the mold parts and connecting to the mold cavity. The invention also relates to a carrier with encapsulated electronic components. The invention further relates to a method for encapsulating electronic components and to the thus manufactured encapsulated separated components. The carrier is provided with a plurality of recessed through-openings located at a distance from the electronic components and an encapsulation arranged round the electronic components, wherein through-openings are recessed into the encapsulating material and wherein some of the through-openings recessed into the carrier coincide at least partially with the through-openings recessed into the encapsulating material.

Abstract: A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.

Abstract: A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region.

Abstract: A housing for storing therein a circuit board, includes: a through hole; an electrically conductive pattern passing through inner walls of the through hole so as to be stretched from the outside surface of the housing to the inside surface of the housing, and being electrically connected to the circuit board; and a plug member with which the through hole is filled, the through hole having openings on the outside and the inside, respectively, of the housing, and the opening on the outside of the housing being larger than the opening on the inside of the housing.

Abstract: A method of manufacturing a packaged semiconductor device includes forming an assembly by placing a semiconductor die over a substrate with a die attach material between the semiconductor die and the substrate. A conformal structure which includes a pressure transmissive material contacts at least a portion of a top surface of the semiconductor die. A pressure is applied to the conformal structure and in turn, the pressure is transmitted to the top surface of the semiconductor die by the pressure transmissive material. While the pressure is applied, concurrently encapsulating the assembly with a molding compound and exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter.

Abstract: A wireless vibration sensor suitable for connection to a distributed industrial control system arranged with a wireless network for communication of process data or control information. The wireless vibration sensor includes at least one sensor, a wireless radio transmitter, and a base part for mounting it firmly on equipment or a structure. The wireless sensor is arranged with a battery and a power storage device. A method for powering up the wireless sensor during active cycles is also described.

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract: A container breach detector system to monitor breaches of a transportation container. A self-contained container breach detector provides activation, status, and/or breach event date and time stamp data and a unique identification number of a communication tower, for a user to determine when and where authorized and/or unauthorized breaches of the transportation container occurred. Furthermore, the self-contained container breach detector serves as a recording device to record the activation, status, and/or breach event date and time stamp data; and communicates via various communication means including text via short message service, SMS, and/or e-mail. A container breach detector is intended for a one-time use only, to be discarded at destination. Each container breach detector has individual serial numbers.

Abstract: Methods and apparatuses for assembly of a non-planar device based on curved chips are described. Slots may be created as longitudinal openings in the chips to reduce bending stresses to increase allowable degrees of deformation of the chips. The chips may be deformed to a desired deformation within the allowable degrees of deformation via the slots. Holding constraints may be provided on at least a portion of the chips to allow the chips to remain curved according the desired deformation.

Abstract: A molded flip-chip semiconductor package includes a leadframe having opposing first and second main surfaces, a first metallization on the first main surface, a second metallization on the second main surface, recessed regions which extend from the second main surface toward the first main surface, and spaced apart leads chemically etched into the leadframe between gaps in the first metallization. The package further includes a semiconductor die having a plurality of pads facing and attached to the leads of the leadframe, a first molding compound that fills the recessed regions, and a second molding compound that encases the semiconductor die and fills the space between the leads such that the second molding compound abuts the first molding compound. A is the overall thickness of the leadframe, B is the spacing between adjacent ones of the leads, and B/A<1.

Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

Abstract: Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.

Abstract: A field device with a housing for accommodating an electronics unit. The housing is pot shaped and composed of a non-conductive material, wherein at least one line guide passageway with a screw thread is provided on the housing, wherein the line guide passageway is provided with a conductive coating in the region of the thread, and wherein the screw thread has at least one groove in at least one region extending in the axial direction of the line guide passageway.

Abstract: A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.

Abstract: An electronic component includes a lead wire, a functional element, and an outer housing. The lead wire includes a leader electrode made of metal containing aluminum, a metal wire containing tin, and a welded section formed by welding a first end of the metal wire to a first end of the leader electrode. A second end of the leader electrode is connected to the functional element. The outer housing seals the functional element therein such that a second end of the metal wire is led out therefrom. The lead wire further includes a resin film coating the welded section at least at a portion not covered with the outer housing. Resin material for the resin film has pierce strength of 0.05 MPa/?m per unit thickness or greater and an elastic coefficient of 10 GPa or less.

Abstract: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.

Abstract: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.

Abstract: The package comprises a chip and a plurality of frame contact pads. The chip is attached to the frame contact pads in a die attach area with a die attach adhesive. The chips is coupled to frame contact pads outside the die attach area with connecting elements. The chip, the connecting elements and the frame contact pads outside the die attach area are anchored in an electrically insulating encapsulation. The frame contact pads each comprise a first patterned layer and a second patterned layer, which second layer has the surface that is exposed outside the encapsulation. At least a portion of the frame contact pads in the die attach area has a first patterned layer with a first pattern that comprises at least one flange/lead that is outside the second patterned layer when seen in perpendicular projection of the first layer on the second layer.

Abstract: A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.

Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.

Abstract: A method for manufacturing an integrated circuit package system includes: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing a bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.

Abstract: A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting track carrier electrically coupled to the circuit carrier. The base plate has a continuous recess that is configured and arranged for feeding a casting compound into the cavity between the base plate and the cover plate. The casting compound is embodied to at least partly enclose the circuit carrier and/or the conducting track carrier in a vibration-damping manner.

Abstract: An integrated circuit package system is provided including: forming a die paddle; forming an under paddle leadframe including lower leadfingers thereon; attaching the under paddle leadframe to the die paddle with the lower leadfingers extending under the die paddle; attaching a die to the die paddle; and planarizing the bottom surface of the under paddle leadframe to separate the lower leadfingers under the die paddle.

Abstract: A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.

Abstract: Remote sensor units for a vehicle are described. A remote sensor unit may comprise an electronic assembly. The electronic assembly may comprise an electronic component. The electronic assembly may comprise one or more signal terminals coupled to the electronic component. The electronic assembly may comprise a protective enclosure arranged to encapsulate the electronic component. The protective enclosure is arranged to isolate the electronic component from thermal energy, pressure or residual material stress associated with one or more satellite housings. Other embodiments are described and claimed.

Abstract: A hot melt water-resistant structure includes: an object to be protected from water; and a resin cover for covering an outside of the object and made of hot melt resin. The object includes an exposed surface and a side surface with a sidewall. The exposed surface is exposed from the resin cover. The side surface surrounds the exposed surface. The sidewall protrudes from the side surface continuously or intermittently. The resin cover covers and contacts the side surface with the sidewall.

Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.