Utilizing Specified Anode Patents (Class 205/292)
  • Patent number: 6251251
    Abstract: An anode assembly including a perforated anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface.
    Type: Grant
    Filed: November 16, 1998
    Date of Patent: June 26, 2001
    Assignee: International Business Machines Corporation
    Inventors: Cyprian E. Uzoh, Panayotis C. Andricacos, John Owen Dukovic, Robert P. Westerfield, Jr.
  • Patent number: 6113759
    Abstract: An anode assembly includes a perforated anode and an electrical contact assembly attached to the anode. A perforated anode holder holds the anode. The anode holder includes perforations at least in a bottom wall such that plating solution may flow through perforations in the anode holder and perforations in the anode. An anode isolator separates the anode and a cathode. The anode isolator includes at least one curvilinear surface. The contact assembly includes a closed or substantially closed cylinder member of titanium or titanium alloy, a copper lining or disk disposed within the cylinder, and a titanium or titanium alloy post fixed and in electrical engagement with the lining or disk.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: September 5, 2000
    Assignee: International Business Machines Corporation
    Inventor: Cyprian E. Uzoh
  • Patent number: 6099711
    Abstract: The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes and applying direct current, only uneven metal distribution can be attained on complex shaped workpieces. By using a pulse current or pulse voltage method, the problem of the coatings being of varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes.
    Type: Grant
    Filed: April 23, 1998
    Date of Patent: August 8, 2000
    Assignee: Atotech Deutschland GmbH
    Inventors: Wolfgang Dahms, Heinrich Meyer, Stefan Kretschmer
  • Patent number: 5935402
    Abstract: A process and assembly for stabilizing organic additives in an electrolytic solution while electroplating copper. The process includes forming a protective film on a first surface of an anode and minimizing contact between the electrolytic solution and a second surface of the anode which is further from the cathode than the first surface. An anode housing is used to minimize contact between the electrolytic solution and the second surface of the anode. The housing includes two side walls and a bottom wall, each having a groove, and a sealing back plate. The anode is fitted in the grooves such that the first surface of the anode is in contact with the electrolytic solution and the second surface of the anode abuts against the sealing back plate. The anode housing may be used in an electroplating system including the anode housing, a plating tank containing the electrolytic solution, a cathode immersed in the electrolytic solution, and an anode, which preferably is in the shape of a slab.
    Type: Grant
    Filed: October 9, 1998
    Date of Patent: August 10, 1999
    Assignee: International Business Machines Corporation
    Inventor: Lisa A. Fanti
  • Patent number: 5628892
    Abstract: A length of electroplated metal foil, typically copper foil is prepared by placing a stationary arcuate anode concentrically with a rotating cathode drum to define a channel therebetween, passing a plating solution through the channel, conducting electricity across the channel for depositing metal on the cathode drum, and separating the metal deposit from the cathode drum. The anode includes a plurality of circumferentially arranged electrode segments formed of a valve metal material and coated with a platinum group metal or oxide thereof. The electrode segments are removably attached and electrically connected to a back plate. The split anode is easy in assembly and disassembly and, hence, in maintenance and repair, has a high degree of precision in configuration and dimensions, and ensures manufacture of copper foil of quality with a minimized variation in thickness during continuous operation.
    Type: Grant
    Filed: May 17, 1994
    Date of Patent: May 13, 1997
    Assignee: TDK Corporation
    Inventors: Yukio Kawashima, Kazuhide Ohe, Hiroyuki Nakada
  • Patent number: 5580437
    Abstract: A particular anode comprising an electrochemically active material selected from the group consisting of the oxides of the elements tin, germanium and lead and mixtures comprising at least one of the respective oxides of such elements is useful in an electrochemical cell for the direct production of essentially dry halogen gas from essentially anhydrous halogen halide, or in a process for such production of essentially dry halogen gas. This cell or process may be used to produce halogen gas such as chlorine, bromine, fluorine and iodine from a respective anhydrous hydrogen halide, such as hydrogen chloride, hydrogen bromide, hydrogen fluoride and hydrogen iodide.
    Type: Grant
    Filed: May 20, 1994
    Date of Patent: December 3, 1996
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: James A. Trainham, III, Clarence G. Law, Jr., John S. Newman, Kenneth B. Keating, Douglas J. Eames
  • Patent number: 5543522
    Abstract: There are disclosed a process for preparing an ambient temperature molten salt, which comprises treating an ambient temperature molten salt consisting essentially of 20 to 50 mole % of an aluminum halide and 80 to 50 mole % of an onium halide, containing oxygen-containing impurities originating from water with thionyl chloride anda process for preparing an ambient temperature molten salt for effecting aluminum electroplating, which comprises treating mixed ambient temperature molten salts consisting essentially of 30 to 50 mole % of an aluminum halide and 70 to 50 mole % of an onium halide, containing oxygen-containing impurities originating from water with thionyl chloride, and then adding aluminum halide to the molten salt to prepare an ambient temperature molten salt composition consisting essentially of 50 to 80 mole % of an aluminum halide and 50 to 20 mole % of an onium halide.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: August 6, 1996
    Assignees: Mitsubishi Chemical Corporation, Nisshin Steel Co., Ltd.
    Inventors: Takayuki Kawahara, Hitoshi Suzuki, Asao Kominato
  • Patent number: 5407556
    Abstract: A process of producing a metallic foil by electrolysis by depositing the metallic foil on a cathode by electrolysis from a sulfuric acid acidic solution is disclosed, which comprises using an electrode having a coating of an electrode active material containing a platinum group metal oxide as an anode and carrying out the electrolysis in an electrolyte containing from 1 to 20 ppm of a lead component when a fluorine component does not exist in the electrolyte or an electrolyte containing from 0.2 to 1 ppm of a fluorine component and from 0.1 to 20 ppm of a lead component when a fluorine component exists in the electrolyte. The life of the electrode can be prolonged and a metallic foil can be stably produced by electrolysis for a long period of time by preventing the lead component(s) derived from the raw material from mixing into the metallic foil.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: April 18, 1995
    Assignee: Permelec Electrode Ltd.
    Inventors: Makoto Shimada, Takayuki Shimamune, Yasuo Nakajima
  • Patent number: 5262040
    Abstract: A metal surface is now described having enhanced adhesion of subsequently applied coatings. The substrate metal of the article, such as a valve metal as represented by titanium, is provided with a highly desirable surface characteristic for subsequent coating application. This can be initiated by selection of a metal of desirable metallurgy and heat history, including prior heat treatment to provide surface grain boundaries which may be most readily etched. In subsequent etching operation, the surface is made to exhibit well defined, three dimensional grains with deep grain boundaries. Subsequently applied coatings, by penetrating into the etched intergranular valleys, are desirably locked onto the metal substrate surface and provide enhanced lifetime even in rugged commercial environments.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: November 16, 1993
    Assignee: ELTECH Systems Corporation
    Inventors: Kenneth L. Hardee, Lynne M. Ernes, Richard C. Carlson
  • Patent number: 5143593
    Abstract: A method of copper-plating a material whereby electrolysis is performed using an electrolytic plating cell including a diaphragm which separates an anode chamber having therein an insoluble metal electrode as an anode from a cathode chamber having therein the material to be plated as a cathode, and further using an electrolyte solution containing copper ions and an additive, wherein the electrolyte is fed to the cathode chamber in a manner such that the copper ion concentration in the electrolyte within the cathode chamber is kept constant and electrolyte is further fed to the anode chamber at a rate of from about 0.2 to 11 ml/KAh.
    Type: Grant
    Filed: June 18, 1991
    Date of Patent: September 1, 1992
    Assignee: Permelec Electrode Ltd.
    Inventors: Kenichi Ueno, Kazuhiro Hirao, Genzo Yamane
  • Patent number: 5100517
    Abstract: Copper plating cells which utilize soluble copper anodes which replenish the electrolyte with copper ions are normally used for applying copper layers to steel filaments. The amount of copper in such soluble anodes is diminished throughout the plating procedure and ultimately such soluble copper anodes need to be replaced. It has been discovered that insoluble anodes can be utilized in such plating cells.
    Type: Grant
    Filed: April 8, 1991
    Date of Patent: March 31, 1992
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Thomas W. Starinshak, Gary P. Wood
  • Patent number: RE36985
    Abstract: A particular anode comprising an electrochemically active material selected from the group .[.comprising.]. .Iadd.consisting of .Iaddend.the oxides of the elements tin, germanium and lead and mixtures comprising at least one of the respective oxides of such elements is useful in an electrochemical cell for the direct production of essentially dry halogen gas from essentially anhydrous halogen halide, or in a process for such production of essentially dry halogen gas. This cell or process may be used to produce halogen gas such as chlorine, bromine, fluorine and iodine from a respective anhydrous hydrogen halide, such as hydrogen chloride, hydrogen bromide, hydrogen fluoride and hydrogen iodide.
    Type: Grant
    Filed: June 8, 1998
    Date of Patent: December 12, 2000
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: James Arthur Trainham, III, Clarence Garland Law, Jr., John S. Newman