Abstract: A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, and a signal processing IC are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; a metal member that is partially exposed on a side surface of the encapsulating portion and is spaced apart from the conductor; and an element supporting portion that is comprised of a metal plate or a semiconductor substrate, supports the at least one magnetoelectric conversion element and a metal member on a surface on a same side as the first surface, and is spaced apart from the conductor.

Abstract: In a described example, a circuit includes a sensor circuit including multiple magnetic field sensors having respective sensor outputs. The magnetic field sensors are configured to provide magnetic field sensor signals at the respective sensor outputs representative of a measure of current flow through a conductive structure. A combiner interface has combiner inputs and a combiner output. The combiner inputs are coupled to the respective sensor outputs. The combiner interface is configured to provide an aggregate sensor measurement at the combiner output responsive to the magnetic field sensor signals, in which the aggregate sensor measurement is decoupled from magnetic fields generated responsive to the current flow through the conductive structure.

Abstract: A current-sensing system includes a conductor for carrying a first electrical current generating a first magnetic field. A device, spaced from the conductor by a clearance, includes a semiconductor integrated circuit die in a package. The semiconductor integrated circuit die includes at least one elongated bar of a first ferromagnetic material magnetized by the first magnetic field; a sensor comprising a first coil wrapped around the at least one elongated bar to sense the bar's magnetization; and an electronic driver creating a second electrical current flowing through a second coil wrapped around the at least one elongated bar generating a second magnetic field to compensate the at least one bar's magnetization. The package has a first outer surface free of device terminals. A discrete plate of a second ferromagnetic material is positioned in the clearance and is conformal with the first outer surface of the package.

Abstract: A charging mechanism for charging a stored-energy spring of a stored-energy spring mechanism includes a charging gear coupled to the stored-energy spring, an intermediate shaft coupled to the charging gear, an idler gear that can be driven by a charging motor, a freewheel coupled to the idler gear, and a dog clutch that couples the freewheel to the intermediate shaft in order to charge the stored-energy spring and uncouples same from the intermediate shaft in the charged state of the stored-energy spring. The dog clutch has a first clutch block coupled to the intermediate shaft for conjoint rotation, and a second clutch block connected to the freewheel. The first clutch block can be displaced along an axis of rotation of the intermediate shaft between two end positions and, in an intermediate position between the end positions can be freely rotated only in a direction of rotation with respect to the second clutch block.

Abstract: A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.

Abstract: A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.

Abstract: Embodiments of the disclosure relate to flexible electronic substrates for placement on an external surface of a vehicle motor assembly. In one embodiment, a motor assembly includes a motor comprising an external surface and one or more electronic assemblies positioned on the external surface of the motor. Each electronic assembly includes a metal substrate disposed on the external surface of the motor, a dielectric layer disposed on the metal substrate, a flexible metal base layer disposed on the dielectric layer, a bonding layer disposed on the flexible metal base layer, and one or more electronic devices disposed on the bonding layer. The bonding layer bonds the one or more electronic devices to the flexible metal base layer.

Abstract: A light emitting semiconductor (LES) device having desirable thermal performance characteristics is disclosed. The LES device includes an insulating substrate layer having a plurality of vias formed therein and at least one LES chip mounted on the insulating substrate layer, with each of the LES chips(s) including an active surface including a light emitting area configured to emit light therefrom and a back surface positioned on a top surface of the insulating substrate layer and including connection pads thereon. A conductor layer is positioned on a bottom surface of the insulating substrate layer and in the vias, the conductor layer in direct contact with the connection pads of the LES chip(s) so as to be electrically and thermally connected thereto. An encapsulant is positioned adjacent the top surface of the insulating substrate layer and surrounding at least part of the LES chip(s), the encapsulant comprising a light transmitting material.

Abstract: A PCB mountable sensor having spring electrical contacts and mechanical attachment means is provided. In use, the spring contacts mate with exposed pads on a target PCB to form an electrical interface therebetween. The attachment means releasably secures the sensor to the PCB against the force of the spring contacts. The attachment means can be, for example, an adapter that fits like a collar around the sensor, or can be integral with the sensor. The design of the sensor provides interchangeability with no or limited tools, no PCB resident connectors, and no potential damage to the PCB upon rework or replacement.

Abstract: A support plate has a front face with an electronic chip mounted on the front face. A cover for encapsulating the electronic chip includes a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate. The support plate and the encapsulating cover define a chamber in which the electronic chip is located. A local slot is arranged to extend between the peripheral wall of the encapsulating cover and the support plate. The local slot has an exterior opening and an interior opening leading into said chamber.

Abstract: The present invention relates to a manufacturing method for an electrical connector, comprising the following steps: providing a first strip, a second strip, and a plurality of grounding terminals, power terminals and signal terminals which are located between the first strip and the second strip; forming a first body and a second body onto the grounding terminals, the power terminals and the signal terminals by insert-molding, wherein each grounding terminal comprises an exposed upper contacting portion, an exposed lower contacting portion and a first connecting portion located between the first body and the second body; bending the first connecting portions, assembling a shielding plate into the accommodating space; and forming an insulation block onto the first body and the second body by an insert-molding.

Abstract: A method for manufacturing a liquid crystal polymer-based electrode array for a neural implant, according to the present invention, can comprise the steps of: forming a seed layer on a liquid crystal polymer substrate; forming a plating mold having a pattern selectively exposing a part of the upper part of the seed layer; plating an electrode material on the exposed seed layer by using the plating mold as a plating barrier layer; forming an electrode by removing the plating mold and the seed layer therebelow; embedding the electrode by compressing a liquid crystal polymer cover layer on the electrode; and forming an electrode site exposing the upper part of the electrode by selectively removing a part of the liquid crystal polymer cover layer.

Abstract: A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.

Abstract: Methods and systems for reducing microbial contamination and growth in an automotive HVAC system by irradiating one or more air contacting surfaces of the HVAC system with antimicrobial UV-C light.

Abstract: A packaged assembly for high density power applications includes a case having shelves on opposing walls, and a double-sided substrate disposed on the shelves of the case, the double-sided substrate having a semiconductor die on a first side of the double-sided substrate and circuit elements on a second side of the double-sided substrate. The case includes aluminum silicon (AlSi). The double-sided substrate is secured to the case by an epoxy. The double-sided substrate a thick film substrate and includes beryllium oxide (BeO) or aluminum oxide (Al2O3). The semiconductor die on the first side of the double-sided substrate is coupled to at least one of the circuit elements on the second side of the double-sided substrate by a through substrate via. The packaged assembly also further includes invertible leads coupled to the double-sided substrate by lead frames.

Abstract: An interposer of silicon for use in a semiconductor module, wherein the interposer has a top side serving for arrangement of functional semiconductor and an underside and is subdivided into a connection layer and a thermal layer along a plane running between the top side and the underside. The connection layer forming the surface of the interposer has a network with contact pads arranged on the surface for connection of the functional semiconductors arranged on the surface of the interposer, while the thermal layer has no metallization, and the underside of the interposer formed by the thermal layer serves for dissipating the heat generated by the functional semiconductors.

Abstract: An electronic component mounting substrate includes an electronic component mounted on a surface of a substrate, an electrode portion disposed on the surface of the substrate and electrically connected to the electronic component, a lead wire connected to the electrode portion, and an encapsulation resin configured to encapsulate a part of the lead wire, the electronic component, and the electrode portion. A surface of at least the part of the lead wire encapsulated by the encapsulation resin and the surface of the substrate are coated with a deposited film.

Abstract: A light emitting device mount includes a positive lead terminal, and a negative lead terminal. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly.

Abstract: An embodiment device includes a first die, a second die, one or more redistribution layers (RDLs) electrically connected to the first die, a plurality of connectors on a surface of the one or more RDLs and a package substrate electrically connected to the first die and the second die. The package substrate is electrically connected to the first die through the one or more RDLs and the plurality of connectors. The package substrate comprises a cavity, and the second die is at least partially disposed in the cavity.

Abstract: An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.

Abstract: The present invention provides a valve timing control device that can suppress a leakage of noise to the outside of the device and can improve reliability without needlessly increasing the volume occupied by the device.

Abstract: A lead frame for mounting semiconductor element includes a protrusion that is horizontally projects from edges of the upper and lower surfaces of a semiconductor-mounting part or a terminal part of the lead frame and that is provided on a lateral side of at least one of the semiconductor-mounting part or the terminal part of the lead frame, wherein the top end of the protrusion is substantially flat or the profile of the cross section of the top end is arc-shaped, and the top end of the protrusion is thick.

Abstract: A high-frequency package comprises a ground lead, connected to a die, occupying a side of the high-frequency package, wherein a slot is formed within the ground lead; and a signal lead, connected to the die, disposed within the slot; wherein the ground lead surrounds the signal lead, and the ground lead and the signal lead form as a ground-signal-ground structure.

Abstract: A semiconductor package formation arrangement includes a mold housing with an interior cavity having top, bottom and first and second end sides. A gate for transferring liquefied molding material extends to the first end side. A lead frame having a top surface, a rear surface opposite the top surface and a mold flow modifier forms a first cavity section between the top surface and the top side and a second cavity section between the rear surface and the bottom side. A topology of the lead frame causes liquefied molding material to fill the first and second cavity sections at different rates. The mold flow modifier extends away from the lead frame so as to compensate for the difference between the first and second rates.

Abstract: An integrated circuit package has an exposed die pad with a trench and openings in the trench that are filled with encapsulant to form an encapsulant ring near the edges of the die pad. During assembly, the encapsulant passes through the openings and fills the trench to form the encapsulant ring. The ring helps to keep the die pad from separating from the encapsulant caused by thermal cycling. Air vents might be included in the die pad surface to allow air to escape from the trenches and the openings as they fill with encapsulant. Trenches from the openings to the die pad edge on the chip-side of the die pad might be included to increase adhesion of the encapsulant to the die pad.

Abstract: A metallic ring is located on a multilayer ceramic substrate. An optical semiconductor laser is located on the multilayer ceramic substrate, inside the metallic ring. A metallic cap with a window is joined to the metallic ring. The metallic cap covers the optical semiconductor laser. An external heat sink is joined to an external side surface of the metallic cap. These features make it possible to improve high-frequency characteristics, producibility, and heat dissipation.

Abstract: The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.

Abstract: A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad by a bond pad clearance distance. A second set of bond pads is arranged in second row adjacent the first row of bond pads. Each bond pad in the second row may be connected to one of the plurality of lead lines on the first level that is routed between adjacent bond pads in the first row. Since the bond pads in the first row are on a different level then the lead lines, the bond pads may be spaced close together.

Abstract: A method for fabricating a leadframe strip is disclosed. A leadframe pattern is formed from flat sheet of base metal. Additional metal layers are plated on patterned tape of base metal and the leadframe surface is roughed. A first set of leadframe areas is planished. A second set of leadframe areas are offsetted and the tape is cut into strips.

Abstract: A wire harness including a wire fitting that holds a wire in a predetermined shape is provided. A wire fitting includes a base molded to an uneven plate-shape and a cover covering a wiring space of the base. In the base, an outer frame portion formed projecting around the wiring space on a wiring portion forming a bottom plate includes an inner edge step portion, an intermediate plate portion, and an outer edge step portion. In the intermediate plate portion, which projects outward, a plurality of through holes for wire fastening are formed linearly along the perimeter of the wiring space, the number of the through holes for wire fastening being at least the number of wire fasteners attached to that portion of a wire that extends from the wiring portion to the outside thereof.

Abstract: A current sensor packaged in an integrated circuit package to include a magnetic field sensing circuit, a current conductor and an insulator that meets the safety isolation requirements for reinforced insulation under the UL 60950-1 Standard is presented. The insulator is provided as an insulation structure having at least two layers of thin sheet material. The insulation structure is dimensioned so that plastic material forming a molded plastic body of the package provides a reinforced insulation. According to one embodiment, the insulation structure has two layers of insulating tape. Each insulating tape layer includes a polyimide film and adhesive. The insulation structure and the molded plastic body can be constructed to achieve at least a 500 VRMS working voltage rating.

Abstract: An electrical control unit comprises a case having a groove on a first contact surface thereof, a cover having a protrusion on a second contact surface thereof, a printed wiring board received in a board receiving space defined between the case and the cover, and an adhesive received in the groove, wherein when the cover is put on the case having the protrusion inserted into the groove, the adhesive in a still soft condition is forced to move toward a space between the first and second contact surfaces for bonding the same, and wherein when the printed wiring board is properly put in the board receiving space, a peripheral outer surface of the board serves as an extra part of an inside wall of the groove.

Abstract: A circuit assembly that includes a planar lead frame formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The circuit assembly also includes a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness. The top-side terminal is configured to be inserted into a hole defined in a section and form an electrical connection to the section, wherein the top-side terminal protrudes from the routing plane.

Abstract: A leadframe (e.g., incorporated in a device package) includes a feature (e.g., a die pad or lead) with a vent hole formed between first and second opposed surfaces. The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion). The vent hole may be formed from a first opening extending from the first surface toward the second surface to a first depth that is less than a thickness of the leadframe feature, and a second opening extending from the second surface toward the first surface to a second depth that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

Abstract: A lead frame includes an outer lead and a plating layer that covers a lower surface and side surfaces of the outer lead. The plating layer does not cover the upper surface of the outer lead. A frame base material is exposed from the plating layer at the upper surface of the outer lead.

Abstract: A mount includes a terminal, and a resin portion. The terminal includes a first surface, a second surface, and an end surface having first and second recessed areas that are extend from the first and second surfaces, respectively. The resin portion is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point that is positioned closest to the first surface, and an extension part that extends outward of the closest point and toward the second surface side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract: The embodiments described herein provide for a packaging configuration that provides leads or connections for a packaging substrate from opposing surfaces of a package. Through silicon vias (TSV) are provided in order to accommodate additional input/output (I/O) pins that smaller dies are supporting. Various combinations of packages are enabled through the embodiments provided.

Abstract: A Ferritic stainless steel, non Ferritic stainless steel or carbon steel based lead frame and method for producing same is provided. The lead frame is preferably used for TantalumNiobium capacitors but could possibly be applicable to other integrated circuits with the same operating parameters. Any reference to Tantalum capacitors in this application applies equally to Niobium capacitors unless otherwise noted. The lead frame is prepared by choosing one of Ferritic stainless steel, non Ferritic stainless steel or carbon steel as a base metal and rolling it to a final required thickness. The base metal is then preferably plated with a nickel strike or other conventional barrier layer and then with final outer plating layers(s). The exact thickness and choice of layering varies and can be tailored to meet the requirements of each lead attach process.

Abstract: A method of assembling semiconductor devices includes dispensing a metal paste including metal particles in a solvent onto a bonding area of a plurality of metal terminals of a leadframe. The dispensing provides a varying thickness over the bonding area. The solvent is evaporated to form a sloped metal coating including a first sloped top face and a second sloped top face. The first sloped top face is closer to the die pad compared to the second sloped top face, the second sloped top face increases in coating thickness with decreasing distance to the die pad, and the first sloped top face decreases in coating thickness with decreasing distance to the die pad. A bottom side of semiconductor die including a plurality of top side bond pads is attached to the die pad. Bond wires are connected between the bond pads and the second sloped top faces.

Abstract: A leadframe (e.g., incorporated in a device package) includes a feature (e.g., a die pad or lead) with a vent hole formed between first and second opposed surfaces. The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion). The vent hole may be formed from a first opening extending from the first surface toward the second surface to a first depth that is less than a thickness of the leadframe feature, and a second opening extending from the second surface toward the first surface to a second depth that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

Abstract: A metal leadframe strip (500) for semiconductor devices comprising a plurality of sites (510) for assembling semiconductor chips, the sites alternating with zones (520) for connecting the leadframe to molding compound runners; the sites (510) having mechanically rough and optically matte surfaces (511, 512); the zones (520) having at least portions with mechanically flattened and optically shiny metal surfaces (521, 522); and the flattened surface portions transitioning into the rough surface portions by a step.

Abstract: Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.

Abstract: A circuit assembly that includes a planar lead frame formed of electrically conductive material having a first thickness. The lead frame is configured to define a routing plane and a plurality of coplanar sections in the routing plane. The circuit assembly also includes a top-side terminal formed of electrically conductive material having a second thickness independent of the first thickness.

Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a bending portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the bending portion within a resin application portion, crack occurred in a narrow wiring width can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a bending portion formed on one of the first lead and the second lead wherein the bending portion is formed within a resin application portion.

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract: A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Abstract: A metal lead frame strip is provided for use in manufacturing a packaged electrical device. An engagement portion of the lead frame strip is encapsulated together with the electrical device in a block of encapsulating material to physically secure the lead frame strip to the device package. The device package is later physically separated from the lead frame strip without leaving residual metal exposed on the separated device package.

Abstract: A packaged semiconductor is disclosed. The packaged semiconductor comprises a conductive integral frame that includes an inner portion and a ring portion encircling the inner portion, a semiconductor die that is mounted to a first surface of the inner portion of the conductive frame, and a casing that supports the conductive frame and covers the semiconductor die. Sections of the conductive frame that connect the inner portion to the ring portion are removed after the casing is applied to the conductive frame.

Abstract: The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a recess formed in the casing and extending into the casing, an insert secured with the casing and extending about the recess defining a portion of a surface of the recess with the insert comprising a reflective surface exposed along the recess, and a plurality of leads partially exposed through the recess.