Nonreversing Pulsed Current Or Voltage Patents (Class 205/104)
  • Patent number: 10208391
    Abstract: An ionic liquid composition comprising a complex of a trihalo aluminum (III) species with at least one organic uncharged ligand comprising a ring structure having at least three ring carbon atoms and at least one ring heteroatom selected from nitrogen and sulfur, wherein the complex is a liquid at a temperature of 100° C. or less. Methods of electroplating aluminum onto a metallic substrate using the above-described ionic liquid composition are also described.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: February 19, 2019
    Assignee: UT-Battelle, LLC
    Inventors: Sheng Dai, Xiao-Guang Sun
  • Patent number: 10189229
    Abstract: A surface-treated steel sheet of the present invention includes: a base steel sheet; a surface treatment layer which is formed on at least one surface of the base steel sheet and includes an oxide layer and a metal layer; and a chemical conversion layer which is formed on a surface of the surface treatment layer. The surface treatment layer contains Zn in an adhered amount of 0.30 g/m2 to 2.00 g/m2 and Ni in an adhered amount of 0.03 g/m2 to 2.00 g/m2, which is equal to or lower than the adhered amount of Zn. In a case of performing a glow discharge spectrometry, at an interface between the oxide layer and the metal layer, an emission intensity of Fe atoms is 20% or less of the maximum emission intensity of the Fe atoms, and the emission intensity of Ni atoms is 20% or less of the maximum emission intensity of the Ni atoms.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: January 29, 2019
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Takehiro Takahashi, Kiyokazu Ishizuka
  • Patent number: 10023968
    Abstract: Disclosed is an electric Al—Zr alloy plating bath containing an aluminum halide (A), one or more compounds (B) selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N?-alkylimidazolium halides, N-alkylpyrazolium halides and N,N?-alkylpyrazolium halides, and a zirconium halide (C). The molar ratio between the aluminum halide (A) and the compounds (B) is from 1:1 to 3:1. The electric Al—Zr alloy plating bath further contains an aromatic organic solvent (D), an organic polymer (E) and one or more additives (F) selected from brightening agents.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: July 17, 2018
    Assignees: Dipsol Chemicals Co., Ltd., Honda Motor Co., Ltd.
    Inventors: Manabu Inoue, Tadahiro Ohnuma, Tsutomu Miyadera
  • Patent number: 9776859
    Abstract: A microscale device comprises a patterned forest of vertically grown and aligned carbon nanotubes defining a carbon nanotube forest with the nanotubes having a height defining a thickness of the forest, the patterned forest defining a patterned frame that defines one or more components of a microscale device. A conformal coating of substantially uniform thickness at least partially coats the nanotubes, defining coated nanotubes and connecting adjacent nanotubes together, without substantially filling interstices between individual coated nanotubes. A metallic interstitial material infiltrates the carbon nanotube forest and at least partially fills interstices between individual coated nanotubes.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: October 3, 2017
    Assignee: Brigham Young University
    Inventors: Robert C. Davis, Richard R. Vanfleet
  • Patent number: 9732433
    Abstract: Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: August 15, 2017
    Assignee: Modumetal, Inc.
    Inventors: Richard Caldwell, Jesse Unger
  • Patent number: 9735017
    Abstract: A false report on appearance inspection of a semiconductor device is prevented by suppressing variation in surface state of an electrodeposited gold electrode. In formation of an electrodeposited gold electrode, an electrodeposited gold electrode comprised of a plurality of electrodeposited gold layers in the stack is formed by alternately repeating a step of performing energization between an anode electrode and a cathode electrode provided in a treatment cup of a plating apparatus to cause crystal growth of an electrodeposited gold layer (energization ON), and a step of performing no energization between the anode electrode and the cathode electrode (energization OFF). Consequently, even if aging variation occurs in composition of the plating solution, variation in surface state of the electrodeposited gold electrode is suppressed, and a surface state with a surface roughness of, for example, about 0.025 rad can be maintained.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: August 15, 2017
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Yoshinori Murakami, Hitoshi Fukuma, Taku Kanaoka
  • Patent number: 9711345
    Abstract: A method for forming an aluminum nitride-based film on a substrate by plasma-enhanced atomic layer deposition (PEALD) includes: (a) forming at least one aluminum nitride (AlN) monolayer and (b) forming at least one aluminum oxide (AlO) monolayer, wherein steps (a) and (b) are alternately conducted continuously to form a laminate. Steps (a) and (b) are discontinued before a total thickness of the laminate exceeds 10 nm, preferably 5 nm.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: July 18, 2017
    Assignee: ASM IP Holding B.V.
    Inventor: Eiichiro Shiba
  • Patent number: 9702219
    Abstract: A stabilization composition including a polymerizable ionic liquid (“PIL”) comprising a cationic group, an anionic group, and a polymerizable functional group, wherein the cationic group has a molecular mass in the range of about 20 g/mol to about 500 g/mol and the anionic group has a molecular mass in the range of about 30 g/mol to about 500 g/mol.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: July 11, 2017
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Corneliu Stanciu, James Ogle, Bradley James Sparks
  • Patent number: 9371232
    Abstract: Disclosed is a trekking atom nanotube growth technology capable of continuously growing long, high quality nanotubes. This patent application is a Continuation In Part of the Proximate Atom Nanotube Growth patent application Ser. No. 13/694,088 filed on Oct. 29, 2012. The current invention represents a departure from chemical vapor deposition technology as the atomic feedstock does not originate in the gaseous environment surrounding the nanotubes. The technology mitigates the problems that cease carbon nanotube growth in chemical vapor deposition growth techniques: 1) The accumulation of material on the surface of the catalyst particles, suspected to be primarily amorphous carbon, 2) The effect of Ostwald ripening that reduces the size of smaller catalyst particles and enlarges larger catalyst particles, 3) The effect of some catalyst materials diffusing into the substrate used to grow carbon nanotubes and ceasing growth when the catalyst particle becomes too small.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: June 21, 2016
    Inventor: Bryan Edward Laubscher
  • Patent number: 9359683
    Abstract: Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: June 7, 2016
    Assignee: APPLIED Materials, Inc.
    Inventors: Bioh Kim, Marvin Bernt, Greg Wilson, Paul R. McHugh
  • Patent number: 9297088
    Abstract: There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of the through-hole, the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using a PR pulsed current, and the third plating process is a plating process of completely filling the through-hole with the metal film using the plating current whose value is equal to or larger than a forward-current value of the PR pulsed current used in the second plating process.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: March 29, 2016
    Assignee: Ebara Corporation
    Inventors: Masashi Shimoyama, Yuji Araki, Fumio Kuriyama, Jumpei Fujikata
  • Patent number: 9273403
    Abstract: The invention relates to a method for improving the performance of nickel electrodes in alkali chloride electrolysis by adding water-soluble platinum compounds to the catolyte.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: March 1, 2016
    Assignee: Covestro Deutschland AG
    Inventors: Andreas Bulan, Rainer Weber, Richard Malchow, Rolf Spatz, Hermann-Jens Womelsdorf
  • Patent number: 9234294
    Abstract: A method of making property modulated composite materials includes depositing a first layer of material having a first microstructure/nanostructure on a substrate followed by depositing a second layer of material having a second microstructure/nanostructure that differs from the first layer. Multiple first and second layers can be deposited to form a composite material that includes a plurality of adjacent first and second layers. By controlling the microstructure/nanostructure of the layers, the material properties of the composite material formed by this method can be tailored for a specific use. The microstructures/nanostructures of the composite materials may be defined by one or more of grain size, grain boundary geometry, crystal orientation, and a defect density.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: January 12, 2016
    Assignee: Modumetal, Inc.
    Inventors: John Whitaker, Zhi Liang Bao
  • Publication number: 20150132604
    Abstract: A coating for protecting a base material from wear and corrosion includes a first layer deposited directly onto an outer surface of the base material. In addition, the coating includes a second layer deposited directly onto the first layer. The first layer is positioned between the base material and the second layer. The first layer includes chromium having a first micro-crack density and the second layer comprises chromium having a second micro-crack density that is less than the first micro-crack density.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 14, 2015
    Applicant: National Oilwell DHT, L.P.
    Inventors: Jiinjen Albert Sue, Unnikrishnan C. Vasudevan, Rajagopala N. Pillai
  • Patent number: 9011706
    Abstract: A foraminous microstructure or film that has photonic or plasmonic properties is made by forming a structure or film composed of at least two constituent materials so that the compositional ratio of the constituent materials varies in a depth direction of the structure, and then removing one of the materials from the structure.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: April 21, 2015
    Assignee: City University of Hong Kong
    Inventors: Yang Yang Li, Zhengtao Xu, Chun Kwan Tsang
  • Patent number: 9005420
    Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 14, 2015
    Assignee: Integran Technologies Inc.
    Inventors: Klaus Tomantschger, Glenn Hibbard, Gino Palumbo, Iain Brooks, Jonathan McCrea, Fred Smith
  • Publication number: 20150050521
    Abstract: Multilayer material comprising a zirconium-based substrate covered with a multilayer coating, the multilayer coating comprising metallic layers composed of identical or different substances chosen from chromium, a chromium alloy or a ternary alloy of the Nb—Cr—Ti system. Such a material has improved resistance to oxidation in accident conditions of a nuclear reactor. The invention also relates to a multilayer coating, a part composed wholly or partly of the multilayer material or of the multilayer coating, as well as the method for manufacturing the multilayer material such as for example a magnetron cathodic sputtering process.
    Type: Application
    Filed: October 27, 2014
    Publication date: February 19, 2015
    Inventors: Marion LE FLEM, Cédric DUCROS, Frédéric SANCHETTE
  • Patent number: 8945362
    Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: February 3, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jacek M. Knop, John G. Carter, Donald E. Cleary
  • Publication number: 20140374267
    Abstract: A method for coating a substrate includes disposing a deposition composition in a container. The deposition composition includes a plurality of nanosheets and a metal material. The method also includes disposing a substrate in the container, contacting the substrate with the deposition composition, applying a voltage to the substrate, electrodepositing, on the substrate, a coating that includes a metal from metal ions and the nanosheets in response to biasing the substrate at the first potential.
    Type: Application
    Filed: June 20, 2013
    Publication date: December 25, 2014
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Othon Monteiro, Oleg Mazyar, Valery Khabashesku
  • Publication number: 20140262794
    Abstract: A method for electroplating a wafer detects plating bath failure based on a voltage change. The method is useful in plating wafers having TSV features. Voltage of each anode of a plating processor may be monitored. An abrupt drop in voltage signals a bath failure resulting from conversion of an accelerator such as SPS to it's by products MPS. Bath failure is delayed or avoided by current pulsing or current ramping. An improved plating bath has a catholyte with a very low acid concentration.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Daniel K. Gebregziabiher, John Klocke, Charles Sharbono, Chandru Thambidurai, David J. Erickson
  • Publication number: 20140262797
    Abstract: The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution.
    Type: Application
    Filed: April 9, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Yi Chang, Liang-Yueh Ou Yang, Chen-Yuan Kao, Hung-Wen Su
  • Patent number: 8821707
    Abstract: Disclosed herein is an electric Al or Al alloy plating bath which comprises (A) an aluminum halide; (B) one kind of compound or at least two kinds of compounds selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N?-alkylimidazolium halides, N-alkyl-pyrazolium halides, N,N?-alkylpyrazolium halides, N-alkylpyrrolidinium halides and N,N-alkyl-pyrrolidinium halides; and (C) a high boiling point aromatic hydrocarbon solvent, wherein the molar ratio of the aluminum halide (A) to the compound (B) ranges from 1:1 to 3:1 and the flash point of the plating bath is not less than 50° C. The plating bath never involves any risk of causing an explosion, can be handled industrially with safety and can provide a smooth and fine Al of Al alloy plated film.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: September 2, 2014
    Assignees: Dipsol Chemicals Co., Ltd., Honda Motor Co., Ltd.
    Inventors: Manabu Inoue, Tadahiro Ohnuma, Tsutomu Miyadera
  • Publication number: 20140224661
    Abstract: In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.
    Type: Application
    Filed: January 7, 2013
    Publication date: August 14, 2014
    Inventors: Tighe A. Spurlin, Jian Zhou, Edward C. Opocensky, Jon Reid, Steven T. Mayer
  • Publication number: 20140178710
    Abstract: An aluminum alloy component is protected by an electrodeposited aluminum coating. An electrodeposited intermediate aluminum-transition metal alloy and/or rare earth metal alloy layer between the aluminum alloy substrate and the protective coating enhances coating adhesion and corrosion resistance. The intermediate layer is formed by room temperature electrodeposition in ionic liquids.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Lei Chen, Mark R. Jaworowski, Curtis H. Riewe, Xiaomei Yu
  • Publication number: 20140141929
    Abstract: An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.
    Type: Application
    Filed: November 20, 2012
    Publication date: May 22, 2014
    Applicant: UNITED TECHNOLOGIES CORPORATION
    Inventors: Thomas R. Hanlon, William P. Ogden, Eli N. Ross
  • Publication number: 20140016233
    Abstract: In the present invention, magnetic and non-magnetic films are formed as a compound of Fe, Ni and P to provide a multilayer film in which such magnetic and non-magnetic films are alternately stacked. The multilayer film includes a magnetic film and a non-magnetic film. The magnetic film and the non-magnetic film are alternately stacked. The magnetic film contains Fe, Ni and P but has Fe as a main component. The magnetic film contains Fe, Ni and P but has Fe or Ni as a main component. The non-magnetic film contains Fe, Ni and P but has Ni as a main component.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 16, 2014
    Applicant: TDK Corporation
    Inventors: Masaya Kato, Atsushi Yamaguchi
  • Publication number: 20140001049
    Abstract: A self-terminating rapid process for controlled growth of platinum or platinum alloy monolayer films from a K2PtCl4—NaCl—NaBr electrolyte. Using the present process, platinum deposition may be quenched at potentials just negative of proton reduction by an alteration of the double layer structure induced by a saturated surface coverage of underpotential deposited hydrogen. The surface may be reactivated for platinum deposition by stepping the potential to more positive values where underpotential deposited hydrogen is oxidized and fresh sites for absorption of platinum chloride become available. Periodic pulsing of the potential enables sequential deposition of two dimensional platinum layers to fabricate films of desired thickness relevant to a range of advanced technologies, from catalysis to magnetics and electronics.
    Type: Application
    Filed: August 28, 2013
    Publication date: January 2, 2014
    Inventors: Thomas P. Moffat, Yihua Liu
  • Patent number: 8603315
    Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: December 10, 2013
    Assignee: Faraday Technology, Inc.
    Inventors: E. Jennings Taylor, Jenny J. Sun
  • Patent number: 8574418
    Abstract: The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: November 5, 2013
    Assignee: Alchimer
    Inventors: Hervé Monchoix, Frédéric Raynal, Jérôme Daviot, José Gonzalez
  • Publication number: 20130220819
    Abstract: A layer of chromium metal is electroplated from trivalent chromium onto an electrically conducting substrate by immersing the substrate and a counter electrode in a electroplating bath and passing a modulated electric current between the electrodes. In one embodiment, the current contains pulses that are cathodic with respect to said substrate and in another embodiment the current contains pulses that are cathodic and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle greater than about 80%.
    Type: Application
    Filed: February 15, 2013
    Publication date: August 29, 2013
    Applicant: Faraday Technology, Inc.
    Inventors: Timothy Hall, Burhanuddin Kagajwala
  • Patent number: 8500983
    Abstract: A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the plating solution. In certain embodiments, the current density of the wafer is constant during immersion. In a specific example, potentiostatic control is employed to produce a current density in the range of about 1.5 to 20 mA/cm2. The immersion step is followed by a high current pulse step. During bottom up fill inside the features of the wafer, a constant current or a current with a micropulse may be used. This protocol may protect the seed from corrosion while enhancing nucleation during the initial stages of plating.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: August 6, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Thomas A. Ponnuswamy, Bryan Pennington, Clifford Berry, Bryan L. Buckalew, Steven T. Mayer
  • Patent number: 8449948
    Abstract: A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: May 28, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Jose Antonio Medina, Keith Y. Sasaki
  • Publication number: 20130130055
    Abstract: A coated steel sheet includes a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer disposed on at least one surface of a steel sheet, and an adhesive coating disposed on the corrosion-resistant coating, the adhesive coating containing Zr and further containing at least one metal element selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, in total, at a ratio by mass of 0.01 to 10 with respect to Zr. The coated steel sheet has excellent humid resin adhesion and corrosion resistance, in which streaky surface defects do not occur.
    Type: Application
    Filed: March 24, 2011
    Publication date: May 23, 2013
    Applicant: JFE STEEL CORPORATION
    Inventors: Yuka Miyamoto, Takeshi Suzuki, Hiroki Iwasa, Norihiko Nakamura, Masao Inose, Hisato Noro, Yoichi Tobiyama
  • Publication number: 20130122326
    Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 16, 2013
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventor: NATIONAL CHIAO TUNG UNIVERSITY
  • Publication number: 20130112564
    Abstract: The embodiment described herein relate to pulse electroplating methods and solutions.
    Type: Application
    Filed: October 4, 2012
    Publication date: May 9, 2013
    Applicant: SOLOPOWER, INC.
    Inventor: SOLOPOWER, INC.
  • Publication number: 20130098665
    Abstract: The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a second metal layer that is adjacent to the first metal layer and contains second metallic crystal grains, with the first metal layer and the second metal layer being laminated along a direction perpendicular to the main surface of the insulating substrate, and the average grain size of the first metallic crystal grains is smaller than the average grain size of the second metallic crystal grains.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 25, 2013
    Inventors: Yuu Ishii, Atsuki Nogami, Yusuke Nakatani
  • Publication number: 20130071755
    Abstract: Disclosed is a copper foil for a negative electrode collector capable of simultaneously achieving high capacity and long life charge/discharge cycles in a secondary battery, wherein the front and back surfaces are of a uniform shape and, for example, the properties of a silicon active material of a lithium ion secondary battery are sufficiently realized; and a negative electrode using the copper foil. In one embodiment, a first roughened layer of metallic copper is formed by pulse cathode electrolysis roughening treatment on the surface of an untreated rolled copper foil base material of oxygen-free copper in a first roughening treatment tank (1) filled with a copper-sulphuric acid electrolyte (12), and a second copper-plate layer is formed on the surface of the first roughened layer by smooth copper plating treatment in a second copper plating treatment tank (2) filled with a copper-sulphuric acid electrolyte (22).
    Type: Application
    Filed: February 25, 2011
    Publication date: March 21, 2013
    Applicant: Furukawa Electric Co., LTD.
    Inventor: Ryoichi Oguro
  • Publication number: 20130029170
    Abstract: Articles of manufacture comprise a body. A porous material is plated on the body, the porous material comprising nickel having a plurality of pores disposed in a generally ordered array extending into the nickel. Methods of forming a porous material on a body comprise disposing an anode and a cathode in an electrolyte comprising nickel ions. An electrical signal is pulsed to at least one of the anode and the cathode. A porous material comprising nickel having a plurality of pores generally disposed in an ordered array extending into the nickel is deposited on the cathode.
    Type: Application
    Filed: July 29, 2011
    Publication date: January 31, 2013
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Hendrik John, Sven Hartwig, Claus-Peter Klages
  • Publication number: 20120279864
    Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.
    Type: Application
    Filed: October 31, 2011
    Publication date: November 8, 2012
    Inventors: Steven T. Mayer, Vijay Bhaskaran, Evan E. Patton, Robert L. Jackson, Jonathan Reid
  • Publication number: 20120199488
    Abstract: A method for electroplating titanium alloy coating into plastic and carbon foam comprises the steps of activating the given specimen, deposition of electroless nickel and electroplating process of titanium alloy to the surface of the specimen. The electroplating process of electroplating titanium alloy coating includes a direct current method and a pulse plating method. The direct current method characterized by lager sized grains and the pulse plating method characterized by smaller sized grains. The advantages of proposed electroplating processes are: a) low cost, b) very broad applications and c) relatively low number of the process steps. Unique combination of physical, mechanical and chemical properties makes the electroplating methods of titanium coating an attractive technology for medicine, biotechnology, sports, defense, aeronautic, and auto industries.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 9, 2012
    Inventors: Margaret E. PARKER, Piotr Cieplak, Barbara Gorecka
  • Publication number: 20120181179
    Abstract: The invention relates to the metalworking field, particularly to electrochemical sizing machining, and can be used for manufacturing of machine workpieces having an intricate profile and shaping furniture from chromium-containing steels and alloys operating in aggressive environment under excessive friction. Technical effect: improving machining accuracy by forming a lustrous layer on the machined surface and reduction of concentration of hexavalent toxic chromium ions in a waste electrolyte solution.
    Type: Application
    Filed: April 29, 2011
    Publication date: July 19, 2012
    Applicant: PECM INDUSTRIAL, LLC
    Inventors: Vyacheslav Alexandrovich ZAYTSEV, Nasih Ziyatdinovich GIMAEV, Timur Rashitovich IDRISOV
  • Publication number: 20120175534
    Abstract: There is described an open cell porous structure the cells of which are optionally filled with an elastomeric or thermosetting plastic comprising a nanocrystalline metallic or nanocrystalline metal matrix composite coating wherein the nanocrystals have a crystallite size of from about 5 nm to about 150 nm. A process for preparing the coated open cell porous structures is also disclosed.
    Type: Application
    Filed: June 9, 2010
    Publication date: July 12, 2012
    Applicant: UNIVERSITAET DES SAARLANDES
    Inventors: Anne Jung, Harald Natter, Rolf Hempelmann, Ehrhardt Lach
  • Patent number: 8177926
    Abstract: Amorphous Fe100-a-bPaMb foil, preferably in the form of a free-standing foil, process for its production by electrodeposition or electroforming of an aqueous plating solution, and its uses as a constitutive element of a transformer, generator, motor, pulse applications and magnetic shieldings. “a” is a real number ranging from 13 to 24, b is a real number ranging from 0 to 4, and M is at least one transition element other than Fe. The amorphous Fe100-a-bPaMb foil has the properties of being amorphous as established by the X-ray diffraction method, an average thickness greater than 20 micrometers, a tensile strength in the range of 200-1100 MPa, an electrical resistivity of over 120 ??cm, and at least one of a high saturation induction (Bs) greater than 1.4 T, a coercive field (Hc) of less than 40 A/m, a loss (W60), at power frequencies (60 Hz), and for a peak induction of at least 1.35 T, of less than 0.65 W/kg, and a relative magnetic permeability (B/?0H) greater than 10000, for low values of ?0H.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: May 15, 2012
    Assignee: Hydro-Quebec
    Inventors: Robert Lacasse, Estelle Potvin, Michel Trudeau, Julian Cave, Francois Allaire, Georges Houlachi
  • Patent number: 8173004
    Abstract: A pulse current from a pulse current supply side is fed to a middle part of an anode holding body to which anodes are connected; both end portions of a cathode holding body, to which cathodes are connected, are connected to a negative pole on the pulse power source side; and inductances of wiring between adjacent anodes and inductances of wiring between adjacent cathodes are set at a ratio of 1:2:3:4 in a direction of spacing from a connection to the pulse power source side. Pulse currents are equally fed to each work and it can be ensured that chromium plating treatment of each work is made equal.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: May 8, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Takahisa Hirasawa, Hiroshi Yoshikura, Junichi Ikeda, Tsuyoshi Kawase, Yuichi Kobayashi
  • Publication number: 20120093680
    Abstract: The method for obtaining copper powders and nanopowders from industrial electrolytes including waste industrial electrolytes through electrochemical deposition of metallic copper on a cathode consists in using potentiostatic pulse electrolysis without the current direction change or with the current direction change, using the cathode potential value close to the plateau or on the plateau of the current voltage curve on which the plateau of the current potential range is from ?0.2 V÷?1 V, and a moveable or static ultramicroelectrode or an array of ultramicroelectrodes made of gold, platinum or stainless steel wire or foil is used as a cathode, whereas metallic copper is used as an anode and the process is carried out at temperature from 18-60° C., and the electrolysis lasts from 0.005 to 60 s. Said method can be used to obtain nanopowders and powders characterised by particle structure and dimension repeatability and purity from 99%+ to 99.
    Type: Application
    Filed: March 17, 2010
    Publication date: April 19, 2012
    Inventors: Przemyslaw Los, Aneta Lukomska, Anna Plewka
  • Patent number: 8147659
    Abstract: A gated electrode structure for altering a potential and electric field in an electrolyte near at least one working electrode is disclosed. The gated electrode structure may comprise a gate electrode biased appropriately with respect to a working electrode. Applying an appropriate static or dynamic (time varying) gate potential relative to the working electrode modifies the electric potential and field in an interfacial region between the working electrode and the electrolyte, and increases electron emission to and from states in the electrolyte, thereby facilitating an electrochemical, electrolytic or electrosynthetic reaction and reducing electrode overvoltage/overpotential.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: April 3, 2012
    Assignee: The Regents of the University of California
    Inventors: Rakesh K. Lal, Likun Shen, Umesh Kumar Mishra
  • Patent number: 8142637
    Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: March 27, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andre Egli, Wing Kwong Wong, Raymund W. M. Kwok, Jochen Heber
  • Publication number: 20120052324
    Abstract: Provided herein is an electric Al—Zr—Mn alloy-plating bath which comprises (A) an aluminum halide; (B) one or at least two kinds of compounds selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N?-dialkyl-imidazolium halides, N-alkyl-pyrazolium halides, N,N?-dialkyl-pyrazolium halides, N-alkylpyrrolidinium halides and N,N-dialkyl-pyrrolidinium halides; (C) a zirconium halide; and (D) a manganese halide, in which the molar ratio of the aluminum halide (A) to the compound (B) ranges from 1:1 to 3:1. The plating bath never involves any risk of causing an explosion and can provide a smooth and fine Al—Zr—Mn alloy-plated film. Moreover, the resulting film has high resistance to corrosion even when it does not contain any chromium and therefore, it is quite suitable from the viewpoint of the environmental protection and it can thus be used in a wide variety of applications including the plating of parts for motorcars, and the plating of parts for electrical appliances.
    Type: Application
    Filed: August 30, 2010
    Publication date: March 1, 2012
    Applicants: HONDA MOTOR CO., LTD., DIPSOL CHEMICALS CO., LTD.
    Inventors: Manabu Inoue, Tadahiro Ohnuma, Tsutomu Miyadera
  • Publication number: 20110290653
    Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.
    Type: Application
    Filed: August 3, 2011
    Publication date: December 1, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: André EGLI, Wing Kwong Wong, Raymund W.M. Kwok, Jochen Heber
  • Patent number: 8048280
    Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: November 1, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Vijay Bhaskaran, Evan E. Patton, Robert L. Jackson, Jonathan Reid