Abstract: An apparatus and method of forming a heat exchanger includes forming a monolithic core body having a first set of flow passages and a core coefficient of thermal expansion, and additively manufacturing onto the monolithic core a first manifold defining a first fluid inlet for the first set of flow passages.

Abstract: A preparation method of a copper-based graphene composite with high thermal conductivity is provided. A new electrodeposited solution is used for direct current (DC) electrodeposition at a reasonable electrodeposition frequency, which fabricates a new copper-based graphene composite with high tensile strength and thermal conductivity. The copper-based graphene composite prepared by electrodeposition has high thermal conductivity of 390-1112 W/(m·k) and tensile strength of 300-450 MPa, which meets the requirements in the field of thermal conduction.

Abstract: An object comprising a chromium-based coating on a substrate is disclosed. The chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises: a first chromium-containing layer, on the substrate, having a thickness of at least 100 nm, and a Vickers microhardness value of 700-1000 HV; a second chromium-containing layer, on the first chromium-containing layer, having a Vickers microhardness value that is at least 1.3 times higher than the Vickers microhardness value of the first chromium-containing layer, and a crystal size of 8-35 nm; and wherein the chromium-based coating exhibits a critical scratch load value (LC2) of at least 60 N in the adhesion test according to ASTM C1624-05 (2015; point 11.11.4.4), and wherein the chromium-based coating does not contain chromium carbide. Further is disclosed a method for its production.

Abstract: In certain aspects, a coated steel substrate comprises a single or multiple-layer electroplated aluminum coating over a steel substrate. The multiple-layer electroplated aluminum coating comprises one or more porous layers and one or more compact layers. The one or more porous layers comprise a material selected from a group consisting of aluminum and aluminum alloys. The one or more compact layers comprise a material selected from a group consisting of aluminum and aluminum alloys. In certain aspects, a method of depositing a multiple-layer aluminum coating over a steel substrate includes electroplating one or more porous aluminum layers over the steel substrate. The one or more porous aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys. One or more compact aluminum layers are electroplated over the steel substrate. The one or more compact aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys.

Abstract: The present disclosure relates to a method of electroplating of a silver-graphene composite onto a substrate. The method comprises preparing a plating bath comprising: a dissolved water soluble silver salt, dispersed graphene flakes, and an aqueous electrolyte comprising a silver complexing agent, a cationic surfactant, and a pH adjusting compound. The zeta potential of the graphene-electrolyte interface in the plating bath is adjusted to be positive and within the range of 10-30 mV by means of the cationic surfactant and the pH adjusting compound. The method also comprises applying a negative electric potential on the substrate surface such that electrophoresis of the graphene flakes occurs and said flakes are co-deposited with the silver during electroplating thereof to form a silver-graphene composite coating on the substrate surface.

Abstract: This invention relates to a metal component, a manufacturing method thereof, and a process chamber having the metal component, and particularly to a metal component useful in a display or semiconductor manufacturing process, a manufacturing method thereof, and a process chamber having the metal component, wherein among addition elements of an aluminum alloy that constitutes the metal substrate of the metal component, the addition element existing on the surface thereof is removed, and a barrier layer having no pores is formed, thereby solving problems attributable to a conventional anodized film having a porous layer and attributable to the addition element in the form of particles on the surface of the metal substrate.

Abstract: An object including a chromium-based coating on a substrate and a method for its production are disclosed. The chromium-based coating having a first layer on the substrate, wherein the first layer has a top surface on the opposite side to the substrate and includes fissures within the first layer, and wherein the material of the first layer is predominantly formed of chromium and chromium carbide; the chromium-based coating further having a second layer on the first layer, the second layer at least partially filling the fissures in the first layer and at least partially covers the top surface of the first layer, wherein the material of the second layer is selected from a group consisting of: chromium oxide, carbon, and a combination of chromium oxide and carbon.

Abstract: The disclosure discloses a method for preparing a permanent magnet material. In this method, an ionic liquid electroplating process is used to electroplate a heavy rare earth metal onto a surface of a sintered magnet to form a magnet with a coating, wherein the sintered magnet has a thickness of 10 mm or less in at least one direction; in the ionic liquid electroplating process, an electroplating solution comprises an ionic liquid, a heavy rare earth salt, a group VIII metal salt, an alkali metal salt and an additive, an anode is a heavy rare earth metal or a heavy rare earth alloy, a cathode is the sintered magnet, an electroplating temperature is 20-50° C., an electroplating time is 15-80 min. The preparation method of the disclosure can improve an intrinsic coercive force of the magnet with low cost and high production efficiency. A utilization rate of heavy rare earth is high.

Abstract: In a method for manufacturing an interconnect structure, a dielectric layer is removed to form a first recess and a second recess. The first recess is below the second recess. A first metal layer is deposited to fill the first recess and a first portion of the second recess. A carbon-containing layer is deposited over the first metal layer to fill a second portion of the second recess, which is over the first portion. A second metal layer is deposited over the carbon-containing layer to fill a third portion of the second recess, which is over the second portion. A carbon concentration of the carbon-containing layer is greater than a carbon concentration of the first metal layer and a carbon concentration of the second metal layer, and the carbon concentration of the first metal layer is substantially the same as the carbon concentration of the second metal layer.

Abstract: An ionic liquid composition comprising a complex of a trihalo aluminum (III) species with at least one organic uncharged ligand comprising a ring structure having at least three ring carbon atoms and at least one ring heteroatom selected from nitrogen and sulfur, wherein the complex is a liquid at a temperature of 100° C. or less. Methods of electroplating aluminum onto a metallic substrate using the above-described ionic liquid composition are also described.

Abstract: A surface-treated steel sheet of the present invention includes: a base steel sheet; a surface treatment layer which is formed on at least one surface of the base steel sheet and includes an oxide layer and a metal layer; and a chemical conversion layer which is formed on a surface of the surface treatment layer. The surface treatment layer contains Zn in an adhered amount of 0.30 g/m2 to 2.00 g/m2 and Ni in an adhered amount of 0.03 g/m2 to 2.00 g/m2, which is equal to or lower than the adhered amount of Zn. In a case of performing a glow discharge spectrometry, at an interface between the oxide layer and the metal layer, an emission intensity of Fe atoms is 20% or less of the maximum emission intensity of the Fe atoms, and the emission intensity of Ni atoms is 20% or less of the maximum emission intensity of the Ni atoms.

Abstract: Disclosed is an electric Al—Zr alloy plating bath containing an aluminum halide (A), one or more compounds (B) selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N?-alkylimidazolium halides, N-alkylpyrazolium halides and N,N?-alkylpyrazolium halides, and a zirconium halide (C). The molar ratio between the aluminum halide (A) and the compounds (B) is from 1:1 to 3:1. The electric Al—Zr alloy plating bath further contains an aromatic organic solvent (D), an organic polymer (E) and one or more additives (F) selected from brightening agents.

Abstract: A microscale device comprises a patterned forest of vertically grown and aligned carbon nanotubes defining a carbon nanotube forest with the nanotubes having a height defining a thickness of the forest, the patterned forest defining a patterned frame that defines one or more components of a microscale device. A conformal coating of substantially uniform thickness at least partially coats the nanotubes, defining coated nanotubes and connecting adjacent nanotubes together, without substantially filling interstices between individual coated nanotubes. A metallic interstitial material infiltrates the carbon nanotube forest and at least partially fills interstices between individual coated nanotubes.

Abstract: Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties.

Abstract: A false report on appearance inspection of a semiconductor device is prevented by suppressing variation in surface state of an electrodeposited gold electrode. In formation of an electrodeposited gold electrode, an electrodeposited gold electrode comprised of a plurality of electrodeposited gold layers in the stack is formed by alternately repeating a step of performing energization between an anode electrode and a cathode electrode provided in a treatment cup of a plating apparatus to cause crystal growth of an electrodeposited gold layer (energization ON), and a step of performing no energization between the anode electrode and the cathode electrode (energization OFF). Consequently, even if aging variation occurs in composition of the plating solution, variation in surface state of the electrodeposited gold electrode is suppressed, and a surface state with a surface roughness of, for example, about 0.025 rad can be maintained.

Abstract: A method for forming an aluminum nitride-based film on a substrate by plasma-enhanced atomic layer deposition (PEALD) includes: (a) forming at least one aluminum nitride (AlN) monolayer and (b) forming at least one aluminum oxide (AlO) monolayer, wherein steps (a) and (b) are alternately conducted continuously to form a laminate. Steps (a) and (b) are discontinued before a total thickness of the laminate exceeds 10 nm, preferably 5 nm.

Abstract: A stabilization composition including a polymerizable ionic liquid (“PIL”) comprising a cationic group, an anionic group, and a polymerizable functional group, wherein the cationic group has a molecular mass in the range of about 20 g/mol to about 500 g/mol and the anionic group has a molecular mass in the range of about 30 g/mol to about 500 g/mol.

Abstract: Disclosed is a trekking atom nanotube growth technology capable of continuously growing long, high quality nanotubes. This patent application is a Continuation In Part of the Proximate Atom Nanotube Growth patent application Ser. No. 13/694,088 filed on Oct. 29, 2012. The current invention represents a departure from chemical vapor deposition technology as the atomic feedstock does not originate in the gaseous environment surrounding the nanotubes. The technology mitigates the problems that cease carbon nanotube growth in chemical vapor deposition growth techniques: 1) The accumulation of material on the surface of the catalyst particles, suspected to be primarily amorphous carbon, 2) The effect of Ostwald ripening that reduces the size of smaller catalyst particles and enlarges larger catalyst particles, 3) The effect of some catalyst materials diffusing into the substrate used to grow carbon nanotubes and ceasing growth when the catalyst particle becomes too small.

Abstract: Electric potential, current density, agitation, and deposition rate are controlled to deposit metal alloys, such as tin based solder alloys or magnetic alloys, with minimal variations in the weight ratios of alloying metals at different locations within the deposited metal alloy feature. Alternative embodiments include processes that form metal alloy features wherein the variation in weight ratio of alloying metals within the feature is not necessarily minimized, but is controlled to provide a desired variation. In addition to metal alloys, alternative embodiments include processes for improving the deposition of single metal features.

Abstract: There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of the through-hole, the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using a PR pulsed current, and the third plating process is a plating process of completely filling the through-hole with the metal film using the plating current whose value is equal to or larger than a forward-current value of the PR pulsed current used in the second plating process.

Abstract: The invention relates to a method for improving the performance of nickel electrodes in alkali chloride electrolysis by adding water-soluble platinum compounds to the catolyte.

Abstract: A method of making property modulated composite materials includes depositing a first layer of material having a first microstructure/nanostructure on a substrate followed by depositing a second layer of material having a second microstructure/nanostructure that differs from the first layer. Multiple first and second layers can be deposited to form a composite material that includes a plurality of adjacent first and second layers. By controlling the microstructure/nanostructure of the layers, the material properties of the composite material formed by this method can be tailored for a specific use. The microstructures/nanostructures of the composite materials may be defined by one or more of grain size, grain boundary geometry, crystal orientation, and a defect density.

Abstract: A coating for protecting a base material from wear and corrosion includes a first layer deposited directly onto an outer surface of the base material. In addition, the coating includes a second layer deposited directly onto the first layer. The first layer is positioned between the base material and the second layer. The first layer includes chromium having a first micro-crack density and the second layer comprises chromium having a second micro-crack density that is less than the first micro-crack density.

Abstract: A foraminous microstructure or film that has photonic or plasmonic properties is made by forming a structure or film composed of at least two constituent materials so that the compositional ratio of the constituent materials varies in a depth direction of the structure, and then removing one of the materials from the structure.

Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.

Abstract: Multilayer material comprising a zirconium-based substrate covered with a multilayer coating, the multilayer coating comprising metallic layers composed of identical or different substances chosen from chromium, a chromium alloy or a ternary alloy of the Nb—Cr—Ti system. Such a material has improved resistance to oxidation in accident conditions of a nuclear reactor. The invention also relates to a multilayer coating, a part composed wholly or partly of the multilayer material or of the multilayer coating, as well as the method for manufacturing the multilayer material such as for example a magnetron cathodic sputtering process.

Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.

Abstract: A method for coating a substrate includes disposing a deposition composition in a container. The deposition composition includes a plurality of nanosheets and a metal material. The method also includes disposing a substrate in the container, contacting the substrate with the deposition composition, applying a voltage to the substrate, electrodepositing, on the substrate, a coating that includes a metal from metal ions and the nanosheets in response to biasing the substrate at the first potential.

Abstract: The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution.

Abstract: A method for electroplating a wafer detects plating bath failure based on a voltage change. The method is useful in plating wafers having TSV features. Voltage of each anode of a plating processor may be monitored. An abrupt drop in voltage signals a bath failure resulting from conversion of an accelerator such as SPS to it's by products MPS. Bath failure is delayed or avoided by current pulsing or current ramping. An improved plating bath has a catholyte with a very low acid concentration.

Abstract: Disclosed herein is an electric Al or Al alloy plating bath which comprises (A) an aluminum halide; (B) one kind of compound or at least two kinds of compounds selected from the group consisting of N-alkylpyridinium halides, N-alkylimidazolium halides, N,N?-alkylimidazolium halides, N-alkyl-pyrazolium halides, N,N?-alkylpyrazolium halides, N-alkylpyrrolidinium halides and N,N-alkyl-pyrrolidinium halides; and (C) a high boiling point aromatic hydrocarbon solvent, wherein the molar ratio of the aluminum halide (A) to the compound (B) ranges from 1:1 to 3:1 and the flash point of the plating bath is not less than 50° C. The plating bath never involves any risk of causing an explosion, can be handled industrially with safety and can provide a smooth and fine Al of Al alloy plated film.

Abstract: In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.

Abstract: An aluminum alloy component is protected by an electrodeposited aluminum coating. An electrodeposited intermediate aluminum-transition metal alloy and/or rare earth metal alloy layer between the aluminum alloy substrate and the protective coating enhances coating adhesion and corrosion resistance. The intermediate layer is formed by room temperature electrodeposition in ionic liquids.

Abstract: An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.

Abstract: In the present invention, magnetic and non-magnetic films are formed as a compound of Fe, Ni and P to provide a multilayer film in which such magnetic and non-magnetic films are alternately stacked. The multilayer film includes a magnetic film and a non-magnetic film. The magnetic film and the non-magnetic film are alternately stacked. The magnetic film contains Fe, Ni and P but has Fe as a main component. The magnetic film contains Fe, Ni and P but has Fe or Ni as a main component. The non-magnetic film contains Fe, Ni and P but has Ni as a main component.

Abstract: A self-terminating rapid process for controlled growth of platinum or platinum alloy monolayer films from a K2PtCl4—NaCl—NaBr electrolyte. Using the present process, platinum deposition may be quenched at potentials just negative of proton reduction by an alteration of the double layer structure induced by a saturated surface coverage of underpotential deposited hydrogen. The surface may be reactivated for platinum deposition by stepping the potential to more positive values where underpotential deposited hydrogen is oxidized and fresh sites for absorption of platinum chloride become available. Periodic pulsing of the potential enables sequential deposition of two dimensional platinum layers to fabricate films of desired thickness relevant to a range of advanced technologies, from catalysis to magnetics and electronics.

Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.

Abstract: The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.

Abstract: A layer of chromium metal is electroplated from trivalent chromium onto an electrically conducting substrate by immersing the substrate and a counter electrode in a electroplating bath and passing a modulated electric current between the electrodes. In one embodiment, the current contains pulses that are cathodic with respect to said substrate and in another embodiment the current contains pulses that are cathodic and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle greater than about 80%.

Abstract: A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the plating solution. In certain embodiments, the current density of the wafer is constant during immersion. In a specific example, potentiostatic control is employed to produce a current density in the range of about 1.5 to 20 mA/cm2. The immersion step is followed by a high current pulse step. During bottom up fill inside the features of the wafer, a constant current or a current with a micropulse may be used. This protocol may protect the seed from corrosion while enhancing nucleation during the initial stages of plating.

Abstract: A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer.

Abstract: A coated steel sheet includes a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer disposed on at least one surface of a steel sheet, and an adhesive coating disposed on the corrosion-resistant coating, the adhesive coating containing Zr and further containing at least one metal element selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, in total, at a ratio by mass of 0.01 to 10 with respect to Zr. The coated steel sheet has excellent humid resin adhesion and corrosion resistance, in which streaky surface defects do not occur.

Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.

Abstract: The embodiment described herein relate to pulse electroplating methods and solutions.

Abstract: The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a second metal layer that is adjacent to the first metal layer and contains second metallic crystal grains, with the first metal layer and the second metal layer being laminated along a direction perpendicular to the main surface of the insulating substrate, and the average grain size of the first metallic crystal grains is smaller than the average grain size of the second metallic crystal grains.

Abstract: Disclosed is a copper foil for a negative electrode collector capable of simultaneously achieving high capacity and long life charge/discharge cycles in a secondary battery, wherein the front and back surfaces are of a uniform shape and, for example, the properties of a silicon active material of a lithium ion secondary battery are sufficiently realized; and a negative electrode using the copper foil. In one embodiment, a first roughened layer of metallic copper is formed by pulse cathode electrolysis roughening treatment on the surface of an untreated rolled copper foil base material of oxygen-free copper in a first roughening treatment tank (1) filled with a copper-sulphuric acid electrolyte (12), and a second copper-plate layer is formed on the surface of the first roughened layer by smooth copper plating treatment in a second copper plating treatment tank (2) filled with a copper-sulphuric acid electrolyte (22).

Abstract: Articles of manufacture comprise a body. A porous material is plated on the body, the porous material comprising nickel having a plurality of pores disposed in a generally ordered array extending into the nickel. Methods of forming a porous material on a body comprise disposing an anode and a cathode in an electrolyte comprising nickel ions. An electrical signal is pulsed to at least one of the anode and the cathode. A porous material comprising nickel having a plurality of pores generally disposed in an ordered array extending into the nickel is deposited on the cathode.

Abstract: Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.

Abstract: A method for electroplating titanium alloy coating into plastic and carbon foam comprises the steps of activating the given specimen, deposition of electroless nickel and electroplating process of titanium alloy to the surface of the specimen. The electroplating process of electroplating titanium alloy coating includes a direct current method and a pulse plating method. The direct current method characterized by lager sized grains and the pulse plating method characterized by smaller sized grains. The advantages of proposed electroplating processes are: a) low cost, b) very broad applications and c) relatively low number of the process steps. Unique combination of physical, mechanical and chemical properties makes the electroplating methods of titanium coating an attractive technology for medicine, biotechnology, sports, defense, aeronautic, and auto industries.

Abstract: The invention relates to the metalworking field, particularly to electrochemical sizing machining, and can be used for manufacturing of machine workpieces having an intricate profile and shaping furniture from chromium-containing steels and alloys operating in aggressive environment under excessive friction. Technical effect: improving machining accuracy by forming a lustrous layer on the machined surface and reduction of concentration of hexavalent toxic chromium ions in a waste electrolyte solution.