Utilizing Organic Compound-containing Bath Patents (Class 205/302)
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Patent number: 11915860Abstract: A laminated core includes a plurality of electrical steel sheets stacked on each other and coated with an insulation coating on both surfaces thereof, and an adhesion part provided between the electrical steel sheets adjacent to each other in a stacking direction and configured to adhere the electrical steel sheets to each other, wherein an adhesion area ratio of the electrical steel sheet by the adhesion part is 1% or more and 40% or less.Type: GrantFiled: December 17, 2019Date of Patent: February 27, 2024Assignee: NIPPON STEEL CORPORATIONInventors: Ryu Hirayama, Kazutoshi Takeda
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Patent number: 11525187Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.Type: GrantFiled: February 21, 2020Date of Patent: December 13, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Koji Tatsumi, Kyohei Mineo, Hirotaka Hirano
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Patent number: 11421334Abstract: A tin solution applicable to tin film formation by solid electrolyte deposition, and a method for forming a tin film using the solution are provided. The tin solution contains tin methanesulfonate, methanesulfonic acid, water, an isopropyl alcohol, and a polyethylene-block-poly (ethylene glycol).Type: GrantFiled: October 21, 2019Date of Patent: August 23, 2022Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Hirofumi Iisaka
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Patent number: 10793962Abstract: An aqueous indium or indium alloy plating bath comprising a source of indium ions, an acid, a source of halide ions, a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and a dihydroxybenzene derivative according to formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, and a process for deposition of indium or an indium alloy wherein the disclosed bath is used.Type: GrantFiled: January 25, 2017Date of Patent: October 6, 2020Assignee: Atotech Deutschland GmbHInventors: Jan Sperling, Stefan Pieper, Grigory Vazhenin, Mauro Castellani, Andreas Kirbs, Dirk Rohde
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Patent number: 10186456Abstract: A method includes forming an ILD to cover a gate stack of a transistor. The ILD and the gate stack are parts of a wafer. The ILD is etched to form a contact opening, and a source/drain region of the transistor or a gate electrode in the gate stack is exposed through the contact opening. A conductive capping layer is formed to extend into the contact opening. A metal-containing material is plated on the conductive capping layer in a plating solution using electrochemical plating. The metal-containing material has a portion filling the contact opening. The plating solution has a sulfur content lower than about 100 ppm. A planarization is performed on the wafer to remove excess portions of the metal-containing material. A remaining portion of the metal-containing material and a remaining portion of the conductive capping layer in combination form a contact plug.Type: GrantFiled: April 20, 2017Date of Patent: January 22, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Sheng Wang, Chi-Cheng Hung, Chen-Yuan Kao, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai
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Patent number: 9064985Abstract: The invention relates to nickel-cobalt alloys as current collectors and conductive interconnects, and to methods of deposition thereof on transparent conductive oxides. The invention further relates to transparent conductive oxides on which a nickel-cobalt alloy is deposited and to electrodes made of such transparent conductive oxides for photochemical applications, in particular, for dye-sensitized solar cells (DSSCs).Type: GrantFiled: October 25, 2007Date of Patent: June 23, 2015Assignee: BAR-ILAN UNIVERSITYInventors: Arie Zaban, Larissa Grinis
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Patent number: 8906217Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: GrantFiled: July 24, 2012Date of Patent: December 9, 2014Assignee: Enthone Inc.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, Jr., Chen Xu
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Publication number: 20140348450Abstract: A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.Type: ApplicationFiled: December 6, 2012Publication date: November 27, 2014Applicants: Mahle International GmbH, Mahle Engine Systems UK LimitedInventor: Roohollah Kachoosangi
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Publication number: 20140054175Abstract: An acidic aqueous composition for semiglossy tin electroplating has a water-soluble tin (II)-containing substance and a surfactant. The surfactant includes a surfactant (A) comprising N,N?,N?-polyoxyethylene-N-alkyl-1,3-diaminopropane. The surfactant (A) the number of carbon atoms of the alkyl group that bonds to N ranges from 14 to 18. The weight-average molecular weight of the surfactant (A) ranges from 300 to 1500.Type: ApplicationFiled: February 28, 2013Publication date: February 27, 2014Applicant: YUKEN INDUSTRY CO., LTD.Inventors: Yoshinori Kusunoki, Shinya Akamatsu
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Patent number: 8518230Abstract: A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.Type: GrantFiled: July 13, 2005Date of Patent: August 27, 2013Assignee: Rohm and Haas Electronic Materials LLCInventor: André Egli
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Patent number: 8466314Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.Type: GrantFiled: April 26, 2011Date of Patent: June 18, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Motoya Shimazu, Yasuo Ohta
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Patent number: 8440066Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.Type: GrantFiled: April 6, 2007Date of Patent: May 14, 2013Assignee: C. Uyemura & Co., Ltd.Inventors: Isamu Yanada, Masanobu Tsujimoto
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Patent number: 8337688Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: August 15, 2011Date of Patent: December 25, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8329018Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: September 6, 2011Date of Patent: December 11, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Publication number: 20120298519Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.Type: ApplicationFiled: June 4, 2012Publication date: November 29, 2012Applicant: ENTHONE INC.Inventors: Andreas Königshofen, Danica Elbick, Christoph Werner, Wolfgang Clauberg, Peter Pies, Andreas Möbius
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Patent number: 8277630Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.Type: GrantFiled: January 13, 2010Date of Patent: October 2, 2012Assignee: Rohm and Haas Electronic Materials LLCInventor: Masanori Orihashi
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Publication number: 20120217168Abstract: Methods for the electrolytic preparation of tin coated metals are disclosed. Organic polybasic acids, such as methanedisulfonic acid [CH2(SO3H)2], 1,3-acetonedisulfonic acid [CO(CH2SO3H)2], anhydrides, and their water soluble salts, and mixtures thereof may be used as the electrolyte in the plating process or as the flux in the reflow process. Acetone, gamma-butyrolactone, or a mixture thereof, may be applied to a tin plated surface, either before or after reflow. The methods of the invention produce plated material that is free of blue haze.Type: ApplicationFiled: May 10, 2012Publication date: August 30, 2012Applicant: Arkema Inc.Inventors: Nicholas M. Martyak, Gary E. Stringer, Gary S. Smith
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Patent number: 8197663Abstract: Methods for the electrolytic preparation of tin coated metals are disclosed. Organic polybasic acids, such as methanedisulfonic acid [CH2(SO3H)2], 1,3-acetonedisulfonic acid [CO(CH2SO3H)2], anhydrides, and their water soluble salts, and mixtures thereof may be used as the electrolyte in the plating process or as the flux in the reflow process. Acetone, gamma-butyrolactone, or a mixture thereof, may be applied to a tin plated surface, either before or after reflow. The methods of the invention produce plated material that is free of blue haze.Type: GrantFiled: December 8, 2006Date of Patent: June 12, 2012Assignee: Arkema Inc.Inventors: Nicholas M. Martyak, Gary E. Stringer, Gary S. Smith
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Publication number: 20120132530Abstract: To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.Type: ApplicationFiled: October 22, 2011Publication date: May 31, 2012Applicant: Rohm and Haas Electronic Materials LLCInventors: Shinjiro HAYASHI, Makoto SAKAI, Mutsuko SAITO
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Patent number: 8083922Abstract: A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method.Type: GrantFiled: July 31, 2008Date of Patent: December 27, 2011Assignee: Taiyo Yuden Co., Ltd.Inventors: Makoto Orikasa, Toshiaki Makino
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Publication number: 20110308960Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.Type: ApplicationFiled: January 13, 2010Publication date: December 22, 2011Applicant: Rohm and Haas Electronic Materials LLCInventor: Masanori Orihashi
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Patent number: 8066864Abstract: The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II and also possibly repeat units comprising five- or six-membered aza aromatics or nitrogen-containing heterocycles. Polymers of this type are used as additive in electroplating baths since these enable a better layer thickness distribution of the electroplated layer.Type: GrantFiled: December 15, 2006Date of Patent: November 29, 2011Assignee: Coventya GmbHInventors: Alexander Jimenez, Thorsten Kühler
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Patent number: 8048284Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: April 2, 2008Date of Patent: November 1, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 8012334Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: GrantFiled: April 2, 2008Date of Patent: September 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Patent number: 7931793Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.Type: GrantFiled: April 24, 2008Date of Patent: April 26, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Motoya Shimazu, Yasuo Ohta
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Publication number: 20110065804Abstract: Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include highly-decorative electroplated finishes for bathroom and kitchen hardware, door hardware, and other highly lustrous products where antimicrobial protection is preferred.Type: ApplicationFiled: March 25, 2009Publication date: March 17, 2011Applicants: PAVCO INC., MICROBAN INTERNATIONAL LTD.Inventors: Leonard L. Diaddario, Matthew W. Stauffer
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Publication number: 20100108531Abstract: The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.Type: ApplicationFiled: November 2, 2009Publication date: May 6, 2010Applicant: MEC COMPANY LTD.Inventors: Mutsuyuki KAWAGUCHI, Tsuyoshi AMATANI, Yuko FUJII, Masami TSUTAE
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Publication number: 20100038254Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.Type: ApplicationFiled: October 14, 2009Publication date: February 18, 2010Applicant: Rohm and Haas Electronic Materials LLCInventors: Yasushi Takizawa, Masaaki Imanari
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Publication number: 20090224422Abstract: Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.Type: ApplicationFiled: January 9, 2009Publication date: September 10, 2009Inventor: Valery M. Dubin
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Publication number: 20090098398Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.Type: ApplicationFiled: April 6, 2007Publication date: April 16, 2009Applicant: C. UYEMURA & CO., LTD.Inventors: Isamu Yanada, Masanobu Tsujimoto
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Patent number: 7517443Abstract: The invention refers to a composition and method of electrolytic tinning in continuous a steel strip or plate with an electrolyte composition comprising the following components (g/l): Tin (in a form of tin sulfamate) 50-90, Sulfamic acid, free 40-100, Sulfates, in a form of SO42-0-15, Nitrogen-bearing block polymer 1-6, said block polymer being a copolymer of propylene oxide and ethylene oxide with molecular weight of 3950 to 6450 and “number of ethylene oxide links-to-number of propylene oxide links” ratio of 1.4-1.2:1.0 at initial buildup of required number of links from propylene oxide followed by oxyethylation.Type: GrantFiled: March 24, 2005Date of Patent: April 14, 2009Assignee: Danieli & C. Officine Meccaniche S.p.A.Inventors: Vladimir Andreevic Paramonov, Vitalij Polikarpovic Vinogradov, Rafkat Spartakovic Takhautdinov, Angelo Frixione, Michele Turchetto, Joseph Frimpong, Anatoliy Aleksandrovic Karpov, Galina Sergeevna Guljaeva
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Patent number: 7465384Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.Type: GrantFiled: February 28, 2006Date of Patent: December 16, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Peter R. Levey, Neil D. Brown
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Publication number: 20080187675Abstract: Disclosed herein arc novel liposome compositions generally including a foreign inclusion (e.g., diamond) component, and a liposome (e.g., i paucilamellar liposome) component. Also disclosed are methods of using these composition for plating and plate obtained thereby. Novel liposome compositions including components such as diamonds, are also disclosed, which can be used in a variety of applications, such as in abrasive, cosmetic or medical applications.Type: ApplicationFiled: September 10, 2007Publication date: August 7, 2008Applicant: Frank C. ScarpaInventors: Frank C. Scarpa, Dennis Johnson
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Patent number: 7357853Abstract: An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.Type: GrantFiled: August 6, 2004Date of Patent: April 15, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Michael P. Toben, Neil D. Brown, Angelo Chirafisi
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Patent number: 7314543Abstract: A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includes a bath-soluble tin compound, a strong acid, and a sulfopropylated anionic surfactant. In another aspect, a composition includes between approximately 20 and 40 grams per liter of one of stannous methane sulfonate, stannous sulfate, and a mixture thereof, between approximately 100 and 200 grams per liter of one of methanesulfonic acid, sulfuric acid, and a mixture thereof, and between approximately 1 and 2 grams per liter of one or more polyethyleneglycol alkyl-3-sulfopropyl diethers. In another aspect, a method includes electroplating tin with a current density of greater than approximately 30 mA/cm2 and a plating efficiency of greater than approximately 95%.Type: GrantFiled: October 14, 2003Date of Patent: January 1, 2008Assignee: Intel CorporationInventors: Ming Fang, Valery M. Dubin, Scott M. Haight
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Patent number: 7041820Abstract: There is provided a method by which various compounds (1) having a carboxyl group in the molecule have the carboxyl group converted to a (dioxolenon-4-yl)methyl ester at low cost, in a simple way and at high yield. The process for producing compounds of formula (3) according to the reaction scheme shown below comprises reacting carboxylic acids of formula (1) with 4-chloromethyldioxolenone compounds of formula (2) in a solvent in the presence of both a phase transfer catalyst and a metal iodide: [where Q represents an organic group, M represents a hydrogen atom, an alkali metal, an alkaline earth metal or a transition metal, R1 and R2 represent a hydrogen atom, an optionally substituted (C1-6 alkyl group or phenyl group)].Type: GrantFiled: March 29, 2002Date of Patent: May 9, 2006Assignees: Nippon Soda Co., Ltd., Daiichi Asubio Pharma Co., Ltd.Inventors: Toshiyuki Watai, Mitsuru Takase, Takahiro Sagae, Shigeo Mori, Noriaki Kawahara
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Patent number: 6923899Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.Type: GrantFiled: March 5, 2003Date of Patent: August 2, 2005Assignee: Shipley Company, L.L.C.Inventors: Neil D. Brown, Angelo Chirafisi, Peter R. Levey
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Patent number: 6911138Abstract: A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.Type: GrantFiled: September 13, 2002Date of Patent: June 28, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Shoichi Higuchi, Yoshihiko Takano, Kunihiko Hamada
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Patent number: 6860981Abstract: The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution.Type: GrantFiled: April 30, 2002Date of Patent: March 1, 2005Assignee: Technic, Inc.Inventors: Robert A. Schetty, III, Winnie Ruth Vickers
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Publication number: 20040251143Abstract: A tin electroplating solution, characterized in that it has a pH of 1.5 to 6.0 and comprises the following components: (1) 5 to 60 g/L of a tin (II) ion, (2) a complexing agent, (3) a surfactant and (4) 0.01 to 0.5 g/L of a bismuth (III) ion; and a method for the tin plating of electronic parts or the like which comprises using the tin electroplating solution are disclosed. The tin electroplating solution exhibits a soldering wettability being comparable with or superior to a conventional tin-lead alloy (solder) without the use of hazardous lead or an organic brightening agent.Type: ApplicationFiled: February 27, 2004Publication date: December 16, 2004Applicant: Rohm and Haas Electronic Materials, L.L.C.Inventors: Suda Kazuyuki, Makoto Kondo
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Publication number: 20040232000Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.Type: ApplicationFiled: June 21, 2004Publication date: November 25, 2004Applicant: Shipley Company, L.L.C.Inventor: Jeffrey N. Crosby
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Patent number: 6821681Abstract: An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, such that fresh or spent electrolyte can be used interchangeably in these type of cells.Type: GrantFiled: August 10, 2001Date of Patent: November 23, 2004Inventor: Johan C. Fitter
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Patent number: 6773568Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.Type: GrantFiled: July 16, 2003Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
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Publication number: 20040149587Abstract: A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound having between 4 and 18 carbon atoms which includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom. The compound is present in an amount sufficient to complex the metal in the solution and inhibit oxidation of the metal. In particular, the complexing agent and metal ion are present in a concentration ratio of between about 3:1 and 9:1 to reduce or minimize agglomeration of the substrates during electroplating. If necessary, a suitable pH adjusting agent can be included in the solution to maintain the pH of the solution in the range of between about 3.5 to 5.5.Type: ApplicationFiled: January 22, 2004Publication date: August 5, 2004Inventor: George Hradil
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Publication number: 20040104122Abstract: A method for coating zinc, zinc plated, or steel articles with a hydroxy benzoic acid protective coating by coating a cleaned zinc, zinc plated, or steel with a hydoxy benzoic acid composition having a pH of about 2.0 to 5.0; and coating cleaned tin surfaced articles with a composition having a PH of 2.0 to 12.0, and the composition having as its essential ingredients proteins, amino acids, amino acid—protein compounds and amine alcohols; and the articles produced thereby along with the coated articles having an appropriate paint thereon.Type: ApplicationFiled: December 2, 2002Publication date: June 3, 2004Inventor: John W. Bibber
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Patent number: 6736954Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.Type: GrantFiled: October 2, 2001Date of Patent: May 18, 2004Assignee: Shipley Company, L.L.C.Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
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Publication number: 20040086697Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;, &pgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.Type: ApplicationFiled: July 16, 2003Publication date: May 6, 2004Applicant: Shipley Company, L.L.C.Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
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Patent number: 6730209Abstract: In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied by lower molecular weight alcohols. In a preferred embodiment, a diol along with low alcohol is added to a bath comprising sulfonic acid, surfactant, grain refiner and brightening agents comprising an aromatic aldehyde and a carboxylic acid.Type: GrantFiled: February 22, 2002Date of Patent: May 4, 2004Assignee: Lucent Technologies Inc.Inventors: Joseph A. Abys, Frank Stanley Humiec, Kenneth J. Murski, Yun Zhang
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Patent number: 6706418Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.Type: GrantFiled: June 29, 2001Date of Patent: March 16, 2004Assignee: Shipley Company L.L.C.Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
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Patent number: RE39476Abstract: Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.Type: GrantFiled: January 10, 2005Date of Patent: January 23, 2007Assignee: Shipley Company, L.L.C.Inventors: Neil D. Brown, George A. Federman, Angelo B. Chirafisi, Gregory Lai