Etching Of Coating Patents (Class 205/223)
  • Patent number: 9908265
    Abstract: The present invention relates to a method of manufacturing a mold having an oxide film with a plurality of pores formed on a surface of an aluminum substrate, the method including (a) a process of applying a voltage to a machined aluminum substrate and anodizing a surface of the aluminum substrate to form an oxide film; and (b) a process of removing at least a part of the oxide film formed in the process (a), wherein a voltage (Va[V]) immediately before the process (a) is terminated and a time (ta[sec]) required to reach the voltage (Va[V]) after starting the application of voltage satisfy the following Equation (i) in the process (a). 0.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: March 6, 2018
    Assignees: MITSUBISHI CHEMICAL CORPORATION, KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masashi Ikawa, Eiko Okamoto, Hiroshi Onomoto, Jitsuo Hirohata, Yuji Matsubara, Hideki Masuda
  • Publication number: 20150140268
    Abstract: A method for manufacturing a mold includes (a) anodizing an aluminum substrate at a voltage of 60 V to 120 V in an electrolytic solution in which two or more species of acid are mixed, and forming an oxide film having a plurality of minute holes on a surface of the aluminum substrate; and (b) removing at least a portion of the oxide film. The electrolytic solution used in (a) satisfies the relation (D1)/2<D2, where D1 is the current density when the aluminum substrate is anodized under the same conditions as in (a) in an electrolytic solution of only the acid (A) having the highest acid dissociation constant (Ka) of the two or more species of acid, and D2 is the current density when the aluminum substrate is anodized under the same conditions (a) in the same electrolytic solution as that of (a).
    Type: Application
    Filed: May 28, 2013
    Publication date: May 21, 2015
    Inventors: Masashi Ikawa, Eiko Okamoto, Hideki Masuda
  • Patent number: 8999133
    Abstract: An anodized layer formation method includes: providing an aluminum film provided on a support or an aluminum base; and forming a porous alumina layer which has minute recessed portions by applying a voltage between an anode which is electrically coupled to a surface of the aluminum film or the aluminum base and a cathode which is provided in an electrolytic solution with the surface of the aluminum film or the aluminum base being in contact with the electrolytic solution. The forming of the porous alumina layer includes increasing the voltage to a target value and, before the voltage is increased to the target value, increasing the voltage to a first peak value which is lower than the target value and thereafter decreasing the voltage to a value which is lower than the first peak value. As such, an anodized layer with reduced variation of recessed portions can be formed.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: April 7, 2015
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Akinobu Isurugi, Kiyoshi Minoura, Hidekazu Hayashi, Kenichiro Nakamatsu
  • Publication number: 20150017418
    Abstract: A method for fabricating a porous framework includes contacting a substrate with a solution containing a plurality of component materials are dissolved in the solution. A solid composite made of the plurality of component materials is electrodeposited onto the substrate. A plurality of electrodepositing voltages is applied to vary a relative proportion of the component materials in the composite being electrodeposited, and at least one of the plurality of component materials is selectively etched away from the composite to form a plurality of pores.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 15, 2015
    Inventors: Chun Kwan TSANG, Jian LU, Yang Yang LI
  • Publication number: 20140371687
    Abstract: The present invention provides a device including a titania nanotube membrane having a plurality of titania nanotubes on a titanium substrate where the titania nanotubes are open at both ends and capable of allowing diffusion of liquids or solids from one side of the membrane to the other through the titania nanotubes. Methods of making the titania nanotube membrane are also provided.
    Type: Application
    Filed: December 5, 2012
    Publication date: December 18, 2014
    Inventors: Adam D. Mendelsohn, Kathleen E. Fischer, Lily H. Peng, William G. Fischer
  • Publication number: 20140363658
    Abstract: An aluminum alloy, an aluminum alloy resin composite, a method of preparing aluminum alloy, and a method of preparing aluminum alloy-resin composite are provided. The aluminum alloy may comprise: an aluminum alloy substrate; and an oxide layer formed on the surface of the aluminum alloy substrate. The oxide layer comprises an outer surface and an inner surface. The outer surface contains corrosion pores having an average diameter of about 200 nm to about 2000 nm; and the inner surface contains nanopores having an average diameter of about 10 nm to about 100 nm.
    Type: Application
    Filed: August 22, 2014
    Publication date: December 11, 2014
    Inventors: Jian SUN, Juan ZENG, Jun CHENG
  • Publication number: 20140357403
    Abstract: Embodiments of golf club heads and methods to manufacture such a golf club heads are generally described herein. In some embodiments, the golf club head may include a ball-striking face and a protective aluminum oxide layer coupled to the ball-striking face of the golf club head. The protective aluminum oxide layer is associated with a hardness that is greater than that of the ball-striking face. In further embodiments, golf club heads may include a top portion and at least one of a plurality of interchangeable alignment indicia coupled thereto, which are configured to guide the golf club head relative to a golf ball.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 4, 2014
    Inventors: Liang Quan, Anthony D. Serrano
  • Patent number: 8900716
    Abstract: An anodized aluminum product in continuous web or sheet form, which is heat sealed and coated with an antimicrobial composition. The antimicrobial coating can be bound to surface of the anodic layer and can comprise a network of cross-linked organo-silane molecules that are also covalently bound to the surface of the anodic layer. A process also is provided including: forming an anodic layer on the surface of an aluminum substrate; heat sealing the anodic layer; preheating the web or sheet to a range from about 140° F. to about 200° F.; applying an antimicrobial composition at an application rate sufficient for the composition to at least begin binding to the surface of and form an antimicrobial coating over the anodic layer; and post heating the coated anodized antimicrobial web or sheet to a range from about 140° F. to about 200° F. to further bind the composition to the cure the antimicrobial coating.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: December 2, 2014
    Assignee: Lorin Industries, Inc.
    Inventors: Lance W. Hodges, Thomas R. Achterhoff, Kevin H. Darcy, James A. Nalewick
  • Patent number: 8894835
    Abstract: For fast and secure determination of the quality of a metal coating as well as of an electrolyte for depositing a metal, in particular for electrolytic deposition of nickel such as of semi-gloss nickel and bright nickel and for analytical control of the deposition electrolyte, a method of inspecting a metal coating is provided, which involves the following method steps: a) depositing the metal coating from a deposition electrolyte onto a working electrode; b) electrolytically dissolving the metal coating through anodic polarization of the working electrode with respect to a counter electrode, which is in electrolytic contact with the working electrode; c) recording an electrical dissolution potential at the working electrode over time, said potential occurring during a dissolution of the metal coating; and d) determining a time-averaged vale of the dissolution potential.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 25, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Philip Hartmann, Michael Jonat, Mathias Wuensche
  • Patent number: 8881402
    Abstract: A roller for producing optical films is disclosed. The roller includes a cylindrical main body and a micro-structured layer surrounding a circumferential surface of the main body. The microstructure layer includes a number of microstructures on its surface away from the main body. The microstructure layer is made from ethylene tetrafluoroethylene.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: November 11, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chia-Ling Hsu
  • Publication number: 20140300436
    Abstract: A method for plating magnets with metal is disclosed. In one embodiment, the metal is aluminum and the aluminum plating provides a number of aesthetic and structural advantages, over brittle magnetic materials, which are only plated with a thin, anti-corrosive metallic layer. More specifically, methods for creating multi-pole bar magnets and structural elements primarily with aluminum coated magnetic material are disclosed.
    Type: Application
    Filed: April 10, 2014
    Publication date: October 9, 2014
    Applicant: Apple Inc.
    Inventor: Simon Regis Louis Lancaster-Larocque
  • Publication number: 20140277318
    Abstract: The present invention generally relates to coated electrodes comprising an electrically conductive substrate and a polymeric coating, and to methods for the preparation of the same.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: Biotectix, LLC
    Inventors: Sarah Richardson-Burns, Jeffrey Hendricks
  • Publication number: 20140246327
    Abstract: A method is devised for providing a code on a tool. The method includes the steps of providing a tool, providing a coating on the tool by electroplating, and providing a code on the coating by using laser to make dents in the coating, with patches left in the coating. The dents are used as black lines or dots of a bar or array code printed on paper while the patches are used as blank lines or dots of the bar or array code printed on the paper.
    Type: Application
    Filed: March 2, 2013
    Publication date: September 4, 2014
    Inventor: Da-Sen LIN
  • Patent number: 8815072
    Abstract: A process is provided for roughening both sides of a copper plate by forming protrusions with fine bump shapes on both sides of the copper plate in an electroplating solution for plating copper while reducing deterioration of the electroplating solution. Opposed pairs of negative electrodes (3c) and positive electrodes (3a) are provided in an electroplating copper solution (2), and a copper plate (4) is arranged between the pair of negative electrodes (3c). An anodic treatment for generating copper fine particles on both surfaces of the copper plate (4) is carried out by performing an electrolytic process for three to ten minutes with the copper plate (4) as a positive electrode between the negative electrodes (3c).
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: August 26, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Hajime Watanabe, Sadao Ishihama, Kiyoteru Yamamoto, Takahiro Imai, Toshihiro Oyoshi
  • Patent number: 8790503
    Abstract: An anodized layer formation method includes: (a) providing an aluminum base or an aluminum film deposited on a support; anodization step (b) in which a forming voltage is increased to a predetermined first voltage level under a predetermined condition with a surface of the aluminum base or a surface of the aluminum film being kept in contact with an electrolytic solution, and thereafter, the forming voltage is maintained at the first voltage level for a predetermined period of time, whereby a porous alumina layer which has a minute recessed portion is formed; and etching step (c) in which, after step (b), the porous alumina layer is brought into contact with an etching solution, whereby the minute recessed portion is enlarged and a lateral surface of the minute recessed portion is sloped.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: July 29, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Ichiroh Ihara
  • Patent number: 8778164
    Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: July 15, 2014
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Derek Raybould, George Reimer
  • Patent number: 8778163
    Abstract: A method for electroplating aluminum metal on a magnesium alloy includes providing an Lewis acidic ionic liquid having dissolved species of an aluminum metal salt; pre-treating a surface of the magnesium alloy including subjecting the surface of the magnesium alloy to a reverse current etching in the ionic liquid; electroplating the aluminum metal on the surface using the ionic liquid as the electrolyte; and subjecting the surface of the magnesium alloy to a post-treatment including neutralization rinsing in a rinsing solvent solution.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: July 15, 2014
    Assignee: Sikorsky Aircraft Corporation
    Inventors: Xiaomei Yu, Mark R. Jaworowski, Daniel V. Viens, Joseph J. Sangiovanni
  • Patent number: 8758589
    Abstract: An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 ?m and less than 100 ?m when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle ? of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: June 24, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hidekazu Hayashi, Tokio Taguchi, Akiyoshi Fujii, Nobuaki Yamada
  • Publication number: 20140110265
    Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 24, 2014
    Applicant: CENTRE DE RECHERCHE PUBLIC - GABRIEL LIPPMANN
    Inventors: Mikael Fredenberg, Patrik Möller, Peter Wiwen-N ilsson, Cecilia Aronsson, Matteo Dainese
  • Patent number: 8702955
    Abstract: Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other el
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: April 22, 2014
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Vacit Arat, Michael S. Lockard, Dennis R. Smalley
  • Publication number: 20140090983
    Abstract: An electrode structure of the present invention includes: an aluminum electrode which is to be in contact with a surface of an aluminum base; a fixing member for fixing the aluminum electrode on the surface of the aluminum base; an elastic member provided between the fixing member and the aluminum base; a lead wire which is electrically connected to the aluminum electrode at least under a certain condition; and a cover member which is tightly closed with the lead wire penetrating through an opening.
    Type: Application
    Filed: November 25, 2011
    Publication date: April 3, 2014
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Hidekazu Hayashi, Kiyoshi Minoura, Akinobu Isurugi
  • Patent number: 8652317
    Abstract: An alumina nanohole array and a method of fabricating the same includes the steps of forming an aluminum thin-film on a substrate at a substrate temperature of ?80° C. or below so that crystal grain growth is suppressed, even when a high-purity aluminum material is used, thus providing improved surface smoothness; and anodizing the aluminum thin-film. Preferably, the method additionally includes texturing by pressing a mold having an orderly array of projections against the aluminum thin-film to form pits on the aluminum thin-film which enables a larger array area to be formed. When the mold and the aluminum thin-film are held at a temperature of 150 to 200° C., the pressure used for pit formation is reduced. A magnetic recording medium manufactured by a method therefore includes forming a magnetic layer within the nanoholes so that the medium is suitable as a bit patterned media for a perpendicular recording system.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: February 18, 2014
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Kouichi Tsuda
  • Patent number: 8641884
    Abstract: A method of fabricating a motheye mold according to the present invention includes the steps of: (a) anodizing a surface of an aluminum film (10a) via an electrode (32a) that is in contact with the surface, thereby forming a porous alumina layer which has a plurality of very small recessed portions; (b) after step (a), allowing the porous alumina layer to be in contact with an etchant, thereby enlarging the very small recessed portions of the porous alumina layer; and (c) after step (b), further anodizing the surface to grow the plurality of very small recessed portions. The aluminum film is made of aluminum with a purity of 99.99 mass % or higher. The electrode includes a first electrode portion (32a1) which is made of aluminum with a purity of 99.50 mass % or lower and a second electrode portion (32a2) which is made of aluminum with a higher purity than the aluminum of the first electrode portion and which is interposed between the surface and the first electrode portion.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: February 4, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hidekazu Hayashi, Tokio Taguchi, Kazuhiko Tsuda
  • Publication number: 20140021055
    Abstract: A substrate of a metal selected from the group consisting of titanium, tantalum, titanium alloys and tantalum alloys, modified by anodic spark deposition (ASD) on the surface thereof of a microporous and nanoroughened layer of the oxide of the same metal, said layer being enriched with Ca, P, Si, Na, and at least one metal selected from Ag and Ga. This surface modified metal substrate show excellent osteointegrating properties associated with antibacterial activity. A further advantage resides in that its preparation process does no longer require alkaline etching to promote cellular adhesion.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 23, 2014
    Applicant: POLITECNICO DI MILANO
    Inventors: Roberto CHIESA, Alberto Cigada, Cinzia Della Valle
  • Patent number: 8591716
    Abstract: A semiconductor substrate with anode pattern is anodized to be shaped into an optical lens. The anodization utilizes an electrolytic solution which etches out oxidized portion as soon as it is formed as a result of the anodization, to thereby develop a porous layer in a pattern in match with the anode pattern. After being removed of the porous layer, the substrate is treated to smooth out minute projections remaining in the top surface of the substrate, thereby obtaining the lens of good transmissivity.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: November 26, 2013
    Assignee: Panasonic Corporation
    Inventors: Yoshiaki Honda, Takayuki Nishikawa, Tomohiro Kamitsu
  • Patent number: 8568899
    Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: October 29, 2013
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Patent number: 8551314
    Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: October 8, 2013
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley
  • Patent number: 8545994
    Abstract: An article includes an electrodeposited metallic material including Co with a minimum content of 75% by weight. The metallic material has a microstructure which is fine-grained with an average grain size between 2 and 5,000 nm and/or an amorphous microstructure. The metallic material forms at least part of an exposed surface of the article. The metallic material has an inherent contact angle for water of less than 90 degrees at room temperature when measured on a smooth exposed surface portion of the metallic material which has a maximum surface roughness Ra of 0.25 microns. The metallic material has an exposed patterned surface portion having surface structures having a height of between at least 5 microns to about 100 microns incorporated therein to increase the contact angle for water at room temperature of the exposed patterned surface portion to over 100 degrees.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: October 1, 2013
    Assignee: Integran Technologies Inc.
    Inventors: Diana Facchini, Francisco Gonzalez, Jonathan McCrea, Mike Uetz, Gino Palumbo, Klaus Tomantschger, Nandakumar Nagarajan, Jared J. Victor, Uwe Erb
  • Patent number: 8545708
    Abstract: A mold of the present invention includes: a flexible polymer film; a curable resin layer provided on a surface of the polymer film; and a porous alumina layer provided on the curable resin layer, the porous alumina layer having an inverted moth-eye structure in its surface, the inverted moth-eye structure having a plurality of recessed portions whose two-dimensional size viewed in a direction normal to the surface is not less than 10 nm and less than 500 nm. According to the present invention, a method for easily forming a flexible moth-eye mold which can be deformed into the form of a roll is provided.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: October 1, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Akiyoshi Fujii, Kiyoshi Minoura, Akinobu Isurugi, Hidekazu Hayashi
  • Patent number: 8529747
    Abstract: An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: September 10, 2013
    Assignee: The Boeing Company
    Inventors: Stephen P. Gaydos, Mary Ann Gilman
  • Patent number: 8512578
    Abstract: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: August 20, 2013
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Dale S. McPherson
  • Patent number: 8492003
    Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: July 23, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Chia-Ying Yen, Hsin-Hwa Chen
  • Publication number: 20130008796
    Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.
    Type: Application
    Filed: March 7, 2012
    Publication date: January 10, 2013
    Applicant: APPLE INC.
    Inventors: Ken Silverman, Ronald Moller, Peter Russell-Clarke, Christopher D. Prest, Rimple Bhatia, Paul Choiniere, Lucy Elizabeth Browning, Masashige Tatebe
  • Publication number: 20120325666
    Abstract: Frost-free surfaces and methods for manufacturing such surfaces are described. The frost-free surfaces reduce ice build-up, prevent vapor condensation and reduce adhesion force between ice and a solid substrate. The surfaces can be on parts used in devices where superhydrophobic properties may be obtained post or during device manufacturing. The superhydrophobic properties are the result of aluminum oxide clusters made on such surfaces.
    Type: Application
    Filed: November 10, 2009
    Publication date: December 27, 2012
    Inventor: Chunbo Ran
  • Patent number: 8308928
    Abstract: A method is provided for applying a cover layer (9) to a net structure (4) to be used for medical purposes, in particular a thrombosis filter. The net structure (4) is applied to a planar substrate (1) that covers openings (5) of the net structure on one side, wherein the openings (5) across the uncovered side are filled with a sacrificial material (7), in particular copper. The net structure (4) is lifted from the substrate (1). A cover layer (9) is deposited on the surface previously covered by the substrate, and the sacrificial material (7) is removed.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: November 13, 2012
    Assignee: Acandis GmbH & Co. KG
    Inventors: Eckhard Quandt, Christiane Zamponi, Clemens Schmutz
  • Patent number: 8268156
    Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primary metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: September 18, 2012
    Assignee: Advantest America, Inc.
    Inventor: Montray Leavy
  • Patent number: 8257573
    Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: September 4, 2012
    Assignee: Microfabrica Inc.
    Inventor: Adam L. Cohen
  • Publication number: 20120213971
    Abstract: A mold manufacturing method includes providing an aluminum base or an aluminum film; allowing passage of an electric current between a surface of the aluminum base and a counter electrode in an aqueous solution with the surface being a cathode, thereby forming a plurality of first recessed portions whose two-dimensional size viewed in a direction normal to the surface is not less than 200 nm and not more than 100 ?m; thereafter, the step of anodizing the surface, thereby forming a porous alumina layer which has a plurality of second recessed portions whose two-dimensional size is not less than 10 nm and less than 500 nm over an inner surface of the plurality of first recessed portions and between the plurality of first recessed portions; and thereafter, bringing the porous alumina layer into contact with an etchant, thereby enlarging the plurality of second recessed portions of the porous alumina layer.
    Type: Application
    Filed: November 4, 2010
    Publication date: August 23, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Ichiroh Ihara
  • Patent number: 8226810
    Abstract: The invention concerns a galvanic deposition method for an anthracite colored coating for metallic parts, including a first step of depositing a gold-nickel alloy by means of an electrolytic bath, characterized in that it includes a second step of treating said gold-nickel alloy by means of a diluted acid bath, containing an acid selected from among hydrochloric, hydrofluoric, phosphoric, nitric and sulphuric acid.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: July 24, 2012
    Assignee: Universo S.A.
    Inventor: Christophe Henzirohs
  • Publication number: 20120171427
    Abstract: The present invention relates to an aluminum die base material for a stamper having a component composition that contains 0.5% by weight to 3.0% by weight of Mg, the total amount of elements other than Mg, including unavoidable impurities, is 500 ppm or less, and the remainder is composed of Al, and a forged structure in which the average crystal grain size is 1000 ?m or less and the surface area ratio of second phase particles is 0.10% or less. According to the present application, a stamper can be provided in which, together with the crystal grain size of the aluminum being refined, the formation of second phase particles is inhibited, surface irregularities attributable to mirrored surface polishing are reduced, and a uniform relief pattern is formed by anodic oxidation treatment.
    Type: Application
    Filed: September 10, 2010
    Publication date: July 5, 2012
    Inventors: Hiroaki Kita, Kota Shirai, Hisakazu Ito
  • Patent number: 8197659
    Abstract: A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: June 12, 2012
    Assignee: IBIDEN Co., Ltd.
    Inventors: Toru Nakai, Satoru Kawai, Hiroshi Niwa, Yoshiyuki Iwata
  • Publication number: 20120114861
    Abstract: Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb). Some embodiments provide for reducing tool wear when using difficult-to-machine materials by (1) depositing difficult to machine materials selectively and potentially with little excess plating thickness and/or (2) pre-machining depositions to within a small increment of desired surface level (e.g. using lapping) and then using diamond fly cutting to complete the process, and/or (3) forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.
    Type: Application
    Filed: October 5, 2011
    Publication date: May 10, 2012
    Inventors: Adam L. Cohen, Uri Frodis, Michael S. Lockard, Ananda H. Kumar, Gang Zhang, Dennis R. Smalley
  • Patent number: 8123963
    Abstract: A method for producing a semiconductor component includes forming an n-doped layer in a p-doped layer of the semiconductor component, wherein the n-doped layer comprises at least one of: a sieve-like layer or a network-like layer. The method also includes porously etching the p-doped layer between the material of the n-doped layer to form a top electrode, and forming a cavity below the n-doped layer.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: February 28, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Heribert Weber, Hans Artmann, Frank Schaefer
  • Publication number: 20120017989
    Abstract: A method of texturing a metal provides a metal with a thickness of 50 to 400 ?m. The metal is anodized, etched and then textured in a first texturing step to produce a first textured surface of the metal. A textured metal is produced with a dimpled surface of dimples with diameters of 5 nm to 2 and a depth of from 2 nm to 2 ?m.
    Type: Application
    Filed: August 24, 2011
    Publication date: January 26, 2012
    Inventors: Pai-Chun Chang, Chung-Jen Chien, Pengfel Qi
  • Publication number: 20120013691
    Abstract: Exemplary embodiments provide an aluminum image drum and method of its formation such that the aluminum image drum can have a surface texture to provide desirable surface oil consumption and high print quality for solid ink jet marking systems.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Applicant: Xerox Corporation
    Inventors: Sean W. HARRIS, David RUFF, Mark TAFT, Kathereine D. WESTON, Barry Daniel REEVES, Jignesh SHETH, Paul MCCONVILLE, David Alan VANKOUWENBERG, Pinyen LIN, Trevor SNYDER
  • Patent number: 8070931
    Abstract: Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other el
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: December 6, 2011
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Vacit Arat, Michael S. Lockard, Dennis R. Smalley
  • Patent number: 7998333
    Abstract: The present invention provides a method of manufacturing a magnetic recording medium having high recording density. The magnetic recording medium manufacturing method of the present invention is directed to a manufacturing method including: disposing at least a silicon layer on a substrate; disposing an uneven structure including regularly arranged projections on the silicon layer; disposing magnetic material on the upper surfaces of the projections and within recessed parts of the uneven structure; and allowing the magnetic material disposed within each recessed part to be changed into silicon compound by heat treatment.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: August 16, 2011
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tatsuya Saito, Toru Den
  • Publication number: 20110162972
    Abstract: A method for producing a thin-film battery includes a film-formation step of forming a film of a positive-electrode material to form a positive-electrode active material film and an annealing step of annealing the positive-electrode active material film. After the annealing step, a lithium-ion introduction step of introducing lithium ions into the positive-electrode active material film. After the introduction of the lithium ions, a reverse-sputtering step of edging the positive-electrode active material film by reverse sputtering.
    Type: Application
    Filed: June 26, 2009
    Publication date: July 7, 2011
    Applicant: SONY CORPORATION
    Inventors: Tatsuya Furuya, Katsunori Takahara, Hiroyuki Morioka, Yuichi Sabi
  • Patent number: RE43694
    Abstract: A simple, cost-effective stamping or molding in the nanometer range is enabled using a stamping surface or molding face with a surface layer having hollow chambers that have been formed by anodic oxidation.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: October 2, 2012
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Thomas Sawitowski
  • Patent number: RE44995
    Abstract: A method for producing a semiconductor component includes forming an n-doped layer in a p-doped layer of the semiconductor component, wherein the n-doped layer comprises at least one of: a sieve-like layer or a network-like layer. The method also includes porously etching the p-doped layer between the material of the n-doped layer to form a top electrode, and forming a cavity below the n-doped layer.
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: July 8, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Heribert Weber, Hans Artmann, Frank Schaefer