Abstract: An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising a source of nickel ions, and optionally a source of ions of at least one alloying metal, at least one buffering agent, at least one of a dimer of a compound of formula (I) or mixtures thereof wherein R1 is a substituted or unsubstituted alkenyl group, R2 may be present or not, and if present R2 is a —(CH2)n—SO3? group, wherein n is an integer in the range of 1-6, and wherein one or more of the hydrogens in the group may be replaced by a substituent, preferably hydroxide; and a method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy with said aqueous bath.

Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.

Abstract: Briefly described, embodiments of this disclosure include compounds (e.g., such as Formula II, Formula II-a, and specific compounds shown in Table 1), pharmaceutical compositions, methods of treating a host infected with a virus from the Flaviviridae family of viruses, methods of inhibiting HCV replication in a host, methods of inhibiting the binding of NS4B polypeptide to the 3?UTR of HCV negative strand RNA in a host, methods of treating liver fibrosis in a host, and the like.

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts as NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 is a carbon in the aromatic ring, and wherein RX—N—RY represents a substituted amine, and RX and RY represent any combination of CH3, C2H5, and hydrogen, except that RX and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100. The polymeric phenazonium compound is usable in as an additive in a metal plating bath.

Abstract: A process of making a polymeric phenazonium compound having the general formula: wherein R1, R2, R4, R5, R6, R8 and R9 are the same or different, and represent hydrogen, a low alkyl or a substituted aryl, R3 starts with NH2 and is diazotized followed by polymerization, R5 and R8 may alternatively represent monomeric or polymeric phenazonium radicals, R7 with its substituent group is a substituted amine, with RX and RY representing any combination of CH3, C2H5, and hydrogen, except that RX and RY cannot both be hydrogen, A is an acid radical, and n is an integer from 2 to 100, preferably from 2 to 20 is described. The polymeric phenazonium compound is usable in as an additive in a metal plating bath.

Abstract: A process for the preparation of N-allyl compounds of the general formula I ##STR1## in which ##STR2## denotes a nitrogen-containing heterocyclic compound, R.sup.1, R.sup.3, and R.sup.4 independently denote hydrogen or C.sub.1 -C.sub.4 alkyl,R.sup.2 denotes hydrogen or methyl,n is equal to 1, 2, 3, or 4, andX denotes a water-solubilizing anion,wherein a compound of formula II ##STR3## is caused to react, in aqueous medium, with a compound of formula III ##STR4## in which A denotes a radical which can be eliminated as an anion. The compounds produced by the process of the invention are very well suited for use as brighteners in nickel electroplating.

Abstract: Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.