Recirculation Patents (Class 204/237)
  • Patent number: 6884332
    Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: April 26, 2005
    Assignee: Kuntz Electroplating Inc.
    Inventors: Peter Forth, Art Vibert, Madeline Busch, Sarah Stevenson, Hussain Al-Ekabi
  • Patent number: 6878245
    Abstract: Embodiments of the invention generally provide an apparatus and method for replenishing organic molecules in an electroplating bath. The replenishment process of the present invention may occur on a real-time basis, and therefore, the concentration of organics minimally varies from desired concentration levels. The replenishment method generally includes conducting pre-processing depletion measurements in order to determine organic depletion rates per current density applied in the electroplating system. Once the organic depletion rates per current density are determined, these depletion rates may be applied to an electroplating processing recipe to calculate the volume of organic depletion per recipe step. The calculated volume of organic depletion per recipe step may then be used to determine the volume of organic molecule replenishment per unit of time that is required per recipe step in order to maintain a desired concentration of organics in the plating solution.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: April 12, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas Gandikota, Chris R. McGuirk, Deenesh Padhi, Sivakami Ramanathan, Muhammad Atif Malik, Girish A. Dixit
  • Patent number: 6872288
    Abstract: An electrowinning cell, having a tank with an opened upper end defined by a tank edge, electrolyte within the tank and a plurality of flat, metallic electrode plates disposed within the tank in side-by-side, spaced-apart, parallel relationship. Adjacent electrode plates define an electrode gap therebetween. An injector manifold is disposed at the bottom of the tank for feeding electrolyte into the tank at locations below the electrode plates. A collector grid, comprised of a plurality of collectors having ports, define an upper level of electrolyte by collecting the electrolyte from the tank. The ports are disposed in spaced-apart relationship within the open upper end defined by the tank edge. The collector grid and the injector creating a flow of electrolyte upward between the plates as the electrolyte flows from the manifold locations below the plates to the ports.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: March 29, 2005
    Assignee: Phelps Dodge Corporation
    Inventors: Jean-Louis Huens, Peter Peckham
  • Patent number: 6869519
    Abstract: An electrolytic process for the production of metallic copper in an electrolytic cell including anode and cathode chambers separated from each other by a porous member, an anode disposed in the anode chamber, and a cathode disposed in the cathode chamber. The process comprises providing an ammoniacal alkaline electrolyte solution containing diammine cuprous ions in each of the anode and cathode chambers, and applying direct current to the anode and cathode to produce metallic copper on the cathode and to produce tetrammine cupric ions on the anode. An electrolytic cell apparatus including anode and cathode chambers separated from each other by a porous member, an anode disposed in the anode chamber, a cathode disposed in the cathode chamber, and a DC current source connected to the anode and cathode, wherein each of the anode and cathode chambers contains an ammoniacal alkaline electrolyte solution containing diammine cuprous ions.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: March 22, 2005
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventor: Kazuya Koyama
  • Patent number: 6863798
    Abstract: A washing, cleaning and sterilizing solution is produced by electrolyzing an electrolyte solution composed of mixed caustic soda and salt in an electrolyzer. The solution is used as it is or diluted with tap water or non-potable water. The solution is applicable to washing, cleaning and sterilizing metal goods, medical instruments, nursing products, foodstuff, farm products, marine products, dishes, cooking utensils, plastic goods, surrounding, facilities, fiber products, machine parts, machine goods, various containers, electrical communication components, vehicles, or the like.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: March 8, 2005
    Assignee: Omega Co., Ltd.
    Inventors: Shinichi Nakamura, Kunihiko Fukuzuka
  • Patent number: 6855233
    Abstract: There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water that enables efficient production of electrolyzed water that has excellent washing and sterilizing effects. There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water, which includes an electrolyzer provided with a strong alkaline reductive electrolyzed water-producing chamber, an acidic water-producing chamber and a partitioning membrane, wherein a flow path diffusing device is provided in the electrolyzer, and a gap between the cathode plate and the anode plate of 0.1 mm to 1 mm.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: February 15, 2005
    Assignee: Kinji Sawada
    Inventor: Yuichi Sawada
  • Patent number: 6855235
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: February 15, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Craig Brodeur, Quinwei Wu, Peter Kimball, Vincent Burkhart
  • Patent number: 6849172
    Abstract: A method of operating a cell for electrowinning of copper, the cell including a plurality of anodes and cathodes therein, the method including the steps of introducing fresh electrolyte and sparging gas to a manifold system in the cell, controlling flow of fresh electrolyte and sparging gas in the manifold system and providing outlet openings in the manifold system such that streams of fresh electrolyte and sparging gas from the outlet openings are directed relatively uniformly across the cathodes in the cell.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: February 1, 2005
    Assignee: BHP Billiton Innovation Pty., Ltd.
    Inventors: Gregory David Rigby, Alan David Stuart, Philip Ernest Grazier
  • Patent number: 6843897
    Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: January 18, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Harald Herchen, Vincent Burkhart
  • Publication number: 20040256221
    Abstract: There is provided an electrolytic solution supply and recovery facility which, in response to an increase in the production amount of an associated electrolytic processing apparatus, can efficiently supply and recover an electrolytic solution while enhancing the productivity and lowering the production cost. An electrolytic solution supply and recovery facility for supplying and recovering an electrolytic solution to and from an electrolytic processing apparatus, includes: a fresh liquid supply section for storing a fresh electrolytic solution, said electrolytic solution having been transferred from a carry-in container that has been carried in from the outside, and for supplying the fresh electrolytic solution to the electrolytic processing apparatus; and a waste liquid recovery section for recovering the electrolytic solution from the electrolytic processing apparatus, storing the electrolytic solution and transferring the electrolytic solution to a carry-out container which is to be carried to the outside.
    Type: Application
    Filed: May 21, 2004
    Publication date: December 23, 2004
    Inventors: Koji Mishima, Hidenao Suzuki, Kazufumi Nomura, Kunihito Ide, Seiji Katsuoka, Yoshitaka Mukaiyama, Mitsuru Miyazaki, Masaaki Kinbara
  • Patent number: 6830673
    Abstract: A higher applied potential may be provided to a consumable anode to reduce sludge formation during electroplating. For example, a higher applied potential may be provided to a consumable anode by decreasing the exposed surface area of the anode to the electrolyte solution in the electroplating cell. The consumable anode may comprise a single anode or an array of anodes coupled to the positive pole of the power source in which the exposed surface area of the anode is less than an exposed surface area of the cathode to the electrolyte solution. In another example, a higher applied potential may be provided to a consumable anode by increasing the potential of the electroplating cell.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: December 14, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Joseph Yahalom, David Starosvetsky, Joseph Hazan
  • Patent number: 6821407
    Abstract: An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: November 23, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, Timothy Mark Archer, Thomas Tan Vu, Seshasayee Varadarajan, Jon Henri, Steven T. Mayer, David Sauer, Anita Kang, Gerald Feldewerth
  • Patent number: 6814858
    Abstract: In accordance with the present invention, there is provided a water treatment system for sterilizing water retained in a water container. The system includes a circulation process line for pumping the to-be-sterilized water out of the water container, sterilizing the water through electrolysis, and feeding the sterilized water back into the water container; an arrangement for producing a sterilizing solution having a sterilizing function by electrolyzing an electrolytic solution containing chlorine ions and having a function of promoting an electrochemical reaction; and an arrangement for supplying the produced sterilizing solution into the circulation process line as required. The system can constantly sterilize the water in the circulation process line and, as required, additionally supply the sterilizing solution produced by the sterilizing solution producing arrangement into the circulation process line according to a variation in the quality of the water.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: November 9, 2004
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Kazuhiro Yamamoto, Minoru Kishi, Yoshihiro Inamoto, Tatsuya Hirota, Tamotsu Kawamura, Takuya Noro
  • Patent number: 6787258
    Abstract: Utility power is wheeled to distributed hydrogen energy storage systems during off peak periods where it is used in an electrolyzer to disassociate water into hydrogen and oxygen. The hydrogen at least is stored for use in a fuel cell or combustion engine driven generator to produce locally generated electricity during peak periods or power interruptions. Efficient electrolysis and gas storage are obtained by operating the electrolyzer at high pressures through two flow loops in which the hydrogen and oxygen produced in the electrolyzer pass to separate gas-water columns and force water into the electrolyzer. When the desired high pressure is reached, the gases are bled off into a series of storage tanks.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: September 7, 2004
    Inventor: Vladimir Prerad
  • Patent number: 6776884
    Abstract: An electropolishing device having: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; and an insulated structure, which includes an upper insulated cover and a lower insulated cover.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: August 17, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Hung Lin, Chin-Ching Wu, Yun-Sheng Chung, Chin-Jyi Wu, Yung-Chen Peng, Yu-Chuan Tu
  • Publication number: 20040154915
    Abstract: Embodiments of the invention generally provide a substrate processing system and method. The substrate processing system generally includes a fluid basin configured to contain a plating solution therein, an anode assembly positioned in a lower portion of the fluid basin, a separation membrane positioned across the fluid basin above the anode assembly, a diffusion member positioned across the fluid basin above the separation membrane, and a plating membrane positioned across the fluid basin above the diffusion member.
    Type: Application
    Filed: February 6, 2003
    Publication date: August 12, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Nicolay Kovarsky, Michael Yang, Dmitry Lubomirsky
  • Publication number: 20040154916
    Abstract: The dilute support frame is made up of interphase longitude and latitude bars that preferably are hollow. The bars can be rectangular, rectangular with a rounded end, half-circular, triangular, polygonal or any combination thereof. The bars are sized to support the ion exchange resin in the dilute channel adjacent the concentrate membrane bag. The support frame also assures fluent water flow in the dilute channel. The support frames are arrayed on the membranes with interphase aisle to save the frame arrays and make water flow fluently. The membrane envelopes in turn with the support frames as both are preferably wound to form the cylinder module, and is covered by one plastic protecting net. This new type of support frame can assure fluent water flow in dilute channels and convenient resin filling.
    Type: Application
    Filed: July 30, 2003
    Publication date: August 12, 2004
    Applicant: ZHEJIANG OMEX ENVIRONMENTAL ENGINEERING LTD.
    Inventors: Xiang Li, Gou-Lin Luo
  • Patent number: 6773559
    Abstract: Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: August 10, 2004
    Assignee: Semitool, Inc.
    Inventors: Daniel Woodruff, Steve Eudy, James Erickson, Thomas Oberlitner, Matthew Egloff
  • Publication number: 20040118677
    Abstract: An electrolyzer for generating hydrogen by the electrolytic dissociation of water employs anode and cathode half-cells, separated by a planar polymer-based solid electrolyte, and includes a water reservoir for independently maintaining a desired level of water in the anode and cathode half-cells. A hydrogen exit chimney extends vertically upward from each cathode half-cell and enters a separation chamber; a gas exit passageway therefrom is closed by a separation membrane that allows the passage of H2 but rejects liquid H2O, while a return water passageway enters near the bottom of the cathode half-cell. The half-cells are preferably formed by molded plastic frames that are arranged as a cell stack containing a plurality of electrolytic cells, with flat metal anodes and cathodes being respectively sandwiched about the solid electrolyte membrane in each cell.
    Type: Application
    Filed: December 24, 2002
    Publication date: June 24, 2004
    Inventors: Holger H. Streckert, Linden P. Blue
  • Patent number: 6752855
    Abstract: A plating system comprises: a plating unit which plates a water; a plating solution storage tank which stores a plating solution; and a plating solution supply system which supplies the plating solution in the plating solution storage tank to the plating unit. A dissolved oxygen removing unit which removes dissolved oxygen from the plating solution flowing in the plating solution supply system is provided in the middle of the plating solution supply system.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: June 22, 2004
    Assignee: Tokyo Electron Limited
    Inventor: Yoshinori Marumo
  • Publication number: 20040112757
    Abstract: The present invention relates to a method for production of molten aluminium by electrolysis of an aluminous ore. preferably alumina, in a molten salt mixture, preferably a sodium fluoride—aluminium fluoride-based electrolyte. The invention describes an electrolysis cell for said production of aluminium by use of essentially inert electrodes in a vertical an/or inclined position, where said cell design facilitates separation of aluminium and evolved oxygen gas by providing a gas separation chamber (14) arranged in communication with the electrolysis chamber (22), thus establishing an electrolyte flow between the electrolysis chamber (22) and the gas separation chamber (14).
    Type: Application
    Filed: November 5, 2003
    Publication date: June 17, 2004
    Inventors: Ole-Jacob Siljan, Stein Julsrud
  • Publication number: 20040112739
    Abstract: Disclosed is a Brown gas mass production apparatus having a line style electrolytic cell in which an electrolytic cell case having an electrolyte distribution and discharging pipe mounted on the inside bottom surface thereof is coated with insulation material on the inner surface thereof, electrode units are disposed by two or three groups in a side-by-side arrangement in the electrolytic cell case, an electrolytic cell upper plate having gas outlet nipples mounted thereon is sealingly coupled to the top surface of the cell case to form a secured sealing between edges of the upper plate and the cell case.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Inventor: Sang-Nam Kim
  • Patent number: 6746593
    Abstract: A high volume electrolytic water treatment system and process for treating wastewater. The system and process is designed to treat waste streams that are both complex and with variable contaminate compositions. The system includes pumping influent water to a headworks screen for removing solids in the water. The screened water is then discharged into primary and secondary surge tanks. The tanks include electrocoagulation electrodes. The electrodes, using alternating current, destabilize materials such as fats, oils, greases and surfactants. The pretreated influent water is then pumped to one or more elongated flow-through modules. The flow-through modules also include electrocoagulation electrodes for further treating of the influent water. From the flow-through modules, the treated water is sent to a foam removal apparatus and then to a clarifier. Clear water from the clarifier then flows into an effluent weir and discharged from the system thereby completing the water treatment process.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: June 8, 2004
    Inventor: Robert J. Herbst
  • Patent number: 6719894
    Abstract: An electrocoagulation process for removing organic and metal contaminants from a pressurized waste fluid is disclosed in which a clarified waste fluid is produced when the pressure is released.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: April 13, 2004
    Inventors: Tom Gus Gavrel, David W. Otto, Ira B. Vinson
  • Patent number: 6716334
    Abstract: A plating cell has an inner plating bath container for performing electroplating on a work piece (e.g., a wafer) submerged in a solution contained by the inner plating bath container. A reclaim inlet funnels any solution overflowing the inner plating bath container back into a reservoir container to be circulated back into the inner plating bath container. A waste channel is also provided having an inlet at a different height than the inlet of the reclaim channel. After electroplating, the wafer is lifted to a position and spun. While spinning, the wafer is thoroughly rinse with, for example, ultra pure water. The spin rate and height of the wafer determine whether the water and solution are reclaimed through the reclaim channel or disposed through the waste channel.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: April 6, 2004
    Assignee: Novellus Systems, Inc
    Inventors: Jonathan D. Reid, Steven W. Taatjes, Robert J. Contolini, Evan E. Patton
  • Patent number: 6685819
    Abstract: A galvanic cell system (50) in fluid communication with a dewatering system (40) of an inhibited oxidation scrubber (20) removes an oxidation catalyst, i.e., solution phase iron (98), from the process liquor (42) produced by the dewatering system (40) and replaces the iron (98) with magnesium (104) in an oxidation-reduction reaction. An electrolytic cell system (154) in fluid communication with a dewatering system (144) of a forced oxidation scrubber (128) removes an oxidation inhibitor, i.e., solution phase aluminum (174), from the process liquor (146) produced by the dewatering system (144) and replaces the aluminum (174) with iron (170) in an oxidation-reduction reaction. The process liquor (42, 146) is subsequently returned to the scrubber (20, 128) with the solution phase metal (98, 174) selectively removed, thereby enhancing the scrubbing efficiency of the scrubber (20, 128).
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: February 3, 2004
    Assignee: Pinnacle West Capital Corporation
    Inventors: Bruce A. Salisbury, Kelly L. Baird, Calvin C. Webb
  • Publication number: 20040016636
    Abstract: Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.
    Type: Application
    Filed: October 9, 2002
    Publication date: January 29, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Michael X. Yang, Dmitry Lubomirsky, Yezdi Dordi, Saravjeet Singh, Sheshraj Tulshibagwale, Nicolay Kovarsky
  • Patent number: 6649034
    Abstract: The present invention provides an alloy electroplating system for semiconductor wafers including a plating chamber connected by a circulating system to a plating solution reservoir. The semiconductor wafer is used as the cathode with an inert primary anode in the plating chamber. A plurality of consumable remote secondary anodes at different voltages in the plating solution reservoir provides the metal ions for alloy plating.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: November 18, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Minh Quoc Tran, Amit P. Marathe, Pin-Chin Connie Wang
  • Patent number: 6627073
    Abstract: The present invention is directed to a new water treatment device comprising an electrolytic tank to put water in, an electrode provided in the electrolytic tank, a water treating path for pouring, from a pool storing water, the water into the electrolytic tank and returning to the pool the water in the electrolytic tank, a residual chlorine sensor for measuring the residual chlorine concentration of the water, and a circulating pump provided on the downstream side of the electrolytic tank on the water treating path in order to circulate the water, and capable of simply and efficiently sterilizing water stored in pools of various sizes from a swimming pool to a home bathtub.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: September 30, 2003
    Assignee: Sanyo Electric Co, Ltd.
    Inventors: Tatsuya Hirota, Yoshihiro Inamoto, Kiyokazu Fujikawa, Yozo Kawamura, Minoru Nakanishi, Minoru Kishi, Takaaki Yonezawa, Tamotsu Kawamura, Kazuhiro Yamamoto, Yasuhiko Shimizu, Yasuhito Kondo
  • Patent number: 6607649
    Abstract: An electrolyte line extends from the outlet of an electrolysis device to a collecting tank and from the same back to the inlet of the electrolysis device. The electrolyte is passed from the outlet of the electrolysis device to a first container which is disposed at a higher level than a second container. Electrolyte collected in the first container is periodically discharged through a first syphon line into the second container, and electrolyte collected in the second container is periodically discharged through a second syphon line into the collecting tank which is disposed at a lower level than the second container. The outlet end of each syphon line is disposed at a distance above the liquid level of the container disposed thereunder, so that electrolyte always flows only in one of the two syphon lines or in none of the syphon lines. When electrolyte flows in none of the two syphon lines, electrolyte is preferably supplied from the collecting tank into the second container.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: August 19, 2003
    Assignee: MG Technologies AG
    Inventors: Helmut Schatton, Nikola Anastasijevic
  • Patent number: 6599402
    Abstract: An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: July 29, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Yezdi Dordi, Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome
  • Patent number: 6599415
    Abstract: A method and apparatus for electropolishing a workpiece without immersing the workpiece in a bath of electrolytic solution. The workpiece is held in an atmospheric environment, while electrolytic solution is discharged from a reservoir in the form of a plurality of jet streams onto the surface of the workpiece. A voltage difference is applied across the workpiece and the jet streams, thereby inducing a current to flow, between the workpiece acting as anode and the jet streams acting as cathode. The workpiece may be rotated about an axis and moved linearly along the same axis while the jet streams of electrolytic solution are discharged onto the workpiece. Anodic dissolution causes polishing of the workpiece surface. The electrolytic solution may be collected after discharge and recycled back into the reservoir, after being filtered and cooled.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: July 29, 2003
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Yu-Chun Ku, Ryan John Santos
  • Publication number: 20030136666
    Abstract: In combination, a fluid dispenser and an electrochemical cell to produce electric energy by chemical conversion of the fluid to be dispensed. The electrical energy produced is preferably used to operate a device associated with the dispensing of the fluid as, for example, in operation of an electric pump-to-pump fluid from the reservoir. The fluid preferably is dispensed for use after dispensing in some other purpose than as a source for electrochemical energy to dispense fluid from the reservoir. For example, preferred fluid containing alcohol compounds are for use in cleaning and disinfecting.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Inventor: Heiner Ophardt
  • Patent number: 6596148
    Abstract: The present invention provides a system and method for selectively removing one or more organic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass and the endpoint of the oxidative process detected by a sensor. Residual organics, if desired, and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: July 22, 2003
    Assignee: Mykrolis Corporation
    Inventors: Brett Matthew Belongia, Zhen Wu Lin, John E. Pillion, Jieh-Hwa Shyu
  • Patent number: 6589404
    Abstract: The electrolytic cell has a trough-like container with a bottom, with side walls and with at least one inlet and at least one outlet for the electrolyte. Numerous plate-like electrodes are disposed in the container and are partly immersed in an electrolyte bath. The bottom of the container which is in contact with the electrolyte bath has numerous openings for the passage of electrolyte, and below the bottom there is disposed at least one distribution chamber for recirculated electrolyte. At least one of the side walls of the container is equipped with at least one recirculation chamber for recirculating electrolyte from the electrolyte bath into the distribution chamber, the upper portion of the recirculation chamber being connected with the electrolyte bath and the lower portion of the recirculation chamber communicating with the distribution chamber.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: July 8, 2003
    Assignee: MG Technologies AG
    Inventors: Nikola Anastasijevic, Stefan Laibach, Reinhard Dobner, Helmut Schatton
  • Patent number: 6585875
    Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: July 1, 2003
    Assignee: CAP Technologies, LLC
    Inventor: Danila Vitalievich Ryabkov
  • Publication number: 20030051996
    Abstract: An electrowinning cell, having a tank with an opened upper end defined by a tank edge, electrolyte within the tank and a plurality of flat, metallic electrode plates disposed within the tank in side-by-side, spaced-apart, parallel relationship. Adjacent electrode plates define an electrode gap therebetween. An injector manifold is disposed at the bottom of the tank for feeding electrolyte into the tank at locations below the electrode plates. A collector grid, comprised of a plurality of collectors having ports, define an upper level of electrolyte by collecting the electrolyte from the tank. The ports are disposed in spaced-apart relationship within the open upper end defined by the tank edge. The collector grid and the injector creating a flow of electrolyte upward between the plates as the electrolyte flows from the manifold locations below the plates to the ports.
    Type: Application
    Filed: June 3, 2002
    Publication date: March 20, 2003
    Applicant: Phelps Dodge Corporation
    Inventors: Jean-Louis Huens, Peter Peckham
  • Publication number: 20030042134
    Abstract: A method for killing microorganisms in water, by passing an aqueous feed solution comprising of water containing some form of halide salt into a non-membrane electrolysis cell comprising an anode and a cathode, adjacent to the anode, while flowing electrical current between the anode and the cathode to electrolyze the aqueous feed solution and convert the halide salt to anti-microbial mixed oxidants.
    Type: Application
    Filed: December 21, 2001
    Publication date: March 6, 2003
    Applicant: The Procter & Gamble Company
    Inventors: Mario Elmen Tremblay, Craig Merillat Rasmussen, Charles Andrew Hong, Donald Stephen Bretl
  • Patent number: 6527920
    Abstract: An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a porous chemical transport barrier between the anode and cathode. The transport barrier limits the chemical transport (via diffusion and/or convection) of all species but allows migration of ionic species (and hence passage of current) during application of sufficiently large electric fields within electrolyte.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: March 4, 2003
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Evan E. Patton, Robert L. Jackson, Jonathan D. Reid
  • Publication number: 20030010644
    Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.
    Type: Application
    Filed: July 3, 2001
    Publication date: January 16, 2003
    Inventors: Yuichi Sonoda, Kozo Arao, Noboru Toyama, Yusuke Miyamoto
  • Publication number: 20030010627
    Abstract: The present invention is to provide a metal surface-treating method which is capable of forming a zinc phosphate coat suitable for the cationic electrodeposition coating of a metallic shaped product, particularly a metallic shaped product having both an iron type metallic surface and a zinc type metallic surface and is suited to a closed system.
    Type: Application
    Filed: January 17, 2002
    Publication date: January 16, 2003
    Inventors: Hiroshi Chihara, Kenji Tsuge, Yutaka Kinose, Toru Hata, Eriko Okuno
  • Publication number: 20030006133
    Abstract: An apparatus for electroplating a rotogravure cylinder out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable anode at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable anode and to the cylinder. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulation pump, a mixing system and heating and cooling elements for the plating solution may be provided.
    Type: Application
    Filed: November 6, 2001
    Publication date: January 9, 2003
    Inventor: Hubert F. Metzger
  • Publication number: 20030000841
    Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
    Type: Application
    Filed: August 13, 2002
    Publication date: January 2, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Joseph J. Stevens, Yevgeniy Rabinovich, Sandy S. Chao, Mark R. Denome, Allen L. D'Ambra, Donald J. Olgado
  • Publication number: 20020179451
    Abstract: An apparatus and method utilizing a strip solution for removing gold from the loaded activated carbon used to accumulate such gold leached from gold bearing ore, and for electrically removing such gold from the strip solution by electrowinning. The apparatus includes a pair of strip columns fillable with loaded activated carbon. The strip columns are connectable individually and in series in respective continuous loops using a valved crossover pipe assembly to an electrowinning device, with the strip solution being pumped therethrough.
    Type: Application
    Filed: April 20, 2001
    Publication date: December 5, 2002
    Inventors: Todd A. Weldon, Charles O. Gale
  • Patent number: 6478935
    Abstract: An apparatus for plating a substrate includes plural plating baths that are each separately provided with (a) an individual temperature adjuster that includes a heater, a cooling jacket, and a temperature controller, or (b) an individual pressure application device for distorting the substrate.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: November 12, 2002
    Assignee: NEC Corporation
    Inventor: Kazuyoshi Ueno
  • Publication number: 20020153254
    Abstract: The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.
    Type: Application
    Filed: May 2, 2002
    Publication date: October 24, 2002
    Applicant: Mykrolis Corporation
    Inventors: Brett Matthew Belongia, Zhen Wu Lin, John E. Pillion, Jieh-Hwa Shyu
  • Patent number: 6464845
    Abstract: The manufacturing apparatus for producing alkaline ionized water and acidic water by electrolysis of water has an electrolytic bath including a cathode cell, an intermediate cell, and an anode cell, separated by diaphragms; an electrolysis solution bath connected to the intermediate cell via an electrolysis solution circulating line and an electrolysis solution circulating pump; a circulation container bath for alkaline ionized water connected to the cathode cell via an alkaline ionized water circulating line and an alkaline ionized water circulating pump; a supplying line for raw material water for producing acidic water connected to an inlet of the anode cell; a withdrawing line for acidic water connected to an outlet of the anode cell; a supplying system for raw material water for making the alkaline ionized water connected to the circulation container bath and a withdrawing line with a water collecting device for withdrawing alkaline ionized water.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: October 15, 2002
    Assignee: Chemicoat & Co., Ltd.
    Inventors: Kazuhiro Shirota, Akira Isaka
  • Publication number: 20020144911
    Abstract: An electrolytic process for the preparation of a compound having a charged electrolytic cell fitted with at least one anode and at least one cathode in a single compartment with a reaction mixture. An electric potential is applied to the at least one anode and at least one cathode under conditions to promote formation of a compound on one of the cathodes or the anode to define a formation electrode. The formation electrode is then agitated.
    Type: Application
    Filed: April 10, 2001
    Publication date: October 10, 2002
    Inventors: Paul W. Cornell, Stephen W. Cornell
  • Publication number: 20020139663
    Abstract: By means of a pump for supplying a processing fluid such as a plating fluid to a closed processing cup such as a closed plating cup, at least either the pressure or flow rate of the processing fluid or plating fluid circulating within the closed processing cup or the closed plating cup is cyclically changed. Further, the direction of circulation of the processing fluid circulating within the closed processing cup is also changed cyclically. Under a method of manufacturing a semiconductor device and a method of manufacturing a printed board, a semiconductor wafer and a printed board are disposed in the closed plating cup such that blind holes formed by closing openings on one end of via holes or openings on one end of through holes are brought into contact with a circulating plating fluid, thereby eliminating air bubbles that remain. As a result, a manufacturing yield or performance of a product is improved.
    Type: Application
    Filed: March 11, 2002
    Publication date: October 3, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Katsuya Kosaki, Takeo Nakamoto
  • Publication number: 20020139684
    Abstract: By means of a pump for supplying a plating fluid to a closed plating cup, at least either the pressure or flow rate of the plating fluid circulating within the closed plating cup is cyclically changed. Alternatively, the direction of circulation of the plating fluid circulating within the closed plating cup maybe also changed cyclically. Under a method of manufacturing a semiconductor device or a method of manufacturing a printed board, a semiconductor wafer or a printed board are disposed in the closed plating cup such that blind holes formed by closing openings on one end of via holes or openings on one end of through holes are brought into contact with a circulating plating fluid, thereby eliminating air bubbles that would remain. As a result, a manufacturing yield or performance of a product is improved.
    Type: Application
    Filed: August 2, 2001
    Publication date: October 3, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Katsuya Kosaki, Takeo Nakamoto