Abstract: An electrical connection box is provided with a connector-attached board and a shield case that internally houses the connector-attached board. The connector-attached board is provided with a circuit board, a connector that is fixed to the circuit board and that engages with a mating connector, and an attachment that is attached to the connector. The shield case surrounds the circuit board and is provided with an upper short wall portion and a lower short wall portion that include a connector opening for facing the connector outside. The attachment is provided with a waterproof portion that covers the periphery of an engagement surface of the connector that faces the mating connector, and the waterproof portion is provided with a waterproof wall that covers the periphery of the connector and the mating connector.

Abstract: The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

Abstract: Ascorbate or a pharmaceutically acceptable salt thereof is described for use in carrying out a method, or for the preparation of a medicament for carrying out a method, of enhancing a magnetic resonance imaging (MRI) image of a body or body region such as an organ or organ region in a subject. The method is carried out by parenterally administering ascorbate or a pharmaceutically acceptable salt thereof to the subject in an MRI image-enhancing amount; and then generating, by MRI of the subject, an image of the body or body region. The ascorbate or pharmaceutically acceptable salt thereof enhances the MRI image.

Abstract: A semiconductor device package includes a dielectric layer, a package body and a protection structure. The dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The package body is disposed on the first surface of the dielectric layer. The package body covers a first portion of the lateral surface of the dielectric layer and exposes a second portion of the lateral surface of the dielectric layer. The protection structure is disposed on the second portion of the lateral surface of the dielectric layer.

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor.

Abstract: A sterile aqueous composition suitable for use as an MRI contrast agent includes 100 to 600 mM ascorbate; and 100-600 mM sodium, meglumine, or a combination thereof. The composition preferably has an osmolarity of 200 to 1400 mOsm/L.

Abstract: An electronic device, such as a filter, includes a first substrate having a bottom surface and a top surface, a first side wall of a certain height being formed along a periphery of the bottom surface to surround an electronic circuit disposed on the bottom surface, an external electrode formed on the top surface, the external electrode being connected to the electronic circuit by a via communicating with the bottom surface and a second substrate. The second substrate has a second side wall of a certain height formed along a periphery of a top surface, the second side wall being aligned and bonded with the first side wall to internally form a cavity defined between the bottom surface of the first substrate, the top surface of the second substrate, the first side wall, and the second side wall.

Abstract: An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.

Abstract: An oscillator includes a first resonator element, a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, a first package which is configured to house the first resonator element and the first circuit element, and has a mounting surface and a mounting terminal disposed on the mounting surface, a second resonator element an oscillation frequency of which is controlled based on the first oscillation signal, and a second package which houses the second resonator element and is provided with the second package mounted on the mounting surface of the first package.

Abstract: A casing for an onboard charger includes a sidewall having a first height and an internal wall having a second height less than the first height. A channel is defined by the internal wall and the sidewall. An inlet connects to a first end of the channel and an outlet connects to a second end of the channel. A heat dissipating liquid can flow into the channel through the inlet and out of the channel through the outlet.

Abstract: A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.

Abstract: A semiconductor device includes a first substrate, a second substrate bonded to the first substrate from a first surface of the second substrate, a third substrate bonded to the second substrate from a second surface of the second substrate, a cavity defined by the first substrate, the second substrate and the third substrate; and a viewer window provided in the third substrate and aligned with the cavity; wherein the inside of the cavity is observed through the viewer window.

Abstract: A housing assembly for a mobile terminal includes a housing body, a circuit board, and a fixing member. The housing body has a wiring hole. The circuit board is disposed in the housing body and has an end which passes through the wiring hole and extends out of the housing body. The fixing member is sleevedly attached to the circuit board and engages with the circuit board. An outer sidewall of the fixing member is attached to an inner sidewall of the wiring hole.

Abstract: A semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device includes a base body, and a semiconductor element bonded on the base body via an adhesive member. The adhesive member contains surface-treated particles, or particles that coexist with a dispersing agent. At least a part of the marginal portion of the adhesive member is a region where the particles are unevenly distributed.

Abstract: A seal mold divided structure for combination cable is characterized in that it comprises the following structures: a first cable and a second cable separated from the combination cable; a connector provided at the end of said first cable; a division molding portion that molds the division part between said first cable and second cable and keeps said first cable and second cable separated from each other; a connector molding portion that molds the connection part between said connector and said first cable; a protection tube that protects said first cable, with its ends respectively fixed to said division molding portion and said connector molding portion; and isolation portions, which are respectively inserted from the inner sides of both ends of said protection tube and wrap the exterior of said first cable, capable of preventing inflow of a molding compound.

Abstract: A configuration compensates for the pressure in a housing, in which at least one housing wall has a pressure compensation opening which is sealed with a semi-permeable membrane. The membrane is fixed, at least in a material fit to the housing wall and is covered by a protective element. Accordingly, the housing wall has, in the region of the pressure compensation opening, an indentation and/or recess for receiving the membrane. The respective periphery thereof corresponds to a periphery of the membrane and the height thereof corresponds at least to the thickness of the membrane.

Abstract: An optical system with a base and an image sensor fixed to the base. The optical system includes a holder fixed to the base about the image sensor. The optical system includes a collar oriented about the image sensor and the holder. The optical system includes a lens barrel oriented about the image sensor, the holder, and the collar. The lens barrel includes at least one lens oriented therein. Two of the holder, collar, and lens barrel are threaded together.

Abstract: A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.

Abstract: A housing for an electronic circuit configuration includes a housing seal disposed on an inner surface of the housing, integrally bonded to at least one outer housing wall and made of a liquid silicone elastomer. An electrical connecting element extends from the interior of the housing through an outer housing wall and out of the housing. A space between the outer housing wall and the electrical connecting element is sealed by the housing seal.

Abstract: A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

Abstract: A method for producing an optoelectronic device is specified. A housing base body is formed with a self-healing polymer material. A recess is found in the housing base body. The recess is confined by a bottom surface and at least one side wall which are formed at least in places by the plastic material of the base body. An optoelectronic semiconductor chip has a first main surface, a second main surface facing away from the first main surface and at least one side surface connecting the first main surface and the second main surface with each other. The optoelectronic semiconductor chip is placed in the recess, so that the first main surface is brought in contact with the bottom surface and the at least one side surface is brought in contact with the at least one side wall.

Abstract: In a semiconductor package, surfaces of a die pad, a semiconductor element, a connecting member, and a lead are subjected to a surface treatment with a silane coupling agent. A first surface of a plurality of surfaces of the semiconductor device includes a first region where an organic substance is exposed, and a second region where an inorganic substance is exposed, the first surface being bonded with the connecting member. A bonding strength between the first region and the sealing resin is weaker than a bonding strength between the second region and the sealing resin.

Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

Abstract: Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. One or more embodiments passively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. A protective housing may encase an IR sensor, which may include a sensing element or IR element, a circuit or signal processor, and a housing seal plug. The IR element may be thermally bonded with a frame or conductive top hat.

Abstract: An electronic device includes a substrate, a cavity part formed above the substrate with a functional device placed therein, a coating structure that defines the cavity part, and the coating structure has a first surrounding wall formed around the cavity part above the substrate, a second surrounding wall formed around the cavity part above the first surrounding wall, a coating layer that defines an upper surface of the cavity part, wherein the second surrounding wall is located inside the first surrounding wall in a plan view.

Abstract: A micro electro mechanical system (MEMS) apparatus includes a substrate. The substrate includes a first surface and a second surface. The first surface and the second surface are on opposing sides of the substrate. A programming contact pad is disposed on the second surface of the substrate. A MEMS device is disposed on the first surface of the substrate. An integrated circuit is disposed on the first surface of the substrate and electrically connected to the MEMS device and the contact pad. An anti-fuse region is coupled to the pad and to ground. When the anti-fuse region is not fused, a first electrical path exists from the programming contact pad to the integrated circuit. When the anti-fuse region is fused, a second electrical path is created from the programming contact pad to ground and the first electrical path is no longer available for programming purposes.

Abstract: The present invention relates to prohibiting water ingress in enclosures designed to protect electronics or other stored objects from damage that would occur if the protected stored objects were submerged in water or other liquids. More particularly the present invention, a water ingress prevention enclosure eliminates the need for watertight doors and other sealing gaskets by utilizing an opening in the lowest portion of the enclosure to allow rising water to pressurize the ambient gas trapped in the enclosure thus forming a pressurized chamber to which liquid cannot rise. Embodiments of the invention include a system, apparatus, method and computer implemented code to enable monitoring and storage of one or more stored objects in a liquid-free environment.

Abstract: A meter box cover including a first portion that engages an inner surface of an opening in a lid of a meter box to prevent the passage of the cover through the opening and a second portion that extends through the opening and beyond an outermost surface of the opening in the lid of the meter box. The meter cover blocks substantially an entirety of the opening and the second portion prevents the cover from being displaced within the opening.

Abstract: An electrical control unit comprises a case having a groove on a first contact surface thereof, a cover having a protrusion on a second contact surface thereof, a printed wiring board received in a board receiving space defined between the case and the cover, and an adhesive received in the groove, wherein when the cover is put on the case having the protrusion inserted into the groove, the adhesive in a still soft condition is forced to move toward a space between the first and second contact surfaces for bonding the same, and wherein when the printed wiring board is properly put in the board receiving space, a peripheral outer surface of the board serves as an extra part of an inside wall of the groove.

Abstract: An electrical wire holding device includes a seal retention member having an insertion hole configured to allow an electrical wire to be inserted therethrough, and housed in a mounting hole formed in a mounted member, an outer periphery seal member retained on an outer peripheral surface of the seal retention member, and sealing a gap between an inner surface of the mounting hole and seal retention member, and an electrical wire holding member juxtaposed with the seal retention member along the electrical wire, and having a fixing part configured to retain the electrical wire and fixing the electrical wire to the mounted member. The seal retention member is configured to be relatively movable to the electrical wire holding member.

Abstract: An electric device includes a support substrate 12, an electric circuit 14 provided in a sealing region set on the support substrate 12, an electric wiring provided on the support substrate 12 for electrically connecting an external electrical signal input/output source with the electric circuit 14, a sealing member 16 provided on the support substrate 12 to surround the sealing region, and a sealing substrate 17 bonded to the support substrate 12 with the sealing member 16 interposed therebetween. the electric circuit 14 includes an electronic element 24 having an organic layer, and a width of the sealing member 16 differs between an intersection region in which the electric wiring 15 and the sealing member 16 intersect each other and a non-intersection region excluding the intersection region.

Abstract: A meter box cover including a first portion that engages an inner surface of an opening in a lid of a meter box to prevent the passage of the cover through the opening and a second portion that extends through the opening and beyond an outermost surface of the opening in the lid of the meter box. The meter cover blocks substantially an entirety of the opening and the second portion prevents the cover from being displaced within the opening.

Abstract: An electric device includes a support substrate 12, an electric circuit 14 provided in a sealing region set on the support substrate 12, an electric wiring provided on the support substrate 12 for electrically connecting an external electrical signal input/output source with the electric circuit 14, a sealing member 16 provided on the support substrate 12 to surround the sealing region, and a sealing substrate 17 bonded to the support substrate 12 with the sealing member 16 interposed therebetween. the electric circuit 14 includes an electronic element 24 having an organic layer, and a width of the sealing member 16 differs between an intersection region in which the electric wiring 15 and the sealing member 16 intersect each other and a non-intersection region excluding the intersection region.

Abstract: A flexible display device is provided. The flexible display device includes a flexible plate, a display unit and a sealant. The flexible plate has a concave. The display unit is disposed in the flexible plate and adjacent to the concave. The sealant is formed in the concave and covers the side of the display unit.

Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.

Abstract: Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through the solder part, and has a separation part which is open or closed only in one direction along with the through hole. The upper reinforcing plate supports the upper portion of the separation part. The lower reinforcing plate supports the lower portion of the solder part, and has an elliptical through hole which partially overlaps with the through hole so that the coil passes through the lower reinforcing plate. The soldering part is formed to enable the coil to be secured to the solder part.

Abstract: Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.

Abstract: A weatherproof outlet includes a base plate for coupling to an electrical box and a hinged cover. The base plate has at least one opening for accessing an electrical wiring device such as an electrical receptacle mounted in the electrical box. The top surface of the base plate includes an inner rim and an outer rim having a dimension to shed water away from the access opening and the wiring device. A weatherproof gasket is attached to the top surface of the base plate within the confines of the inner wall and overlying the access opening. The gasket includes a plurality of slits for receiving the prongs of a plug and to form a waterproof seal around the prongs when inserted into the slots of an electrical receptacle.

Abstract: A high voltage wiring system for an electric powertrain is disclosed. The system includes a power conversion unit sealed in a first enclosure. The system also includes at least one second enclosure configured to be sealed and having at least one cable disposed therein. The disclosed system further includes a plurality of wiring termination compartments configured to provide a plurality of electrical termination points. The plurality of wiring termination compartments are separately encased in a material configured to provide a sealed barrier between an outside environment and the plurality of electrical termination points. The disclosed system further includes a source of at least one pressurized gas configured to substantially prevent the ingress of moisture into the first enclosure, the at least one second enclosure, and the plurality of wiring termination compartments.

Abstract: A housing comprising a liquid-tight electric bushing is provided. The housing comprises an opening and a printed circuit board comprising at least first and second layers. The first layer is a top side of the printed circuit board and spans the opening. A first contact element is disposed on the top side and in a blind bore through the first layer that extends to the second layer. The second layer is a conductor track in the interior of the printed circuit board.

Abstract: In an upper surface of a bottom wall of a box body having a part accommodation room formed inside, a recess is provided. In the bottom of the recess, a bolt hole to fix an electrical junction box to a vehicle body is penetrated. In the upper surface of the bottom wall of the body hole, a flat sealing surface is formed to surround an opening of the recess. When an electronic unit is accommodated in the part accommodation room, the bottom surface of the electronic unit is brought into close contact with the sealing surface to close the recess, thus providing a seal between the part accommodation room and recess.

Abstract: A fire and/or water resistant enclosure is provided for housing an operable digital data storage device. The enclosure is a low cost, preferably molded gypsum enclosure having various embodiments for providing resistance to fire occurring outside said enclosure and/or to water. In one embodiment, a fan cooperates with one or more hatchless ventilation passageways to cool the digital data storage device. Another embodiment provides a water resistant pouch surrounding the data storage device which may be made of flexible foil or of finned relatively robust and non-flexible thermal conductor. The enclosure in some embodiments utilizes a fan and in some embodiments operates without a fan. Similarly, the enclosure in some embodiments utilizes movable hatches and in other embodiments is hatchless in design.

Abstract: The invention relates to electrical sensors, which are tight against longitudinal water, and to a process for a simple and cost efficient manufacture, with a tightly closed housing, a sensor element, at least one cable leading out of the housing, wherein the electrical conductors of the cable in the housing comprise a massive cross section without a cavity at least in one longitudinal section, a conductor seal seals the massive cross section against the lead insulation, a lead seal seals the lead insulation against the jacket of the cable, and against all other jackets, and a jacket seal seals the cable jacket against the housing.

Abstract: A disaster resistant data storage module is provided. In a preferred embodiment, the module is sized to fit into a standard drive bay inside the chassis of a personal computer or server. Standard sized hard drives may be utilized. For example a 2.5 inch standard hard drive may be placed in a protective enclosure which is in turn sized to fit in a standard 3.5 inch drive bay. Another aspect of the invention is to provide a highly reflective exterior surface or coating which reflects radiant energy from a fire but which simultaneously conducts heat generated by a data storage device carried within the module.

Abstract: An image display device has: a display panel having a display screen to display an image on a front surface; a case that accommodates the display panel, the case having a standing wall section that surrounds a surroundings edge of the display panel alienating from the surroundings edge; and a cover that covers a portion between the surroundings edge of the display panel and the standing wall section of the case. The device further has: a frame having a putting section where a back surroundings edge of the display panel is placed, and an isolation section touching side of the display panel and it separates between the display panel and the standing wall section of the case; and wiring that passes between the isolation section and the standing wall section.

Abstract: A sealing system for sealing a component (102) within an electronic device (100) is provided. The system includes one or more apertures (206) within an internal housing (202). Further the system includes an adhesive (602), adhered on a first surface to a ledge (502) and bottom perimeter surface 402 of the component. Furthermore, the system includes an external housing (204). The external housing presses the perimeter of the component onto the ledge.

Abstract: Provided is a cover used for a thermostatic apparatus including an inner chamber enclosed with a plurality of walls and a temperature/humidity controller for controlling temperature and humidity in the inner chamber. The cover forms a space with a wall of the plurality of walls by being attached to the wall so as to cover a hole provided in the wall. The cover includes a opening through which a cord-shaped body passes, the cord-shaped body extending from the outside of the inner chamber to the inside thereof through the hole, a peripheral part being in hermetic contact with the wall; a contact part being in hermetic contact with the cord-shaped body in the opening; and a sealant being in hermetic contact with the hole. The cord-shaped body is led through the sealant in hermetic state, and a part of the cord-shaped body is housed in the space.

Abstract: A housing for an electronic circuit is provided with a single-part seal for sealing a clearance space between a floor plate and a cover, through which exposed electrical conductors are led, which connect the circuit on the inside of the housing to the surroundings. The floor plate, the cover and the conductors are made of the same kind of material, e.g., a metal. The floor plate and the cover are made of aluminum and the conductors of copper.

Abstract: An image display device has: a display panel having a display screen to display an image on a front surface; a case that accommodates the display panel, the case having a standing wall section that surrounds a surroundings edge of the display panel alienating from the surroundings edge; and a cover that covers a portion between the surroundings edge of the display panel and the standing wall section of the case. The device further has: a frame having a putting section where a back surroundings edge of the display panel is placed, and an isolation section touching side of the display panel and it separates between the display panel and the standing wall section of the case; and wiring that passes between the isolation section and the standing wall section.

Abstract: A cable cover for an ultrasonic flow meter is disclosed. In some embodiments, the cable cover includes multiple interlockable pieces configured to couple to a spoolpiece of an ultrasonic flow meter. Each interlockable piece includes a body having a dowel and a slot. The interlockable pieces are assembled in a series with the dowel of each interlockable piece inserted into the slot of another interlockable piece.