Abstract: A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.

Abstract: A method for forming a coated particle having a core particle that is fully coated by a dual-layer coating that includes an inner layer formed of a hydrophilic composition and an outer layer formed of a hydrophobic polymer. The core particles are added to a hydrophilic solution and mixed together. The hydrophobic polymer is then added to form a mixture. The mixture is sonicated to coat the particles and the coated particles are separated and dried to form meta-stable coated particles.

Abstract: The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined.

Abstract: The invention relates to a process for the production of electrolyte capacitors having a low equivalent series resistance and low residual current for high nominal voltages, electrolyte capacitors produced by this process and the use of such electrolyte capacitors.

Abstract: A process for producing a cadmium free electrical contact material having at least one metal and magnesium stannate Mg2SnO4. The process includes mixing pulverulent magnesium stannate Mg2SnO4 or a mamesium stannate precursor compound with at least one metal powder and optionally further oxides, pressing the mixture in order to obtain a compact and sintering the compact to obtain a sintered body.

Abstract: The subject invention provides materials and methods of fabricating and using an electrochemical biosensor for continuous detection of biological analytes. In a specific embodiment, the biosensor detects a given analyte when the analyte binds with a molecularly imprinted polymer (MIP) matrix immobilized atop a sensing substrate eliminating the need for a redox probing agent commonly found in electrochemical biosensors. Furthermore, the detection sensitivity of the biosensor is enhanced by modifying the electrode surface with a plurality of nanoscopic metallic structures. Advantageously, technologies provided herein can be used in a variety of low-power electronics for wearable applications.

Abstract: The invention relates to a process for the production of electrolyte capacitors having a low equivalent series resistance and low residual current for high nominal voltages, electrolyte capacitors produced by this process and the use of such electrolyte capacitors.

Abstract: A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

Abstract: Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method comprises: step (A) of treating the circuit substrate with a first liquid agent containing an oxidizing agent; step (B) of treating the circuit substrate after the step (A) with a second liquid agent which dissolves copper oxide, and thereby removing copper oxide from the conductive pattern's surface; step (C) of treating the circuit substrate after the step (B) with a third liquid agent whose rate of dissolving silver oxide (I) at 25° C. is 1000 times or more faster than its rate of dissolving copper (0) at 25° C., and thereby removing silver oxide from the conductive pattern's surface; and step (D) of performing electroless plating on the conductive pattern of the circuit substrate after the step (C).

Abstract: The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.

Abstract: A method of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-? (I), M1M2pOq (II), 0.05??<1.8, where, M1 is at least one element selected from a group consisting of groups 2, 9-12 of the periodic table, M2 is at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table, 0<p?2, and 0<q<4.

Abstract: Provided herein are substrates useful for surface-enhanced Raman spectroscopy (SERS), as well as methods of making substrates. The substrates comprise a support element; a nanoparticulate layer; a SERS-active layer in contact with said nanoparticulate layer; and optionally, an immobilizing layer disposed between said nanoparticulate layer and said support element; wherein if the optional immobilizing layer is not present, the nanoparticulate layer is thermally bonded to the support element; and if said optional immobilizing layer is present, said nanoparticulate layer thermally bonded to said immobilizing layer, and optionally, further thermally bonded to said support element. In addition, methods of making the substrates, along with methods of detecting and increasing a Raman signal using the substrates, are described herein.

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.

Abstract: A coated overhead conductor having an assembly including one or more conductive wires, such that the assembly includes an outer surface coated with an electrochemical deposition coating forming an outer layer, wherein the electrochemical deposition coating includes a first metal oxide, such that the first metal oxide is not aluminum oxide. Methods for making the overhead conductor are also provided.

Abstract: An electroplating solution and method for producing an electroplating solution containing a gallium salt, an ionic compound and a solvent that results in a gallium thin film that can be deposited on a substrate.

Abstract: This disclosure provides systems, methods and apparatus for an adhesive metal nitride layer on glass. In one aspect, a glass substrate having a surface is provided. A via with a depth to width aspect ratio of 5 to 1 or greater extends at least partially through the glass substrate. An adhesive metal nitride layer is disposed on the surface of the glass substrate and on one or more interior surfaces of the via. The adhesive metal nitride layer includes at least one of titanium nitride and tantalum nitride.

Abstract: A method for producing a converter module (1) a correspondingly produced converter module are improved by at least part of a structure (3) being produced on a carrier (2) forming a component of the converter module (1) and by a material containing metal being at least partially applied on the carrier (2).

Abstract: Molecularly imprinted conducting polymer (MICP) films were electro-polymerized on glassy carbon electrode having specific recognition sites for amino acid viz. L-tyrosine and/or L-cysteine. The amino acid templates in various imprinted films were ejected out by over-oxidation followed by washing and stabilization. Again, the template leached MICP films were modified with metal oxides [oxides of Cu2+, Hg2+, Pd2+, Au3+, Pt4+ etc]. The resultant leached MICP and metal oxide modified template leached MICP film based GCE will now selectively sense L-tyrosine and/or L-cysteine in aqueous media by direct and catalytic means respectively employing differential pulse voltammetric waveform. The sensitivity and selectivity of the sensors prepared by the invention are high and the stability is good, which will be widely used in clinical diagnostics, chemical industry, environment protection and other related fields.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.

Abstract: An anode (30) is formed by building a carbon, such as a carbon reinforced carbon composite, or other ceramic substrate (50). A ductile, refractory metal is electroplated on the ceramic substrate to form a refractory metal carbide layer (52) and a ductile refractory metal layer (54), at least on a focal track portion (36). A high-Z refractory metal is vacuum plasma sprayed on the ductile refractory metal layer to forma vacuum plasma sprayed high-Z refractory metal layer (56), at least on the focal track portion.

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: A method for shrinking a linewidth on a substrate includes the steps of applying a stretching force on the substrate, defining a line on a top surface of the substrate and releasing the applied stretching force. The applied force is executed by mechanical stretching or thermal expansion and has a direction parallel to the line.

Abstract: A glass-flake loaded organic sealant system is useful for sealing active layers such as those in electronic devices and solar cells.

Abstract: Provided is a chip electronic device that has an increased reliability with a small size. A chip electronic component has a main body made of a ceramic having an internal electrode therein. Provided on the main body is an external electrode that is made of a first electrode layer on the main body, a conductive protective layer on the first electrode layer, and a second electrode layer on the conductive protective layer formed by electrolytic plating. The conductive protective layer prevents hydrogen from diffusing into the main body during the electrolytic plating.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.

Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:

Abstract: A composite oxygen transport membrane having a dense layer, a porous support layer and an intermediate porous layer located between the dense layer and the porous support layer. Both the dense layer and the intermediate porous layer are formed from an ionic conductive material to conduct oxygen ions and an electrically conductive material to conduct electrons. The porous support layer has a high permeability, high porosity, and a high average pore diameter and the intermediate porous layer has a lower permeability and lower pore diameter than the porous support layer. Catalyst particles selected to promote oxidation of a combustible substance are located in the intermediate porous layer and in the porous support adjacent to the intermediate porous layer. The catalyst particles can be formed by wicking a solution of catalyst precursors through the porous support toward the intermediate porous layer.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: The present invention relates to a method of producing an electrodeposited metal oxide coating for a supercapacitor electrode. The present invention relates to the chronoamperometric electrodeposition of the metal oxide over a period from a few seconds, up to about 30 seconds leading to superior performance as a result of an increased surface area of the deposit. According to the present invention, the capacitances achieved are typically greater than 1300 F/g, and in some instances, over 4000 F/g.

Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.

Abstract: A ceramic plate with reflective film and method of manufacturing the same are provided. The ceramic plate with reflective film at least comprises a ceramic substrate and a reflective film. The reflective film at least includes a glass layer and a metal film with metal crystals. Each of the metal crystals possesses a particular diameter for providing high infrared reflectivity with a particular wavelength.

Abstract: Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.

Abstract: A method of fabricating a membrane having a tapered pore, a polymeric membrane having a tapered pore, and uses of such polymeric membrane are disclosed. The membrane includes apertures of increasing diameter which are aligned with each other to form the tapered pore.

Abstract: A method of making colloidal sphere templates and the sphere-templated porous materials made from the templates. The templated porous materials or thin films comprise micron and submicron-scaled spheres in ordered, disordered, or partially ordered arrays. The invention is useful in the synthesis of submicron porous, metallic tin-based and other high capacity anode materials with controlled pore structures for application in rechargeable lithium-ion batteries. The expected benefits of the resulting nanostructured metal films include a large increase in lithium storage capacity, rate capability, and improved stability with electrochemical cycling.

Abstract: A process for fabricating oleophobic surface coatings to be deposited on a metal surface, such as the front-face or aperture plate of piezoelectric print heads and transfix rolls. The surface coatings are applied to the surface by electrochemical polymerization.

Abstract: The invention relates to an inlaid ceramic decoration (10) including a ceramic body (11) that has at least one recess (12) forming the pattern for a decoration (13). According to the invention, said at least one recess is entirely filled by first and second electrically conductive layers (14, 15) of approximately 50 nm and a metallic galvanic plating (16) so as to form a ceramic element (10) inlaid with at least one metallic decoration (13) with improved visual rendering. The invention also relates to the method of manufacturing the inlaid ceramic element. The invention concerns the field of decorated ceramic parts.

Abstract: The present invention relates to the production of an adaptive deformable mirror for compensation of defects of a wavefront.

Abstract: Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.

Abstract: An electrode for lead-battery comprises a current collector covered by an active layer of lead-containing paste. The current is formed by a glassy carbon substrate on which is deposited an intermediate layer. The glassy carbon substrate has preferably a thickness comprised between 1 mm and 3 mm whereas the thickness of the intermediate layer is advantageously comprised between 50 ?m and 200 ?m. In a particular embodiment, the glassy carbon substrate is in form of a comb.

Abstract: A structure and method for forming a relatively thin diffusion barrier/seed bilayer for copper metallization in an electronic device is disclosed. A single layer of an alloy is formed over a dielectric (and possibly the copper layer). The alloy includes a copper platable metal (e.g., ruthenium) and a nitride forming material (e.g., tungsten) and nitrogen. The alloy layer is annealed, and the alloy naturally segregates into two layers. The first layer is a barrier layer including the nitride forming material and nitrogen. The second layer is a seed layer including the copper platable metal.

Abstract: Surface metallization technology for ceramic substrates is disclosed herein. It makes use of a known phenomenon that many metal-metal oxide alloys in liquid state readily wet an oxide ceramic surface and strongly bond to it upon solidification. To achieve high adhesion strength of a metallization to ceramic, a discrete metallization layer consisting of metal droplets bonded to ceramic surface using metal-metal oxide bonding process is produced first. Next, a continuous metal layer is deposited on top of the discrete layer and bonded to it using a sintering process. As a result a strongly adhering, glass-free metallization layer directly bonded to ceramic surface is produced. In particular, the process can be successfully used to metallize aluminum nitride ceramic with high thermal and electrical conductivity copper metal.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.

Abstract: A chip-type antenna for receiving FM broadcasting signal includes a ceramic substrate, a ferrite layer formed on a top surface of the ceramic substrate, and a radiation structure. The ceramic substrate and the ferrite layer form an antenna substrate. The radiation structure is formed on the antenna substrate. The chip-type antenna for receiving FM broadcasting signal utilizes the high dielectric constant of the ceramic substrate and the electric characteristic of the ferrite layer to reduce the dimension of the antenna.

Abstract: An electrochemical method for manufacturing a lithium phosphate (Li3PO4) thin film includes preparing an electroplating solution and forming the lithium phosphate thin film on a conductive substrate under suitable conditions. The electroplating bath includes about 10?2 M to about 10?1 M lithium ion and about 10?2 M to about 1 M monohydrogen phosphate ion (HPO42?) or dihydrogen phosphate ion (H2PO4?).

Abstract: A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.

Abstract: Embodiments include electronic device substrates and methods for forming the same. A method for forming a package comprising a multilayer substrate includes forming a stack of a plurality of dielectric layers comprising a ceramic material, the stack including upper and lower dielectric layers. The method also includes providing a plurality of metallization lines on the dielectric layers in the stack. The method also includes forming a plurality of vias in the dielectric layers, the vias formed to include electrically conductive material therein. A first metal layer is formed on the upper dielectric layer, and a second metal layer is formed on the lower dielectric layer. The first metal layer and the second metal layer are each formed to be at least 250 ?m thick. Other embodiments are described and claimed.