Abstract: In a system for providing electrolyte to an electrolysis cell for producing hydrogen gas to inject into the intake of an internal combustion engine, a water store is in communication with a water supply line, for replenishing the level of electrolyte solution used by the electrolysis cell. A valve which may be disposed at a level below the level of the water supply line and is opened, for example upon deactivation of the engine, to drain the water out of the water supply line and prevent freezing in sub-freezing temperatures.

Abstract: Systems and methods for hydrogen generation based on the hydrolysis of a solid fuel are disclosed. The hydrogen generator comprises a fuel chamber for storing a solid chemical hydride and a chamber for storing a liquid reagent, and a liquid outlet disposed within the fuel chamber. The contact between the solid chemical hydride and the liquid reagent produces a substantially fluid nongaseous product and hydrogen gas. The fuel chamber is configured for movement relative to the outlet within the fuel chamber, thereby causing relative movement between the liquid outlet and unreacted solid fuel.

Abstract: The invention relates generally to a desludging system for electrolytic cells for metal production in the hydrometallurgical industry. Specifically, it relates to a system for desludging cells, preferably for copper cathodes, which comprises removable collectors for lead sludge accumulated at the bottom of cells. Collectors are located at the bottom of the cell and lead sludge is transported towards trays which are later removed from the cell with the sludge thereon without having to stop the cathode production.

Abstract: Electrochemical apparatus and processes for the point-of-use production of cleansing, sanitizing, and antimicrobial agents, such as sodium hypochlorite (NaOCl) or hypochlorous acid (HOCl). The processes may be used to produce NaOCl from seawater, low purity un-softened or NaCl-based salt solutions. HOCl may be produced from HCl solutions and water. NaOCl is produced using a sodium ion conductive ceramic membrane, such as membranes based on NASICON-type materials, in an electrolytic cell. HOCl is produced using an anion conductive membrane in an electrolytic cell. The cleansing, sanitizing, and antimicrobial agent may be generated on demand and used in household, industrial, and water treatment applications.

Abstract: A device and process is presented for producing hydrogen peroxide on an as needed basis is disclosed. The process and device produces hydrogen peroxide on a small scale without the addition of chemicals and disposal of waste streams.

Abstract: An oxygen emitter which is an electrolytic cell is disclosed. When the anode and cathode are separated by a critical distance, very small microbubbles and nanobubbles of oxygen are generated. The very small oxygen bubbles remain in suspension, forming a solution supersaturated in oxygen. A flow-through model for oxygenating flowing water is disclosed. The use of supersaturated water for enhancing the growth of plants is disclosed. Methods for applying supersaturated water to plants manually, by drip irrigation or in hydroponic culture are described. The treatment of waste water by raising the dissolved oxygen with the use of an oxygen emitter is disclosed.

Abstract: The present invention provides a system for generating hydrogen gas in an aqueous solution based electrolytic or galvanic cell wherein the cathode is made from aluminum or an aluminum alloy. In a preferred arrangement the cell is a galvanic cell and cathode is made from aluminum or aluminum alloy and the anode is made from magnesium or magnesium alloy.

Abstract: A method of operating an integrated hydrogen production and processing system is provided. The method includes operating an electrolyzer to produce hydrogen from water and utilizing heat generated from the electrolyzer to increase a temperature of an electrolyte in a first mode of operation. The method also includes heating the electrolyte in a second mode of operation by extracting heat from a hydrogen compressor to increase or maintain the temperature of the electrolyte during periods when electrolysis is not performed in the electrolyzer or during startup of the electrolyzer.

Abstract: The present invention relates, generally, to a method and apparatus for electrowinning metals, and more particularly to a method and apparatus for copper electrowinning using the ferrous/ferric anode reaction and a flow-through anode, such as, for example, a dimensionally stable carbon, carbon composite, metal-graphite, or stainless steel anode. In general, the use of a flow-through anode—coupled with an effective electrolyte circulation system—enables the efficient and cost-effective operation of a copper electrowinning system employing the ferrous/ferric anode reaction at a total cell voltage of less than about 1.5 V and at current densities of greater than about 26 Amps per square foot (about 280 A/m2), and reduces acid mist generation. Furthermore, the use of such a system permits the use of low ferrous iron concentrations and optimized electrolyte flow rates as compared to prior art systems while producing high quality, commercially saleable product (i.e.

Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.

Abstract: Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having a plurality of electrodes and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrodes. The chamber further includes a barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The barrier can be a porous, permeable barrier or a nonporous, semipermeable barrier.

Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.

Abstract: A method and apparatus are provided for the electrochemical treatment of an aqueous solution in an electrolytic cell. Output solution having a predetermined level of available free chlorine is produced by applying a substantially constant current across the cell between an anode and a cathode while passing a substantially constant throughput of chloride ions through the cell.

Abstract: The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is tilted to promote turbulent electrolyte flow in a space between a bottom surface of the semiconductor wafer and top surface of the trough-shaped receptacle.

Abstract: A chemical control system for controlling the chemistry of a chemical solution having predetermined chemical constituents in a plating system, such as a NiFe plating system, employs a mix container for containing a plating solution and a hold container for containing a plating solution delivered from the mix container. A precision delivery arrangement delivers a precise predetermined quantum of a predetermined constituent of the plating solution to multiple mix containers and the hold containers. Transfer of plating solution between the mix and hold containers is effected by a transfer pump. Nitrogen gas that has been humidified with deionized water protects the plating solution from either acquiring water or becoming dehydrated, the humidified nitrogen gas being humidified to a predetermined relative humidity with respect to the temperature of the plating solution in the mix container. This is achieved by urging the nitrogen gas through a column that is at the same temperature as the plating solution.

Abstract: A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.

Abstract: The present invention is an apparatus and method for disinfecting or sanitizing a desired object. The apparatus includes a container for an aqueous solution; the container may be a spray bottle. The apparatus includes an electrolytic cell, containing an electrolyte, an electrical power source, a control circuit for providing an electric charge to the electrolyte to create an oxidant, and a fluid connection between the cell and container to permit introduction of the oxidant into the aqueous solution to create a disinfectant.

Abstract: A plating apparatus for plating a substrate. The apparatus is provided with a plating unit, a substrate cleaning unit, a substrate transport mechanism, a post-treatment agent supplying section, a minor constituent managing section for managing minor constituents (an accelerator, a retarder and chlorine) of a plating liquid being used in the plating unit, an enclosure which houses therein a substrate treating section including the plating unit, the cleaning unit and the substrate transport mechanism, and a system controller for controlling the entire apparatus.

Abstract: A process for dissolving metals, in particular tin, and a plant for dissolving metals operating according to said process allow to minimize the quantity of metal in the sludge and the oxygen consumption, and entail a first step in which in a first reactor an effective quantity of oxygen is solubilized in an electrolytic solution obtaining an oxygen-enriched electrolytic solution; and a second step, distinct from the former, in which in a second reactor said oxygen-enriched solution is flown through a bed of metal for the deposition in a metallic form.

Abstract: Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the anode 2, especially in the area of top surface 8. A passageway 4 for electrolyte 5 is between anode 2 and wall 3. Mesh 11 is located at a throat section 12 of passageway 4 shortly before the start of the guide 7. In addition, mesh 13 is located further upstream in passageway 4 as an alternative and/or as an addition to mesh 11. Guide 7 of wall 3, serrations 9, and meshes 11 and 13 enhance and maximize the production of stream-wise vortices. These vortices cause a substantial increase in the ion flow, which overcomes boundary layers and results in additional deposition of copper onto the web 6.

Abstract: In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of the electrolyte fluid through one auxiliary cell provided with one insoluble auxiliary anode and at least one auxiliary cathode, a current being conducted between them by applying a voltage. Accordingly, excess quantities of the oxidized substances of the redox system are reduced at the auxiliary cathode, the formation of ions of the metal to be deposited being reduced as a result thereof. Starting from this prior art, the present invention relates to using pieces of the metal to be deposited as an auxiliary cathode.

Abstract: A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a purification system configured to remove at least a portion of the at least one byproduct from the plating substance. The purification system comprises at least a first processing vessel, a second processing vessel, and a flow path providing flow from the first processing vessel to the second processing vessel. The flow path may be configured such that the flow from the first vessel to the second vessel is caused by gravity. A method is also provided for removing at least a portion of at least one byproduct from a plating substance used in a plating cell.

Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having a cell body configured to contain a plating solution therein. An anode assembly is immersed in a fluid solution contained in the cell body, the anode being positioned in an anode compartment of the cell body. A cathode assembly is positioned in a cathode compartment of the cell body, and a multilevel diffusion differentiated permeable membrane is positioned between the anode compartment and the cathode compartment. The multilevel diffusion differentiated permeable membrane is generally configured to separate the anode compartment from the cathode compartment, while allowing a fluid solution to flow therethrough in a direction from the anode compartment towards the cathode compartment.

Abstract: A washing, cleaning and sterilizing solution is produced by electrolyzing an electrolyte solution composed of mixed caustic soda and salt in an electrolyzer. The solution is used as it is or diluted with tap water or non-potable water. The solution is applicable to washing, cleaning and sterilizing metal goods, medical instruments, nursing products, foodstuff, farm products, marine products, dishes, cooking utensils, plastic goods, surrounding, facilities, fiber products, machine parts, machine goods, various containers, electrical communication components, vehicles, or the like.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: A method of operating a cell for electrowinning of copper, the cell including a plurality of anodes and cathodes therein, the method including the steps of introducing fresh electrolyte and sparging gas to a manifold system in the cell, controlling flow of fresh electrolyte and sparging gas in the manifold system and providing outlet openings in the manifold system such that streams of fresh electrolyte and sparging gas from the outlet openings are directed relatively uniformly across the cathodes in the cell.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: A plating processing device is so arranged that at least a part of a portion touching plating liquid is made of a material whose change rate of surface roughness in response to a removing agent is lower than resin when the material and the resin are measured in the same conditions. For example, a storage tank (1), a plating processing tank (2), a buffer tank (3), and a pipe (9) are made of hard glass and quartz glass. With this, it is possible to prevent a plating material from being deposited as foreign body on wall surfaces of the plating processing tank, etc.

Abstract: A separating element for separating the bottom part of an electrolytic tank from the rest of the tank space in connection with the removal of solids settled on the bottom of the electrolytic tank, said separating element being installable in the electrolytic tank and removable therefrom along a path formed by support and control members arranged in the electrolytic tank. The separating element comprises a flexible wall element and at least one set of support members arranged in the wall element.

Abstract: An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.

Abstract: The present invention pertains to methods and apparatus for electroplating a substantially uniform layer of a metal onto a work piece having a seed layer thereon. The total current of a plating cell is distributed among a plurality of anodes in the plating cell in order to tailor the current distribution in the plating electrolyte to compensate for resistance and voltage variation across a work piece due to the seed layer. Focusing elements are used to create “virtual anodes” in proximity to the plating surface of the work piece to further control the current distribution in the electrolyte during plating.

Abstract: A portable oxidant generator for generating a chlorine or chlor-oxygen solution suitable for sterilizing contaminated drinking water, thereby providing a water disinfection system and potable water. The oxidant generator includes an electrolytic chamber and a power supply or source. The chamber holds a salt brine solution such that the solution is in contact with an anode and cathode included in the chamber. The power supply provides electrical charge that is passed between the anode and cathode through the salt brine solution. In the preferred embodiment of the present invention, a combination manual pump/switch is activated and injects electrolyte into the cell chamber and electrolyzes the solution. In one embodiment, as electrolysis proceeds, hydrogen gas is liberated and causes a gas pressure within the cell chamber thereby forcing the freshly generated oxidant solution from the cell.

Abstract: An plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plate, of a material to be plated. The plating apparatus includes a holding portion having a heating portion for holding a material to be plated in such a state that a surface to be plated faces downward, and a plating bath for introducing an electroless plating liquid having a predetermined temperature into a plating chamber, and holding the electroless plating liquid while allowing the electroless plating liquid to overflow an overflow dam. The material which is by the holding portion, is brought into contact with the plating liquid in the plating bath to plate the material.

Abstract: An identification system for tools such as sockets includes an electro-plating section and a dyeing section respectively defined in an outer surface of the tools. The arrangement of the electro-plating section and the dyeing section can be various fashions so as to present different meanings to the users.

Abstract: A microfluidic system and method, suitable for “lab-on-a-chip” applications, by which a bubble is inflated in fluid flowing through a microfluidic channel at a predetermined location along the channel and the bubble is maintained at that location to stop flow through the channel in the manner of a valve. The microfluidic channel is formed on a semiconductor chip and a pair of electrodes is formed one on each side of the channel, whereby a bubble is electrochemically inflated between the electrodes and held in fixed position by the channel wall when a voltage is applied across the fluid incident to connecting the electrodes to a voltage source. When the voltage is removed, deflation of the bubble valve rapidly occurs to restore flow. The present invention provides flow control in a microfluidic system regardless of channel cross-sectional geometry and with no moving parts and low power consumption. Moreover, the present invention may be practiced using existing fabrication techniques.

Abstract: A method and an apparatus for purifying water including groundwater contaminated with a pollutant such as organohalogenated compounds are provided. The contaminated water is purified by aeration to expel the pollutant into gas phase, and the pollutant containing gas is then mixed with a chlorine-containing gas under light irradiation to decompose the pollutant, where the chlorine-containing gas may generated from functional water by aeration.

Abstract: An automated chemical management system for managing the chemical content of an electrochemical bath used to deposit a material on the surface of a microelectronic workpiece is set forth. The automated chemical management system includes a dosing system that is adapted to dose an amount of one or more chemicals to replenish a given electrochemical bath constituent in accordance with a predetermined dosing equation. The chemical management system also includes an analytical measurement system that is adapted to provide a measurement result indicative of the amount of the given constituent in the electrochemical bath at predetermined time intervals. The chemical management system uses the measurement results to modify the dosing equation of the dosing system. In this manner, the replenishment operations executed by the chemical management system are effectively refined over time thereby providing more accurate control of the amount of the target constituent in the electrochemical bath.

Abstract: In an electrolytic apparatus that passes a strip between paired members of a liquid throttle unit provided on at least one of an inlet side and an outlet side of a treatment cell through which the strip is continuously passed, an electrolytic apparatus with strip non-contacting liquid throttle unit is provided which is characterized in that the spacing between the paired members of the liquid throttle unit is set very slightly larger than the thickness of the passed strip to maintain the surfaces of the strip and the liquid throttle unit members, e.g. a seal roll, nozzle device or wedge-shaped block, in a non-contacting state.

Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.

Abstract: A water treating apparatus is provided which is capable of producing a hypochlorous acid-containing electrolytic water having a satisfactory sterilizing ability in a household. The water treating apparatus is an apparatus for producing hypochlorous acid in for-treatment water containing a salt by use of an electrochemical reaction which occurs in the for-treatment water when a direct current voltage is applied to at least a pair of electrodes oppositely disposed in the for-treatment water, wherein the direct current voltage to be applied to the electrodes is obtained by smoothing an alternating voltage of domestic use power supply into direct current power of a predetermined voltage, an electrode having titanium covered with a coating containing at least palladium or-ruthenium is used as an anode, and at most 90% of the salt added to the for-treatment water is converted into hypochlorous acid by the electrochemical reaction.

Abstract: An anode is configured to be used within a metal film plating apparatus. The anode has a substantially planar electric field generating portion and an electrolyte solution chemical reaction portion. The planar electric field generating portion is coated with an inert material that is impervious to the electrolyte solution. In one embodiment, the anode is formed as a perforated anode. In one aspect, the electric field generating portion is formed contiguous with the electrolyte solution chemical reaction portion. In another aspects, the planar electric field generating portion is formed as a distinct member from the electrolyte solution chemical reaction portion.

Abstract: An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame comprises a resin selected from the group consisting of acrylic resins, polyvinyl chloride resins and polycarbonate resins. A metal filament, for connection to the negative pole of a source of electrical energy, extends from the first projection to the second projection. Adjacent to the metal filament a first conductive plate is attached to the insulating frame at a first distance from the metal filament. A second conductive plate attaches to the insulating frame at a second distance from the metal filament. The first plate and the second plate are adapted for connection to the positive pole of a source of electrical energy.

Abstract: This invention is directed toward a process of manufacturing, including a technique of assembling parts of an apparatus. The technique includes forming electrode structures on a substrate, suspending the apparatus part or parts in a dielectric medium between electrodes of the electrode structure, and using near-field (that is, short range) electric field forces to align the part or parts in pre-determined positions in accordance with the desired apparatus topography. The part or parts may include semiconductor die, nanometer wires for making connections to devices, or other components requiring precision alignment.

Abstract: A method for killing microorganisms in water, by passing an aqueous feed solution comprising of water containing some form of halide salt into a non-membrane electrolysis cell comprising an anode and a cathode, adjacent to the anode, while flowing electrical current between the anode and the cathode to electrolyze the aqueous feed solution and convert the halide salt to anti-microbial mixed oxidants.

Abstract: A portable oxidant generator for generating oxidants suitable for sterilizing contaminated drinking water, thereby providing potable water. The oxidant generator optionally comprises an electrolytic cell and a power supply or source for powering the generator. In a preferred embodiment, the cell holds an electrolyte solution such that the solution contacts an anode and a cathode. The power supply provides electrical charge that is passed to the electrolyte solution and/or other electrolyte substance. In a preferred embodiment of the present invention, the power supply includes an energy storage device that is charged to predetermined voltage. The energy storage device is preferably charged by a generator that converts mechanical energy into electrical energy. The present invention optionally includes an electrolyte storage compartment in the cap.

Abstract: The present invention is to provide a metal surface-treating method which is capable of forming a zinc phosphate coat suitable for the cationic electrodeposition coating of a metallic shaped product, particularly a metallic shaped product having both an iron type metallic surface and a zinc type metallic surface and is suited to a closed system.

Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.

Abstract: An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.