Contacting Substrate With Solid Member Or Material (e.g., Polishing, Rolling, Etc.) Patents (Class 205/206)
  • Patent number: 7317388
    Abstract: A position detection system for measuring a position of a mobile object traveling throughout a controlled area, the position detection system includes a tag, which is provided on the mobile object, a detector, which obtains object position information which indicates the position of the mobile object, object position information includes direction information and distance information relative to the detector of the mobile object, and the detector travels throughout the controlled area, and a base station which obtains detector position information which indicates the position of the detector, detector position information includes an absolute position and angle within the controlled area of the detector, in order to measure the position within the controlled area of the mobile object based on object position information and detector position information.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: January 8, 2008
    Assignee: Honda Motor Co., Ltd.
    Inventors: Koji Kawabe, Satoki Matsumoto
  • Patent number: 7201830
    Abstract: The invention concerns an anode for gas evolution in electrochemical applications comprising a titanium or other valve metal substrate characterized by a surface with a low average roughness, having a profile typical of a localized attack on the crystal grain boundary. The invention further describes a method for preparing the anodic substrate of the invention comprising a controlled etching in a sulfuric acid solution.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: April 10, 2007
    Assignee: De Nora Elletrodi S.p.A.
    Inventors: Corrado Mojana, Ulderico Nevosi
  • Patent number: 7094327
    Abstract: The invention relates to a composition for treating magnesium alloys aimed at improving the resistance thereof to corrosion. The composition is an aqueous solution with a pH ranging between 7 and 10, containing a niobium salt, hydrofluoric acid, and optionally a zirconium salt, phosphoric acid, and boric acid. The alloy is treated in an electrochemical cell in which said alloy acts as an anode. The cell contains an inventive composition at a temperature between 20° C. and 40° C. as an electrolyte. An initial voltage which is sufficient to create a current density between 1.5 and 2.5 A/dm2 is applied to the cell, whereupon the voltage is progressively increased to a level ranging between 240 and 330 V in order to maintain the initial current density.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: August 22, 2006
    Assignee: Univeriste Pierre et Marie Curie
    Inventors: Hélène Ardelean, Philippe Marcus
  • Patent number: 7074314
    Abstract: The present invention provides a liquid repellent member applied to ink jet, comprising a carbon substrate, and a liquid repellent film formed on a surface of the carbon substrate and formed by bonding between carbon and fluorine.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: July 11, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masataka Eida, Kazuo Iwata, Toshinori Hasegawa
  • Patent number: 7008522
    Abstract: A method of locally repairing parts coated with a thermal barrier including a ceramic outer layer and a metal underlayer of alumina-forming alloy for protecting the substrate against oxidation and for bonding with the ceramic outer layer, includes: defining the zone for repair with a mechanical mask adapted to the shape of the part and the zone for repair; scouring the zone for repair so as to remove the ceramic, the alumina layer, and the damaged portions of the underlayer; supplying materials for repairing the underlayer to the repair zone by subjecting the partially-scoured part to metal deposition by use of an electrical current; and subjecting the part to a heat treatment in order to enable the added metals to diffuse into the remaining underlayer in the repair zone for repair and to enable a surface film of alumina to form. After the underlayer has been reconstituted, the zone for repair is again defined by a mechanical mask and a new ceramic layer is deposited thereon.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: March 7, 2006
    Assignee: Snecma Moteurs-Snecma Services
    Inventors: Bruno Gilles François Boucard, Jean-Paul Fournes, Frédéric Yves Pierre Jacquot, Yann Philippe Jaslier, Jacques Louis Leger, André Hubert Louis Malie, Guillaume Roger Pierre Oberlaender, Catherine Marie-Hélène Richin
  • Patent number: 6997787
    Abstract: A cutting tool having a hard tip is pressed with a uniform pressure against a surface of a vehicle wheel as the wheel is rotated to smooth and seal the surface. The smoothed and sealed wheel surface is then chrome plated with a process that includes applying a nickel layer directly upon smoothed and sealed wheel surface and a chromium layer over the nickel layer.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: February 14, 2006
    Assignee: Hayes Lemmerz International, Inc.
    Inventors: Geoffrey L. Gatton, Lou Grenier, Peter Yee
  • Patent number: 6932896
    Abstract: Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: August 23, 2005
    Assignee: Nutool, Inc.
    Inventors: Bulent M. Basol, Cyprian Uzoh, Homayoun Talieh
  • Patent number: 6911137
    Abstract: Method for the electrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in that the flow of the electrolyte is influenced by holding a body between the strip and the anode. A device for the electrolytic coating of a metal strip is also enclosed.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: June 28, 2005
    Assignee: Corus Technology BV
    Inventor: Dammes Hans Van Der Weijde
  • Patent number: 6833025
    Abstract: Coating composition comprising mineral pigment, for creating a matt or silk coated paper with decreased ink scuff tendency. The coating composition also comprises organic particles, which particles in an amount of 0.5-9.5 weight-% calculated on said mineral pigment, exhibit a particle size of more than 2 &mgr;m and at the most 50 &mgr;m. The invention also relates to a paper which is coated with said coating composition.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: December 21, 2004
    Assignee: Stora Enso Aktiebolag
    Inventors: Philip Håkansson, Kilian Kleinhenz, Karen Sjölin, Göran Ström, Bengt Haugwitz, Annette Forssten
  • Publication number: 20040245089
    Abstract: The present invention presents a method of roughening one or more exposed surfaces on a processing element in order to improve the adhesion of materials on these surfaces during processing. The roughening procedure comprises the application of a belt sanding technique to these one or more exposed surfaces to produce an average surface roughness in excess of Ra=250 mil.
    Type: Application
    Filed: June 4, 2003
    Publication date: December 9, 2004
    Inventor: John Lawson
  • Publication number: 20040188268
    Abstract: A manufacturing procedure of a hand tool includes the steps of: forging the workpiece, annealing the workpiece, rolling the workpiece in a barrel, performing a first surface treatment, machining the surface of the workpiece, performing a heat treatment on the workpiece, performing a second surface treatment, performing a third surface treatment, vibrating the workpiece, and electroplating the workpiece. Thus, the whole surface of the hand tool has the same color and brightness, thereby enhancing the aesthetic quality of the hand tool.
    Type: Application
    Filed: March 29, 2003
    Publication date: September 30, 2004
    Inventor: Chih-Ching Hsien
  • Publication number: 20040170858
    Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200° C.
    Type: Application
    Filed: January 14, 2004
    Publication date: September 2, 2004
    Inventors: Akitoshi Takanashi, Kenichiro Iwakiri, Akiko Sugimoto, Junshi Yoshioka, Shinichi Obata, Makoto Dobashi
  • Patent number: 6612915
    Abstract: A work piece carrier head can carry a semiconductor wafer during both plating and polishing operations. The carrier head includes a first component secured to a shaft by which the carrier head can be rotated, translated, and moved up and down, a second component connected to the first component and movable by fluid pressure relative to the first component between retracted and extended positions, and a third component connected to the first and second components for up and down movement between wafer loading or unloading and wafer plating or polishing positions. The third carrier head component includes a contact element by which electrical contact with the wafer is provided to permit wafer plating.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: September 2, 2003
    Assignee: NuTool Inc.
    Inventors: Cyprian Uzoh, Boguslaw Andrzej Nagorski, Konstantin Volodarsky, Douglas W. Young
  • Patent number: 6610417
    Abstract: The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: August 26, 2003
    Assignee: Oak-Mitsui, Inc.
    Inventors: John A. Andresakis, Edward Skorupski, Wendy Herrick, Michael D. Woodry
  • Publication number: 20030116441
    Abstract: From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which adversely affect its balance and cause impedance and vibration of the propeller and its boat in the water. Ant-fouling paints are either too toxic for the marine environment of lack smoothness on the surface. These problems have been overcome by a combination of known steps, namely, polishing the propeller to prepare it for electroplating, cleansing to remove all traces of dirt and grease, electroplating with copper to a depth of at least 0.005″ or 0.15 mm, followed by spraying with a standard solution (5%) of sodium hypochlorite and sodium chloride in a suitable container to form a firmly adhering conversion coating of basic cupric chloride and then sealing for at least twenty-four hours.
    Type: Application
    Filed: January 30, 2003
    Publication date: June 26, 2003
    Inventor: Ronald Kempin
  • Patent number: 6582579
    Abstract: The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the cavities while removing residual portions from the field regions of the substrate. Another method according to the present invention includes forming a uniform conductive material overburden on a top surface of the substrate. The present invention also discloses a method for depositing a second conductive material on the first conductive material of the substrate.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: June 24, 2003
    Assignee: NuTool, Inc.
    Inventor: Cyprian Uzoh
  • Publication number: 20030098241
    Abstract: A process for selectively forming a metal barrier layer on a surface of an interconnect of a wiring substrate comprising the steps of abrading the substrate and simultaneously feeding onto the substrate a plating solution having said metal dissolved therein. The abrading step comprises contacting the substrate against an abrasive surface and causing relative linear and/or rotary motion between the abrasive surface and the substrate while the substrate is in contact with the abrasive surface. Growth of the metal barrier layer on a portion of the wiring substrate other than the interconnect layer is suppressed and the metal barrier layer thus formed is thinner, exhibits improved uniformity and superior prevention against Cu diffusion.
    Type: Application
    Filed: November 20, 2002
    Publication date: May 29, 2003
    Inventors: Yoshio Homma, Noriyuki Sakuma, Hiroshi Nakano, Takeyuki Itabashi, Haruo Akahoshi
  • Patent number: 6551760
    Abstract: A lithographic printing plate having an average curvature in a rolling direction of 1.5×10−3 mm−1 or less, a curvature distribution in a crosswise direction of 1.5×10−3 mm−1 or less, and a curvature in a direction perpendicular to said rolling direction of 1.0×10−3 mm−1 or less and a method for producing the printing plate are disclosed. A method for producing a support for a lithographic printing plate is also disclosed, which comprises roughening a surface of an aluminum web having a center line average surface roughness of 0.15 to 0.35 &mgr;m and a maximum surface roughness of 1 to 3.5 &mgr;m by at least one of mechanical surface roughening, chemical etching and electrochemical surface roughening, and then applying anodization thereto.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: April 22, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Akio Uesugi, Masahiro Endo
  • Patent number: 6540901
    Abstract: The present invention provides a process for the manufacture of a substrate for use in the production of lithographic printing plates, the process comprising the steps of: (a) providing an aluminum substrate; (b) graining at least one surface of the substrate; (c) applying an anodic layer to the at least one grained surface; (d) treating the at least one grained and anodized surface with an aqueous solution comprising at least one salt of a metal from Group IB, IIB, IVA, IVB, VB, VIA, VIB, VIIB or VIII of the Periodic Table; and (e) treating the at least one treated surface with an aqueous solution comprising at least one orthophosphate salt of an alkali metal.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: April 1, 2003
    Assignee: AGFA-Gevaert
    Inventors: Felton Rudolph Mayers, Tu Vinh Chau
  • Patent number: 6533917
    Abstract: Disclosed are a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate in sequence to (1) a surface roughening treatment, (2) a heat treatment, (3) a treatment of dissolving from 0.01 to 5 g/m2 of said aluminum plate, and then (4) an anodization treatment; a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate to an electrochemical surface roughening treatment both before and after an electrolytic treatment in an aqueous neutral salt solution using the aluminum plate as a cathode.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: March 18, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Akio Uesugi
  • Patent number: 6521114
    Abstract: From the time that they are immersed into a marine environment, bronze propellers are prone to attack by marine organisms, such as barnacles, coral and algae, which attach themselves to the bronze metallic surface, creating lumps on the propeller, which adversely affect its balance and cause impedance and vibration of the propeller and its boat in the water. Anti-fouling paints are either too toxic for the marine environment or lack smoothness on the surface. These problems have been overcome by polishing the propeller to prepare it for electroplating, cleansing to remove dirt and grease, electroplating with copper, followed by spraying with a standard solution (5%) of sodium hypochlorite and sodium chloride and allowing sufficient time for a reaction of the hypochlorite solution with the copper to form a firmly adhering conversion coating of basic cupric chloride. The coating is blue-green in color.
    Type: Grant
    Filed: May 11, 1999
    Date of Patent: February 18, 2003
    Assignee: Propeller Antifouling Pty Ltd.
    Inventor: Ronald Kempin
  • Publication number: 20030029729
    Abstract: A method of forming a solid inter-layer conductive rod. A printed circuit board comprising an insulating core layer, a first conductive layer and a second conductive layer is provided. The insulating core layer is sandwiched between the first conductive layer and the second conductive layer. A first opening that exposes a portion of the insulating core layer is formed in the first conductive layer. The exposed insulating core layer is removed by laser drilling to form a second opening that exposes a portion of the second conductive layer. An electroplating process is conducted using the second conductive layer as a negative electrode so that conductive material solidly fills the first opening and the second opening to form a solid conductive rod.
    Type: Application
    Filed: August 10, 2001
    Publication date: February 13, 2003
    Inventors: Jao-Chin Cheng, Chang-Chin Hsieh, Chih-Peng Fan, Chih-Hao Yeh
  • Patent number: 6475646
    Abstract: A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m2, which impede a wire bonding property or solder wettability of the lead frame.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: November 5, 2002
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Se-chul Park, Dong-il Shin, Sung-il Kang, Sang-hoon Lee, Bae-soon Jang
  • Patent number: 6475565
    Abstract: The invention relates to a process for producing a clothing wire which is suitable for fitting to an opening-cylinder base body, wherein a raw wire which is customarily used to produce clothing wire is processed on end to form a wire coil, in which the teeth of the wire are perpendicular to the coil axis and which has a diameter which corresponds to the diameter of the opening-cylinder base body or differs by at most ±5% from the diameter of the opening-cylinder base body, and the wire coil is pushed loosely onto a support device and, together with this device, is introduced into an electroplating unit, the process steps which are customarily used for the chemical deburring of a raw wire and the nickel-diamond coating of a clothed opening cylinder taking place in the electroplating unit, and the clothing wire being removed from the electroplating unit.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: November 5, 2002
    Assignee: Elektroschmelzwerk Kempten GmbH
    Inventors: Jörg Lukschandel, Manfred Menge, Jürgen Meyer
  • Publication number: 20020139681
    Abstract: A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cathode (45) without use of any liquid materials; passing electrical current through a contacting applicator (46) which contains a metal electrolyte solution; passing the current from the applicator (46) to the cathode (45) and contacting the interconnect (26) with the applicator (46) and coating all of the exposed interconnect surface.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 3, 2002
    Applicant: Siemens Westinghouse Power Corporation
    Inventor: Jeffrey William Long
  • Publication number: 20020056648
    Abstract: A process for producing an aluminum support for a planographic printing plate, the process comprising the steps of: (a) preparing an aluminum plate; (b) disposing said aluminum plate in an aqueous acidic solution; and (c) electrochemically surface-roughening said aluminum plate using an alternating current, wherein a ratio QC/QA of a cathode-time quantity of electricity of said aluminum plate QC to an anode-time quantity of electricity of said aluminum plate QA is from 0.95 to 2.5. An aluminum support for a planographic printing plate formed by the process. A planographic printing master plate comprising at least a positive-type or negative-type light-sensitive layer on the aluminum support.
    Type: Application
    Filed: September 14, 2001
    Publication date: May 16, 2002
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Hirokazu Sawada, Akio Uesugi, Atsuo Nishino, Yoshitaka Masuda
  • Patent number: 6365030
    Abstract: A method of manufacturing R—Fe—B bonded magnets, capable of forming various corrosion resisting films on a R—Fe—B bonded magnet uniformly with a very high bonded strength so as to attain such a very high corrosion resistance thereof that prevents the bonded magnet from being rusted even in a long-period high-temperature high-humidity test; comprising barrel-polishing a porous R—Fe—B bonded magnet by a dry method using as media an abrasive stone formed by sintering inorganic powder of Al2O3, SiC, ZrO and MgO, or a mixture of an abrasive for metal balls and vegetable media, such as vegetable skin chips, sawdust, rind of a fruit and a core of corn, or a mixture of vegetable media the surfaces of which are modified by the above-mentioned abrasive and the above-mentioned inorganic pulverized bodies, so as to enable a surface of the magnet to be smoothed and sealed.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: April 2, 2002
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Kohshi Yoshimura, Fumiaki Kikui, Takeshi Nishiuchi
  • Publication number: 20020033342
    Abstract: The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed layer from a top surface of a substrate and then depositing a conductive material in the cavities of the substrate, where portions of the seed layer remains in the cavities. Another method includes forming an oxide layer on the top surface of the substrate such that the conductive material can be deposited in the cavities without the material being formed on the top surface of the substrate. The present invention also discloses methods for forming multi-level interconnects and the corresponding structures.
    Type: Application
    Filed: July 13, 2001
    Publication date: March 21, 2002
    Inventors: Cyprian Emeka Uzoh, Homayoun Talieh, Bulent Basol
  • Patent number: 6358566
    Abstract: A process of producing an aluminum beverage can body having a decorative surface exhibiting a dichroic effect when observed in white light. In the process, a can body is formed from a sheet of metal selected from aluminum and aluminum alloy by drawing and ironing, surfaces of the can body are cleaned to produce a cleaned can body, a decorative structure exhibiting a dichroic effect is applied to a surface of the cleaned can body, and the can body is subjected to finishing operations. The decorative structure is applied by the steps of: applying a layer of dielectric material directly onto the metal of the cleaned can body without pre-treatment of the metal with a metal brightener, and forming a semi-transparent metal layer on or within the dielectric layer.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: March 19, 2002
    Assignee: Alcan International Limited
    Inventor: Aron Marcus Rosenfeld
  • Patent number: 6355154
    Abstract: The present invention relates to am article plated with boron carabide in a nickel-phosphorus matrix, obtained by a plating process comprising the following steps: a) preparation of an electrolytic bath comprising two or more nickel salts, at least one complexing agent, at least one phosphorus salt, and, in addition, an anti-tensioning agent and boron carbide in the form of powder; b) electroplating of the article in the electrolytic bath at a temperature ranging from 40° C. to 70° C., with a current density ranging from 1 to 10 A/dm2; and c) heat treatment of the product thus plated. The plating is used for any article that requires a type of plating which presents high resistance to wear, and in particular for cylinders for the production of corrugated cardboard.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: March 12, 2002
    Assignee: SBR S.r.l.
    Inventor: Angelo Buratti
  • Publication number: 20020020629
    Abstract: A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m2, which impede a wire bonding property or solder wettability of the lead frame.
    Type: Application
    Filed: December 8, 2000
    Publication date: February 21, 2002
    Applicant: Samsung Techwin Co., Ltd.
    Inventors: Se-Chul Park, Dong-Il Shin, Sung-Il Kang, Sang-Hoon Lee, Bae-Soon Jang
  • Patent number: 6342145
    Abstract: Methods of producing aluminum picture frames having two regions of different colors. Aluminum frame stock is coated with a colored maskant or paint. Selective regions of the coated frame stock are abraded, and then anodized and dyed a second color absorbed by the exposed regions. In a second embodiment, aluminum frame stock is etched, anodized, and dyed a first color. The frame stock is then selectively abraded to remove regions of the first color, and then anodized and dyed a second color so the abraded regions absorb the second color. In a third embodiment, the frame stock is first etched, anodized, and dyed a first color. Selective areas of the frame stock are protected using an etch-resistant mask and is then etched stripping the unmasked regions of the first color and then anodized again and dyed a second color absorbed by the unmasked regions. The mask is then chemically removed.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: January 29, 2002
    Assignee: Nielsen & Bainbridge LLC
    Inventors: Vazgen Houssian, Ralph Jones, Ron Berhardt, David Wellings Pointon
  • Patent number: 6328872
    Abstract: The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conductive material and another chamber can be used for polishing the semiconductor substrate. The plating/depositing process can be performed using brush plating or electro chemical mechanical deposition and the polishing process can be performed using electropolishing or chemical mechanical polishing. The present invention further provides a method and apparatus for intermittently applying the conductive material to the semiconductor substrate and also intermittently polishing the substrate when such conductive material is not being applied to the substrate.
    Type: Grant
    Filed: April 3, 1999
    Date of Patent: December 11, 2001
    Assignee: Nutool, Inc.
    Inventors: Homayoun Talieh, Cyprian Emeka Uzoh
  • Patent number: 6319556
    Abstract: A reflector plate is provided for scattering radiant heat energy in a semiconductor processing reactor chamber to achieve uniform temperature across a substrate to be processed. The surface is characterized by a plurality of adjoining depressions with substantially no planar sections among the depressions. The width to depth ratio for the depressions averages over 3:1. Crests separating the depressions define an angle of greater than about 60°, thus providing a relatively smooth texture for the reflecting surface. The reflecting surface is thus easy to clean. A method of manufacturing the reflector plate comprises removing material from a planar metal surface by ball-end milling. The depth of each depression and degree of overlap with adjacent depressions can randomly vary within selected ranges. A highly specular finish is then provided on the stippled surface by gold electroplating.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: November 20, 2001
    Assignee: Micron Technology Inc.
    Inventors: Aage Olsen, Michael W. Halpin
  • Publication number: 20010038908
    Abstract: A substrate for a planographic printing plate and a method of fabrication thereof. After a surface roughening treatment and before an anodizing treatment, an aluminum alloy plate to be used as the substrate is washed in an alkali solution, and then in an acidic solution. After surface-roughening, overlap points of Fe and Si macularly distributed at the surface of the aluminum alloy plate have a surface coverage of not more than 0.5%, and there are no more than 800 per 1 mm2 of overlap points which have sizes larger than 1.6×10−7 mm2. The planographic printing plate of the present invention has excellent printing capabilities in that, irrespective of printing conditions, soiling does not occur at a non-image portion of the planographic printing plate.
    Type: Application
    Filed: March 9, 2001
    Publication date: November 8, 2001
    Inventors: Masaya Matsuki, Yoshinori Hotta, Hirokazu Sawada, Akio Uesugi
  • Patent number: 6306274
    Abstract: Disclosed are an apparatus and method for making both coarse-sided electrodeposition blades for cutting, for instance, semiconductor wafers. The apparatus comprises at least an electrolyte bath containing an electrodeposition object and pulverized grindstone in the electrolyte, an electrolytic metal immersed in the electrolyte, and an electric source whose positive and negative terminals are connected to the electrolytic metal and electrodeposition object, and the surface of the electrodeposition object, on which a required electro-deposit is to be formed, is of a predetermined coarseness.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: October 23, 2001
    Assignee: Disco Corporation
    Inventor: Keiichi Kajiyama
  • Publication number: 20010013472
    Abstract: A method of plating for filling via holes, in which each via hole formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate, is plated with copper, to be filled with the plated metal, the method comprising the steps of forming a copper film on the top surface of the insulation layer covering the substrate, and the side walls and bottoms of the respective via holes, immersing the substrate having the copper film formed in an aqueous solution containing a plating promoter to thereby deposit the plating promoter on the surface of the copper film, removing the plating promoter from the surface of the copper film located on the insulation layer and leaving the plating promoter on the side walls and bottoms of the respective via holes, and subsequently electroplating the substrate having the copper film formed with copper to thereby fill the via holes with the plated copper and simultaneously form a continuous copper film which eventually c
    Type: Application
    Filed: January 30, 2001
    Publication date: August 16, 2001
    Inventors: Kenji Nakamura, Masao Nakazawa
  • Patent number: 6261436
    Abstract: A gold bonding wire fabrication method, which includes the steps of (a) drawing a non-gold wire rod, for example, a pure silver wire rod or pure palladium wire rod into a core wire of thickness within about 1 &mgr;m˜500 &mgr;m, (b) electroplating the core wire with a layer of gold plating of thickness within about 0.025 &mgr;m˜25 &mgr;m.
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: July 17, 2001
    Assignee: ASEP TEC Co., Ltd.
    Inventor: Tao-Kuang Chang
  • Patent number: 6242111
    Abstract: Disclosed is a method of making an anodized aluminum susceptor capable of withstanding an elevated temperature of 590° C., or a temperature as high as 475° C. in the presence of an NF3 plasma, without peeling or cracking, which preferably comprises selecting a high purity or low magnesium aluminum alloy, roughening the surface of the alloy, and then anodizing the surface roughened alloy in an electrolyte comprising an organic acid to form the desired anodized aluminum oxide coating thereon. Further, the invention comprises a high purity or low magnesium aluminum alloy susceptor and an organic acid anodic coating thereon highly resistant to spalling or cracking at elevated temperatures.
    Type: Grant
    Filed: September 8, 1993
    Date of Patent: June 5, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Susan G. Telford, Craig Bercaw
  • Patent number: 6231619
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then dried by passing the substrates between opposing resilient rollers and preferably passed an air knife.
    Type: Grant
    Filed: December 11, 1995
    Date of Patent: May 15, 2001
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Patent number: 6231744
    Abstract: An array of nanowires having a relativley constant diameter and techniques and apparatus for fabrication thereof are described. In one embodiment, a technique for melting a material under vacuum and followed by pressure injection of the molten material into the pores of a porous substrate produces continuous nanowires. In another embodiment, a technique to systematically change the channel diameter and channel packing density of an anodic alumina substrate includes the steps of anodizing an aluminum substrate with an electrolyte to provide an anodic aluminum oxide film having a pore with a wall surface composition which is different than aluminum oxide and etching the pore wall surface with an acid to affect at least one of the surface properties of the pore wall and the pore wall composition.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: May 15, 2001
    Assignee: Massachusetts Institute of Technology
    Inventors: Jackie Y. Ying, Zhibo Zhang, Lei Zhang, Mildred S. Dresselhaus
  • Patent number: 6187461
    Abstract: A cobalt-chromium (Co-Cr) magnetic film electrodeposited on the surface of an aluminum alloy. A process for making an aluminum alloy electrodeposited a cobalt-chromium (Co-Cr) magnetic film comprises the steps of chemically polishing an aluminum alloy substrate, pretreating either with phosphate or with zincate and electrodepositing in a plating bath containing cobalt and chromium ions to prepare the cobalt-chromium thin film on the aluminum alloy. Chromium content in the film can be designed by adjusting the parameters of pretreatment and electroplating. The produced cobalt-chromium film can flexibly adjust the magnetic characteristics (e.g. coercive force (Hc) and ramanence magnetization (Mr)) and is suitable for use in a magnetic recorder. The chemical composition, adhesion, microhardness, magnetic properties of the deposits indicate that the Co-Cr films produced are satisfactory for magnetic recording service.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: February 13, 2001
    Assignee: National Science Council
    Inventors: Jing-Chie Lin, Jiann-Gow Her, Shyh-Biau Jiang, Chiang-Nan Chang, Jyh-Rurng Your
  • Patent number: 6180171
    Abstract: A plated product and apparatus for forming recesses or grooves on material to be plated to produce such a product. The product includes material having a surface having many recesses, each having an opening of size d, where d is in the range 5-100 microns, a depth in the range from 0.2 d to d, or many grooves. In preferred embodiments, each groove or recess has an anchor portion. In some embodiments, each groove has a ridge portion at each of both edges of its opening. The angle of each groove to the surface of the material and each groove's depth and opening width are preferably in specified ranges. When the material is plated, part of the thin metal film enters the anchor portions of its grooves or recesses, so that the plated metal has superior capacity to resist peeling off of the plated metal.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: January 30, 2001
    Assignee: Sintokogio, Ltd.
    Inventors: Kunio Ota, Hitoshi Rokutanda, Hiroaki Suzuki, Shinobu Kato, Seietsu Abe
  • Patent number: 6139713
    Abstract: A plurality of recesses having the same interval and array as those of pores of an alumina film, which are to be formed in anodizing, are formed on a smooth surface of an aluminum plate in advance, and then, the aluminum plate is anodized. With this process, the roundness of the pores of the porous anodized alumina film and the uniformity of pore size are improved, and the pores are regularly arrayed at a predetermined interval. The recesses are formed by pressing a substrate having a plurality of projections on its surface against the aluminum plate surface to be anodized.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: October 31, 2000
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Hideki Masuda, Masashi Nakao, Toshiaki Tamamura
  • Patent number: 6127050
    Abstract: An archival medium, such as a compact disc, is made of a metal such as aluminum which is mechanically gained with particulate material under conditions that embed particulate material into the surface of the medium and visibly imageable by selective exposure to infrared laser radiation. A mechanically grained aluminum medium can also be anodically oxidized under conditions that do not impair the ability of the substrate to be laser imaged. The archival medium can be coated with opaque and transparent polymer coatings before or after imaging for security and/or protection. The coating can be a laser ablatable coating to provide a tamper-proof medium.
    Type: Grant
    Filed: May 15, 1998
    Date of Patent: October 3, 2000
    Inventors: Howard A. Fromson, William J. Rozell
  • Patent number: 6106689
    Abstract: A process for forming a zinc oxide film including immersing an electroconductive substrate having a surface including a plurality of linear projections in an aqueous solution containing at least nitrate ions and zinc ions to form a zinc oxide film on the electroconductive substrate by a liquid-phase deposition. The plurality of linear projections may preferably provide an uneven surface which has a center-line average surface roughness Ra(X) of 15-300 nm when scanned in a direction parallel to the linear projections, a center line average surface roughness Ra(Y) of 20-600 nm when scanned in a direction perpendicular to the linear projections, and an Ra(X)/Ra(Y) ratio of at most 0.8. The thus formed zinc oxide film is provided with an uneven surface suitable for an optical-confinement layer of a photo-electricity generating device excellent in photoelectric performances.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: August 22, 2000
    Assignee: Canon Kabushiki Kaisha
    Inventor: Jinsho Matsuyama
  • Patent number: 6063253
    Abstract: A method for electroplating of a substrate traveling in a substrate direction. The method comprises directing a first fluid stream and a second fluid stream respectively across the first and second width portions of the substrate. The first and second fluid streams do not flow substantially cocurrently with nor countercurrently to the substrate direction.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: May 16, 2000
    Assignee: 3M Innovative Properties Company
    Inventors: Gary A. Shreve, Alan G. Hulme-Lowe, Guglielmo M. Izzi
  • Patent number: 6039860
    Abstract: A method for chromium plating a part made of titanium or titanium alloy eliminates the conventional chemical cleaning of the part prior to electroplating, and instead employs a mechanical cleaning of the part including degreasing the part and then grit-blasting the part with aluminum oxide particles. Immediately following the grit-blasting step, for example within one minute of its completion, the part is connected to the negative terminal of a DC power supply and is then immersed into a bath of chromium plating solution which contains an anode element connected to the positive terminal of the power supply. The part is left in the bath for a period of time so as to deposit a plating of chromium on the surface of the part. For final finishing of the part, a post-plating grinding operation is performed in which the surface speed of the grinding wheel is not greater than about 6500 surface feet per minute and the in-feed rate is less than about 0.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: March 21, 2000
    Assignee: McDonnell Douglas Corporation
    Inventors: Austin M. Cooper, Robert M. Hazencomb, Albert W. Silva, Robert William Wright
  • Patent number: 5935406
    Abstract: An improved process for the manufacture of uniformly and accurately sized metal spheres, particularly copper spheres, which comprises the steps of classifying a starting lot of spheres into closely sized fractions; separately electroplating each size fraction to a desired final mean diameter and size distribution; and then combining the plated fractions to give a metal sphere product having the requisite mean particles size and size distribution. The electroplating build-up step is characterized by a high level of precision. Additional benefits derive from the high hardness of copper electroplate on relatively soft copper starting particles which facilitates grinding or polishing irregularly shaped plated particles down to the desired sphericity and mean diameter, from the ability of metal such as copper electroplate to cover and envelop contaminated surfaces of starting particles, and from the ability to produce spheres having a unique combination of bulk and surface properties.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: August 10, 1999
    Assignee: ThermicEdge Corporation
    Inventors: Karel Hajmrle, Kenneth G. Reid
  • Patent number: 5897761
    Abstract: An electrodeposited copper foil for use in the manufacture of a printed wiring board in which the original profile of the matte surface has been completely removed, preferably by buffing, leaving a surface having linear streaks and a roughness 1.5 .mu.m or less. The new surface is then given a nodule forming treatment which produces a surface roughness of 1.5 to 2.0 .mu.m, which may be followed by a corrosion resisting treatment. This invention further provides a method of manufacturing such an electrodeposited copper foil. Such copper foils are especially useful in making fine circuit patterns.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: April 27, 1999
    Assignee: Mitsui Mining & Smleting Co., Ltd.
    Inventors: Hideyasu Tagusari, Yutaka Hirasawa, Kazuhide Oshima