Abstract: A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.

Abstract: An antenna amplifier has its printed circuit board clamped between upper and lower housing parts which have peripheral edges raised to engage the periphery of the circuit board between them. A recess in the housing part can clear a plug connector on the circuit board. Resilient catches can connect the housing parts to apply pressure on the circuit board.

Abstract: A fire resistant, forced air cooled enclosure for one or more computer digital data storage devices is provided. An operable digital data storage device is mounted in a fire resistant enclosure. One or more openings are formed in the enclosure. A movable fire resistant hatch is positioned adjacent each of the openings and each hatch is movable between a closed position in which it closes the opening and an open position allowing ambient air to pass therethrough. A fan is positioned either inside or outside of the enclosure for actively driving ambient air through the opening to cool the data storage device. A hatch closure system is provided for closing each of said hatches automatically in the presence of a threshold temperature. The hatch closure system includes a temperature sensitive element which, when activated in the presence of the threshold temperature, causes the hatch to move to its closed position.

Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

Abstract: There is provided a semiconductor device comprising a semiconductor chip whose main surface comprises first electrode pads; a wiring portion electrically connected to the electrode pad and including a bump portion that protrudes upward in a vertical direction with respect to the main surface; a sealing layer covering the perimeter and main surface of the chip; and a re-distribution wiring layer which electrically connected to the wiring portion and extending from a first portion of the sealing layer over the main surface to a second region of the sealing layer outside the first region.