Agitating Or Moving Electrolyte During Coating Patents (Class 205/148)
  • Patent number: 9875979
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: January 23, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Patent number: 9869623
    Abstract: This disclosure relates to rapid and repeatable tests that can be used to evaluate the interfacial adhesion of coatings to substrates. In particular embodiments, tests are used to assess the resistance of anodic oxides to delamination from aluminum substrates. The tests can be conducted using standard hardness test equipment such as a Vickers indenter, and yield more controlled, repeatable results than a large sample of life-cycle tests such as rock tumble tests. In particular embodiments, the tests involve forming an array of multiple indentations within the substrate such that stressed regions where the coating will likely delaminate are formed and evaluated.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: January 16, 2018
    Assignee: Apple Inc.
    Inventors: Eric W. Hamann, William A. Counts, James A. Curran
  • Patent number: 9850588
    Abstract: Acid bismuth electroplating baths are stable and have high current efficiency over the life of the baths. The bismuth baths are easy to control because of the reduced number of bath components.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: December 26, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Adolphe Foyet, Margit Clauss
  • Patent number: 9790608
    Abstract: A method of forming a down-hole tool comprises contacting at least a portion of at least one down-hole structure comprising at least one ceramic-metal composite material with a molten electrolyte comprising sodium tetraborate. Electrical current is applied to at least a portion of the at least one down-hole structure to form at least one borided down-hole structure comprising at least one metal boride material. Other methods of forming a down-hole tool, and a down-hole tool are also described.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 17, 2017
    Assignee: Baker Hughes Incorporated
    Inventors: Vivekanand Sista, John H. Stevens, James L. Overstreet
  • Patent number: 9644279
    Abstract: To provide a high-nickel plating bath which is weakly acidic and can stably form a plating film having a nickel content of 11 to 19% (preferably 12 to 18%) even at a current density of 3 A/dm2 or more. An acidic zinc-nickel alloy electroplating solution which contains an amine compound represented by the formula H2N—R1-R2 {wherein: R1 is [(CH2)M—NH]L or (CH2)N; R2 is H, NH2, or R3; R3 is an alkanol or alkoxyl group having 1, 2, 3, 4, or 5 carbon atoms; L is 2, 3, 4, or 5; M is 2, 3, 4, or 5; and N is 3, 4, or 5}.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: May 9, 2017
    Assignee: Nippon Hyomen Kagaku Kabushiki Kaisha
    Inventors: Mitsuhiro Omachi, Atsushi Kaneko, Satoshi Ito
  • Patent number: 9476137
    Abstract: A metal oxide film suitable for protection of metals, composed mainly of aluminum. A metal oxide film includes a film of an oxide of a metal composed mainly of aluminum, having a thickness of 10 nm or greater, and exhibiting a moisture release rate from the film of 1E18 mol./cm2 or less. Further, there is provided a process for producing a metal oxide film, wherein a metal composed mainly of aluminum is subjected to anodic oxidation in a chemical solution of 4 to 10 pH value so as to obtain a metal oxide film.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: October 25, 2016
    Assignees: Tohoku University, Mitsubishi Chemical Corporation
    Inventors: Tadahiro Ohmi, Yasuyuki Shirai, Hitoshi Morinaga, Yasuhiro Kawase, Masafumi Kitano, Fumikazu Mizutani, Makoto Ishikawa
  • Patent number: 9453290
    Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: September 27, 2016
    Assignee: TEL NEXX, INC.
    Inventors: Arthur Keigler, John Harrell, Zhenqiu Liu, Qunwei Wu
  • Patent number: 9193012
    Abstract: The present disclosure includes methods for coating and/or repairing a surface of a titanium metal part. Uncoated or damaged portions of the surface of titanium parts are prepared for coating, followed by applying a first coating. A second coating may then be applied to form a coated or repaired surface. The coated or repaired surface may be machined to produce a finished surface having a predetermined thickness.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: November 24, 2015
    Assignee: Goodrich Corporation
    Inventors: Edward Evans, Glenn Forbes, Mirko Zdero
  • Patent number: 9005420
    Abstract: Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: 2 nm-5 micron), entirely coarse-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: April 14, 2015
    Assignee: Integran Technologies Inc.
    Inventors: Klaus Tomantschger, Glenn Hibbard, Gino Palumbo, Iain Brooks, Jonathan McCrea, Fred Smith
  • Publication number: 20150041329
    Abstract: A method of depositing nickel on a surface of an object, the method including the steps of providing a source of direct current having a positive and a negative terminal; connecting the object to the negative terminal; connecting an anode to the positive terminal; and submerging the object and anode in a solution comprising nickel. The anode is positioned at a distance equal to or less than 2 mm from the surface of the object and when the source of direct current is switched on, nickel in the solution comprising nickel is deposited on the surface of the object.
    Type: Application
    Filed: April 10, 2014
    Publication date: February 12, 2015
    Inventor: Mohammad Sakhawat HUSSAIN
  • Publication number: 20150014175
    Abstract: An electroplating apparatus for plating a metal onto a surface of a wafer is disclosed. The apparatus comprises a wafer support configured to support a wafer and a processing base. The processing base has a scroll pump oriented to pump a plating solution in a substantially perpendicular direction with respect to the surface of the wafer. Further, the scroll pump includes a first scroll and a second scroll, at least one of which is configured as an anode. In one embodiment, the processing base includes an anolyte chamber including the scroll pump, a catholyte chamber, and a membrane separating the anolyte chamber from the catholyte chamber.
    Type: Application
    Filed: July 9, 2013
    Publication date: January 15, 2015
    Inventor: Raymon F. Thompson
  • Publication number: 20150014176
    Abstract: A wafer processing apparatus is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer at a processing position with respect to a processing base. The processing base includes a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer when the wafer contacts the processing fluid while in the processing position. While in contact with the processing fluid, the wafer support may rotate the wafer in the processing fluid. In one embodiment, the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer being processed.
    Type: Application
    Filed: July 9, 2013
    Publication date: January 15, 2015
    Inventor: Raymon F. Thompson
  • Patent number: 8920616
    Abstract: An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: December 30, 2014
    Assignee: Headway Technologies, Inc.
    Inventors: Chao-Peng Chen, Jaswant Chudasama, Pradeep Mishra, Chen-Li Lin, David Wagner
  • Patent number: 8834699
    Abstract: A method of anodizing that is performed in the capacitor case. The anode and a formation cathode are inserted into the capacitor case. The formation cathode includes one or more passageways through which formation electrolyte is transferred to contact the surface of the anode. In one particular implementation, the anode includes several slots and the formation cathodes are plates that are inserted into the slots. One or more valves coupled to formation electrolyte storage tanks storing different electrolytes may be coupled to the formation cathode. A rinsing step can be performed by supplying water through the passageways in the formation cathode. Other implementations anodize outside the capacitor case.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: September 16, 2014
    Assignee: Tantalum Pellet Co.
    Inventor: Todd Knowles
  • Publication number: 20140246326
    Abstract: The subject of the present invention is a method of the electrolytic isolation of arsenic from industrial electrolytes including waste electrolytes used in the electrorafination of copper after its prior decopperisation.
    Type: Application
    Filed: October 19, 2012
    Publication date: September 4, 2014
    Applicant: NANO-TECH SP. Z O.O.
    Inventors: Michal Gieron, Slawomir Ruta, Przemyslaw Zaprzalski
  • Patent number: 8795480
    Abstract: Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: August 5, 2014
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, David W. Porter
  • Patent number: 8784636
    Abstract: A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: July 22, 2014
    Assignee: Ebara Corporation
    Inventors: Mizuki Nagai, Nobutoshi Saito, Fumio Kuriyama, Akira Fukunaga
  • Publication number: 20140190835
    Abstract: A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 10, 2014
    Applicant: YUKEN INDUSTRY CO., LTD.
    Inventors: Norikazu KOJIMA, Yoshiharu KIKUCHI
  • Publication number: 20140166492
    Abstract: An Sn alloy plating apparatus includes: a plating bath having a cathode chamber for holding therein an Sn alloy plating solution in which the substrate is to be immersed and an anode chamber for holding therein an anolyte containing Sn ions and an acid; an Sn anode located in the anode chamber; and an electrolytic solution supply line configured to supply an electrolytic solution containing the acid into the anode chamber such that a Sn ion concentration of the anolyte in the anode chamber is kept not less than a predetermined value and a concentration of the acid in the anolyte is kept not less than a predetermined acceptable value. The electrolytic solution supply line supplies the electrolytic solution into the anode chamber to increase an amount of the anolyte in the anode chamber and supply the anolyte into the Sn alloy plating solution by the increased amount.
    Type: Application
    Filed: December 11, 2013
    Publication date: June 19, 2014
    Inventors: Masashi SHIMOYAMA, Jumpei FUJIKATA, Yuji ARAKI, Masamichi TAMURA, Toshiki MIYAKAWA
  • Publication number: 20140131211
    Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 15, 2014
    Applicant: Novellus Systems, Inc.
    Inventors: Robert Rash, Richard Abraham, David W. Porter, Steven T. Mayer
  • Publication number: 20140097089
    Abstract: Methods of preparing metal and metal alloys with partially microcrystalline anodic coatings are disclosed. Associated article therefrom are correspondingly disclosed. The partially microcrystalline anodic coatings exhibit steam, superheated steam, alkaline and acidic resistance. Partially microcrystalline anodic coating can be prepared by impregnation of micropores of a metal or metal substrate with metal precursor species, conversion of the metal precursor species into metal hydroxides, thermal treatment to dry out moisture and to promote phase transformation of the metal hydroxide product into metal oxides solids and bonding with metastable metal oxide substance in the pore structure of the metal or metal alloy substrate, and hydrothermal sealing to create sealed partially microcrystalline anodic coating.
    Type: Application
    Filed: December 12, 2013
    Publication date: April 10, 2014
    Applicant: SANFORD PROCESS CORPORATION
    Inventors: Timothy P. Cabot, John J. Tetrault, Dong-Jin Sung
  • Publication number: 20140100112
    Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. As exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. An exemplary article may comprise a biaxially textured base material, and at least one biaxially textured layer selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer is formed by electrodeposition on the biaxially textured base material.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 10, 2014
    Applicant: Alliance for Sustainable Energy, LLC
    Inventors: Raghu N. BHATTACHARYA, Sovannary PHOK, Priscila SPAGNOL, Tapas CHAUDHURI
  • Patent number: 8685221
    Abstract: One embodiment is a method for void-free metallic electrofilling inside openings, said method includes: providing a substrate with at least one opening, the substrate includes an electrically conductive surface, including inside the at least one opening; immersing the substrate in an electrolyte contained in an ECD cell, the ECD cell includes at least one anode and a cathode, the cathode includes at least a portion of the conductive surface, the electrolyte includes plating metallic ions and at least one inhibitor additive, said metallic ions and at least one inhibitor additive having concentrations; providing electrolyte agitation across the substrate surface; and applying electroplating current density to the substrate; wherein the agitation, the concentrations, and the electroplating current density are such to produce void-free metallic electrofilling of the at least one opening, and wherein a height of electrodeposited surface bumps, or transition steps or humps, or transition spikes, is less than 140 nm
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: April 1, 2014
    Inventor: Uri Cohen
  • Publication number: 20140017512
    Abstract: A button or fastener member is provided wherein aluminum or an aluminum alloy is used as raw material, a first copper plating layer is formed directly over the entire surface of said raw material, and a second copper plating layer is formed directly on top of the first copper plating layer, with the aforementioned second copper plating layer being thicker than the aforementioned first copper plating layer.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 16, 2014
    Applicant: YKK CORPORATION OF AMERICA
    Inventors: Masayuki Iimori, Michael David Hopper
  • Publication number: 20130306484
    Abstract: The present disclosure is directed to modified metal materials for implantation and/or bone replacement, and to methods for modifying surface properties of metal substrates for enhancing cellular adhesion (tissue integration) and providing antimicrobial properties. Some embodiments comprise surface coatings for metal implants, such as titanium-based materials, using (1) electrochemical processing and/or oxidation methods, and/or (2) laser processing, in order to enhance bone cell-materials interactions and achieve improved antimicrobial properties. One embodiment comprises the modification of a metal surface by growth of in situ nanotubes via anodization, followed by electrodeposition of silver on the nanotubes. Other embodiments include the use of LENS™ processing to coat a metal surface with calcium-based bioceramic composition layers. These surface treatment methods can be applied as a post-processing operation to metallic implants such as hip, knee and spinal devices as well as screws, pins and plates.
    Type: Application
    Filed: July 31, 2013
    Publication date: November 21, 2013
    Applicant: WASHINGTON STATE UNIVERSITY
    Inventors: Amit Bandyopadhyay, Susmita Bose
  • Patent number: 8586506
    Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinide, lanthanides, and oxides thereof. An exemplary article (150) may comprise a biaxially textured base material (130), and at least one biaxially textured layer (110) selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer (110) is formed by electrodeposition on the biaxially textured base material (130).
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: November 19, 2013
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Raghu N. Bhattacharya, Sovannary Phok, Priscila Spagnol, Tapas Chaudhuri
  • Patent number: 8551317
    Abstract: Disclosed are a method and an apparatus for forming an oxide coating film with excellent corrosion resistance and adhesiveness on a cathode made of a metal plate by a simple process at low cost. A direct current voltage is applied between an anode (12) and a cathode (13) in an electrolyte solution which cathode (13) is made of a metal plate to be coated with oxide and arranged opposite to the anode (12), while supplying oxygen or a gas containing oxygen into the electrolyte solution, so that the metal plate cathode (13) is coated with oxide, thereby being formed into a oxide-coated metal plate.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: October 8, 2013
    Assignees: Toyo Seikan Kaisha, Ltd., Toyo Kohan Co., Ltd.
    Inventors: Wataru Kurokawa, Hiroshi Matsubayashi, Mitsuhide Aihara, Masanobu Matsubara, Masatoki Ishida, Norimasa Maida
  • Patent number: 8545687
    Abstract: Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: October 1, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Reinhard Schneider, Henry Kunze, Ferdinand Wiener
  • Patent number: 8524065
    Abstract: Embodiments of systems and methods for electrocoating a part are presented herein. According to one embodiment, an electrocoating system comprises a tank, a pump in fluid communication with the tank, and an external anode positioned outside of the tank. The external anode is a substantially membrane-free metal pipe configured to provide an electric charge to a fluid for electrocoating a part. The system may further comprise one or more internal nozzles positioned inside of the tank to direct an electrically charged fluid from the pump into the tank for electrocoating a part. In addition, the system may further comprise one or more external nozzles positionable outside of the tank to direct an electrically charged fluid from the pump to one or more selected areas of a part positioned for electrocoating outside of the tank.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: September 3, 2013
    Assignee: Metokote Corporation
    Inventors: Brent Allen Schwartz, Brian Todd Young
  • Publication number: 20130220818
    Abstract: One embodiment is for the close agitation of electroplating solution substantially near an electrode in an electroplating cell. The agitation occurs within the Nernst diffusion layer allowing for ion replenishment of the electroplating solution at the working electrode face. The system operates by producing a flat agitation face (180) and a working electrode (350) face that are brought to within 10 microns of one another during the plating process whilst the agitator 380 is being actuated. In one embodiment, the working electrode is rigid such as a semiconductor wafer. In another embodiment, the working electrode is a flexible material (600) such as fabric or flexible electronics. Other embodiments are described and shown.
    Type: Application
    Filed: August 13, 2012
    Publication date: August 29, 2013
    Inventors: Trevor Graham Niblock, Michael Glickman
  • Patent number: 8512543
    Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: August 20, 2013
    Assignee: Tel Nexx, Inc.
    Inventors: Arthur Keigler, John Harrell, Zhenqiu Liu, Qunwei Wu
  • Publication number: 20130122326
    Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 16, 2013
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventor: NATIONAL CHIAO TUNG UNIVERSITY
  • Patent number: 8419917
    Abstract: An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: April 16, 2013
    Assignee: Lam Research Corporation
    Inventors: Yezdi Dordi, Bob Maraschin, John Boyd, Fred C. Redeker
  • Publication number: 20130002120
    Abstract: Provided is a spark plug that is excellent not only in salt resistance but also in stress corrosion cracking resistance. The spark plug includes a metal shell covered by a composite layer including a nickel plating layer and a chromate layer formed on the nickel plating layer. The chromate layer has a film thickness of 2 to 45 nm and Cr element concentration of not more than 60 at % and contains Ni in addition to Cr.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 3, 2013
    Applicant: NGK Spark Plug Co., LTD
    Inventors: Hiroaki Nasu, Akito Sato, Kazuhiro Kodama
  • Patent number: 8313621
    Abstract: A method and apparatus for anodizing a porous valve metal pellet in a flowing liquid electrolyte is described. The apparatus comprises an insulative container comprised of a lower region, a central region including a cavity for holding the pellet, an upper region, and a continuous passageway extending through the lower, central, and upper regions. Lower and upper screens serving as lower and upper electrodes are disposed in the passageway in the lower and upper container regions, respectively. During anodizing, the electrolyte flows through the lower container region including the lower screen, the porous pellet and then the upper container region including the upper screen. The lower and upper screens are at an opposite electrical polarity as the pellet so that a dielectric oxide is formed on the exposed valve metal including interior portions of the pellet that are exposed to the flowing electrolyte.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: November 20, 2012
    Assignee: Greatbatch Ltd.
    Inventors: David Goad, Neal Nesselbeck, Jason Hahl
  • Patent number: 8252167
    Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: August 28, 2012
    Assignee: Ebara Corporation
    Inventors: Fumio Kuriyama, Takashi Takemura, Nobutoshi Saito, Masaaki Kimura, Rei Kiumi
  • Patent number: 8246797
    Abstract: The invention concerns a surface treatment electrode (11) to treat at least one object (1). It comprises at least one cavity (23) enclosing the object (1) to be treated during the treatment, having a geometry ensuring free movement of the object (1), this cavity (23) being delimited by a wall (24) comprising at least one opening (25) communicating the inside of the cavity (23) with a treatment solution (5) in which the electrode (11) is immersed during the surface treatment. The cavity (23) is substantially cylindrical and its diameter is approximately 50 to 100 micrometers larger than a maximum size of the object (1).
    Type: Grant
    Filed: April 3, 2006
    Date of Patent: August 21, 2012
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Ronan Botrel, Herve Bourcier
  • Publication number: 20120175260
    Abstract: A device for simultaneous coating of a plurality of workpieces is described, the plurality of workpieces being situated in a shared flow shaft through which an electrolyte flows, and each workpiece being connected electrically conducting to at least one component electrode and being electrically insulated in relation to at least one bath electrode, and a plurality of flow channels and a flow distributor for distributing the electrolyte stream to the plurality of flow channels further being situated in the flow shaft, the at least one bath electrode being situated in one of the flow channels.
    Type: Application
    Filed: May 11, 2010
    Publication date: July 12, 2012
    Inventors: Rolf Keller, Harald Bauer, Michael Lingner
  • Publication number: 20120160695
    Abstract: The invention relates to a method of making a nanotubular titania substrate having a titanium dioxide surface comprised of a plurality of vertically oriented titanium dioxide nanotubes containing oxygen vacancies, including the steps of anodizing a titanium metal substrate in an acidified fluoride electrolyte and annealing the titanium oxide surface in a non-oxidating atmosphere. The invention further relates to a nanotubular titania substrate having an annealed titanium dioxide surface comprised of self-ordered titanium dioxide nanotubes containing oxygen vacancies. The invention further relates to a photo-electrolysis method for generating H2 wherein the photo-anode is a nanotubular titania substrate of the invention. The invention also relates to an electrochemical method of synthesizing CdZn/CdZnTe nanowires, wherein a nanoporous TiO2 template was used in combination with non-aqueous electrolyte.
    Type: Application
    Filed: November 8, 2011
    Publication date: June 28, 2012
    Applicant: UNIVERSITY OF NEVADA
    Inventors: Manoranjan MISRA, Krishnan Selva RAJA, Susant Kumar MOHAPATRA, Vishal Khamdeo MAHAJAN
  • Patent number: 8177926
    Abstract: Amorphous Fe100-a-bPaMb foil, preferably in the form of a free-standing foil, process for its production by electrodeposition or electroforming of an aqueous plating solution, and its uses as a constitutive element of a transformer, generator, motor, pulse applications and magnetic shieldings. “a” is a real number ranging from 13 to 24, b is a real number ranging from 0 to 4, and M is at least one transition element other than Fe. The amorphous Fe100-a-bPaMb foil has the properties of being amorphous as established by the X-ray diffraction method, an average thickness greater than 20 micrometers, a tensile strength in the range of 200-1100 MPa, an electrical resistivity of over 120 ??cm, and at least one of a high saturation induction (Bs) greater than 1.4 T, a coercive field (Hc) of less than 40 A/m, a loss (W60), at power frequencies (60 Hz), and for a peak induction of at least 1.35 T, of less than 0.65 W/kg, and a relative magnetic permeability (B/?0H) greater than 10000, for low values of ?0H.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: May 15, 2012
    Assignee: Hydro-Quebec
    Inventors: Robert Lacasse, Estelle Potvin, Michel Trudeau, Julian Cave, Francois Allaire, Georges Houlachi
  • Publication number: 20120088118
    Abstract: Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.
    Type: Application
    Filed: December 8, 2011
    Publication date: April 12, 2012
    Applicant: Modumetal LLC
    Inventor: Christina LOMASNEY
  • Patent number: 8062496
    Abstract: An apparatus and method is disclosed for simultaneously electroplating at least two parts in a series electrical configuration in an electroplating system using a shared electrolyte with excellent consistency in thickness profiles, coating weights and coating microstructure. Parts in high volume and at low capital and operating cost are produced as coatings or in free-standing form.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: November 22, 2011
    Assignee: Integran Technologies Inc.
    Inventor: Klaus Tomantschger
  • Patent number: 8029660
    Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: October 4, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Tota Maitani, Taku Kanaoka
  • Patent number: 8012330
    Abstract: A plating method, employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated. A resistor body is disposed above the anode and immersed in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body. Thus, a raised portion of the plating solution is created in the center of the upper surface of the resistor body. The substrate is then lowered with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: September 6, 2011
    Assignee: Ebara Corporation
    Inventors: Takashi Kawakami, Tsutomu Nakada
  • Patent number: 7947161
    Abstract: A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: May 24, 2011
    Assignee: Faraday Technology, Inc.
    Inventors: Lawrence E. Gebhart, E. Jennings Taylor
  • Publication number: 20110073482
    Abstract: A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.
    Type: Application
    Filed: December 13, 2010
    Publication date: March 31, 2011
    Inventors: Fumio Kuriyama, Takashi Takemura, Nobutoshi Saito, Masaaki Kimura, Rei Kiumi
  • Patent number: 7897027
    Abstract: A plating method includes providing an article in a plating bath, covering a surface of the article with an insulating member in the plating bath, and electrolytically plating the article while moving one of the insulating member and the article relative to each other.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 1, 2011
    Assignee: IBIDEN Co., Ltd.
    Inventors: Toru Nakai, Satoru Kawai, Hiroshi Niwa, Yoshiyuki Iwata
  • Patent number: 7879217
    Abstract: A method and apparatus for anodizing a porous valve metal pellet in a flowing liquid electrolyte is described. The apparatus comprises an insulative container comprised of a lower region, a central region including a cavity for holding the pellet, an upper region, and a continuous passageway extending through the lower, central, and upper regions. Lower and upper screens serving as lower and upper electrodes are disposed in the passageway in the lower and upper container regions, respectively. During anodizing, the electrolyte flows through the lower container region including the lower screen, the porous pellet and then the upper container region including the upper screen. The lower and upper screens are at an opposite electrical polarity as the pellet so that a dielectric oxide is formed on the exposed valve metal including interior portions of the pellet that are exposed to the flowing electrolyte.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: February 1, 2011
    Assignee: Greatbatch Ltd.
    Inventors: David Goad, Neal Nesselbeck, Jason Hahl
  • Publication number: 20100307926
    Abstract: Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises: —a container filled with the liquid; —a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; —a power supply device for supplying electrical power to the wafer.
    Type: Application
    Filed: October 9, 2008
    Publication date: December 9, 2010
    Applicant: Renewable Energy Corporation ASA
    Inventors: Erik Sauar, Robertus Antonius Steeman, Karl Ivar Lundahl
  • Patent number: 7842176
    Abstract: A method for horizontally electroplating or electro deposition a thin film on a substrate comprises the steps of transferring and positioning a substrate on a substrate supporter; the substrate being positioned approximately horizontally; moving a plurality of stop plates to enclose horizontal edges of the substrate so as to form with an enclosure around an edge of the substrate; moving a first electrode to be in contact with a portion of the substrate; the portion being a non-wired area; moving a second electrode to be above and not in contact with the substrate; wherein the second electrode has a polarity opposite to that of the first electrode; and filling electroplating liquid into the enclosure formed by the stop plates so as to be in contact with the second electrode above the substrate for electroplating or electro deposition.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: November 30, 2010
    Inventor: Yen-Chen Liao