Tin, Lead, Or Germanium Is Predominant Constituent Patents (Class 205/252)
  • Patent number: 10955439
    Abstract: A method of treating a material on a probe is provided. The method includes the steps of immersing a probe tip into a first fluid, wherein the probe tip includes one or more oxidized metallic fragments on a surface of the probe tip; polarizing the probe tip, through a counter electrode, with a negative current to reduce the one or more oxidized metallic fragments to one or more substantially unoxidized metallic fragments; removing the probe tip from the first fluid; immersing the probe in a second fluid, wherein the second fluid is a complexer for the one or more substantially unoxidized metallic fragments; and polarizing the probe tip with a positive current, through the counter electrode, wherein the positive current oxidizes the one or more substantially unoxidized metallic fragments.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: March 23, 2021
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, David M. Audette, Grant Wagner
  • Patent number: 9816197
    Abstract: An Sn alloy plating apparatus is disclosed. The apparatus includes a plating bath configured to store an Sn alloy plating solution therein with an insoluble anode and a substrate immersed in the Sn alloy plating solution, an Sn dissolving having an anion exchange membrane therein which isolates an anode chamber, in which an Sn anode is disposed, and a cathode chamber, in which a cathode is disposed, from each other, a pure water supply structure configured to supply pure water to the anode chamber and the cathode chamber, a methanesulfonic acid solution supply structure configured to supply a methanesulfonic acid solution, containing a methanesulfonic acid, to the anode chamber and the cathode chamber, and an Sn replenisher supply structure configured to supply an Sn replenisher, produced in the anode chamber and containing Sn ions and a methanesulfonic acid, to the plating bath.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: November 14, 2017
    Assignee: EBARA CORPORATION
    Inventors: Masashi Shimoyama, Yuji Araki, Masamichi Tamura, Toshiki Miyakawa
  • Patent number: 8974752
    Abstract: Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.
    Type: Grant
    Filed: September 30, 2012
    Date of Patent: March 10, 2015
    Assignee: Dow Global Technologies LLC
    Inventor: Matthew L. Grandbois
  • Publication number: 20150010774
    Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with germanium.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 8, 2015
    Inventors: Thomas A. Woodrow, III, Jean A. Nielsen
  • Publication number: 20150008131
    Abstract: The present disclosure generally relates to the field of tin electroplating. More specifically, the present disclosure relates to methods for mitigating tin whisker formation on tin-plated films and tin-plated surfaces by doping the tin with gold.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 8, 2015
    Inventors: Thomas A. Woodrow, III, Jean A. Nielsen
  • Publication number: 20140348450
    Abstract: A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.
    Type: Application
    Filed: December 6, 2012
    Publication date: November 27, 2014
    Applicants: Mahle International GmbH, Mahle Engine Systems UK Limited
    Inventor: Roohollah Kachoosangi
  • Publication number: 20140299351
    Abstract: The invention relates to a contact element for a solder-free electrical connection. The contact element has at least one contact section that is designed to produce an electrical contact, in particular by means of insulation displacement terminations and/or a spring contact and/or crimping and/or riveting and/or screwing and/or caulking and/or folding and/or bending of a stamped grid. The invention also relates to a stannous surface coating that covers the contact element at least in sections. In order to provide a contact element having a lead-free surface coating that prevents whisker growth or minimizes such growth to a large extent, the surface coating contains between 15 and 73 mass percent of silver.
    Type: Application
    Filed: October 19, 2012
    Publication date: October 9, 2014
    Inventors: Manfred Moser, Richard Gueckel, Stefan Rysy, Erik Biehl
  • Publication number: 20140209468
    Abstract: Systems and methods for tin antimony plating are provided. One plating method includes doping a tin (Sn) plating solution with antimony (Sb). One method also includes electroplating a component using the antimony-doped tin plating. The antimony-doped tin plating formed by one method includes between about 1% and about 3% antimony.
    Type: Application
    Filed: October 5, 2012
    Publication date: July 31, 2014
    Applicant: THE BOEING COMPANY
    Inventor: The Boeing Company
  • Publication number: 20130277226
    Abstract: The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol.
    Type: Application
    Filed: January 3, 2012
    Publication date: October 24, 2013
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Iris Barz, Arnd Kilian, Markus Muskulus, Britta Schafsteller
  • Publication number: 20130264215
    Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.
    Type: Application
    Filed: December 8, 2011
    Publication date: October 10, 2013
    Applicant: UMICORE GALVANOTECHNIK GMBH
    Inventors: Bernd Weyhmueller, Franz Kohl, Uwe Manz, Klaus Bronder, Frank Oberst, Mario Tomazzoni
  • Publication number: 20130252020
    Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.
    Type: Application
    Filed: December 6, 2011
    Publication date: September 26, 2013
    Inventor: George Hradil
  • Patent number: 8518230
    Abstract: A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: August 27, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: André Egli
  • Patent number: 8506787
    Abstract: An electrochemical cell having two or more diffusion bonded layers, which demonstrates a high degree of ruggedness, reliability, efficiency and attitude insensitiveness, is provided. The novel cell structure simplifies construction and operation of these cells. Also provided is a method for passive water removal from these cells. The inventive cell, as well as stacks made using these cells, is suitable for use in applications such as commercial space power systems, long endurance aircraft, undersea power systems, remote backup power systems, and regenerative fuel cells.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: August 13, 2013
    Assignee: Infinity Fuel Cell and Hydrogen, Inc.
    Inventors: Christopher Callahan, James F. McElroy, Alfred Meyer, William F. Smith
  • Patent number: 8491774
    Abstract: Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: July 23, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: André Egli
  • Patent number: 8466314
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 18, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • Patent number: 8440066
    Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: May 14, 2013
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Isamu Yanada, Masanobu Tsujimoto
  • Patent number: 8440065
    Abstract: The invention provides an electroplating composition, method, and improved apparatus, which enables electroplating tin-silver alloys at high speed and without burning. The composition is an aqueous acidic solution including salts of stannous tin and a monovalent silver, and a complexing agent selected from the group consisting of thiocarbazides and thiohydrazides, and optionally an aldehyde and/or dialdehyde organic brightener compound. A sulfonic acid and a surfactant may also be included. The improved apparatus provides a protective structure substantially surrounding the anode(s) to decrease turbulence and the problematic silver displacement reaction.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: May 14, 2013
    Assignee: TECHNIC, Inc.
    Inventors: Hana Marcella Hradil, Edward Frank Hradil, George Hradil
  • Publication number: 20130089751
    Abstract: The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/m2 in equivalent units of metal Zr; Sn of 0.3 to 20 g/m2 in equivalent units of metal Sn; Fe of 5 to 2000 mg/m2 in equivalent units of metal Fe; and Ni of 5 to 2000 mg/m2 in equivalent units of metal Ni.
    Type: Application
    Filed: June 28, 2011
    Publication date: April 11, 2013
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shigeru Hirano, Akira Tachiki, Hirokazu Yokoya, Morio Yanagihara, Makoto Kawabata
  • Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8329018
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20120208044
    Abstract: Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance.
    Type: Application
    Filed: July 31, 2009
    Publication date: August 16, 2012
    Applicants: M-TECH JAPAN CO. LTD.
    Inventors: Shinji Dewaki, Teru Matsuura, Kenji Dewaki, Yukari Dewaki
  • Patent number: 8137525
    Abstract: A method of making colloidal sphere templates and the sphere-templated porous materials made from the templates. The templated porous materials or thin films comprise micron and submicron-scaled spheres in ordered, disordered, or partially ordered arrays. The invention is useful in the synthesis of submicron porous, metallic tin-based and other high capacity anode materials with controlled pore structures for application in rechargeable lithium-ion batteries. The expected benefits of the resulting nanostructured metal films include a large increase in lithium storage capacity, rate capability, and improved stability with electrochemical cycling.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: March 20, 2012
    Assignee: The Regents of the University of California
    Inventors: John H. Harreld, Galen D. Stucky, Nathan L. Mitchell, Jeff S. Sakamoto
  • Patent number: 8062500
    Abstract: A method and apparatus for electrolytically producing oxidation reduction potential water from aqueous salt solutions for use in disinfection, sterilization, decontamination, wound cleansing. The apparatus includes an electrolysis unit having a three-compartment cell (22) comprising a cathode chamber (18), an anode chamber (16), and a saline solution chamber (20) interposed between the anode and cathode chambers. Two communicating (24, 26) membranes separate the three chambers. The center chamber includes a fluid flow inlet (21a) and outlet (21b) and contains insulative material that ensures direct voltage potential does not travel through the chamber. A supply of water flows through the cathode and anode chambers at the respective sides of the saline chamber. Saline solution flows through the center chamber, either by circulating a pre-prepared aqueous solution containing ionic species, or, alternatively, by circulating pure water or an aqueous solution of, e.g.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: November 22, 2011
    Assignee: Oculus Innovative Sciences, Inc.
    Inventor: Osao Sumita
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20110233065
    Abstract: This invention relates to an electrolyte as well as a method for the deposition of a matte metal layer on a substrate surface, where the matte metal layer is V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Te, Re, Pt, Au, TI, Bi, or an alloy thereof, and there is a halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminum, magnesium, or boron to facilitate deposition of a smooth and even layer with much lower deposition metal requirements.
    Type: Application
    Filed: July 8, 2009
    Publication date: September 29, 2011
    Applicant: ENTHONE INC.
    Inventors: Andreas Königshofen, Danica Elbick, Helmut Starke
  • Patent number: 7968444
    Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: June 28, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yu Luo, Neil D. Brown, Michael P. Toben
  • Patent number: 7887692
    Abstract: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.
    Type: Grant
    Filed: February 27, 2007
    Date of Patent: February 15, 2011
    Assignee: Electroplating Engineers of Japan Limited
    Inventors: Shingo Watanabe, Junji Ohnishi, Hiroshi Wachi, Takayuki Sone
  • Publication number: 20100300890
    Abstract: An aqueous cyanide-free electrolyte bath for plating of tin alloy layers on substrate surfaces comprising (i) a tin ion source and a source for another alloy element, characterised in that it further contains (ii) N-methyl pyrrolidone is described.
    Type: Application
    Filed: February 5, 2009
    Publication date: December 2, 2010
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Philip Hartmann, Lars Kohlmann, Heiko Brunner, Klaus-Dieter Schulz
  • Publication number: 20100170804
    Abstract: Tin plating film composed of tin or tin alloy is formed on a front surface and a rear surface of a substrate composing a lead frame. As tin alloy, for example, tin-copper alloy (content of copper: 2 mass %), tin-bismuth alloy (content of bismuth: 2 mass %) and the like can be cited. The substrate is composed of, for example, Cu alloy or the like. Within the tin plating film, plural crystal grains are arranged irregularly. Further, plural gap portions exist within the tin plating film. An external stress is reduced even if a bending process or the like are performed subsequently, because the gap portions exist within the tin plating film. Consequently, growths of whiskers accompanied by the external stress are suppressed.
    Type: Application
    Filed: March 15, 2010
    Publication date: July 8, 2010
    Applicant: FUJITSU LIMITED
    Inventor: Seiki Sakuyama
  • Publication number: 20100040899
    Abstract: A plating member comprising a lead-free plating material is obtained by the present invention in a manner such that whisker formation on a plating layer 16 of the plating member can be suppressed and thus the plating member has good solderability. In the case of such plating member having, on the surface of a base material 15, a plating layer 16 comprising a lead-free material (Sn—Cu alloy, etc.), the plating layer 16 has a layer structure of two or more layers (a1 to a3), the average particle diameter of plating particles (P1 to P3) constituting each layer varies from layer to layer, and the plating particle volume fraction of the plating layer 16 is 80% to 90% when the proportion of plating particles occupying a unit volume is defined as a plating particle volume fraction of 100% on the assumption that a unit volume 20 is filled with plating particles P3 each having the maximum average particle diameter.
    Type: Application
    Filed: December 28, 2007
    Publication date: February 18, 2010
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takashi Nomura, Mitsuru Sakano
  • Publication number: 20090123789
    Abstract: There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside carbon nanotubes for storage and the production of energy. There is also disclosed a method of generating various reactions by confining the volatile materials inside the crystalline void structure and releasing the confined volatile material. In this embodiment, the released volatile material may be combined with a different material to initiate or sustain a chemical, thermal, nuclear, electrical, mechanical, or biological reaction.
    Type: Application
    Filed: May 9, 2008
    Publication date: May 14, 2009
    Inventors: William K. Cooper, James F. Loan, Christopher H. Cooper
  • Patent number: 7465384
    Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: December 16, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Peter R. Levey, Neil D. Brown
  • Publication number: 20080283406
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Application
    Filed: April 24, 2008
    Publication date: November 20, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • Patent number: 7431817
    Abstract: The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin ions soluble, complexed gold ions, and an alloy stabilizing agent that includes ethoxylated compounds with phosphate ester functional group, brightening additives based on ethoxylated phosphate esters and alkali metal fatty acids dipropionates. The brighteners may be used alone or in conjunction with each other to achieve beneficial synergistic effect. The alloy stabilizing agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between 2 and 10 and the gold ions and tin ions are present in relative amounts sufficient to provide a deposit having a gold content less than 90% by weight and a tin content greater than 10% by weight.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: October 7, 2008
    Assignee: Technic, Inc.
    Inventors: Hana Hradil, George Hradil, Edward Hradil
  • Publication number: 20080171244
    Abstract: A standalone hydrogen generating system is provided using a hydrogen generating device which can generate a hydrogen-containing gas at a low temperature and can be operated only by electric energy supplied from a fuel cell and does not require large electric energy.
    Type: Application
    Filed: December 26, 2005
    Publication date: July 17, 2008
    Applicant: GS YUASA CORPORATION
    Inventors: Ryoichi Okuyama, Yoshihiro Yamamoto, Katsuji Ashida
  • Patent number: 7323097
    Abstract: An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed in the plating solution are connected to an anode and the body to be plated is connected to a cathode of a power supply.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: January 29, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Mitsuru Kinoshita, Tsugihiko Hirano, Katsunori Takahashi
  • Patent number: 7309411
    Abstract: An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic acid or alkali metal salt thereof such as a sodium or potassium gluconate or heptonate complexant; boric acid; and a bath soluble substituted phenolic compound. The current regime applied to the plating bath can include time intervals of direct current and of pulsed current in order to selectively control the deposition of tin by activation or diffusion control.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: December 18, 2007
    Inventors: Roderick D. Herdman, Trevor Pearson
  • Patent number: 7273540
    Abstract: An electrolytic plating method, including: preparing a plating solution including water which is a primary medium, a sulfonic acid, and tin, copper, and silver ions, and a complexing agent, concentrations of the sulfonic acid, and tin, copper, and silver ions being 0.5 to 5 mol/L, 0.21 to 2 mol/L, 0.002 to 0.02 mol/L, and 0.01 to 0.1 mol/L, respectively, a mole ratio of the silver-ion concentration to the copper-ion concentration being in a range of 4.5 to 5.58; and separating a solution around a soluble anode containing 90 percent or more of tin from the plating solution on a cathode side by a non-ionic micro-porous membrane having a pore diameter of 0.01 to 0.05 ?m and a thickness of 5 to 100 ?m.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: September 25, 2007
    Assignee: Shinryo Electronics Co., Ltd.
    Inventors: Hiromi Sonoda, Katsuji Nakamura
  • Patent number: 7208073
    Abstract: Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: April 24, 2007
    Assignee: Technic, Inc.
    Inventor: George Hradil
  • Patent number: 7195702
    Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: March 27, 2007
    Assignee: Taskem, Inc.
    Inventors: George S. Bokisa, Sr., William E. Eckles, Robert E. Frischauf
  • Patent number: 7087315
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 8, 2006
    Assignees: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., Ltd.
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Patent number: 6982030
    Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: January 3, 2006
    Assignee: Technic, Inc.
    Inventors: Yun Zhang, Robert A. Schetty, III, Kilnam Hwang
  • Patent number: 6899802
    Abstract: In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention can recycle a foemer plating solution to prepare a new plating solution, for example, in the following order: a process for preparing a Sn—Bi alloy plating solution (S1); a process for an active carbon treatment to remove the completing agent (S2); a process for removing Bi (S3); a process for a sedimenting treatment (S4); and a process for analyzing and correcting Sn plating solution. The recycling of plating solutions eliminates their effluent treatment and reduces environmental loads, effluent costs, and costs for purchasing new solutions. In the administration of the plating solution compositions, the conventional data can be utilized to facilitate the administrating operation.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: May 31, 2005
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Koujiro Kameyama
  • Patent number: 6884523
    Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: April 26, 2005
    Assignee: NEC Electronics Corporation
    Inventor: Kenta Ogawa
  • Patent number: 6875332
    Abstract: The present invention relates to a to-be-mounted electronic component to which functional alloy plating using a bonding material for mounting is applied with a substitute bonding material for solder (tin-lead alloy), and aims at providing alloy plating which has been put to a practical use in such a way that the function of existing alloy plating of this type has been significantly improved to eliminate toxic plating from various kinds of electronic components for use in electronic devices so that it is useful in protecting the environment.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: April 5, 2005
    Assignee: Nishihara Rikoh Corporation
    Inventor: Masaaki Ishiyama
  • Publication number: 20040245113
    Abstract: Disclosed are systems and methods of plating a tin alloy in an efficient, economical, and environmentally friendly manner. An electrochemical cell containing an anolyte compartment and a catholyte compartment separated by a selective membrane is employed. The selective membrane prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment. A conduit may be employed in the electrochemical cell to permit one way flow of anolyte to the catholyte compartment thereby replenishing tin to the catholyte compartment.
    Type: Application
    Filed: June 6, 2003
    Publication date: December 9, 2004
    Inventors: George S. Bokisa, William E. Eckles, Robert E. Frischauf
  • Publication number: 20040231999
    Abstract: The invention relates to an electroplating solution for providing a deposit of an alloy of gold and tin. This solution includes an aqueous solvent in which gold is present in the form of a solution soluble cyanide complex and tin is present in the form of a solution soluble organotin complex. 2,2′-dipyridyl is present as an additive that allows the codeposition of useful gold-tin alloy compositions at current densities lower than would be possible in its absence, given the concentrations of the individual metallic components in the solution. This additive is generally used at a concentration of 0.1 to 1 grams per liter for imparting significant enhancements in providing gold-tin alloy deposits.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 25, 2004
    Inventor: Ronald J. Morrissey
  • Patent number: 6821681
    Abstract: An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, such that fresh or spent electrolyte can be used interchangeably in these type of cells.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: November 23, 2004
    Inventor: Johan C. Fitter
  • Patent number: 6811672
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: November 2, 2004
    Assignees: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., Ltd.
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Patent number: RE39476
    Abstract: Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: January 23, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Neil D. Brown, George A. Federman, Angelo B. Chirafisi, Gregory Lai