Organic Sulfoxy-containing Patents (Class 205/254)
  • Patent number: 10174433
    Abstract: A stannous methanesulfonate solution for tin electroplating applications and a method of forming the same are disclosed. The solution has an elevated pH. The solution also has a sufficient tin concentration for electroplating applications.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: January 8, 2019
    Assignee: Honeywell International Inc.
    Inventors: Christian N. Werner, Ronald E. H. Friedemann, Jessica Maurer
  • Patent number: 10080807
    Abstract: The present invention is based on a finding of an unexpected synergistic and safe combination of antineoplastic agents which when administered in combination provides greater efficacy than the single agents alone. Accordingly, a method of treating neoplasia in a subject in need of treatment is provided, by administering to the subject an amount of a prodrug of mitomycin C that yields a therapeutically effective amount of mitomycin C, in combination with an amount of a chemotherapeutic agent. In one embodiment, the prodrug of mitomycin C is a liposomal-prodrug of mitomycin C. Together, the prodrug of mitomycin C and chemotherapeutic agent provide a synergistic antineoplastic effect.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: September 25, 2018
    Assignees: Lipomedix Pharmaceuticals Ltd., Shaare Zedek Scientific Ltd.
    Inventors: Alberto Gabizon, Patricia Ohana, Hilary Shmeeda
  • Patent number: 9937261
    Abstract: A method of treating neoplasia in a subject in need of treatment is provided by administering to the subject an amount of a prodrug of mitomycin C that yields a therapeutically effective amount of mitomycin C, in combination with radiation therapy. In one embodiment, the prodrug of mitomycin C is a liposomal-prodrug of mitomycin C. Together, the prodrug of mitomycin C and radiation therapy provide a synergistic antineoplastic effect.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: April 10, 2018
    Assignees: Lipomedix Pharmaceuticals Ltd., The University of North Carolina at Chapel Hill
    Inventors: Alberto Gabizon, Patricia Ohana, Andrew Wang
  • Patent number: 8920623
    Abstract: Methods are disclosed for replenishing tin and its alloying metals in an aqueous electrolytic plating bath using an acidic solution containing stannous oxide. During electroplating of tin or tin alloys the stannous ions and alloying metal ions are depleted. To maintain continuous and efficient electroplating processes predetermined amounts of the plating bath containing tin and its alloying metals are bailed out. The bail out is then mixed with a predetermined amount of acidic solution containing stannous oxide and any alloying metals. The mixture is then retuned to the plating bath to return the stannous ions and alloying metal ions to their steady state concentrations.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: December 30, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yu Luo, Neil D. Brown, Michael P. Toben
  • Publication number: 20140299351
    Abstract: The invention relates to a contact element for a solder-free electrical connection. The contact element has at least one contact section that is designed to produce an electrical contact, in particular by means of insulation displacement terminations and/or a spring contact and/or crimping and/or riveting and/or screwing and/or caulking and/or folding and/or bending of a stamped grid. The invention also relates to a stannous surface coating that covers the contact element at least in sections. In order to provide a contact element having a lead-free surface coating that prevents whisker growth or minimizes such growth to a large extent, the surface coating contains between 15 and 73 mass percent of silver.
    Type: Application
    Filed: October 19, 2012
    Publication date: October 9, 2014
    Inventors: Manfred Moser, Richard Gueckel, Stefan Rysy, Erik Biehl
  • Patent number: 8603315
    Abstract: A method for electrochemically plating tin or tin alloy onto a workpiece to provide a tin or tin alloy deposit on said workpiece having a stress differential and workpieces characterized by a tin or tin alloy deposit having a stress differential.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: December 10, 2013
    Assignee: Faraday Technology, Inc.
    Inventors: E. Jennings Taylor, Jenny J. Sun
  • Patent number: 7608687
    Abstract: A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: October 27, 2009
    Assignee: Alza Corporation
    Inventor: Samuel Zalipsky
  • Patent number: 7592307
    Abstract: A conjugate comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-, hydroxy- or carboxyl-containing ligand is described. The resulting conjugate is capable of releasing the parent amine, hydroxy, or carboxyl-containing compound via thiol-mediated cleavage. The system allows for delivery of various amino-, hydroxy-, or carboxy-containing drugs in the form of their thiolytically cleavable macromolecular conjugates.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: September 22, 2009
    Assignee: Alza Corporation
    Inventors: Samuel Zalipsky, Radwan Kiwan
  • Patent number: 7465384
    Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: December 16, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Peter R. Levey, Neil D. Brown
  • Patent number: 7309411
    Abstract: An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic acid or alkali metal salt thereof such as a sodium or potassium gluconate or heptonate complexant; boric acid; and a bath soluble substituted phenolic compound. The current regime applied to the plating bath can include time intervals of direct current and of pulsed current in order to selectively control the deposition of tin by activation or diffusion control.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: December 18, 2007
    Inventors: Roderick D. Herdman, Trevor Pearson
  • Patent number: 7285622
    Abstract: A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: October 23, 2007
    Assignee: Alza Corporation
    Inventor: Samuel Zalipsky
  • Patent number: 7276248
    Abstract: Conjugates of a hydrophobic moiety, such as a lipid, linked through a cleavable dithiobenzyl linkage to a therapeutic agent are described. The dithiobenzyl linkage is susceptible to cleavage by mild thiolysis, resulting in release of the therapeutic agent in its original form. The linkage is stable under nonreducing conditions. The conjugate can be incorporated into liposomes for administration in vivo and release of the therapeutic agent in response to endogeneous in vivo reducing conditions or in response to administration of an exogeneous reducing agent.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: October 2, 2007
    Assignee: ALZA Corporation
    Inventors: Samuel Zalipsky, Alberto A. Gabizon
  • Patent number: 7273540
    Abstract: An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being 0.5 to 5 mol/L, 0.21 to 2 mol/L, 0.002 to 0.02 mol/L, and 0.01 to 0.1 mol/L, respectively, a mole ratio of the silver-ion concentration to the copper-ion concentration being in a range of 4.5 to 5.58; and separating a solution around a soluble anode containing 90 percent or more of tin from the plating solution on a cathode side by a non-ionic micro-porous membrane having a pore diameter of 0.01 to 0.05 ?m and a thickness of 5 to 100 ?m.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: September 25, 2007
    Assignee: Shinryo Electronics Co., Ltd.
    Inventors: Hiromi Sonoda, Katsuji Nakamura
  • Patent number: 7238368
    Abstract: A conjugate comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-, hydroxy- or carboxyl-containing ligand is described. The resulting conjugate is capable of releasing the parent amine, hydroxy, or carboxyl-containing compound via thiol-mediated cleavage. The system allows for delivery of various amino-, hydroxy-, or carboxy-containing drugs in the form of their thiolytically cleavable macromolecular conjugates.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: July 3, 2007
    Assignee: ALZA Corporation
    Inventors: Samuel Zalipsky, Radwan Kiwan
  • Patent number: 7195702
    Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: March 27, 2007
    Assignee: Taskem, Inc.
    Inventors: George S. Bokisa, Sr., William E. Eckles, Robert E. Frischauf
  • Patent number: 6849270
    Abstract: A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: February 1, 2005
    Assignee: Alza Corporation
    Inventor: Samuel Zalipsky
  • Patent number: 6790333
    Abstract: The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment. Functional alloy plating using substitute bonding material for Pb and electronic component to be mounted to which the functional alloy plating is applied, characterized in that with Sn (tin) as a base, one of Bi (bismuth), Ag (silver) and Cu (copper) is selected, a Bi content to the Sn is set to 1.0% or less, the Bi content to the Sn is set to 2.0 to 10.0%, an Ag content to the Sn is set to 1.0 to 3.0%, the Ag content to the Sn is set to 3.0 to 5.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: September 14, 2004
    Assignee: Nishihara Rikoh Corporation
    Inventor: Masaaki Ishiyama
  • Patent number: 6730209
    Abstract: In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied by lower molecular weight alcohols. In a preferred embodiment, a diol along with low alcohol is added to a bath comprising sulfonic acid, surfactant, grain refiner and brightening agents comprising an aromatic aldehyde and a carboxylic acid.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: May 4, 2004
    Assignee: Lucent Technologies Inc.
    Inventors: Joseph A. Abys, Frank Stanley Humiec, Kenneth J. Murski, Yun Zhang
  • Publication number: 20040065558
    Abstract: An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarbox acid or alkali metal salt thereof such as a sodium or potassium gluconate or heptonate complexant; boric acid; and a bath soluble substituted phenolic compound. The current regime applied to the plating bath can include time intervals of direct current and of pulsed current in order to selectively control the deposition of tin by activation or diffusion control.
    Type: Application
    Filed: July 30, 2003
    Publication date: April 8, 2004
    Inventors: Roderick D. Herdman, Trevor Pearson
  • Patent number: 6605299
    Abstract: A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: August 12, 2003
    Assignee: Alza Corporation
    Inventor: Samuel Zalipsky
  • Patent number: 6582582
    Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: June 24, 2003
    Inventor: Donald Becking
  • Publication number: 20030089617
    Abstract: In the low-lead-content plating process of the present invention, tens to hundreds ppms of lead, thallium and iron ions, which are much lower than the international “non-lead” standard, are added into a pure tin plating liquid to change the crystal phase orientation during infrared-ray reflow, thereby reducing the melting point of the plated layer.
    Type: Application
    Filed: December 28, 2001
    Publication date: May 15, 2003
    Inventor: Philip Chung-Hwei Chen
  • Patent number: 6562220
    Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.
    Type: Grant
    Filed: May 21, 2001
    Date of Patent: May 13, 2003
    Assignee: Technic, Inc.
    Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
  • Patent number: 6562221
    Abstract: A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is particularly suited to high speed reel to reel or strip steel plating.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: May 13, 2003
    Inventor: David Crotty
  • Publication number: 20030024822
    Abstract: The invention concerns a process for the deposition of a silver-tin alloy from an acidic, cyanide-free electrolyte, containing silver ions, tin ions as well as a complexing agent. In order to provide a process which, despite the great differential of potential between silver and tin, makes it possible to simultaneously precipitate both metals to form well-adhering layers which, in addition, have a smooth, matte to silky surface and which are easily soldered, the invention involves the use of, as a further component an aromatic compound with an aldehyde group added to the electrolyte.
    Type: Application
    Filed: April 30, 2001
    Publication date: February 6, 2003
    Inventor: Ortrud Steinius
  • Patent number: 6508927
    Abstract: A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: January 21, 2003
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Isamu Yanada, Masanobu Tsujimoto, Tetsurou Okada, Teruya Oka, Hideyuki Tsubokura
  • Patent number: 6458264
    Abstract: An acidic Sn—Cu alloy plating bath composition comprising: (a) Sn2+ ions and Cu2+ ions, (b) at least one acid selected from the group consisting of alkane sulfonic acids, alkanol sulfonic acids, and sulfuric acid, and (c) a thiourea compound. The composition exhibits high current efficiency and does not cause Cu to deposit on the Sn anode, the Sn—Cu alloy plating bath is free from such problems as inadequate adhesion of the plating to substrate and covering of with copper deposit. Moreover, processing waste water from the Sn—Cu plating bath is easy because the composition does not contain a complexing agent. The Sn—Cu alloy plating bath of the present invention, therefore, can advantageously produce not only Sn—Cu alloy plating but also ternary alloy plating containing other metals in an industrial scale.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: October 1, 2002
    Assignee: Ebara-Udylite Co., Ltd.
    Inventors: Yoshiaki Muramatsu, Yoshihiko Yada, Hideki Miyazaki, Kanae Tokio
  • Patent number: 6436269
    Abstract: The present invention relates to an aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer or a thioureylene quaternary ammonium polymer. The plating baths also may contain one or more of the following additives: hydroxy polycarboxylic acids or salts thereof such as citric acid; ammonium salts; conducting salts; aromatic carbonyl-containing compounds; polymers of aliphatic amines such as a poly(alkyleneimine); and hydroxyalkyl substituted diamines as metal complexing agents. The plating baths of this invention deposit a bright and level deposit, and they can be adapted to provide plated alloys having high tin concentration over a wide current density range.
    Type: Grant
    Filed: October 19, 2000
    Date of Patent: August 20, 2002
    Assignee: Atotech Deutschland GmbH
    Inventors: Vincent C. Opaskar, Lee Desmond Capper
  • Publication number: 20020104763
    Abstract: A tin-copper alloy electroplating bath which comprises a water-soluble tin salt, a water-soluble copper salt, an inorganic or organic acid or a water-soluble salt thereof, and one or more compounds selected from thioamide compounds and thiol compounds. The present invention makes it possible to form a tin-copper alloy deposit, in place of tin-lead alloy plating, on electronic parts such as chips, quartz crystal oscillators, hoops, connector pins, lead frames, bumps, lead pins of packages, and printed circuit boards.
    Type: Application
    Filed: November 4, 1999
    Publication date: August 8, 2002
    Inventors: ISAMU YANADA, MASANOBU TSUJIMOTO, TETSUROU OKADA, TERUYA OKA, HIDEYUKI TSUBOKURA
  • Patent number: 6372117
    Abstract: A tin/copper alloy electroplating solution capable of forming a bright plating film in a wide electric current density range is provided. The electroplating solution is a cyanide-free aqueous solution containing an organosulfonic acid, divalent tin and copper salts, as metal salts, of the organosulfonic acid, a dispersant, and a brightener.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: April 16, 2002
    Assignee: Nippon MacDermid Co., Ltd.
    Inventor: Takaaki Tamura
  • Patent number: 6365179
    Abstract: Conjugates of a hydrophobic moiety, such as a lipid, linked through a cleavable dithiobenzyl linkage to a therapeutic agent are described. The dithiobenzyl linkage is susceptible to cleavage by mild thiolysis, resulting in release of the therapeutic agent in its original form. The linkage is stable under nonreducing conditions. The conjugate can be incorporated into liposomes for administration in vivo and release of the therapeutic agent in response to endogeneous in vivo reducing conditions or in response to administration of an exogeneous reducing agent.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: April 2, 2002
    Assignee: ALZA Corporation
    Inventors: Samuel Zalipsky, Alberto A. Gabizon
  • Publication number: 20020014414
    Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.
    Type: Application
    Filed: May 21, 2001
    Publication date: February 7, 2002
    Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
  • Patent number: 6342148
    Abstract: An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: January 29, 2002
    Assignee: Lucent Technologies Inc.
    Inventors: See Hong Chiu, Yun Zhang
  • Patent number: 6342244
    Abstract: A compound comprised of a hydrophilic polymer covalently yet reversibly linked to a amine-containing ligand through a dithiobenzyl linkage is described.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: January 29, 2002
    Assignee: Alza Corporation
    Inventor: Samuel Zalipsky
  • Patent number: 6337145
    Abstract: A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of non-ionic wetting agents and free alkyl sulfonic acid. After the deposition of the galvanic overlay a heat treatment is carried out in the temperature range of 150° C. to 200° C. for between 1 and 100 hours. The multilayer material for sliding elements comprises at least a backing and an overlay of 12 to 16 wt. % tin and 7 to 11 wt. % copper, the rest being lead. The overlay comprises 15 to 25 wt. % particles of intermetallic compound Cu6Sn5.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: January 8, 2002
    Assignee: Federal-Mogul Wiesbaden GmbH & Co.
    Inventor: George Pratt
  • Publication number: 20020000378
    Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution.
    Type: Application
    Filed: June 18, 2001
    Publication date: January 3, 2002
    Applicant: Semitool, Inc.
    Inventors: Robert W. Batz,, Scot Conrady, Thomas L. Ritzdorf
  • Patent number: 6331240
    Abstract: A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin salt of metastannic acid and a trivalent indium salt of an organosulfonic acid, further adding a chelating agent, and adjusting the pH of the aqueous solution to a value of 7 to 11 with a caustic alkali.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: December 18, 2001
    Inventors: Kyoko Tsunoda, Takaaki Tamura
  • Patent number: 6267863
    Abstract: An electroplating solution for plating bright tin, lead, or tin-lead alloy solder coatings in high speed electroplating applications. The electroplating solution includes an alkane or alkanol sulfonic acid electrolyte, a non-ionic surfactant, a grain refiner and two brightening agents: an aromatic aldehyde and a carboxylic acid. In one embodiment of the electroplating solution, the sulfonic acid electrolyte is methane sulfonic acid, the non-ionic surfactant is octylphenoxy(10)polyethoxy ethanol, the grain refiner is phenolphthalein, the aromatic aldehyde is chlorobenzaldehyde, and the carboxylic acid is methacrylic acid.
    Type: Grant
    Filed: February 5, 1999
    Date of Patent: July 31, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Joseph Anthony Abys, Kenneth J. Murski, Yun Zhang
  • Patent number: 6251253
    Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.
    Type: Grant
    Filed: March 19, 1999
    Date of Patent: June 26, 2001
    Assignees: Technic, Inc., Specialty Chemical Systems, Inc.
    Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
  • Patent number: 6248228
    Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, cadmium, tin/zinc, zinc/nickel and tin/nickel.
    Type: Grant
    Filed: March 19, 1999
    Date of Patent: June 19, 2001
    Assignee: Technic, Inc. and Specialty Chemical System, Inc.
    Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
  • Patent number: 6183619
    Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfonic acid electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. An additional significant appearance is to reduce the overall costs of this type of bath with the more economical salts of alkyl and alkanol sulfonic acids. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, tin/lead, tin/lead/copper, tin/zinc and zinc/nickel.
    Type: Grant
    Filed: March 19, 1999
    Date of Patent: February 6, 2001
    Assignees: Technic, Inc., Specialty Chemical Systems, Inc.
    Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
  • Patent number: 6179985
    Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy fluoroborate electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, cadmium, indium, iron, tin/lead and tin/lead copper.
    Type: Grant
    Filed: March 19, 1999
    Date of Patent: January 30, 2001
    Assignees: Technic, Inc., Specialty Chemical Systems, Inc.
    Inventors: Hyman D. Gillman, Brenda Fernandes, Kazimierz Wikiel
  • Patent number: 6176996
    Abstract: A tin-based, two-component alloy electroplating composition comprising 20 to 500 g/l of a tin salt, 1 to 100 g/l of a metal salt selected from the group consisting of a zinc, cobalt, bismuth and copper salt, 20 to 200 g/l of methanesulfonic acid, 10 to 300 g/1 of a conductive compound, and 0.5 to 50 g/l of a complexing agent provides a plating layer having excellent corrosion resistance and solderability to electronic devices such as lead frames, connectors and printed circuit boards.
    Type: Grant
    Filed: October 28, 1998
    Date of Patent: January 23, 2001
    Inventor: Sungsoo Moon
  • Patent number: 6103089
    Abstract: A multilayer material is described, whose overlay exhibits improved hardness and improved wear-resistance. The multilayer material includes an overlay, which contains 8-18.5 wt. % tin and 2-16 wt. % copper, the balance being lead, wherein the tin is present as a finely crystalline deposit completely homogeneously distributed in the lead. A process for producing sliding elements in which the overlay of lead-tin-copper is applied to the prefabricated semi-finished product by electroplating provides that a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of fatty acid polyglycol ester and a grain refining agent including a carboxylic acid.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: August 15, 2000
    Assignee: Federal-Mogul Wiesbaden GmbH
    Inventors: Klaus Staschko, Hans-Ulrich Huhn, Klaus Muller, Joachim Heyer
  • Patent number: 6103088
    Abstract: The invention provides a process for preparing bismuth compounds, in particular a process for preparing highly concentrated solutions of bismuth methanesulfonate, that are stable to hydrolysis.The preparation takes place from aqueous solutions of bismuth compounds of the formula (I)BiX.sub.3 (I)by subjecting acid of the formula (II)HX (II)whereX is the anion of a mineral acid, an organic acid radical, fluoroborate, hexafluorosilicate or cyanide, in an electrolytic cell, to electrolytic dissolution of the anode with metallic bismuth as the anode.
    Type: Grant
    Filed: October 22, 1998
    Date of Patent: August 15, 2000
    Assignee: Goldschmidt Ag.
    Inventors: Dieter Guhl, Frank Honselmann
  • Patent number: 6099713
    Abstract: Disclosed is a tin-silver alloy electroplating bath containing: (A) stannous salt; (B) silver salt; (C) one kind or two or more kinds of acids selected from the group consisting of sulfuric acid, phosphoric acid, phosphonic acid, hydroxycarboxylic acid, alkanesulfonic acid, and alkanolsulfonic acid; (D) thiourea; (E) nonionic surface active agent; and (F) one kind or two or more kinds of additives selected from the group consisting of a mercapto group containing aromatic compound, dioxyaromatic compound, and unsaturated carboxylic acid. The electroplating using the above electroplating bath is allowed to form a homogeneous tin-silver alloy plated film having a good external appearance by eliminating preferential deposition of silver and substitutional deposition of silver on an anode and the plated film.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: August 8, 2000
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Isamu Yanada, Masanobu Tsujimoto
  • Patent number: 6030516
    Abstract: There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: an unsubstituted or substituted para alkylbenzene sulphonic acid (component a), one or more acids capable of giving good plating at low current density (component b), one or more addition agents, a tin source, water. There are also described methods of tin plating by the compositions of the invention.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: February 29, 2000
    Inventor: Cavan Hugh O'Driscoll
  • Patent number: 5911866
    Abstract: The invention relates to an acid tin-silver alloy plating bath which comprises tin ions, silver ions, one compound selected from the group consisting of aromatic thiol compounds and aromatic sulfide compounds, substantially non-cyanide and a balance of water, the pH of the bath being not higher than 2. According to this acid bath, tin and silver can be kept dissolved in the bath in a stable state for a long period of time even at a high temperature and a predetermined plating capacity is kept for a long period of time even though the bath is free from cyanide.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: June 15, 1999
    Assignee: Dipsol Chemicals Co., Ltd.
    Inventors: Katsuhide Oshima, Satoshi Yuasa
  • Patent number: 5902472
    Abstract: A tin-silver alloy plating solution having a tin compound, a silver compound, and a complexing agent including a pyrophosphoric compound and an iodic compound. The tin-silver alloy layer composition can achieve a high electric current efficiency without using harmful compounds such as cyanides. The plating solution is very stable, possesses adhesivability, and the solder-wettability of the tin-silver alloy layer is satisfactory. Also, the alloy is an advantageous alloy for solder plating.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: May 11, 1999
    Assignee: Naganoken and Shinko Electric Industries Co., Ltd.
    Inventors: Susumu Arai, Tohru Watanabe, Mitsutoshi Higashi
  • Patent number: 5871631
    Abstract: An additive for an acidic tinplating bath comprises: an additive ingredient (A) prepared by adding oxypropylene to polyoxyethylene glycol and having an average molecular weight ranging from 3000 to 18000; an additive ingredient (B) prepared by adding oxypropylene to polyoxyethylene glycol and having an average molecular weight ranging from 300 to 1500; and the additive ingredient (A) and the additive ingredient (B) having a weight ratio of the additive ingredient (A) to the additive ingredient (B) being from 97/3 to 40/60.
    Type: Grant
    Filed: January 15, 1997
    Date of Patent: February 16, 1999
    Assignees: NKK Corporation, LeaRonal Japan Inc.
    Inventors: Mikiyuki Ichiba, Hiroshi Kubo, Yoshinori Yomura, Takeshi Miura, Kazuyuki Suda