With Agitator Patents (Class 204/273)
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Publication number: 20030209427Abstract: Segmented nanoparticles are manufactured according to different methods and in various apparatuses.Type: ApplicationFiled: April 11, 2003Publication date: November 13, 2003Applicant: NANOPLEX, TECHNOLOGIESInventors: Michael J. Natan, Thomas E. Mallouk, Benjamin R. Martin, Brian D. Reiss, Louis J. Dietz, James L. Winkler
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Patent number: 6613202Abstract: A water treatment tank for treating waste water using an electrochemical treatment process. The electrochemical process removes both suspended and dissolved solids in the water and allows the treated water to be removed from the tank for reuse or discharge. The tank includes a tank housing with first and second waste water receiving compartments. The two compartments are identical and are used alternately when treating the waste water. A waste water inlet line is attached to the top of the first compartment for filling the compartment with waste water. A side of the first compartment includes an annular opening for receiving an electrode assembly with a plurality of electrodes extending inside the compartment for treating the waste water electrochemically. The electrodes are attached to the power supply via electrode cables with the polarity of a current cycle reversed periodically depending on the types of water contaminates being treated.Type: GrantFiled: May 2, 2001Date of Patent: September 2, 2003Assignee: Current Water Technology, Inc.Inventors: Lori B. Herbst, Robert Herbst, Keith Wilkerson
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Patent number: 6610189Abstract: A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features. In one embodiment, the mechanical enhancement comprises mechanically vibrating the plating surface. In another embodiment, the mechanical enhancement comprises mechanically vibrating the electrolyte solution. In a further embodiment, the mechanical enhancement comprises increasing the pressure applied to the electrolyte solution.Type: GrantFiled: January 3, 2001Date of Patent: August 26, 2003Assignee: Applied Materials, Inc.Inventors: Hougong Wang, Bo Zheng, Girish Dixit, Fusen Chen
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Patent number: 6562217Abstract: A method for making conductive particles that efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid.Type: GrantFiled: December 27, 1999Date of Patent: May 13, 2003Assignee: Sekisui Chemical Co., Ltd.Inventors: Yoshiaki Tanaka, Yoshiaki Kodera, Manabu Matsubara, Kazuhiko Kanki, Tatsuo Suzuki, Kazuo Ukai
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Patent number: 6547945Abstract: An electrochemical cell for use in electrochemical processes, such as plating processes, has a first electrode which extends circumferentially about at least a portion of an electrode chamber. The article being treated is the second electrode and is disposed within the chamber. Electrolyte is flowed between the two electrodes. Various construction details of the electrochemical cell are developed which facilitate a plating process. In one embodiment, a supply conduit to the electrode chamber has a swirler.Type: GrantFiled: January 5, 2001Date of Patent: April 15, 2003Assignee: United Technologies CorporationInventors: Christopher T. Shallow, Robert B. Parrish
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Patent number: 6547936Abstract: An apparatus for electroplating and deplating an object out of a plating solution is disclosed. The apparatus includes a plating tank adapted to support the object and to contain a plating solution so that the object is at least partially disposed into the plating solution. The apparatus also includes a non-dissolvable conductor at least partially disposed within the plating solution. A current source is electrically connected to the non-dissolvable conductor and to the object. An ultrasonic system may be provided to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulating pump and heating and cooling elements for the plating solution may be provided.Type: GrantFiled: March 20, 2000Date of Patent: April 15, 2003Assignee: Chema Technology, Inc.Inventor: Hubert F. Metzger
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Publication number: 20030062271Abstract: An electrochemical stripping method for selectively removing at least one coating from the surface of a substrate is described. The substrate is immersed in an aqueous composition through which electrical current flows. The composition includes an acid having the formula HxAF6, in which “A” is Si, Ge, Ti, Zr, Al, or Ga; and x is 1-6. Various coatings can be removed, such as diffusion or overlay coatings. The method can be used to fully-strip a coating (e.g., from a turbine component), or to partially strip one sublayer of the coating. Related processes and an apparatus are also described.Type: ApplicationFiled: September 28, 2001Publication date: April 3, 2003Inventors: Lawrence Bernard Kool, Ralph James Carl, Bin Wei, James Anthony Ruud, Mark Alan Rosenzweig, Stephen Joseph Ferrigno
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Patent number: 6540888Abstract: A mineral ionizing device (10) consisting of a container (20) filled with water and containing a solid-mineral, cylindrical first electrode (50), a second electrode (58) coaxially located within the first electrode (50), a vibration unit (100) which produces a vibration within the container (20), a set of protrusions (64) located on the surface of the second electrode (58) and a periodic current reversing unit (84) which applies a d-c current across the first and second electrodes (50,58). The combination of the vibration unit (100), the protrusions (64) and the current reversing unit (84) aids in releasing gaseous bubbles which form on the surface of the second electrode (58). The application of the d-c current causes the mineral in the first electrode (50) to release mineral ions into the water which results in the production of very clean mineral water.Type: GrantFiled: March 19, 2001Date of Patent: April 1, 2003Inventors: Marvin Robey, Ralph Kuttner
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Publication number: 20030057103Abstract: The present invention relates to an electrowinning cell adapted to recover metal ions from a solution as their corresponding elementary metals. The electrowinning cell includes a reservoir and a filter in fluid communication with the reservoir. The filter is operative to receive a solution containing metal ions from a location proximate to the cathode and to retain a first portion of the solution having a first concentration of metal ions and to remove a second portion of the solution having a second concentration of metal ions lower than the first concentration. The electrowinning cell additionally includes return means operative to return the first portion of the solution to the reservoir. The present invention also relates to a method of concentrating metal ions in a solution for use in an electrochemical cell and to a system for reducing metal ions in a solution to their corresponding elementary metals.Type: ApplicationFiled: July 26, 2001Publication date: March 27, 2003Inventor: Juzer Jangbarwala
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Publication number: 20030042145Abstract: Electroplating methods and systems employing ultrasonic energy to enhance electroplating processes. The electroplating methods involve sweeping a plating surface with ultrasonic energy having an area of maximum ultrasonic energy density while simultaneously performing electroplating. The systems include movement apparatus providing relative movement between an ultrasonic energy source and a cathode while the ultrasonic energy source and the cathode are located within a plating tank.Type: ApplicationFiled: September 5, 2001Publication date: March 6, 2003Applicant: 3M Innovative Properties CompanyInventors: Haiyan Zhang, Harlan L. Krinke
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Patent number: 6482300Abstract: This invention provides a technique capable of solving a problem of an ununiform plating on an annular edge portion of a surface to be plated of a wafer, which ununiform plating is usually caused due to an ununiform flow of a plating apparatus, thereby ensuring a uniform plating treatment on the entire surface to be plated of a wafer. The present invention is directed to a cup-shaped plating apparatus comprising a wafer support section provided along an upper opening of a plating tank, a plurality of solution-outlet passages provided below the wafer support section and extending from the inside of and to the outside of the plating tank and at least one solution-supply pipe provided through the bottom of the plating tank.Type: GrantFiled: February 9, 2001Date of Patent: November 19, 2002Assignee: Electroplating Engineers of Japan LimitedInventor: Yasuhiko Sakaki
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Publication number: 20020166763Abstract: An oxygen enrichment system is provided. The system includes an electrochemical cell for generating oxygen from ambient air. The electrochemical cell extracts oxygen from ambient air based on hydroxide conduction. A mixer is provided in fluid communication with ambient air, and an outlet provides oxygen enriched air to a user or air-breathing apparatus. In further embodiments, a purification system is also included. The air enrichment system may be employed with suitable batteries to provide a portable air enrichment device.Type: ApplicationFiled: April 17, 2002Publication date: November 14, 2002Inventors: Tsepin Tsai, Sadeg M. Faris
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Publication number: 20020157962Abstract: A mineral ionizing device (10) consisting of a container (20) filled with water and containing a solid-mineral, cylindrical first electrode (50), a second electrode (58) coaxially located within the first electrode (50), a vibration unit (100) which produces a vibration within the container (20), a set of protrusions (64) located on the surface of the second electrode (58) and a periodic current reversing unit (84) which applies a d-c current across the first and second electrodes (50,58). The combination of the vibration unit (100), the protrusions (64) and the current reversing unit (84) aids in releasing gaseous bubbles which form on the surface of the second electrode (58). The application of the d-c current causes the mineral in the first electrode (50) to release mineral ions into the water which results in the production of very clean mineral water.Type: ApplicationFiled: March 19, 2001Publication date: October 31, 2002Inventors: Marvin Robey, Ralph Kuttner
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Patent number: 6454917Abstract: An electroplating tool, which includes at least of a deposition cassette which is installed on a negative electrode and copper piece in an electroplating tank, or a copper rod is installed on the positive electrode of the electroplating room. 25 wafers are installed in the electroplating room, and both ends of each of the wafers are respectively fixed in place by a wafer clamp. The wafer clamp is in contact with the negative electrode, and is electrically connected to the wafer. The copper rod or copper piece that connects to the positive electrode can be a big piece that is installed on the outer side of the deposition cassette opening. It can also assume a comb-like arrangement of 25 pieces, respectively interlocked and extending into the gaps between the wafers. Moreover, in order to increase the even distribution during copper deposition, the present invention further adds a sound wave vibration apparatus at the bottom of and on the two sides of the electroplating tank.Type: GrantFiled: October 30, 2000Date of Patent: September 24, 2002Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventor: Bih-Tiao Lin
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Publication number: 20020092764Abstract: The present invention relates to a method of forming a conductive layer and an electroplating device, and in particular, to a method of forming a conductive layer that provides an electrically-conductive layer having both characteristics of increased adhesiveness to an electroplated body and increased uniformity. The electroplating apparatus and method can produce supersonic waves for electroplating. Thus, the electroplating device can include a wave generator. The electroplating device can further include a plating bath filled with an electrolyte solution that can propagate super sonic waves, a power supply, a plated body connected electrically to a first terminal of the power supply, and a plating body connected electrically to a second terminal of the power supply where the plating body provides ions the same as dissolved in the electrolyte solution to maintain a desired concentration of dissolved ions.Type: ApplicationFiled: March 6, 2002Publication date: July 18, 2002Applicant: HYUNDAI MICROELECTRONICS CO., LTDInventors: Do-Heyoung Kim, Jae-Jeong Kim, Jae-Hee Ha
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Patent number: 6419805Abstract: A plating apparatus is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. With regard to improving the uniformity of the plating deposition, the plating apparatus and method effectuate random horizontal fluid flow within the bath to reduce the occurrence of relatively long horizontal fluid flow that causes non-uniform plating deposition across the surface of the wafer.Type: GrantFiled: August 15, 2000Date of Patent: July 16, 2002Assignee: Technic Inc.Inventors: Robert Kaufman, Gary C. Downes
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Publication number: 20020079213Abstract: The device for purifying machining liquids for electroerosion machines, comprises a first ultrasonic decantation device (11) to separate by decantation the metallic contamination particles (38) from the machining electrode and the machined piece, a second ultrasonic decantation device (45) of a lower power to separate the particles (39) of said machining additive, and filtration elements (46) to separate carbonaceous particles (41) from the decomposition of the dielectric liquid. After filtration, this latter is remixed with the additive particles in a mixing receptacle (47) to obtain purified machining liquid.Type: ApplicationFiled: December 18, 2001Publication date: June 27, 2002Applicant: CHARMILLES TECHNOLOGIES SAInventor: Rene Demellayer
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Patent number: 6398939Abstract: An electrowinning cell, having a tank with an opened upper end defined by a tank edge, electrolyte within the tank and a plurality of flat, metallic electrode plates disposed within the tank in side-by-side, spaced-apart, parallel relationship. Adjacent electrode plates define an electrode gap therebetween. An injector manifold is disposed at the bottom of the tank for feeding electrolyte into the tank at locations below the electrode plates. A collector grid, comprised of a plurality of collectors having ports, define an upper level of electrolyte by collecting the electrolyte from the tank. The ports are disposed in spaced-apart relationship within the open upper end defined by the tank edge. The collector grid and the injector creating a flow of electrolyte upward between the plates as the electrolyte flows from the manifold locations below the plates to the ports.Type: GrantFiled: March 9, 2001Date of Patent: June 4, 2002Assignee: Phelps Dodge CorporationInventors: Jean-Louis Huens, Peter Peckham
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Patent number: 6368482Abstract: A system and a method for selective plating processes are disclosed which use directed beams of high intensity acoustic waves to create non-linear effects that alter and improve the plating process. The directed beams are focused on the surface of an object, which in one embodiment is immersed in a plating solution, and in another embodiment is suspended above a plating solution. The plating processes provide precise control of the thickness of the layers of the plating, while at the same time, in at least some incidents, eliminates the need for masking.Type: GrantFiled: September 19, 2000Date of Patent: April 9, 2002Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration, Washington, DC (US)Inventors: Richard C. Oeftering, Charles Denofrio
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Patent number: 6361678Abstract: The present invention provides a method of detecting a short incident in an electrochemical cell (e.g., a Simons electrochemical fluorination cell or bipolar flow cell) using means for detecting vibration to detect vibration of an external piece on the cell. The present invention further provides a system for detecting a short incident in an electrochemical cell.Type: GrantFiled: August 22, 2000Date of Patent: March 26, 2002Assignee: 3M Innovative Properties CompanyInventors: William V. Childs, Christopher L. Gross, Mark P. Smith, Eric A. Schotz
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Patent number: 6350385Abstract: A method and apparatus turbulently exposes water flowing through a water system to a plurality of electrodes of an ion generator and provides a self-contained tank through which water flows. The generally cylindrical containment tank includes a tangential inlet pipe and an elliptical base having an outlet pipe. An aspect ratio, inlet pipe diameter versus containment tank diameter, is defined to achieve optimum ionization. A tank cover serves as the non-electrical conducting head for a plurality of electrodes which extend downwardly from the underside of the cover. The electrodes are functionally configured to maximize water flow between them. The rate of water flow within the containment tank is defined such that residence time of flow within the tank likewise optimizes water ionization. A sight glass allows for visualization of the container contents, and in particular anode wastage or wear, during operation.Type: GrantFiled: December 22, 2000Date of Patent: February 26, 2002Inventors: William Holt, John V. Kraft
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Patent number: 6322689Abstract: An anodizing method of a metal body which includes an anodizing treatment process performed while vibrationally fluidly stirring and aerating a treatment bath in which the metal body is vibrated and swung and an apparatus for performing the same.Type: GrantFiled: March 28, 2000Date of Patent: November 27, 2001Assignee: Japan Techno Co., Ltd.Inventor: Ryushin Omasa
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Patent number: 6315885Abstract: The present invention relates to a method of electropolishing aided by ultrasonic means having the capability of rapidly discharging dregs. More specifically, the invention relates to a method of electrochemical polishing process aided by an auxiliary ultrasonic cleaning device which emits ultrasonic vibrating energy to effectively discharge dregs, shorten the polishing cycle time for each workpiece, and improve the surface roughness of the workpiece. The present invention further provides an electropolishing apparatus that can be easily retrofitted to almost every existing machine tool as an auxiliary unit. Alternately, the ultrasonic apparatus can be installed separately as an independent ultrasonic generating unit.Type: GrantFiled: October 27, 1999Date of Patent: November 13, 2001Assignee: National Science CouncilInventor: Hong Hocheng
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Patent number: 6277265Abstract: An apparatus and method for electrocoriolysis, the separation of ionic substances from liquids in the electrodynamic mode. The method maximizes centrifugal forces on a fluid contained in a chamber having oppositely polarized electrodes. A feed fluid is fed into the chamber. Spacing of the electrodes can be minimized for enhancement of the process. A constant voltage can be applied. Centrifugal force and the electric potential across the chamber create enhanced separation. Concentrated solution can be removed from a location in the chamber and depleted solution from another location.Type: GrantFiled: July 23, 1999Date of Patent: August 21, 2001Assignee: Apogee CorporationInventor: Joseph J. Hanak
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Patent number: 6267855Abstract: In a water purifying apparatus (1) having inner and outer cylindrical electrodes (51,52) concentrically arranged together to form a water channel (500) therebetween, the outer electrode has a plurality of small perforations (55) penetrating therethrough. The electrodes are placed in a water tank (2) reserving raw water. A voltage is applied between the electrodes for causing electrolysis of the raw water in the water channel. As a result of the electrolysis, the raw water is processed into purified water. Resultant gases generated by the electrolysis may be released from the water channel through the small perforations of the electrodes. In addition, the inner electrode may have small perforations penetrating therethrough.Type: GrantFiled: May 4, 1999Date of Patent: July 31, 2001Assignee: Sanden CorporationInventors: Kazushige Watanabe, Motoharu Sato, Takaaki Suga
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Patent number: 6261433Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.Type: GrantFiled: April 21, 1999Date of Patent: July 17, 2001Assignee: Applied Materials, Inc.Inventor: Uziel Landau
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Patent number: 6251250Abstract: A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.Type: GrantFiled: September 3, 1999Date of Patent: June 26, 2001Inventor: Arthur Keigler
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Patent number: 6228230Abstract: An apparatus for electroplating small parts comprises an electroplating bath for holding an electrolyte and electroplating anodes. The apparatus includes a container having at least one screened parts compartment for holding the parts to be electroplated, and incorporates an electrically conductive screen as its base portion, on which the parts are settled. The conductive screen is adaptable to be connected to the negative pole of a power supply to function as the cathode. A pump circulates freshly ionized electrolyte into the parts compartment and directs a flow of the electrolyte to periodically tumble the parts in the parts compartment. Thereafter, the parts are shaken by a shaker to level the parts to maximize the surface and electrical contact between the parts and the screen when they are settled on the screen. In alternative embodiments of the invention, the container can be of perforated panel construction.Type: GrantFiled: April 19, 1999Date of Patent: May 8, 2001Assignee: AEM, Inc.Inventors: Xiang-Ming Li, Tom w. Lamayeau, Kenneth McMasters Wallace, Bruce W. Hess, William DeoGracias, Daniel H. Chang
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Patent number: 6214182Abstract: Disclosed is an apparatus for electrochemical treatment of waste water by electroflocculation. The apparatus uses an arrangement of electrodes and an anode scraping device, whereby the sword-shaped anode(s) are flanked by cathodes made in the same manner, on which the support structure for the anode scraping devices is supported. Transport of the oxide crusts scraped off the anode surface towards the lower reactor end is supported by a gas stream fed into the electrolytic gap through hollow sections which serve the purpose of spacers for the electrodes. The anodes may consist of several individual sheets, with intermediate layers for lowering the frictional resistance when withdrawing individual sheets. The liquid seal of the upper reactor side in the area of the scraping device is achieved by a plug of elastic, electrically nonconductive material.Type: GrantFiled: December 7, 1999Date of Patent: April 10, 2001Inventor: Johann W. Ritter
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Patent number: 6214179Abstract: This invention relates to a method of electrowinning metal from an eluate containing the metal in solution and includes the steps of feeding the eluate into a closed tank which includes a suitably electrified anode and cathode, electrolytically depositing metal from the eluate onto the cathode and at least periodically causing the deposited metal to be dislodged from the cathode for removal from the tank. Preferably the metal is dislodged from the cathode by movement of the cathode in the eluate in the tank. The invention further extends to an electrowinning cell for carrying out the method of the invention with the anode being in the form of a metal cylinder in which the cathode is rotatably located.Type: GrantFiled: December 28, 1998Date of Patent: April 10, 2001Assignee: Kemix (Proprietary) LimitedInventor: William Norman Cartner
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Patent number: 6197169Abstract: An apparatus for electroplating and deplating a rotogravure cylinder out of a plating solution using ultrasonic energy is disclosed. The apparatus includes a plating tank adapted to rotatably maintain the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a mounting structure mountable within the tank partially on each side of and generally below the cylinder, along with a plurality of conductors at least partially disposed within the plating solution. A current source is electrically connected to the upper portions of the conductors and to the cylinder. An ultrasonic system to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A protective cover to protect the transducer element from the effects of the plating solution.Type: GrantFiled: September 11, 1998Date of Patent: March 6, 2001Inventor: Hubert F. Metzger
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Patent number: 6190530Abstract: An anode container, electroplating system, method and object so plated. A feature of the invention is that an anode container has an interior cross-sectional area, at or near a lower end thereof, that is larger than an interior cross-sectional area of an upper end thereof. An anode-receiving container also has a body with a plurality of sides and a lower end having a larger cross-sectional interior area than an upper end. The container may also include punched out apertures positioned to provide strength to the container and an apparatus to vibrate the container coupled to a lower end of the container.Type: GrantFiled: April 12, 1999Date of Patent: February 20, 2001Assignee: International Business Machines CorporationInventors: William Louis Brodsky, Donald W. Henderson, Lawrence Philip Lehman
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Patent number: 6187152Abstract: A multiple station processing chamber used to deposit and/or remove a material on a semiconductor wafer is described. The multiple station processing chamber is comprised of two or more processing stations at which the wafer is exposed to a processing fluid. The processing stations are positioned within the chamber such that the wafer may be moved from station to station while remaining within the chamber. Each station of the multiple station processing chamber may have a fluid containment ring used for containment, disposal, and/or reuse of the electrolyte used to process the wafer at that particular processing station. The wafer is brought to the first processing station on a wafer support and exposed to a first processing fluid, which is then diverted into fluid containment ring for the first processing station. The wafer is then moved to a second processing chamber where the process is repeated with a second processing fluid.Type: GrantFiled: July 17, 1998Date of Patent: February 13, 2001Assignee: Cutek Research, Inc.Inventors: Chiu H. Ting, William H. Holtkamp
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Patent number: 6153065Abstract: An internal stress testing device for high speed electroplating is disclosed. The testing device comprises: a tank to be filled with a plating solution; a metal plate for anode disposed within the tank; a metal rod for cathode disposed within the tank and rotatably held by a motor at a position opposite to the metal plate for anode; a metal plate for cathode in the shape of a thin plate mounted on the metal rod; and a DC power supply connected to the metal plate for anode and the metal rod for cathode.Type: GrantFiled: June 15, 1999Date of Patent: November 28, 2000Assignee: Yamamoto-MS Co., Ltd.Inventor: Wataru Yamamoto
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Patent number: 6123815Abstract: An apparatus for use in at least one of a plating and a pretreatment for plating, comprising:(A) a vibrationally stirring apparatus for a treatment bath, the vibrationally stirring apparatus (A) being provided with vibration generating means having an vibration motor, and vibrationally stirring means for vibrating a vibration vane at an amplitude of 0.5 to 3.0 mm and at a vibrational frequency of 200 to 800 times per minute, the vibration vane being fixed in one stage or in multistage to a vibrating bar which vibrates in the treatment bath interlockingly with the vibration generating means;(B) an aeration apparatus for the treatment bath;(C) an apparatus for swinging an electrode bar for suspending the plating target thereon; and(D) an apparatus for applying vibration to the electrode bar.Type: GrantFiled: January 14, 2000Date of Patent: September 26, 2000Assignee: Nihon Techno Kabushiki KaishaInventor: Ryushin Omasa
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Patent number: 6117304Abstract: An electroanalytical voltammetric cell containing:(a) a cell body housing a counter electrode and a working electrode;(b) means for causing a sample solution to flow through the cell and to fill a space between the counter-electrode and the working electrode; and(c) a vibrator present in the space between the two electrodes which vibrates in order to fully mix the sample solution in the space.Type: GrantFiled: March 2, 1998Date of Patent: September 12, 2000Assignee: VerdEco Technologies, Ltd.Inventor: Chaim Noah Yarnitzky
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Patent number: 6099703Abstract: Water cleaning device with at least one reactor device (4) for electrolytic cleaning of polluted water, assembled of one or more anodes (1a) and cathodes (2a), one flotation device (14, 15) and one device for handling sludge (23, 24, 18). The water flow inside and just outside (downstream) of the electrochemical reactor (4) is turbulent. The turbulence is created by one or more mechanical devices which affect the flow pattern.Type: GrantFiled: September 11, 1998Date of Patent: August 8, 2000Assignee: Cleaner Technology ASInventors: Ulf Syversen, Jan Sundell, Ingunn Saur, Synnove Rubach, Gudolf Kjaerheim
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Patent number: 6080288Abstract: A system and method for electro-forming a metal layer on a substrate. The system has a rotary jet planarizer in an electro-forming or galvanic cell. The cell includes a toroidally-shaped manifold with two inlets and an outlet. Each of the inlets is coupled to tubing from a sump assembly. Pressurized electrolyte flows from the sump assembly to the manifold. Directly downstream from the manifold is a diffuser having a plurality of openings. Electrolyte flows through the diffuser to an toroidally-shaped anode basket filled with metal pellets. After flowing through the anode basket, the electrolyte flows to a rotary jet planarizer. The planarizer has a rotatable plate with a main opening, a plurality of apertures radially extending from the main opening, and a conduit that is coupled to the main opening and extends out of the cell. A motor is coupled to the rotary jet planarizer to rotate the plate.Type: GrantFiled: May 29, 1998Date of Patent: June 27, 2000Inventors: Vladimir Schwartz, Michael Schwartz, Doron Dagan, Klaus M. Bierwagen, Ronald E. Blazo
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Patent number: 6077412Abstract: A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which a rotating anode is used to agitate and distribute the electrolyte. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while a rotating anode is used to agitate and distribute the electrolyte.Type: GrantFiled: October 30, 1998Date of Patent: June 20, 2000Assignee: Cutek Research, Inc.Inventors: Chiu H. Ting, William H. Holtkamp, Wen C. Ko
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Patent number: 6036837Abstract: A method and two-part plating apparatus for plating groups of elongated objects. The plating apparatus includes a fixture and a fixture support. The fixture is configured to loosely retain a group of elongated articles in a generally vertical orientation where the upper ends are contained within a cavity and the lower ends are in contact with a support surface. The cavity includes an electrode which is electrically connected to the upper ends of the elongated articles. The fixture is configured to be placed onto and partially through a fixture support which is in contact with a container of plating solution. The fixture support has a base and an agitation element which moves the fixture with respect to the base, thus shifting and exposing surfaces of the elongated articles to facilitate plating.Type: GrantFiled: November 2, 1998Date of Patent: March 14, 2000Assignee: Celex, IncorporatedInventors: Dennis B. Nau, Jeffrey J. Bellm
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Patent number: 6001235Abstract: A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.Type: GrantFiled: June 23, 1997Date of Patent: December 14, 1999Assignee: International Business Machines CorporationInventors: David M. Arken, Andrew Chiu, Joseph John Fatula, Jr., Robert William Hitzfield, Wen-Chien David Hsiao, Yiping Hsiao
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Patent number: 5993637Abstract: An electrode structure is constituted by a first electrode, and at least one second electrode providing a pair of opposite portions with a prescribed spacing therebetween at which the first electrode is disposed. The electrode structure is suitably used for electrolytic etching and is effective in providing an accurate etching pattern without damaging the surface of an etching object.Type: GrantFiled: December 3, 1997Date of Patent: November 30, 1999Assignee: Canon Kabushiki KaishaInventors: Masaya Hisamatsu, Akio Hasebe, Tsutomu Murakami, Hirofumi Ichinose, Satoshi Shinkura, Yukie Ueno
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Patent number: 5972180Abstract: An apparatus for electopolishing a helix used for a traveling wave tube has the following structure. A bath is provided which receives an electrolyte solution for etching the helix. A holder is further provided for holding the helix in the electrolyte solution without any displacement or any vibration, wherein a part of the helix is electrically connected to an anode. A controller mechanically supporting a cathode is provided for moving the cathode around the helix at substantially a constant speed in a direction substantially parallel to a longitudinal direction of the helix so as to keep a distance of the cathode from the helix to be substantially constant.Type: GrantFiled: January 12, 1998Date of Patent: October 26, 1999Assignee: NEC CorporationInventor: Seiji Chujo
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Patent number: 5932077Abstract: A wet process apparatus, e.g., plating cell for plating a flat substrate introduces a flow of electrolyte or other plating solution across the surface of the substrate to be plated. The substrate is mounted on a holder that is positioned on a door that swings between a horizontal open position and a vertical closed position. There is a circular opening in a front wall against which the door seats. The door can have a sealing ring that contacts the wall of the cell outside of the opening. A cathode ring disposed in a recess in the periphery of the opening makes electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper within the plating chamber rotates to draw bubbles or other impurities from the substrate, and a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 Mhz. The cell can be used for electroless or galvanic plating.Type: GrantFiled: February 9, 1998Date of Patent: August 3, 1999Assignee: Reynolds Tech Fabricators, Inc.Inventor: H. Vincent Reynolds
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Patent number: 5932076Abstract: An electroforming apparatus, in particular for the manufacture of CD/LD data media molding tools, comprises an anode assembly and a rotatable cathode assembly spaced therefrom, and a stationary nozzle means for ejecting an electrolytic fluid into the space between the anode and cathode assemblies. An annular part of the cathode assembly surrounding a molding tool blank is penetrated by a plurality of circumferentially distributed flow passages, the inlet ends thereof are disposed to successively come into alignment with the nozzle means upon rotation of the cathode assembly so that the electrolytic fluid ejected from the nozzle means is received by the flow passages and guided thereby into the space between the anode and cathode assemblies. The width of the spac can thereby substantially be minimized.Type: GrantFiled: August 18, 1997Date of Patent: August 3, 1999Assignee: Technotrans GmbHInventor: Andreas Gubig
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Patent number: 5928505Abstract: The present invention is directed to a water purification and dispensing apparatus which receives power through induction to eliminate the presence of exposed electrical contacts terminals. The water dispenser includes a motor driven pump, a water storage area, a rechargeable battery and a nozzle, such that water is pumped from the water storage area out through the nozzle. Two electrodes are provided in either the water storage area or a separate tank for purifying water placed therein. When the dispenser and/or purifying tank is mounted on a base, inductors in the base, the dispenser, and the tank connect via mutual inductance such that power supplied by the base is received by the dispenser and tank. Since power transfers magnetically, there are no exposed contact points which could corrode and/or short if water is accidentally spilled thereon.Type: GrantFiled: November 26, 1997Date of Patent: July 27, 1999Assignee: Matsushita Electric Works, Ltd.Inventors: Satoru Inakagata, Takahiro Heiuchi
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Patent number: 5902465Abstract: An apparatus for treating industrial wastes through electrolysis is disclosed. Steam or waste steam is utilized to heat the electrolyzing apparatus so as to separate contamination materials from the waste water, thereby treating the waste water. An electrolyzing tank has a waste water inlet on the bottom thereof, and a steam supply pipe is wound around the electrolyzing tank, for heating the electrolyzing tank during a passing of steam through the pipe. An insulating tube is formed inside the electrolyzing tank, and is coated with an insulating material on inside thereof, for insulating the electrolyzing tube from its contents. A cathode tube is installed within the insulating tank, for serving as a cathode during an electrolysis. An agitator having agitating blades is fixed on a shaft, the shaft is inserted into the center of the cathode tube, and anodes are attached on tips of the blades.Type: GrantFiled: December 23, 1997Date of Patent: May 11, 1999Assignee: Bong Shin Co., Ltd.Inventor: Yong-Chul Pang
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Patent number: 5897756Abstract: A device in the form of a flow cell for the chemical or electrolytic surface treatment of plate-shaped articles has first feed elements in the form of tubes with outlet openings for the directed supply of a process liquid to the articles to be treated and, in accordance with the invention, additional, second feed means in the process liquid for the directed introduction of air into the active area of guide elements, which consist of flow gratings, maintained at a distance on both sides of the articles to be treated, with small plates arranged in the manner of a shutter, which are inclined upward and downward in the direction parallel with the main plane of the flat plate articles.This principle of admixing air in connection with the design of the guide elements as flow gratings has the effect that the emerging air bubbles pass the flow gratings in an upward direction and carry the surrounding process liquid along.Type: GrantFiled: June 26, 1997Date of Patent: April 27, 1999Assignee: Lea Ronal GmbHInventor: Karl Hans Fuchs
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Patent number: 5885426Abstract: A halogen generator produces a halogen sanitizing agent to sanitize water in a spa or other water feature. A coaxial wall fitting desirably couples the halogen generator to the water feature. The halogen generator desirably includes a bipolar electrolytic cell in which a center electrode plate rotates between stationary anode and cathode plates. The bipolar electrode includes a plurality of vanes which motivate water flow between the anode and the cathode. The vanes on the rotating electrode also produce a flow of water through the generator. In this manner, the bipolar electrode functions as a impeller to pump water through the halogen generator. The vanes are positioned between the electrode and cathode, and are sufficiently spaced from the cathode to inhibit scale formation on the cathode. The vanes, however, generally do not contact the cathode when rotating.Type: GrantFiled: August 26, 1997Date of Patent: March 23, 1999Assignee: BioQuestInventor: Michael A. Silveri
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Patent number: 5882502Abstract: An electrochemical apparatus and system for extracting and recovering metals from their compounds using electrochemical cells where the anolyte 10 is connected electrically to the catholyte 11 through an independent set of electrodes 13, 14 immersed in each electrolyte and connected to each other by a conductor 16. The specification details the application of this principle to commercial size cells and systems to extract metals from solutions, from ores in-situ, from ores in heaps and fixed beds, from fine metal concentrates dissolved either at the anode cell or in a separate leaching vessel. Alkaline electrolytes are also given for the extraction and recovery of nickel and copper from their oxide ores. A method for extracting gold from ores or residues is also included.Type: GrantFiled: September 25, 1996Date of Patent: March 16, 1999Assignee: RMG Services Pty Ltd.Inventor: Rodolfo Gomez