Abstract: The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adhering the insulating member as bottom of the opening hole, and making a metal plating as a conductor portion grow in the opening hole from the lower conductor layer. In the method, after metal plating has reached the conductor film, the metal plating is grown on the conductor film and the conductor portion as electrode, to thereby form a thickness enough to form an upper conductive layer.

Abstract: A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section. The plating liquid flows spirally from the lower end of the gap to the upper end by action of a vortex producing flow path (29) communicating to the lower end of the gap. The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.

Abstract: The present invention provides a device for packaging a composition for applying to keratinous materials, the device comprising a container defining an inside space containing the composition; a coating of a biocidal material covering at least part of the container and coming into contact with the composition contained in the inside space of the container; and a member that is movable within the container.

Abstract: This invention relates generally to a method and apparatus for electroplating selected portions of a high contact force, high elastic response range pin-receiving and cylindrical electrical contact having a pair of spaced apart cantilever beams which extend forwardly from a base to a pin-receiving end. In accordance with the invention at least one plating cell is provided including a cavity type of enclosure thereof in general matching the outer contour of the lower portion and pin receiving end of the contact whereas plating solution is ejected towards the pin receiving end including at least one conducting device for electric current is provided adjacent to the opposite region of the contact for engaging with thereof whereas electric current is being conducted.

Abstract: Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a density of not less than 10,000,000 micropores/mm2. In this microfine structure, some penetrating micropores are filled with a substance other than the material of the base.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: One embodiment of the present invention one embodiment of the present invention is a method for electrofilling a metal or alloy inside at least one opening surrounded by a field on a front surface of a substrate, wherein at least one surface inside the at least one opening includes an exposed metallic surface, said method including steps of: (a) immersing the substrate in an activation or wetting solution; (b) applying ultrasonic or megasonic vibrations to the substrate; and, after commencing applying ultrasonic or megasonic vibrations to the substrate, (c) applying high pressure jets of an electrolyte to the substrate, said electrolyte includes metallic ions of said metal or alloy; and (d) applying an electroplating current to the substrate to electroplate said metal or alloy inside the at least one opening.

Abstract: A method of manufacturing a magnetic recording medium includes forming an electrically conductive intermediate layer over a non-magnetic substrate; forming an aluminum-containing layer on the intermediate layer; forming a plurality of micro pits in the aluminum-containing layer; generating an alumina-containing layer by oxidizing the aluminum-containing layer and simultaneously forming nano holes in the alumina-containing layer originating from the micro pits to expose the intermediate layer; cleaning and drying the nano holes using a sub- and super-critical fluid; and depositing a magnetic metal selectively on the intermediate layer to form a magnetic recording layer having a plurality of magnetic recording elements. The method thus employs alumina nano holes (ANHs) to fill magnetic metal uniformly and selectively even for ANHs with a diameter not larger than 25 nm.

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract: A coreless substrate includes a stiffener material (110, 210, 620) having a plated via (120, 320) formed therein, an electrically insulating material (130, 230, 830) above the stiffener material, and an electrically conductive material (140, 240, 840) in the electrically insulating layer. In the same or another embodiment, a package for a microelectronic device includes a stiffener material layer (115, 215, 615) having plated vias (120, 320) formed therein and further having a recess (118, 218) therein, build-up layers (150, 350, 850) over the stiffener material layer, and a die (370) attached over the build-up layers. The stiffener material layer and the build-up layers form a coreless substrate (100, 380, 910, 920) of the package. The coreless substrate has a surface (381), and the die covers less than all of the surface of the coreless substrate such that the surface has at least one exposed region (382).

Abstract: A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of the article to be coated. The anode is powered by an electrical power source (44), and the article serves as the cathode. The anode and article are both immersed in a plating bath (38). The article and anode are rotated relative to one another about a central axis (22) of the article. The relative movement between the anode and the article causes a uniform plating (46) to be applied to selected regions of the article that pass the anode. Another anode (50) can be arranged in fixed relation with the article to cause plating to a separate selected region of the article concurrently with the other anode.

Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: To enable surface treatment of the inside of a part or the like and also simplify grinding work by equipment and a procedure that are simple in comparison with convention A first semi-sintered electrode 31 that is formed in a tapered shape whose distal end portion becomes smaller in diameter toward the distal end portion is attached to an electrode supporting tube 26, is configured to be rotatable by a motor 27, is positioned near a seat portion 8 of a nozzle body 1, and generates electrical discharge by surface modifying electrical discharge machining method between the seat portion 8 and the first semi-sintered electrode 31, whereby a coating that is formed as a result of the material that forms the first semi-sintered electrode 31 being moved and deposited can be formed on the seat portion 8 and grinding treatment of the inside of the nozzle body 1 matching the outer diameter of a nozzle needle 2 as has conventionally been the case can be rendered unnecessary.

Abstract: A plating method for pre-plating or plating a cylinder inner peripheral surface to be treated of a cylinder block by introducing treatment liquid to the cylinder inner peripheral surface by using a plating apparatus provided with a sealing jig having a sealing member and an electrode to which the seal jig is mounted includes the steps, which are performed successively: sealing the cylinder inner peripheral surface by bringing the sealing jig into contact with the cylinder inner peripheral surface; introducing the treatment liquid to the cylinder inner peripheral surface; and treating the cylinder inner peripheral surface by applying predetermined charge to the electrode of the plating apparatus and the cylinder block to thereby perform pre-plating or plating process in a state that a liquid to be treated fills a space including the cylinder inner peripheral surface. In the method, the treatment liquid introducing step is performed after confirmation of sealing by the sealing step.

Abstract: There is described a method wherein through holes of a wall are treated on a inside, and wherein one respective pole electrode is assigned to each through hole that is to be processed.

Abstract: Apparatus and method for electrolytic coating of a mould, the internal surfaces of which demarcate a mould cavity, with a coating material for the purpose of achieving or re-achieving intended mould cavity dimensions. The mould, as the cathode, and an anode positioned in the mould cavity and an electrolyte containing the coating material are used. The electrolyte serving as the carrier of the coating material flows through the mould cavity in a controlled manner. During the electrolytic coating, only the internal surfaces of the mould cavity come into contact with the electrolyte and the external surfaces of the s mould therefore do not have to be covered. The mechanical properties can be kept largely uniform over the entire region. The coating can be achieved more rapidly than with the conventional processes.

Abstract: A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

Abstract: A light-weight composite material with enhanced structural characteristics includes, in one embodiment, a compositionally modulated nanolaminate coating electrically deposited into an open, accessible void structure of a porous substrate. As a result of including a nanolaminate within the void structure, the composite can include a greater amount of nanolaminate material per unit volume than can be achieved by depositing a nanolaminate material solely on a two-dimensional surface. In addition, the nanolaminate material as well as other material electrodeposited to form the composite is compositionally modulated so that discontinuities between layers are minimized and potentially eliminated. The light-weight but structurally enhanced composite material can be used in a number of different applications including, but not limited to, ballistic applications (e.g., armor panels or tank panels), automotive protection applications (e.g., car door panels, racing shells) and sporting equipment applications (e.g.

Abstract: A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole, the third metal layer extending from the second metal layer onto a wall of the hole. When plating the third metal layer, the first and second metal layers can function as a conductive commoning element.

Abstract: A system and method comprising a master electrode arranged on substrate, said master electrode comprising a pattern layer, least partly of an insulating material and having a first surface provided with a plurality of cavities in which a conducting material is arranged, said electrode conducting material being electrically connected to at least one electrode current supply contact; said substrate comprising a top surface in contact with or arranged adjacent said first surface and having conducting material and/or structures of a conducting material arranged thereon, said substrate conducting material being electrically connected to at least one current supply contact; whereby a plurality of electrochemical cells are formed delimited by said cavities, said substrate conducting material and said electrode conducting material, said cells comprising an electrolyte; herein an electrode resistance between said electrode conducting material and said electrode current supply contact and a substrate resistance between

Abstract: A method of micro forming an array of microstructures comprising: advancing a punch having an array of protrusions (620) towards a sheet of material (640) disposed between the punch (620) and a die (630), each protrusion (625) shaped to deform the sheet of material (640) into a corresponding microstructure; providing a holder for holding the sheet of material (640) in place; and punching the sheet of material (640) with the protrusions on the punch (620) to form the array of microstructures on the sheet of material (640).

Abstract: In one embodiment, SWNTs are synthesized from an embedded catalyst in a modified porous anodic alumina (PAA) template. Pd is electrodeposited into the template to form nanowires that grow from an underlying conductive layer beneath the PAA and extend to the initiation sites of the SWNTs within each pore. Individual vertical channels of SWNTs are created, each with a vertical Pd nanowire back contact. Further Pd deposition results in annular Pd nanoparticles that form on portions of SWNTs extending onto the PAA surface. Two-terminal electrical characteristics produce linear I-V relationships, indicating ohmic contact in the devices.

Abstract: A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the inside surface (4) and a revolving guide means (6). In order to ensure advantageous coating conditions it is proposed that the electrolyte is conveyed with the help of the guide means (6) immersed only partly in the bath (8) in the circumferential direction through the gap (9) between the guide means (6) and the work-piece (3) guided outside of the bath (8).

Abstract: An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.

Abstract: A method is disclosed for the manufacture of colloidal rod particles as nanobarcodes. Template membranes for the deposition of materials are prepared using photolithographic techniques.

Abstract: A process for the production of wear-resistant, coated surfaces includes the use of at least two electrodes connected to a voltages source which are mounted in, or border, a reaction space through which an electrolyte flows in which the surface to be coated is located. The process is distinguished by the fact that the direction of the flow of the electrolyte is selectively reversed at least once during the coating process to enable better control of the formation of the oxide layer.

Abstract: The interior of cavities and through-holes in electrically conductive substrates having high-aspect ratios of 8:1 or greater can be electroplated with a uniform layer of metal on their interior surfaces by using a pulse reverse voltage waveform having a pulse train of long cathodic pulses followed by short anodic pulses even in the absence of conventional additives such as levelers and brighteners.

Abstract: The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield with a venturi-shaped partition and an aligned partition below the printed circuit boards, and operating a plurality of eductors below the floating shield. The means to alternately generate a laminar flow of electolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors. The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.

Abstract: A composite nickel and copper alloy plating film (3) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent.

Abstract: A method is provided for manufacturing a wiring substrate having via conductors. The method includes the steps of providing a substrate having via holes which open at a surface of the substrate, and completely immersing the substrate, together with an electrode, into an electroplating solution in such a manner that the substrate extends vertically. Bubbles are generated in the solution at a position below the substrate such that the generated bubbles rise along the surface of the substrate, from a lower end to an upper end thereof, while striking the surface. Electric current is caused to flow between the electrode and the substrate to thereby form via conductors in the via holes.

Abstract: A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the inside surface (4) and a revolving guide means (6). In order to ensure advantageous coating conditions it is proposed that the electrolyte is conveyed with the help of the guide means (6) immersed only partly in the bath (8) in the circumferential direction through the gap (9) between the guide means (6) and the work-piece (3) guided outside of the bath (8).

Abstract: Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to about 2.50 M, and which are intended for the metallization of micron-sized dimensioned trenches or vias, through-holes and microvias.

Abstract: Disclosed is a fabrication method of a printed circuit board, consisting of plating a metal on a pattern-formed metallic substrate to form a conductive metal line; forming a polymer layer as a base substrate over the conductive metal line-formed metallic substrate and drying the formed polymer layer; forming a via hole to the polymer layer, followed by plugging the formed via hole by electroplating; and removing the metallic substrate. The method is advantageous in terms of maximum efficiency of use of the surface area of PCB, and fineness and high integration of circuits because of not requiring an additional etching process.

Abstract: A circuit board comprising an insulating substrate, via-holes made in the insulating substrate, and a wiring conductor having at least one layer disposed on the insulating substrate. The circuit board is characterized in that a gold-plated layer of the wiring conductor exposed to the inside of the via-hole is thinner than a gold-plated layer of the wiring conductor exposed to a portion other than the inside of the via-hole in the insulating substrate. A method of manufacturing the circuit board is characterized in that gold electroplating of the wiring conductor is performed with the open-end of the via-hole contacted on a shielding board in a plating bath. The present invention provides a circuit board capable of satisfying the requirements for long-lasting strength of solder ball junction and good wire bonding ability at the same time.

Abstract: The present invention includes an electrolytic plating system with an elecrolytic plating bath, means for positioning the printed circuit boards in the bath, and means to alternately generate a laminar flow of electrolyte on each side of the printed circuit boards. A preferred means to alternately generate a laminar flow of electolyte comprises a floating shield with a venturi-shaped partition and an aligned partition below the printed circuit boards, and operating a plurality of eductors below the floating shield. The means to alternately generate a laminar flow of electolyte can further comprise a transport mechanism that moves the floating shield and its partitions from side to side relative to the eductors or a mechanism to move the eductors. The plating can be also be improved by using a vibrator and a spring-mounting system that prevents vibration energy being absorbed by fixed portions of the plating system.

Abstract: A memory element comprising nanomagnets having a rotational symmetry selected in order to provide high remanence and a suitable coercivity. There is also a sensor element comprising nanomagnets having a rotational symmetry selected such that they are superparamagnetic and exhibit substantially zero hysteresis so that a magnetisation of the nanomagnets depends only on the current value of applied field and not on the field history.

Abstract: MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator.

Abstract: A method for producing an inner tin film on the surface of plumbing components, such as those made of red brass or yellow brass, for drinking water supply. The lead content on the inner surface of the hollow component parts is first reduced by treatment with an acid-based aqueous reducing solution. For this purpose, chloride-free and sulfate-free, non-oxidizing hydracids may be used. The hollow component parts are subsequently chemically internally tinned.

Abstract: A method of coating a metal surface, particularly an inner surface of a gun barrel, with a chromium layer, includes the following steps: electrolytically precipitating on the metal surface a plurality of partial chromium layers in a superposed relationship by electric current pulses equaling the number of the partial chromium layers; and selecting the duration of each pulse such that a crystallite growth of individual partial chromium layers is stopped prior to a natural termination thereof for obtaining a globular polytropic structure of the entire chromium layer.

Abstract: There is provided a cylinder for an internal combustion engine, wherein the inner wall surface of the cylinder which constitutes a slide-contacting surface for the piston is treated with a metal plating which is minimal in burden to the environment, excellent in abrasion resistance and hard enough to endure the practical use of the cylinder, thus making it possible to dispense with a finishing work such as honing work. The cylinder is featured in that the inner wall surface of the cylinder which is adapted to be slidably contacted with a piston is electroplated in a plating bath comprising a nickel plating solution containing a boron compound such as trimethylamine borane, dimethylamine borane, etc.

Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a two-step process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

Abstract: A method of coating an internal surface of a weapon barrel includes the steps of applying an intermediate layer to the internal barrel surface by explosion plating and applying a cover layer at least indirectly to the intermediate layer by electroplating. The intermediate layer has a heat conductivity which is greater than that of the weapon barrel and a ductility which is greater than that of the cover layer.

Abstract: A hard, wear-resistant ceramic surface is applied to spinning rotor cups in an electrolytic bath on which is imposed a shaped-wave electric current. A special electrode has been designed to facilitate application of the coating to the unique shape of a spinning rotor cup under the shaped wave conditions.

Abstract: A multilayer substrate for a buildup with a via, which multilayer substrate comprises a base material comprising an insulation resin layer on which a predetermined hole is formed,

Abstract: A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cathode (45) without use of any liquid materials; passing electrical current through a contacting applicator (46) which contains a metal electrolyte solution; passing the current from the applicator (46) to the cathode (45) and contacting the interconnect (26) with the applicator (46) and coating all of the exposed interconnect surface.

Abstract: The specification describes interconnection techniques for interconnecting large arrays of micromechanical devices on a silicon platform. Interconnections are routed through vias extending through the thickness of the substrate. The vias are formed by etching holes through the silicon wafer, depositing an insulating layer on the sidewalls of the holes, depositing a barrier layer on the insulating layer, electrolytically depositing a metal selected from the group consisting of copper and nickel to form via plugs in the holes, and depositing another barrier layer over the via plugs. It is found that electrolytic deposition will successfully plug the holes even when the aspect ratio of the through holes is greater than four and the hole diameter less than 100 microns.

Abstract: A method of forming a copper layer with increased electromigration resistance. A doped copper layer is formed by controlling the incorporation of a non-metallic dopant during copper electroplating.

Abstract: A method and apparatus for anodizing a component. The component is placed in a container having first and second seal members that seal an annular surface of the component to be anodized. The first and second seal members, the annular surface of the component, and an inner surface of the container form a reaction chamber that holds a reaction medium therein. The reaction medium is supplied to the reaction chamber through a supply passage formed in the container. The reaction medium is drained from the reaction chamber through a drain passage formed in the container.

Abstract: In a process for manufacturing an electrode (1) on a substrate (2) using a conventional structuring process, an electrically conducting surface structure is created which has at least one tip (3) or edge (4). In the area of the tip (3) or edge (4), an electrode layer (5) is galvanized onto the substrate (2) and/or applied by electrostatic powder coating. Then, a surface area of the substrate (2), which surrounds the electrode layer (5) located on the tip (3) or edge (4), is converted into an insulating layer (8) by a chemical reaction. The electrode layer (5) can also be applied in a manner where, in the area of the tip (3) or edge (4), a chemical is released, which upon irradiation by electromagnetic and/or particle radiation, precipitates an electrically conducting material. This chemical is then impinged in the area of the tip (3) or edge (4) with optical radiation.

Abstract: The electrochemical processing of a component such as an injection nozzle, must be calibrated in order to compare the throughput of the nozzle to a standard nozzle. Both throughput rates are determine at the same high pressure which is far above 100 bar. As a throughput medium, electrolyte is used in an ecm unit. From this a sufficient quantity is delivered into a temporarily pressure chamber in which another fluid has been supplied by a high pressure pump. A predetermined high pressure is built up which by way of a highly accurate control valve is maintained during the calibration procedure.