Abstract: The present invention relates to an electrochemical method for converting an amino acid and/or its salts to an amine and/or a nitrile. The total yield and selectivity of amine and nitrile obtained by the method according to the present invention is higher than prior art when the reaction medium has a high concentration of amino acid and/or its salts at the beginning of the reaction.

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1?5.

Abstract: A plating module includes a plating tank, a substrate holder, an elevating mechanism, an anode, an ionically resistive element, a supply pipe, and a bypass pipe. The substrate holder is for holding a substrate Wf with a surface to be plated Wf-a facing downward. The elevating mechanism is for moving up and down the substrate holder. The anode is disposed inside the plating tank so as to face the substrate Wf held by the substrate holder. The ionically resistive element is disposed between the anode and the substrate Wf. The supply pipe is for supplying a process liquid stored in a reservoir tank from a lower side of the ionically resistive element to the plating tank. The bypass pipe is for discharging the process liquid supplied to the plating tank via the supply pipe from the lower side of the ionically resistive element to the reservoir tank.

Abstract: A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

Abstract: Systems and processes for treating surfaces of metal components are provided. The systems can include a container for containing a metal workpiece having a surface with a complex external geometry and for containing a solution that has electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece; optionally one or more electrodes for creating an electrical field; and optionally a temperature control device configured to provide a predetermined temperature or range of temperatures. The processes can include providing a metal workpiece having a surface with a complex external geometry; and contacting the workpiece in the presence of a predetermined electrical field at a predetermined temperature with a solution containing electrolytes at a flow rate that varies according to a local shape of the surface to thereby treat the surface of the metal workpiece.

Abstract: Provided is a method of producing a transdermal absorption sheet using an electroforming mold. A method of manufacturing an electroforming mold includes preparing a mold which is a matrix having a recessed pattern, immersing the mold in a degassed pretreatment liquid stored in a pretreatment liquid tank, then applying ultrasound waves generated from an ultrasound oscillator to the recessed pattern of the mold, and filling recessed portions constituting the recessed pattern with the pretreatment liquid. By immersing the mold in an electroforming tank and performing an electroforming treatment, an electroforming mold is manufactured. A mold having a recessed pattern is manufactured from the electroforming mold and a transdermal absorption sheet is produced using the mold.

Abstract: In a method of manufacturing a Ni plated coating that includes at least one Ni plated layer, an agitation intensity of a plating bath is changed while the Ni plated layer is being electrodeposited to change potential of the deposited Ni plated layer in a deposition depth direction. A Ni plated coating including a D-Ni plated layer and a B-Ni plated layer adjoining the D-Ni plated layer has, other than an interface voltage changing region at an interface between the D-Ni plated layer and the B-Ni plated layer, an in-layer voltage changing region in which, in the D-Ni plated layer or in the B-Ni plated layer, potential is changed in a deposition depth direction at an average rate of 1 mV/0.1 ?m or greater.

Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Abstract: This disclosure relates to rapid and repeatable tests that can be used to evaluate the interfacial adhesion of coatings to substrates. In particular embodiments, tests are used to assess the resistance of anodic oxides to delamination from aluminum substrates. The tests can be conducted using standard hardness test equipment such as a Vickers indenter, and yield more controlled, repeatable results than a large sample of life-cycle tests such as rock tumble tests. In particular embodiments, the tests involve forming an array of multiple indentations within the substrate such that stressed regions where the coating will likely delaminate are formed and evaluated.

Abstract: Acid bismuth electroplating baths are stable and have high current efficiency over the life of the baths. The bismuth baths are easy to control because of the reduced number of bath components.

Abstract: A method of forming a down-hole tool comprises contacting at least a portion of at least one down-hole structure comprising at least one ceramic-metal composite material with a molten electrolyte comprising sodium tetraborate. Electrical current is applied to at least a portion of the at least one down-hole structure to form at least one borided down-hole structure comprising at least one metal boride material. Other methods of forming a down-hole tool, and a down-hole tool are also described.

Abstract: To provide a high-nickel plating bath which is weakly acidic and can stably form a plating film having a nickel content of 11 to 19% (preferably 12 to 18%) even at a current density of 3 A/dm2 or more. An acidic zinc-nickel alloy electroplating solution which contains an amine compound represented by the formula H2N—R1-R2 {wherein: R1 is [(CH2)M—NH]L or (CH2)N; R2 is H, NH2, or R3; R3 is an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5}.

Abstract: A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.

Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.

Abstract: The present disclosure includes methods for coating and/or repairing a surface of a titanium metal part. Uncoated or damaged portions of the surface of titanium parts are prepared for coating, followed by applying a first coating. A second coating may then be applied to form a coated or repaired surface. The coated or repaired surface may be machined to produce a finished surface having a predetermined thickness.

Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.

Abstract: A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object.

Abstract: An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber.

Abstract: A wafer processing apparatus is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer at a processing position with respect to a processing base. The processing base includes a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer when the wafer contacts the processing fluid while in the processing position. While in contact with the processing fluid, the wafer support may rotate the wafer in the processing fluid. In one embodiment, the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer being processed.

Abstract: An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered.

Abstract: A method of anodizing that is performed in the capacitor case. The anode and a formation cathode are inserted into the capacitor case. The formation cathode includes one or more passageways through which formation electrolyte is transferred to contact the surface of the anode. In one particular implementation, the anode includes several slots and the formation cathodes are plates that are inserted into the slots. One or more valves coupled to formation electrolyte storage tanks storing different electrolytes may be coupled to the formation cathode. A rinsing step can be performed by supplying water through the passageways in the formation cathode. Other implementations anodize outside the capacitor case.

Abstract: The subject of the present invention is a method of the electrolytic isolation of arsenic from industrial electrolytes including waste electrolytes used in the electrorafination of copper after its prior decopperisation.

Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.

Abstract: A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

Abstract: A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.

Abstract: An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn ions and an acid; an Sn anode located in the anode chamber; and an electrolytic solution supply line configured to supply an electrolytic solution containing the acid into the anode chamber such that a Sn ion concentration of the anolyte in the anode chamber is kept not less than a predetermined value and a concentration of the acid in the anolyte is kept not less than a predetermined acceptable value. The electrolytic solution supply line supplies the electrolytic solution into the anode chamber to increase an amount of the anolyte in the anode chamber and supply the anolyte into the Sn alloy plating solution by the increased amount.

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

Abstract: Methods of preparing metal and metal alloys with partially microcrystalline anodic coatings are disclosed. Associated article therefrom are correspondingly disclosed. The partially microcrystalline anodic coatings exhibit steam, superheated steam, alkaline and acidic resistance. Partially microcrystalline anodic coating can be prepared by impregnation of micropores of a metal or metal substrate with metal precursor species, conversion of the metal precursor species into metal hydroxides, thermal treatment to dry out moisture and to promote phase transformation of the metal hydroxide product into metal oxides solids and bonding with metastable metal oxide substance in the pore structure of the metal or metal alloy substrate, and hydrothermal sealing to create sealed partially microcrystalline anodic coating.

Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. As exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. An exemplary article may comprise a biaxially textured base material, and at least one biaxially textured layer selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer is formed by electrodeposition on the biaxially textured base material.

Abstract: One embodiment is a method for void-free metallic electrofilling inside openings, said method includes: providing a substrate with at least one opening, the substrate includes an electrically conductive surface, including inside the at least one opening; immersing the substrate in an electrolyte contained in an ECD cell, the ECD cell includes at least one anode and a cathode, the cathode includes at least a portion of the conductive surface, the electrolyte includes plating metallic ions and at least one inhibitor additive, said metallic ions and at least one inhibitor additive having concentrations; providing electrolyte agitation across the substrate surface; and applying electroplating current density to the substrate; wherein the agitation, the concentrations, and the electroplating current density are such to produce void-free metallic electrofilling of the at least one opening, and wherein a height of electrodeposited surface bumps, or transition steps or humps, or transition spikes, is less than 140 nm

Abstract: A button or fastener member is provided wherein aluminum or an aluminum alloy is used as raw material, a first copper plating layer is formed directly over the entire surface of said raw material, and a second copper plating layer is formed directly on top of the first copper plating layer, with the aforementioned second copper plating layer being thicker than the aforementioned first copper plating layer.

Abstract: The present disclosure is directed to modified metal materials for implantation and/or bone replacement, and to methods for modifying surface properties of metal substrates for enhancing cellular adhesion (tissue integration) and providing antimicrobial properties. Some embodiments comprise surface coatings for metal implants, such as titanium-based materials, using (1) electrochemical processing and/or oxidation methods, and/or (2) laser processing, in order to enhance bone cell-materials interactions and achieve improved antimicrobial properties. One embodiment comprises the modification of a metal surface by growth of in situ nanotubes via anodization, followed by electrodeposition of silver on the nanotubes. Other embodiments include the use of LENS™ processing to coat a metal surface with calcium-based bioceramic composition layers. These surface treatment methods can be applied as a post-processing operation to metallic implants such as hip, knee and spinal devices as well as screws, pins and plates.

Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinide, lanthanides, and oxides thereof. An exemplary article (150) may comprise a biaxially textured base material (130), and at least one biaxially textured layer (110) selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer (110) is formed by electrodeposition on the biaxially textured base material (130).

Abstract: Disclosed are a method and an apparatus for forming an oxide coating film with excellent corrosion resistance and adhesiveness on a cathode made of a metal plate by a simple process at low cost. A direct current voltage is applied between an anode (12) and a cathode (13) in an electrolyte solution which cathode (13) is made of a metal plate to be coated with oxide and arranged opposite to the anode (12), while supplying oxygen or a gas containing oxygen into the electrolyte solution, so that the metal plate cathode (13) is coated with oxide, thereby being formed into a oxide-coated metal plate.

Abstract: Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.

Abstract: Embodiments of systems and methods for electrocoating a part are presented herein. According to one embodiment, an electrocoating system comprises a tank, a pump in fluid communication with the tank, and an external anode positioned outside of the tank. The external anode is a substantially membrane-free metal pipe configured to provide an electric charge to a fluid for electrocoating a part. The system may further comprise one or more internal nozzles positioned inside of the tank to direct an electrically charged fluid from the pump into the tank for electrocoating a part. In addition, the system may further comprise one or more external nozzles positionable outside of the tank to direct an electrically charged fluid from the pump to one or more selected areas of a part positioned for electrocoating outside of the tank.

Abstract: One embodiment is for the close agitation of electroplating solution substantially near an electrode in an electroplating cell. The agitation occurs within the Nernst diffusion layer allowing for ion replenishment of the electroplating solution at the working electrode face. The system operates by producing a flat agitation face (180) and a working electrode (350) face that are brought to within 10 microns of one another during the plating process whilst the agitator 380 is being actuated. In one embodiment, the working electrode is rigid such as a semiconductor wafer. In another embodiment, the working electrode is a flexible material (600) such as fabric or flexible electronics. Other embodiments are described and shown.

Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.

Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.

Abstract: An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.

Abstract: Provided is a spark plug that is excellent not only in salt resistance but also in stress corrosion cracking resistance. The spark plug includes a metal shell covered by a composite layer including a nickel plating layer and a chromate layer formed on the nickel plating layer. The chromate layer has a film thickness of 2 to 45 nm and Cr element concentration of not more than 60 at % and contains Ni in addition to Cr.

Abstract: A method and apparatus for anodizing a porous valve metal pellet in a flowing liquid electrolyte is described. The apparatus comprises an insulative container comprised of a lower region, a central region including a cavity for holding the pellet, an upper region, and a continuous passageway extending through the lower, central, and upper regions. Lower and upper screens serving as lower and upper electrodes are disposed in the passageway in the lower and upper container regions, respectively. During anodizing, the electrolyte flows through the lower container region including the lower screen, the porous pellet and then the upper container region including the upper screen. The lower and upper screens are at an opposite electrical polarity as the pellet so that a dielectric oxide is formed on the exposed valve metal including interior portions of the pellet that are exposed to the flowing electrolyte.

Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.

Abstract: The invention concerns a surface treatment electrode (11) to treat at least one object (1). It comprises at least one cavity (23) enclosing the object (1) to be treated during the treatment, having a geometry ensuring free movement of the object (1), this cavity (23) being delimited by a wall (24) comprising at least one opening (25) communicating the inside of the cavity (23) with a treatment solution (5) in which the electrode (11) is immersed during the surface treatment. The cavity (23) is substantially cylindrical and its diameter is approximately 50 to 100 micrometers larger than a maximum size of the object (1).

Abstract: A device for simultaneous coating of a plurality of workpieces is described, the plurality of workpieces being situated in a shared flow shaft through which an electrolyte flows, and each workpiece being connected electrically conducting to at least one component electrode and being electrically insulated in relation to at least one bath electrode, and a plurality of flow channels and a flow distributor for distributing the electrolyte stream to the plurality of flow channels further being situated in the flow shaft, the at least one bath electrode being situated in one of the flow channels.

Abstract: The invention relates to a method of making a nanotubular titania substrate having a titanium dioxide surface comprised of a plurality of vertically oriented titanium dioxide nanotubes containing oxygen vacancies, including the steps of anodizing a titanium metal substrate in an acidified fluoride electrolyte and annealing the titanium oxide surface in a non-oxidating atmosphere. The invention further relates to a nanotubular titania substrate having an annealed titanium dioxide surface comprised of self-ordered titanium dioxide nanotubes containing oxygen vacancies. The invention further relates to a photo-electrolysis method for generating H2 wherein the photo-anode is a nanotubular titania substrate of the invention. The invention also relates to an electrochemical method of synthesizing CdZn/CdZnTe nanowires, wherein a nanoporous TiO2 template was used in combination with non-aqueous electrolyte.

Abstract: Amorphous Fe100-a-bPaMb foil, preferably in the form of a free-standing foil, process for its production by electrodeposition or electroforming of an aqueous plating solution, and its uses as a constitutive element of a transformer, generator, motor, pulse applications and magnetic shieldings. “a” is a real number ranging from 13 to 24, b is a real number ranging from 0 to 4, and M is at least one transition element other than Fe. The amorphous Fe100-a-bPaMb foil has the properties of being amorphous as established by the X-ray diffraction method, an average thickness greater than 20 micrometers, a tensile strength in the range of 200-1100 MPa, an electrical resistivity of over 120 ??cm, and at least one of a high saturation induction (Bs) greater than 1.4 T, a coercive field (Hc) of less than 40 A/m, a loss (W60), at power frequencies (60 Hz), and for a peak induction of at least 1.35 T, of less than 0.65 W/kg, and a relative magnetic permeability (B/?0H) greater than 10000, for low values of ?0H.

Abstract: Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.

Abstract: An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coating weights and coating microstructure. Parts in high volume and at low capital and operating cost are produced as coatings or in free-standing form.

Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.