Abstract: Electrodepositable coating compositions containing 1,1-di-activated vinyl compounds are described. The coating compositions produce cured coating layers that exhibit resistance to cratering. The coating compositions can be used in electrodepositable coating composition formulations.

Abstract: A chemically amplified positive-type photosensitive resin composition for a thick film including an acid generator which is capable of producing an acid when irradiated with an active beam or radiation and includes a compound having a carboxyl group; a resin whose solubility in alkali increases under the action of an acid and which includes an acrylic resin containing a structural unit derived from acrylic ester having a cyclic group containing —SO2— or a cyclic group containing lactone; and an organic solvent.

Abstract: In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.

Abstract: A doctor blade for wiping printing ink off a surface of a printing plate, comprising a flat and elongated main body having a working edge region configured in a longitudinal direction, the working edge region being covered with a first coating on the basis of a nickel-phosphorus alloy applied by electroless deposition, and hard material particles being dispersed in the first coating, characterized in that the first coating is covered with a second coating on the basis of galvanically deposited nickel.

Abstract: The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, H2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions.

Abstract: Disclosed herein is a nickel electroplating solution and chip parts using the same, and more particularly, to a nickel electroplating solution including: nickel metal; nickel chloride; boric acid; a first additive of at least one selected from a group consisting of benzene, naphthalene, xylene, sulfonic acid, sodium sulfonate, and saccharine (C7H5NO3S); and a second additive of at least one selected from a group consisting of sodium dialkyl sulfosuccinate, sodium lauryl sulfate, polyethylene glycol, polyethylene glycol methylether, and polyethylene glycol lauryl amineether to have excellent smoothness and wettability, thereby forming a nickel electroplating layer which is uniform and smooth and has no unplated part and improve soldering characteristics regardless of the surface state and structural shape of an external terminal electrode which is a plated article, and chip parts using the same.

Abstract: The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH2, OCH2CH3, C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: Described is an aqueous nickel-iron alloy electroplating bath comprising 260-280 grams/liter nickel chloride; 10-15 grams/liter ferrous ammonium sulfate; 0.8-1.9 grams/liter acid saccharin and 0.4-1.9 grams/liter of naphalene trisulfonic acid. Also, an aqueous nickel electroplating bath is described comprising 230-310 grams/liter nickel chloride, 0.1-1.9 grams/liter acid saccharin and 0.4-1.9 grams/liter napthalene trisulfonic acid.

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, cadmium, tin/zinc, zinc/nickel and tin/nickel.

Abstract: A slide member having a highly lubricative and highly abrasion-resistant plating layer formed on the sliding surface thereof. The plating layer contains fine particles of graphite selected from flake graphite, vein graphite and/or amorphous graphite in its metallic matrix. The plating layer has a hardness of not less than 550 in terms of Hv and is produced by using a plating solution containing naphthalene sulfanate of formalin condensate as surface active agent. The matrix is preferable to be a Ni—P type metallic matrix and the dispersed fine particles of graphite are preferable having a size of 0.1 to 20 &mgr;m and are contained by 0.1 to 10 wt % relative to the matrix.

Abstract: An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stress in a Watts bath, a chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulses and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel alloy or cobalt alloy platings without internal stress.

Abstract: A method of electrodepositing nickel and nickel alloys on a metal surface of a substrate wherein a Watts or other nickel deposition electrolyte is used as the bath in the presence of a conventional base brightener. According to the invention, an ethylene-oxide adduct or propylene-oxide adduct or ethyleneoxide/propylene-oxide adduct is added in an amount less than 5 mg/l and the deposition is carried out at 40 to 75.degree. C. and the concentration of the adduct and the temperature are so selected that during operation and with visual inspection there is no cloudiness nor any diffuse scattering of light incident upon the bath.

Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro

Abstract: This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.

Abstract: Nickel-plated shaped parts are produced by galvanic precipitation of nickel from aqueous-acid baths which contain as essential constituents one or several nickel salts, one or several inorganic acids and one or several brighteners. As brighteners are used thiourea salts having general formula (I), in which R.sup.1 to R.sup.4 stand for hydrogen, C.sub.1 to C.sub.18 -alkyl, which may be substituted by carboxyl groups, C.sub.1 to C.sub.4 -alkoxycarbonyl groups or cyano groups, C.sub.2 to C.sub.12 -alkenyl, C.sub.2 to C.sub.12 -alkinyl, C.sub.5 to C.sub.8 -cycloalkyl, C.sub.7 to C.sub.12 -phenylalkyl or phenyl, which may be substituted by one or two C.sub.1 to C.sub.4 -alkyl residues, C.sub.1 to C.sub.4 -alkoxy residues, halogen atoms, hydroxyl groups, phenyl groups, phenyl residues or C.sub.1 to C.sub.4 alkoxycarbonyl groups; Y sands for a chemical bond or for linear or branched alkylene, alkenylene or alkinylene having each up to 20 C.

Abstract: Nickelized shaped articles are produced by electrodeposition of nickel from aqueous acidic baths containing as essential constituents one or more nickel salts, one or more inorganic acids and one or more brighteners by a procedure in which the brighteners used are phosphonium salts I ##STR1## where R.sup.1 to R.sup.3 are each C.sub.1 -C.sub.18 -alkyl, which may be carboxyl-, C.sub.1 -C.sub.4 -alkoxycarbonyl- or cyano-substituted, C.sub.2 -C.sub.12 -alkenyl, C.sub.2 -C.sub.12 -alkynyl, C.sub.5 -C.sub.8 -cycloalkyl, C.sub.7 -C.sub.12 -phenylalkyl, phenyl, which may be substituted by one or two substituents selected from the group consisting of C.sub.1 -C.sub.4 -alkyl, C.sub.1 -C.sub.4 -alkoxy, halogen, hydroxyl, phenyl and C.sub.1 -C.sub.4 -alkoxycarbonyl, or mono- or di(C.sub.1 -C.sub.4 -alkyl)amino,R.sup.4 and R.sup.5 are each hydrogen or C.sub.1 -C.sub.4 -alkyl,A is hydrogen or a group of the formula --CO--H, --CO--R.sup.6, --CO--OH, --CO--OR.sup.6, --CO--CH.sub.2 --CO--OR.sup.6, --O--CO--H, --O--CO--R.sup.

Abstract: A process for producing nanocrystalline materials, and in particular nanocrystalline nickel having an average grain size of less than about 11 nanometers is described. The nanocrystalline material is electrodeposited onto the cathode in an aqueous acidic electrolytic cell by application of a pulsed D.C. current. The cell electrolyte also contains a stress reliever, such as saccharin, which helps to control the grain size. The novel product of the invention find utility as wear resistant coatings, hydrogen storage materials, magnetic materials and as catalysts for hydrogen evolution.

Abstract: A carbon composite tensile test specimen for high temperature testing and a method of fabricating the same are disclosed. A plurality of holes are drilled in first and second end sections of the specimen and then the end sections are electroplated with nickel. The nickel plating of the end sections prevents breakage of the ends in the jaws of a tensile testing apparatus. For high-temperature testing, a standard-sized specimen may be used with the jaws in the hot zone.