Abstract: Disclosed is a technique for manufacturing a Ni—Fe alloy thin foil using a single-step electrodeposition-based plating process without requiring processes such as melting, casting, forging, and rolling. A manufacturing apparatus is provided which includes an electrolyzer adapted to receive an electrolyte containing, as a major component thereof, a solution of nickel and iron compounds, a cathode partially dipped in the electrolyte and arranged in such a fashion that it is rotatable, an anode completely dipped in the electrolyte and arranged in such a fashion that it faces the cathode while being spaced apart from the cathode by a desired distance, and a current supply device adapted to generate a flow of current between the cathode and the anode, whereby a Ni—Fe alloy thin film is electrodeposited to a desired thickness over a surface of the cathode facing the anode, and then peeled off from the surface of the cathode, so that a continuous Ni—Fe alloy thin foil is manufactured.

Abstract: Bumps are formed by means of uniform plating in which air can be easily discharged.

Abstract: A process for electrolytically processing a flat perforated item, comprising the steps of: moving the item in a transport direction to a treatment station where the item is contacted with an electrolyte, continuously mechanically wiping, in the presence of one of a cathodic item and an anode, and an anodic item and a cathode, a surface of the item using means for reducing the thickness of a diffusion layer depleted in metal ions adjacent the surface of the item, which means include a wiping roller extending perpendicular to the transport direction over the entire width of the item and in contact with the item; and moving the electrolyte in a direction substantially perpendicular to a plane of the item so as to direct the electrolyte only toward the perforations in the item and to convey the electrolyte through the in the item under pressure.

Abstract: An electrolyte line extends from the outlet of an electrolysis device to a collecting tank and from the same back to the inlet of the electrolysis device. The electrolyte is passed from the outlet of the electrolysis device to a first container which is disposed at a higher level than a second container. Electrolyte collected in the first container is periodically discharged through a first syphon line into the second container, and electrolyte collected in the second container is periodically discharged through a second syphon line into the collecting tank which is disposed at a lower level than the second container. The outlet end of each syphon line is disposed at a distance above the liquid level of the container disposed thereunder, so that electrolyte always flows only in one of the two syphon lines or in none of the syphon lines. When electrolyte flows in none of the two syphon lines, electrolyte is preferably supplied from the collecting tank into the second container.

Abstract: A first reactive solution is made of a water solution composed of LiOH.7H2O melted in distilled water, and a second reactive solution is made of a water solution composed of CoSO4.7H2O melted in distilled water. Then, the first and the second reactive solutions are put in a flow-type reactor with a pair of electrodes and a porous base material provided in between the pair of electrodes therein. The first reactive solution is flown in between one electrode and the porous base material at its given flow rate, and the second reactive solution is flown in between the other electrode and the porous base material at its given flow rate. Then, a given voltage is applied between the pair of electrodes to synthesize a compound thin film including the components of the first and the second reactive solutions directly on the porous base material.

Abstract: The present invention is applicable to composite particles for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating using such composite particles as well as a plating (coating) using the same. The purpose of the invention is to obtain a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity, and a method of plating using such composite particles. In this invention, each of the composite particles includes a friction-reducing mother or core particle (1) encapsulated with shell particles (2) comprised of the same components as a base metal of a composite dispersion plating bath (5). This provides a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity.

Abstract: A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer, rinse and reflow systems for use with the continuous plating system.

Abstract: A cup-type plating apparatus includes a plating tank having a support section provided on an upper end thereof for holding a wafer; a solution feed section provided at the center of a bottom portion of the plating tank; an anode disposed within the plating tank; and a diaphragm for separating the anode from the wafer. The diaphragm is slanted upward from the solution feed section toward the periphery of the plating tank. A gas release port is provided in the plating tank at such a position as to release bubbles collected under an upper end portion of the diaphragm.

Abstract: In an electroplating method, a plating target article (X) disposed so as to be in contact with plating bath (14) is set as a cathode while a metal member disposed so as to be in contact with the plating bath (14) is set as an anode, and a voltage is applied between the cathode and the anode while vibrational flow is induced by vibrating vibrational vanes (16f) which are fixed in multi-stage style to a vibrating rod (16e) vibrating in the plating bath (14) interlockingly with vibration generating means (16d). Plating current flowing from the anode through the plating bath (14) to the cathode is pulsed and alternately set to one of a first state where the plating current keeps a first value I1 for a first time T1 and a second state where the plating current keeps a second value I2 having the same polarity as the first value I1 for a second time T2, the first value I1 being five or more times larger than the second value I2, and the first time T1 being three or more times longer than the second time T2.

Abstract: A megasonic plating technique employs a submerged megasonic transducer array (22) to create a ridge (38) of electrolyte that extends upward above a plating tray (12). A chuck (40) holds the substrate (42) so the face to be plated is oriented downwards. A controlled power supply (32) for the megasonic transducer array (22) energizes selected transducer cells (36) to create the ridge (38) of electrolyte and cause it to move or walk across the face of the substrate. This technique avoids need for drive mechanisms for either the tray (12) or the chuck (40). A annular anode element (24) may be positioned above the transducer array, and may be a consumable anode. This technique may be used for electroplating, electroless plating, or for other wet chemistry techniques such as planing or etching.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: An electroplating formulation and process is provided for electroplating an iron layer onto an aluminum or aluminum alloy substrate. The method entails immersing an iron-containing anode and an aluminum containing cathode in an electroplating bath including boric acid in a concentration of at least about 50 grams per liter, and ferrous ions, and then applying electrical current to the cathode. A preferred electroplating bath solution includes the following: (1) Fe+2 having a concentration ranging from about 0.65 to about 2.5 moles per liter of solution; (2) at least one anion associated with the Fe+2 ion; (3) a reducing agent in an amount sufficient to prevent oxidation of Fe+2 to Fe+3; (4) Cl− in an amount sufficient to promote dissolution of the anode and increase the conductivity of the solution; (5) a wetting agent in an amount sufficient to prevent pitting of the aluminum electroplated surface; and (6) boric acid in a concentration of at least about 50 grams per liter.

Abstract: A method for producing electro- or electroless-deposited-film, in which the crystal orientation of the film is controlled to provide improved product properties. A paramagnetic material or diamagnetic material in its electrolytic-state is deposited on a substrate by an electro- or electroless-deposition process. A magnetic field having an intensity at least on the order of 7 T is applied in a predetermined direction, so as to perform the deposition in environment added with the magnetic field. A porous plate is preferably arranged adjacent to the substrate, for suppressing flow of an electrolytic liquid that may occur during the application of the magnetic field.

Abstract: One electrode is provided in association with the object to be coated, the other electrode. A pre-stretched ion-exchange membrane in a thin tubular form is sandwiched inbetween two nonconductive water permeable screen tubular housings. The assembly contains a supply line that provides a water way for the electrolyte to flow from the top of the device into a lower cap, then to the lower cap reservoir that allows stabilization and disbursement of electrolyte through the rifled housing Inertia developed through this defined pattern creates a swirling action that scrubs the impurities away from the anode, and to the top of the device to be carried out top. The location of the supply line is just inside the inner screen inserted through both the upper housing and lower cap. The tubular electrode is provided to the inside of membrane housing completing the inner portion of the waterway return chamber.

Abstract: In a plating method for successively treating a plating target from a pre-treatment step until a plating treatment, (A) a vibrationally stirring apparatus for a treatment bath, (B) an aeration apparatus for the treatment bath, (C) an apparatus for swinging an electrode bar for suspending the plating target thereon, and (D) an apparatus for applying vibration to the electrode bar, are operated in a cleaning tank and at least one of an electroless plating tank and an electroplating tank used as a treatment tank in the pre-treatment step and the plating step.

Abstract: Method for producing a nickel foam having a specific weight of between 200 and 400 g/m2, at least comprising the steps of:

Abstract: A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.

Abstract: A method of anodizing a metal comprising immersing a metal substrate into an a glycerine-based electrolytic solution and applying a constant current to produce a uniform film. The electrolytic solution additionally comprises at least one acidic organic salt, inorganic salt, or mixtures thereof. Suitable salts include dibasic potassium phosphate, P-toluene sulfonate, potassium hydrogen sulfate and monobasic potassium tartrate. The electrolytic solution may be prepared by mixing glycerine and the salt or salts, and then heating the solution to about 150 to 180° C. for about 1 to 12 hours. The prepared solution preferably has a water content of less than 0.1 wt %. Anodizing may be performed in the electrolytic solution at temperatures above about 150° C. to achieve non-thickness-limited film growth. Temperature fluctuations within the solution are reduced by the use of impellers or ultrasonic agitation.

Abstract: A heated platen or chuck is employed in connection with a wet chemistry process cell, such as a plating cell for plating a flat substrate. A flow of electrolyte or other wet process solution is introduced into the cell across the surface of the substrate which is mounted on a the chuck or holder. A cathode ring may be disposed to make electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper may be employed to draw bubbles or other impurities from the substrate, and a megasonic transducer can apply megasonic acoustic energy to the solution. The cell can be used for electroless or galvanic plating. A heater in the chuck heats the substrate to a temperature significantly above that of the electrolyte. Heating the substrate during plating improves the grain structure of the plated metal.

Abstract: A plating apparatus and methodology is disclosed that is particularly useful in improving the plating rate, improving the plating of via holes, improving the uniformity of the plating deposition across the surface of the wafer, and minimizing damage to the wafer. With regard to improving the plating rate and the plating of via holes, the plating apparatus and method immerses a wafer in a plating fluid bath and continuously directs plating fluid towards the surface of the wafer. Immersing the wafer in a plating fluid bath reduces the occurrence of trapped gas pockets within via holes which makes it easier to plate them. The continuous directing of plating fluid towards the surface of the wafer increases the ion concentration gradient which is, in turn, increases the plating rate.

Abstract: An anode container, electroplating system, method and object so plated. A feature of the invention is that an anode container has an interior cross-sectional area, at or near a lower end thereof, that is larger than an interior cross-sectional area of an upper end thereof. An anode-receiving container also has a body with a plurality of sides and a lower end having a larger cross-sectional interior area than an upper end. The container may also include punched out apertures positioned to provide strength to the container and an apparatus to vibrate the container coupled to a lower end of the container.

Abstract: An apparatus for depositing an electrically conductive layer on the surface of a wafer comprises a flange. The flange has a cylindrical wall and an annulus attached to a first end of the cylindrical wall. The annulus shields the edge region of the wafer surface during electroplating reducing the thickness of the deposited electrically conductive layer on the edge region. Further, the cylindrical wall of the flange can be provided with a plurality of apertures adjacent the wafer allowing gas bubbles entrapped on the wafer surface to readily escape.

Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN.sub.50) while at least one material layer has a hardness that is less than about 250 (KHN.sub.50).

Abstract: Plating of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.

Abstract: The non-uniformity of electroplating on wafers is due to the appreciable resistance of the thin seed layer and edge effects. Mathematical analysis of the current distribution during wafer electroplating reveals that the ratio between the resistance of the thin deposited seed layer and the resistance of the electrolyte and the electrochemical reaction determines the uniformity of the electroplated layer. Uniform plating is critical-in-wafer metallization for the subsequent step of chemical mechanical polishing of the wafer. Based on the analysis, methods to improve the uniformity of metal electroplating over the entire wafer include increasing the resistance of the electrolyte, increasing the distance between the wafer and the anode, increasing the thickness of the seed layer, increasing the ionic resistance of a porous separator placed between the wafer and the anode, placement of a rotating distributor in front of the wafer, and establishing contacts at the center of the wafer.

Abstract: A processing chamber for depositing and/or removing material onto/from a semiconductor wafer when the wafer is subjected to an electrolyte and in an electric field, and in which a rotating anode is used to agitate and distribute the electrolyte. A hollow sleeve is utilized to form a containment chamber for holding the electrolyte. A wafer residing on a support is moved vertically upward to engage the sleeve to form an enclosing floor for the containment chamber. One electrode is disposed within the containment chamber while the opposite electrode is comprised of several electrodes distributed around the circumference of the wafer. The electrodes are also protected from the electrolyte when the support is raised and engaged to the sleeve. In one embodiment, the support and the sleeve are stationary during processing, while a rotating anode is used to agitate and distribute the electrolyte.

Abstract: A method and two-part plating apparatus for plating groups of elongated objects. The plating apparatus includes a fixture and a fixture support. The fixture is configured to loosely retain a group of elongated articles in a generally vertical orientation where the upper ends are contained within a cavity and the lower ends are in contact with a support surface. The cavity includes an electrode which is electrically connected to the upper ends of the elongated articles. The fixture is configured to be placed onto and partially through a fixture support which is in contact with a container of plating solution. The fixture support has a base and an agitation element which moves the fixture with respect to the base, thus shifting and exposing surfaces of the elongated articles to facilitate plating.

Abstract: A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board.

Abstract: An electrolytic process for metal-coating the pre-cleaned surface of a workpiece of an electrically conducting material, which process comprises:i) providing an electrolytic cell with a cathode comprising the workpiece and an anode comprising the metal for metal-coating of the surface of the workpiece;ii) introducing an electrolyte into the zone created between the anode and the cathode by causing it to flow under pressure through at least one opening in the anode impinge on the cathode; andiii) applying a voltage between the anode and the cathode and operating in a regime in which the electrical current decreases or remains substantially constant with increase in the voltage applied between the anode and the cathode, and in a regime in which discrete gas bubbles are present on the surface of the workpiece during treatment.

Abstract: Zinc metal is deposited from an alkali electrolyte solution onto conductive seed particles in an electrowinning process which yields unusually high current efficiency and low energy consumption.

Abstract: In a method of manufacturing foils of plastic material which are electrically conductive in a transverse direction, but not in the plane of the foil wherein micropassages are formed in the foil by etching nucleus traces which are generated by exposure to a heavy ion beam, conductive layers are deposited on one side of the foil and the micropassages are filled by electrolytic metal ion depositions from the other side until caps are formed on the passages. After dissolving the two conductive layers, the steps are repeated to form caps also on the passages at the other side of the foil so as to provide for good contacting capabilities at both sides of the foil.

Abstract: A plating cell for plating a flat substrate employs a sparger to introduce a flow of electrolyte or other plating solution across the surface of the substrate to be plated. A fluid-powered rotary blade or wiper within the cathode chamber has a rotary blade with an edge spaced a small distance, preferably about three-eighths inch, from the substrate, and an annular turbine which rotates under a flow of the electrolytic fluid that is also being fed to the sparger. The rotary wiper is run at a speed between about 35 and 80 rpm and draws the electrolyte away from the substrate. This helps remove hydrogen bubbles that form during electroplating. In addition, a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 MHz.

Abstract: This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil being characterized by an ultimate tensile strength at 23.degree. C. of at least about 60,000 psi, a loss of ultimate tensile strength at 23.degree. C. of no more than about 15% after being annealed at 180.degree. C. for 30 minutes, an average grain size of up to about 1 micron, and a fatigue performance characterized by at least about 5000 cycles to failure when the strain amplitude is about 0.05% to about 0.2%. In one embodiment, the copper foil is electrodeposited using an electrolyte solution characterized by a free chloride ion concentration of up to about 4 ppm and an organic additive concentration of at least about 0.3 ppm.

Abstract: A nozzle for fast plating with plating solution jetting and sucking functions includes an outer cylindrical member and an inner cylindrical member, a plating solution issuing passage being defined between the outer and inner cylindrical members, and the inner space in the inner cylindrical member constituting a plating solution sucking passage. The inner cylindrical member has a front end flared portion having a forwardly flared surface acting to diffuse the solution. The outer cylindrical member has a front open end defining a gap with respect to the flared surface, the gap constituting a jetting port of the plating solution jetting passage. Plating solution supplied from a supply opening of the plating solution jetting passage is jetted from the jetting port toward a workpiece to be plated, the jetted plating solution is discharged from a rear end discharge opening of the plating solution sucking passage.

Abstract: An electrolytic process for simultaneously cleaning and metal-coating the surface of a workpiece of an electrically conducting material, which process comprises: i) providing an electrolytic cell with a cathode comprising the surface of the workpiece and an anode comprising the metal for metal-coating of the surface of the workpiece; ii) introducing an electrolyte into the zone created between the anode and the cathode by causing it to flow under pressure through at least one opening in the anode and thereby impinge on the cathode; and iii) applying a voltage between the anode and the cathode and operating in a regime in which the electrical current decreases or remains substantially constant with increase in the voltage applied between the anode and the cathode, and in a regime in which discrete gas bubbles are present on the surface of the workpiece during treatment.

Abstract: A plating cell for plating a flat substrate, for example, a stamper for a high-density compact disk recording, employs a sparger to introduce a flow of electrolyte across the surface of the substrate to be plated. A fluid-powered rotary blade or wiper within the cathode chamber has a rotary blade with an edge spaced a small distance, preferably about three-eighths inch, from the substrate, and an annular turbine which rotates under a flow of the electrolytic fluid that is also being fed to the sparger. The rotary wiper is run at a speed between about 35 and 80 rpm and draws the electrolyte away from the substrate. This helps remove hydrogen bubble that form during electroplating. A semipermeable weir separates the cathode chamber from an anode chamber that contains an anode basket that is filled with plating material. The plating cell is provided with a backwash flow regime so that impurities and inclusions from the anode chamber are kept out of the plating bath.

Abstract: A plating liquid for forming a nickel plating layer containing a dispersed substance and phosphorus having 1.0 g/l or more of sodium is desirably utilized in the high speed plating process. Other important aspects of the invention include a plating method using the aforementioned plating liquid, characterized in that a voltage is impressed while permitting the plating liquid to flow between a surface to be plated of a workpiece at a plating liquid flow rate of 1.0-3.0 m/sec and an electric current density of 20-200 A/dm.sup.2, and an engine cylinder having a plated interior surface characterized in that the plating layer of the cylinder is formed by a high speed plating treatment using the aforementioned plating liquid.

Abstract: A method for the production of metal foam with high specific surface area is disclosed. A foam material which may be either conductive or nonconductive is provided. If the material is nonconductive, an electrically conductive covering layer is formed. The electrically conductive foam material is then electrolytically coated with nickel from a nickel plating bath. The bath includes at least one unsaturated organic second class brightener in an amount effective to promote preferential growth of nickel onto the foam material such that the value of the growth ratio R, defined by the total of the growth of metal onto the foam material in the direction of the preferential growth divided by the total of the growth of metal in a direction perpendicular to the direction of the preferential growth, is greater than one. The nickel plating may be carried out using pulse current. The bath liquid may be flowed through the openings of the foam substrate in one or more directions during the deposition.

Abstract: In a nitriding method intended to confer upon ferrous metal parts, in addon to surface properties resulting directly from nitriding, corrosion resistance comparable to that obtained when the nitriding treatment is followed by an oxidizing treatment, in particular in a salt bath, the parts are treated by immersion for an appropriate time in a molten salt bath containing in the known manner essentially alkali metal carbonates and cyanates and a small quantity of a sulfur-containing substance. The parts are held at a positive potential relative to a counter-electrode in contact with the bath so that a high current flows through the bath from the parts to the counter-electrode and the concentration of cyanides formed by secondary reaction is kept below 6%. It is preferable to use a constant average current; the typical current densities are from 300 amperes to 800 amperes per m.sup.2, the typical temperature ranges are from 450.degree. C. to 650.degree. C.

Abstract: Aluminum and aluminum alloy parts, such as pistons, are electroplated with iron employing a ferrous electroplating solution. The solution comprises (a) ferrous iron having a concentration ranging from about 0.65 to 2.0 Moles of Fe.sup.2+ per liter of solution; (b) at least one anion selected from the group consisting of sulfamate and ammonium sulfate and associated with the Fe.sup.2+ ions; (c) a reducing agent, such as ascorbic acid, in an amount sufficient to prevent oxidation of Fe.sup.2+ to Fe.sup.3+ ; (d) Cl.sup.- anion in an amount sufficient to promote dissolution of the iron anode; and (e) a wetting agent in an amount sufficient to prevent pitting of the aluminum cathode. The ferrous electroplating bath of the present invention permits plating of relatively thick layers of iron on aluminum, typically on the order of about 0.6 to 2 mils (0.0015 to 0.0051 cm), with a microhardness of at least about 40 (Rockwell C scale).

Abstract: A hollow member whose internal surface is to be applied with composite plating is held in a condition in which a generatrix of the internal surface extends vertically. An electrode is inserted into the hollow member with a predetermined clearance to the internal surface of the hollow member. A composite plating liquid supply passage has a discharge opening which is in communication with an opening at a lower end of the hollow member. A gas is entrained in a form of bubbles into a composite plating liquid which is supplied into the clearance through the supply passage.

Abstract: A system for making porous silicon on blank and patterned Si substrates by "immersion scanning", particularly suitable for fabricating light-emitting Si devices and utilizing an open electrolytic cell having a cathode and an opposing anode consisting of a Si substrate on which the porous silicon is to be formed, both disposed, with their opposing surfaces in parallel, in an aqueous HF solution electrolyte contained in the cell. The substrate anode is mounted to be movable relative to the electrolyte so as to be mechanically cycled or scanned in and out of the electrolyte at a programmable rate during anodization. The uniformity, thickness and porosity of the resulting anodized layer on the substrate are determined by the scanning speed, number of cycles, current density, and HF-based electrolyte parameters of the system, and the Si substrate resistivity, conductivity type, and crystal orientation.

Abstract: In an electroplating container in which at least one portion of an inside surface of the container is formed from a metal material serving as cathode or anode and an anode or cathode is placed in the container, a composite electroplating liquid containing metal ions and fine solid particles is introduced into a bottom portion of the container in such a manner that the introduced composite electroplating liquid spouts downward against an inside bottom surface of the container and is allowed to flow upward through a flow path formed between the anode and the cathode, and an electric current is applied between the anode and cathode so as to form a composite electroplating layer including the fine solid particles evenly distributed in a metal matrix on a surface of the cathode or anode facing the flow path.

Abstract: An apparatus (10) for electrolytic plating of a substrate (44) includes a tank (14) in which a shaft (30) is centrally mounted for rotation about a first axis (28). The shaft carries an arm (40), on the distal end (112) of which is rotatably mounted a fixture wheel (44). The substrate to be plated is carried on the fixture wheel, which rides on an annular track (50) formed on the bottom of the tank around the shaft. A plurality of spaced pins (52) projecting upwardly from the track engage with a plurality of spaced recesses (56) formed about the perimeter (54) of the wheel, so that the wheel rotates about a second axis (64) while revolving around the first axis. The fixture carries a plurality of electrical contact members (46) that contact the substrate. Each contact member is separately supplied with current from a multichannel power supply (22).

Abstract: An electroplating apparatus includes a casing having a large opening at the bottom, a substrate being electroplated in the casing, a plating solution injector penetrating through an upper part of the casing for introducing a plating solution into the casing, an exhaust port penetrating through an upper part of the casing for draining the plating solution, a vertically movable substrate stage disposed beneath the casing for holding the substrate and having an opening smaller than the substrate, and a spin chuck for carrying the substrate to the substrate stage. In this apparatus, initially, the substrate is put on the spin chuck. Then, the substrate stage moves up and closes the casing from the bottom, and the substrate is electroplated in the casing. After the electroplating, the substrate stage moves down, and the substrate is transferred to the spin chuck. Automatic transfer of the substrate is possible using a uniaxial robot that moves only in the vertical or horizontal directions.

Abstract: This invention is directed to a controlled low profile electrodeposited copper foil. In one embodiment this foil has a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns. In one embodiment this foil has an ultimate tensile strength measured at 23.degree. C. in the range of about 87,000 to about 120,000 psi and an elongation measured at 180.degree. C. of about 15% to about 28%.

Abstract: An apparatus for electroplating, particularly in the production of metal matrices for manufacturing articles of plastic, such as compact discs, said apparatus comprising a container having a peripheral wall and opposed first and second end walls so as to form a plating space therein, adapted to house an electrolyte, and an anode, a carrier with an electrically conductive surface to be plated forming the cathode and means being arranged between the anode and the cathode for providing a flow of electrolyte from said cathode towards said anode. For allowing a faster production of metal matrices with better quality it is suggested according to the invention that the peripheral wall is formed with an internal contour which substantially corresponds to the surface to be plated, said carrier forming the second container end wall which through intermediate current supply members is sealingly urged against the mating edge of the peripheral wall, while the anode is located adjacent said first end wall of the container.

Abstract: A process is provided to prepare flexible composite polymer fibers by electrochemically forming a coating of a conductive organic polymer on the outer surface of a polymeric fiber.

Abstract: A device is provided for brush electroplating a surface of a workpiece. The device includes an anode generally composed of a metal to be electroplated on the surface of the workpiece. The anode is selectively retained within a cavity formed in a lower surface of a carrier piece composed of a generally electrical non-conductive material. The lower surface of the carrier piece is shaped to conform to at least a portion of the surface of the workpiece. An absorbent material extends over the lower surface of the carrier piece to form a brush. The cover material and lower surface of the anode are spaced from each other to form a chamber. The device also includes an assembly, fluidly connected to the space between the anode and absorbent material, to inject a flow of the electrolytic fluid into the chamber.