Abstract: One of the objects of the present invention is to provide a method for readily manufacturing a seamless mold in the form of a roll which has a porous alumina layer over its surface. The mold manufacturing method of the present invention is a method for manufacturing a mold which has a porous alumina layer over its surface, including the steps of: providing a hollow cylindrical support; forming an insulating layer on an outer perimeter surface of the hollow cylindrical support; depositing aluminum on the insulating layer to form an aluminum film; and anodizing a surface of the aluminum film to form a porous alumina layer which has a plurality of minute recessed portions.

Abstract: Frost-free surfaces and methods for manufacturing such surfaces are described. The frost-free surfaces reduce ice build-up, prevent vapor condensation and reduce adhesion force between ice and a solid substrate. The surfaces can be on parts used in devices where superhydrophobic properties may be obtained post or during device manufacturing. The superhydrophobic properties are the result of aluminum oxide clusters made on such surfaces.

Abstract: An anodized layer formation method of an embodiment of the present invention includes the step a of providing an aluminum film which is formed on a first principal surface of a support and the step b of anodizing a surface of the aluminum film to form a porous alumina layer which has a plurality of minute recessed portions. In the step a, a second principal surface of the support which is opposite to the first principal surface is provided with a low heat conduction member that has a predetermined pattern. According to an embodiment of the present invention, a porous alumina layer can be formed which includes regions of different minute structures in the predetermined pattern.

Abstract: Embodiments of the invention relate to a method for preparing crystalline metal-organic frameworks (MOFs). The method includes the steps of providing an electrolyte solution in contact with a conductive surface, and applying a current or potential to the conductive surface in contact with the electrolyte solution. The electrolyte solution includes a protonated organic ligand, a metal ion, and a probase. Application of the reductive current or potential to the conductive surface produces the crystalline metal-organic framework (MOF) deposited on the conductive surface. The MOFs produced by the method may be incorporated into a gas separation membrane, a purification filter, and/or a sensor.

Abstract: A metal substrate with an insulation layer includes a metal substrate having at least an aluminum base and an insulation layer formed on said aluminum base of said metal substrate. The insulation layer is a porous type anodized film of aluminum. The anodized film includes a barrier layer portion and a porous layer portion, and at least the porous layer portion has compressive strain at room temperature. a magnitude of the strain ranges from 0.005% to 0.25%. The anodized film has a thickness of 3 micrometers to 20 micrometers.

Abstract: A method for preparation of highly porous and preferentially-oriented {100} platinum on a substrate by electrodeposition in a deposition bath, comprising using a deposition potential Edep lower than ERHE+150 mV and an acidified platinum salt solution having a Pt salt concentration less than 5.0 mmole L?1 or, in presence of hydrogen, comprising limiting the concentration of Pt salts in the electrolyte to less than 5.0 mmole L?1 and controlling the temperature of the electrolyte. Preferentially-oriented {100} platinum nanowires and thin films, comprising Pt{100} in a range between about 20 and about 60% and having a roughness factor of at least 50 are produced.

Abstract: A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm2. The foil has reduced craters, which are defects unique to rolled foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and is suitable for producing a flexible printed wiring board capable of bearing a fine wiring pattern. A method of roughening the rolled foil is also provided.

Abstract: One exemplary embodiment includes a method of selectively electroplating an electrically conductive coating on portions of a first face of a bipolar plate for use in a proton exchange membrane (PEM) fuel cell. The first face of the bipolar plate defines at least one reactant gas flow channel and a plurality of lands adjacent the at least one channel. The electrically conductive coating may be selectively electroplated on a plurality of first portions of the lands leaving second portions of the lands uncoated by the electrically conductive coating.

Abstract: A moth-eye mold fabrication method of an embodiment of the present invention includes the steps of: (a) anodizing a surface of an aluminum film to form a porous alumina layer which has a plurality of minute recessed portions; (b) after step (a), bringing the porous alumina layer into contact with an etching solution, thereby enlarging the plurality of minute recessed portions of the porous alumina layer; and (c) after step (b), further anodizing the surface to grow the plurality of minute recessed portions, wherein a voltage applied in step (c) is higher than a voltage applied in step (a). According to an embodiment of the present invention, a mold fabrication method is provided which is capable of preventing formation of a plurality of tiny pores in one micropore.

Abstract: There is provided a method for preparation of a transition metal electroplated porous carbon nanofiber composite for hydrogen storage. Specifically, the preparation method of a transition metal electroplated porous carbon nanofiber composite for hydrogen storage according to the present invention comprises electroplating a transition metal with a controlled particle diameter and a surface dispersion ratio on a porous carbon nanofiber with specific surface area from 500 to 3000 m2/g, pore volume from 0.1 to 2.0 cc/g and diameter from 10 to 500 nm. With increased hydrogen storage capacity, the transition metal electroplated porous carbon nanofiber composite provided by the present invention can be utilized as hydrogen storage medium of active material for electrodes of electrochemical devices, such as fuel cell, secondary cell and supercapcitor.

Abstract: Nanopillars with nanoscale diameters are provided where the nanopillar has uniformly aligned nano-twins either perpendicular or inclined by 1-90° to the pillar-axis with no grain-boundaries or any other features.

Abstract: A light reflecting substrate comprises at least: an insulating layer and a metal layer disposed in contact with the insulating layer. The total reflectivity of light in the wavelength range of more than 320 nm and not more than 700 nm is not less than 50% and the total reflectivity of light in the wavelength range of 300 nm to 320 nm is not less than 60%. The light reflecting substrate further improves the emission power of the light-emitting device when used as the substrate therefor.

Abstract: A mercury vapour sensor in which the sensor surface is a gold substrate, and gold nanostructures with controlled crystallographic facets are strongly adhered to the substrate. A substantial increase in response magnitude and stability of a quartz crystal microbalance (QCM) based mercury vapour sensor is achieved using this sensor surface. The method of forming gold nanostructures on a gold substrate includes the steps of electrodepositing gold onto a gold working electrode from a solution of hydrogen or alkali metal tetrahaloaureate (III) and an additive such as lead acetate at an electro-deposition temperature between 20 and 40° C. and a deposition time of at least 15 seconds. The growth is controlled by the composition of the deposition solution, the temperature and the current density. The deposition rates may be varied as will the deposition times which are preferably about 150 seconds but may be as long as 15 minutes. The preferred deposition solution contains 2.

Abstract: There is provided a manufacturing method of an aluminum structure, including a conductive treatment process of forming an electrically conductive layer made of aluminum on a surface of a resin molded body and a plating process of plating the resin molded body subjected to the conductive treatment process with aluminum in a molten salt bath. Even with a porous resin molded body having a three-dimensional network structure, the method allows the surface of the porous resin molded body to be plated with aluminum, thus forming a high-purity aluminum structure having a uniform thick film. Porous aluminum having a large area is also provided.

Abstract: An anodized layer formation method of at least one example embodiment of the present invention includes the steps of: (a) providing an aluminum base which has a machined surface; (b) forming, in the surface of the aluminum base, a minute uneven structure which has a smaller average neighboring distance than an average neighboring distance of a plurality of minute recessed portions that an intended porous alumina layer has; and (c) after step (b), anodizing the surface of the aluminum base, thereby forming a porous alumina layer which has the plurality of minute recessed portions. According to at least one embodiment the present invention, a porous alumina layer which has uniformly-distributed minute recessed portions can be formed over a machined surface of an aluminum base.

Abstract: A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1.

Abstract: The invention provides a method for producing a corrosion-resistant article, where the article is conductive and subject to hydrogen uptake during electroplating of a coating. The method comprises electroplating a zinc/nickel coating on the article in an aqueous, basic plating solution containing zinc and nickel ions. The method uses an electrolyte in the form of a soluble hydroxide salt with the weight ratio of zinc ions to nickel ions in the solution being sufficient to provide the coating comprising from about 85% to about 95% by weight zinc, and about 5% to about 15% by weight nickel. The plating solution is substantially free of brightening agents which retard hydrogen bake-out.

Abstract: The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is possible.

Abstract: A mold of at least one embodiment of the present invention includes: a base; a conductive layer provided on the base; and an anodized film provided on the conductive layer, the anodized film having an inverted motheye structure in its surface, the inverted motheye structure having a plurality of recessed portions whose two-dimensional size viewed in a direction normal to the surface is not less than 10 nm and less than 500 nm, wherein the base, the conductive layer, and the anodized film are capable of transmitting ultraviolet light.

Abstract: A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are disposed at a density of 1×106 to 1×1010 micropores/mm2. The through micropores are filled with a metal at a filling ratio of at least 30% and a polymer layer is formed on at least one surface of the insulating base.

Abstract: An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 ?m and less than 100 ?m when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle ? of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones.

Abstract: The present invention relates to nanopillar arrays that may have relatively large dimensions and relatively large interpillar distances. The present invention also relates to methods of forming the same. In some embodiments of the invention, methods of forming hexagonal nanopillar arrays include forming a base comprising aluminum; forming a hexagonal pattern of pits in the aluminum; anodizing the aluminum to form aluminum oxide comprising a primary hexagonal nanopore array at the positions of the pits in the aluminum; depositing a conductive material into the nanopores of the primary hexagonal nanopore array; and removing the mask and the aluminum oxide to provide the hexagonal nanopillar array.

Abstract: The present invention provides an alloy film of Mn or its Fe—Mn is depositable on a metalized alumina ceramic (Al2O3-SiO3) substrate for hermetically sealed glass-metal fusion used for aircraft switch assemblies. The coefficient of thermal expansion of Fe—Mn alloys appear to be fairly low, nearer to that of glass. Fe—Mn alloy film is an alternative to Fe64—Ni36 alloy films (Invar) normally used for glass to glass fusion purposes. Fe—Mn alloy films is also depositable directly on bare Alumina (Al2O3) substrate with or without zincating pretreatment. Similarly bright, smooth coherent film of Mn—Au or Fe—Mn—Ni Au alloys is depositable from an aqueous solution of simple salt bath or on Cu substrate without the use of cyanide without bridging with zincate processes.

Abstract: The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 80% to 60% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold layer. A fluid polymer is applied to the gold layer and cured.

Abstract: A method of fabricating an electrically conductive mechanical interconnection element (12) comprises: a first stage of electrochemically depositing a structure comprising a plurality of metal wires (2a) of sub-micrometric diameter projecting from the likewise metallic surface of a substrate (2); and a second stage of controlled partial dissolution of said wires to reduce their diameter. A method of making a mechanical and/or electrical interconnection, the method comprising the steps consisting in: fabricating two interconnection elements by a method as described above; and placing said interconnection elements face to face and pressing one against the other so as to cause the nanometric wires projecting from the surfaces of said elements to interpenetrate and tangle together. A three-dimensional electronic device comprising a stack of microelectronic chips mechanically and electrically connected to one another by such interconnection elements.

Abstract: A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along an outer shape of the circuit so as to partly remove the metal thin film along the outer shape of the circuit; a Cu plating layer, a Ni plating layer and a Au plating layer formed by metal plating and sequentially provided on a surface of the undercoat layer. A first middle plating layer and a second middle plating layer are provided between the Ni plating layer and the Au plating layer. The first middle plating layer includes metal with a less noble standard electrode potential with respect to Au and is in contact with the Au plating layer. The second middle plating layer includes metal with a noble standard electrode potential with respect to the metal in the first middle plating layer and is in contact with the first middle plating layer.

Abstract: An electrodeposited magnetic recording medium having multiple coercivity values is disclosed. In some embodiments, layers having different coercivity levels may be separated by exchange coupled composites and in other embodiments a range of coercivity levels are deposited in a gradient fashion. In some embodiments, the layers with multiple coercivity values comprise bit patterned media islands formed from a photoresist.

Abstract: The invention relates to a method for producing electronic components consisting in carrying out a first anodization of a carrier material (1) for forming at least one first pore (3) extending in a first direction in said carrier material (1) and in carrying out a second anodization for forming at least one second pore (17) extending in the carrier material (1) in a second direction different from the first direction.

Abstract: A method for coating a construction material made of metal alloy with a functional metal. The functional metal is deposited electrolytically on the surface of the construction material selectively so that the deposition occurs on the grain boundaries of the construction material and other points of discontinuity. The invention also relates to a construction material product, which is selectively coated with a functional metal.

Abstract: A cathode containing a metal substrate that possesses a micro-roughened surface imparted by spark anodization is provided. The surface is formed by contacting the substrate with an electrolytic solution and applying a voltage to form a dielectric sub-oxide layer. The voltage is raised to a sufficiently high level to initiate “sparking” at the surface of the substrate, which is believed to create high local surface temperatures sufficient to etch away the substrate. This results in the formation of a “micro-roughened” surface having a plurality elevated regions. These elevated regions can increase the effective surface area and thus allow for the formation of capacitors with increased cathode capacitance for a given size and/or capacitors with a reduced size for a given capacitance. The elevated regions may also exhibit excellent adhesion to additional electrochemically-active materials and provide enhanced stability in certain liquid electrolytes.

Abstract: A sheet glass for microscopy includes a base plate and a metal pattern configured on the base plate. The structure of the sheet glass increases the throughput, reduces the cost and shortens the distance between grids and targets for keeping grids and targets within the depth of field of the microscope. A manufacturing method of sheet glass for microscopy is also disclosed.

Abstract: A method of making nanowire probes is provided. The method includes providing a template having a nanoporous structure, providing a probe tip that is disposed on top of the template, and growing nanowires on the probe tip, where the nanowires are grown from the probe tip along the nanopores, and the nanowires conform to the shape of the nanopores.

Abstract: This invention presents microstructures enhanced with nanopillars. The invention also provides ways for manufacturing nanopillar-enhanced microstructures. In some embodiments, the invention also provides methods of use for the nanopillar-enhanced microstructures.

Abstract: Heat exchange device with a boiling surface comprising porous surface layer arranged on a solid substrate, the porous surface layer comprises a porous wall structure defining and separating macro-pores that are interconnected in the general direction normal to the surface of the substrate and have a diameter greater than 5 ?m and less than 1000 ?m wherein the diameter of the pores gradually increases with distance from the substrate wherein the porous wall structure is a continuous branched structure.

Abstract: A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopores, applying a filling material that is to be inserted into the silicon, which has a diameter that is less than a diameter of the pores, inserting the filling material into the pores and removing the excess filling material form the silicon surface, if necessary, and tempering the silicon substrate that is furnished with the filling material that has been filled into the pores, at a temperature between ca. 1000° C. and ca. 1400° C., in order to close the generated pores again and to enclose the filling material.

Abstract: A plasmonic coupling device (1) comprising a first structure (2), and a second structure (3) comprising two or more conductive nanoparticles (7), wherein each nanoparticle is elongate and is attached to the first structure such that it is oriented with a major axis thereof substantially perpendicular to the first structure. In a plasmonic coupling device comprising such nanoparticles, radiation incident on the device can produce localised surface plasmons in the nanoparticles. The localised surface plasmons can become deiocalised along the device, due to the near-field electromagnetic interaction between the two or more nanoparticles or between the one or more nanoparticles of an assembly and a nearby assembly or assemblies. This interaction allows for electro-magnetic energy, and the radiation, to be efficiently coupled between the nanoparticles or between the assemblies of one or more nanoparticles.

Abstract: A photovoltaic wire is presented where the active layers coat a metallic wire, preferably aluminum. The active layers are an array of doped silicon nanowires electrically attached to the metallic wire that extend from the surface of the wire into a layer of semiconducting polymer, preferably polyaniline. The surface of the polymer is coated with a transparent conductor to complete the photovoltaic circuit.

Abstract: This invention presents microstructures enhanced with nanopillars. The invention also provides a novel way for manufacturing nanopillar-enhanced microstructures, using conventional microfabrication techniques. In some embodiments, the invention also provides methods of use for the nanopillar-enhanced microstructures.

Abstract: A mold comprising alumina having a microscopic pattern, in which distances between adjacent recesses or salients therein are not longer than wavelength of visible light, formed by anodic oxidation on a surface of an aluminum pre-mold without a rolling mark, wherein height or depth difference at a crystal grain boundary is 300 nm or less.

Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.

Abstract: Embodiments of the invention relate to methods of fabricating solar-cell structures and resulting solar-cell structures. In one embodiment of a method of fabricating a solar-cell structure, a substrate including a front surface and an opposing back surface is provided. A porous-silicon layer may be electrochemically formed from a portion of the substrate that extends inwardly from the front surface. A portion of the porous-silicon layer may be electrochemically passivated. Metallic material may be plated to form at least a portion of each of a plurality of electrical contacts that are in electrical contact with the substrate. In a method according to another embodiment of the invention, the porous-silicon layer may used to getter impurities present in the substrate. In such an embodiment, the porous-silicon layer may be removed after gettering.

Abstract: Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm2. The provided rolled copper or copper alloy foil subject to roughening is reduced in craters which are obvious defects unique to rolled copper or copper alloy foils having a roughened surface, has high strength, adhesive strength with the resin layer, acid resistance and anti-tin plating solution properties, high peel strength, favorable etching properties and gloss level, and also suits for use in producing a flexible printed wiring board capable of bearing a fine wiring pattern.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: A pressure wave generator is provided, which has excellent output stability over time. This pressure wave generator comprises a substrate, a heat generating layer, and a heat insulating layer formed between the substrate and the heat generating layer. A pressure wave is generated in a surrounding medium (air) by a change in temperature of the heat generating layer, which is caused upon energization of the heat generating layer. The heat insulating layer comprises a porous layer and a barrier layer formed between the porous layer and the heat generating layer to prevent diffusion of reactive substances such as oxygen and moisture in the air and impurities into the porous layer. By the formation of the barrier layer, it is possible to prevent a reduction in output of the pressure wave generator caused by a change over time of the porous layer.

Abstract: Process of preparing copper foil for use in fine geometry circuit boards in which spaced apart islands are formed in the copper foil, with the islands being smaller in dimension than crystals in the foil so that most of the islands are single crystals, and the islands are grown out until they meet one another to form a continuous foil having a columnar structure that etches preferentially along the intersections of the islands in directions perpendicular to the surface of the foil thus formed.

Abstract: The present invention is directed to the development of a nanoporous alumina template comprising a multilayer metal film structure that allows for the in situ removal of an electrically insulating barrier layer, thus exposing an electrode at the pore bases. An exemplary multilayer thin film precursor is developed herein which contains an aluminum anodization layer, a diffusion barrier and an electrode. Aluminum anodization in an acidic electrolyte solution with a subsequent voltage pulse sequence produces a nanoporous alumina template with a barrier free conductive electrode surface. The nanoporous template of the present invention provides an efficient means for electrodeposition of nanomaterials.

Abstract: An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palladium, or gold, or an alloy of two or more metals, or a combination of two or more alloys or metal layers thereof having an increase in the surface area of 5 times to 500 times of the corresponding surface area resulting from the basic geometric shape.

Abstract: A method for treating the surface of aluminum components or components comprising aluminum includes anodizing the surface. Anodizing includes introducing at least one pigmenting substance, particularly fully pigmenting substance, into depressions or pores open toward the surface of a comb or pore structure of the surface created by the anodizing process, and/or introducing oxidizable substances into depressions or pores open toward the surface of a comb or pore structure of the surface created by the anodizing process and oxidizing these substances. The method further includes applying a ceramic thin-film coating or siliceous sol-gel coating onto the surface. The ceramic thin-film coating or the sol-gel coating comprises a pigment particularly serving refraction purposes.

Abstract: An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.

Abstract: A method comprising forming a structural element 115 on a surface 620 of a layer 510 via an electroless plating of nickel or cobalt 130 onto the surface, the layer being rigidly fixed to an underlying substrate 110. The method also comprises etching away a portion of the layer such that a part of the structural element is able to move with respect to the substrate.