Utilizing Organic Compound-containing Bath Patents (Class 205/302)
  • Patent number: 10793962
    Abstract: An aqueous indium or indium alloy plating bath comprising a source of indium ions, an acid, a source of halide ions, a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and a dihydroxybenzene derivative according to formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, and a process for deposition of indium or an indium alloy wherein the disclosed bath is used.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: October 6, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Jan Sperling, Stefan Pieper, Grigory Vazhenin, Mauro Castellani, Andreas Kirbs, Dirk Rohde
  • Patent number: 10186456
    Abstract: A method includes forming an ILD to cover a gate stack of a transistor. The ILD and the gate stack are parts of a wafer. The ILD is etched to form a contact opening, and a source/drain region of the transistor or a gate electrode in the gate stack is exposed through the contact opening. A conductive capping layer is formed to extend into the contact opening. A metal-containing material is plated on the conductive capping layer in a plating solution using electrochemical plating. The metal-containing material has a portion filling the contact opening. The plating solution has a sulfur content lower than about 100 ppm. A planarization is performed on the wafer to remove excess portions of the metal-containing material. A remaining portion of the metal-containing material and a remaining portion of the conductive capping layer in combination form a contact plug.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: January 22, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sheng Wang, Chi-Cheng Hung, Chen-Yuan Kao, Yi-Wei Chiu, Liang-Yueh Ou Yang, Yueh-Ching Pai
  • Patent number: 9064985
    Abstract: The invention relates to nickel-cobalt alloys as current collectors and conductive interconnects, and to methods of deposition thereof on transparent conductive oxides. The invention further relates to transparent conductive oxides on which a nickel-cobalt alloy is deposited and to electrodes made of such transparent conductive oxides for photochemical applications, in particular, for dye-sensitized solar cells (DSSCs).
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: June 23, 2015
    Assignee: BAR-ILAN UNIVERSITY
    Inventors: Arie Zaban, Larissa Grinis
  • Patent number: 8906217
    Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: December 9, 2014
    Assignee: Enthone Inc.
    Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, Jr., Chen Xu
  • Publication number: 20140348450
    Abstract: A sliding bearing having a composite layer comprising carbon nanostructures (6) incorporated within a metallic matrix (5), and a method of manufacture of such a sliding bearing by electroplating.
    Type: Application
    Filed: December 6, 2012
    Publication date: November 27, 2014
    Applicants: Mahle International GmbH, Mahle Engine Systems UK Limited
    Inventor: Roohollah Kachoosangi
  • Publication number: 20140054175
    Abstract: An acidic aqueous composition for semiglossy tin electroplating has a water-soluble tin (II)-containing substance and a surfactant. The surfactant includes a surfactant (A) comprising N,N?,N?-polyoxyethylene-N-alkyl-1,3-diaminopropane. The surfactant (A) the number of carbon atoms of the alkyl group that bonds to N ranges from 14 to 18. The weight-average molecular weight of the surfactant (A) ranges from 300 to 1500.
    Type: Application
    Filed: February 28, 2013
    Publication date: February 27, 2014
    Applicant: YUKEN INDUSTRY CO., LTD.
    Inventors: Yoshinori Kusunoki, Shinya Akamatsu
  • Patent number: 8518230
    Abstract: A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: August 27, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: André Egli
  • Patent number: 8466314
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 18, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • Patent number: 8440066
    Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: May 14, 2013
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Isamu Yanada, Masanobu Tsujimoto
  • Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8329018
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20120298519
    Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
    Type: Application
    Filed: June 4, 2012
    Publication date: November 29, 2012
    Applicant: ENTHONE INC.
    Inventors: Andreas Königshofen, Danica Elbick, Christoph Werner, Wolfgang Clauberg, Peter Pies, Andreas Möbius
  • Patent number: 8277630
    Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: October 2, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Publication number: 20120217168
    Abstract: Methods for the electrolytic preparation of tin coated metals are disclosed. Organic polybasic acids, such as methanedisulfonic acid [CH2(SO3H)2], 1,3-acetonedisulfonic acid [CO(CH2SO3H)2], anhydrides, and their water soluble salts, and mixtures thereof may be used as the electrolyte in the plating process or as the flux in the reflow process. Acetone, gamma-butyrolactone, or a mixture thereof, may be applied to a tin plated surface, either before or after reflow. The methods of the invention produce plated material that is free of blue haze.
    Type: Application
    Filed: May 10, 2012
    Publication date: August 30, 2012
    Applicant: Arkema Inc.
    Inventors: Nicholas M. Martyak, Gary E. Stringer, Gary S. Smith
  • Patent number: 8197663
    Abstract: Methods for the electrolytic preparation of tin coated metals are disclosed. Organic polybasic acids, such as methanedisulfonic acid [CH2(SO3H)2], 1,3-acetonedisulfonic acid [CO(CH2SO3H)2], anhydrides, and their water soluble salts, and mixtures thereof may be used as the electrolyte in the plating process or as the flux in the reflow process. Acetone, gamma-butyrolactone, or a mixture thereof, may be applied to a tin plated surface, either before or after reflow. The methods of the invention produce plated material that is free of blue haze.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: June 12, 2012
    Assignee: Arkema Inc.
    Inventors: Nicholas M. Martyak, Gary E. Stringer, Gary S. Smith
  • Publication number: 20120132530
    Abstract: To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.
    Type: Application
    Filed: October 22, 2011
    Publication date: May 31, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro HAYASHI, Makoto SAKAI, Mutsuko SAITO
  • Patent number: 8083922
    Abstract: A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 27, 2011
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Makoto Orikasa, Toshiaki Makino
  • Publication number: 20110308960
    Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
    Type: Application
    Filed: January 13, 2010
    Publication date: December 22, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Patent number: 8066864
    Abstract: The invention relates to polymers which comprise at least partially cross-linked main chains constructed from repeat units of the general formula I and possibly repeat units of the general formula II and also possibly repeat units comprising five- or six-membered aza aromatics or nitrogen-containing heterocycles. Polymers of this type are used as additive in electroplating baths since these enable a better layer thickness distribution of the electroplated layer.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: November 29, 2011
    Assignee: Coventya GmbH
    Inventors: Alexander Jimenez, Thorsten Kühler
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8012334
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 7931793
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 26, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • Publication number: 20110065804
    Abstract: Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include highly-decorative electroplated finishes for bathroom and kitchen hardware, door hardware, and other highly lustrous products where antimicrobial protection is preferred.
    Type: Application
    Filed: March 25, 2009
    Publication date: March 17, 2011
    Applicants: PAVCO INC., MICROBAN INTERNATIONAL LTD.
    Inventors: Leonard L. Diaddario, Matthew W. Stauffer
  • Publication number: 20100108531
    Abstract: The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 6, 2010
    Applicant: MEC COMPANY LTD.
    Inventors: Mutsuyuki KAWAGUCHI, Tsuyoshi AMATANI, Yuko FUJII, Masami TSUTAE
  • Publication number: 20100038254
    Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.
    Type: Application
    Filed: October 14, 2009
    Publication date: February 18, 2010
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yasushi Takizawa, Masaaki Imanari
  • Publication number: 20090224422
    Abstract: Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.
    Type: Application
    Filed: January 9, 2009
    Publication date: September 10, 2009
    Inventor: Valery M. Dubin
  • Publication number: 20090098398
    Abstract: Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.
    Type: Application
    Filed: April 6, 2007
    Publication date: April 16, 2009
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Isamu Yanada, Masanobu Tsujimoto
  • Patent number: 7517443
    Abstract: The invention refers to a composition and method of electrolytic tinning in continuous a steel strip or plate with an electrolyte composition comprising the following components (g/l): Tin (in a form of tin sulfamate) 50-90, Sulfamic acid, free 40-100, Sulfates, in a form of SO42-0-15, Nitrogen-bearing block polymer 1-6, said block polymer being a copolymer of propylene oxide and ethylene oxide with molecular weight of 3950 to 6450 and “number of ethylene oxide links-to-number of propylene oxide links” ratio of 1.4-1.2:1.0 at initial buildup of required number of links from propylene oxide followed by oxyethylation.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: April 14, 2009
    Assignee: Danieli & C. Officine Meccaniche S.p.A.
    Inventors: Vladimir Andreevic Paramonov, Vitalij Polikarpovic Vinogradov, Rafkat Spartakovic Takhautdinov, Angelo Frixione, Michele Turchetto, Joseph Frimpong, Anatoliy Aleksandrovic Karpov, Galina Sergeevna Guljaeva
  • Patent number: 7465384
    Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: December 16, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Peter R. Levey, Neil D. Brown
  • Publication number: 20080187675
    Abstract: Disclosed herein arc novel liposome compositions generally including a foreign inclusion (e.g., diamond) component, and a liposome (e.g., i paucilamellar liposome) component. Also disclosed are methods of using these composition for plating and plate obtained thereby. Novel liposome compositions including components such as diamonds, are also disclosed, which can be used in a variety of applications, such as in abrasive, cosmetic or medical applications.
    Type: Application
    Filed: September 10, 2007
    Publication date: August 7, 2008
    Applicant: Frank C. Scarpa
    Inventors: Frank C. Scarpa, Dennis Johnson
  • Patent number: 7357853
    Abstract: An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: April 15, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael P. Toben, Neil D. Brown, Angelo Chirafisi
  • Patent number: 7314543
    Abstract: A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includes a bath-soluble tin compound, a strong acid, and a sulfopropylated anionic surfactant. In another aspect, a composition includes between approximately 20 and 40 grams per liter of one of stannous methane sulfonate, stannous sulfate, and a mixture thereof, between approximately 100 and 200 grams per liter of one of methanesulfonic acid, sulfuric acid, and a mixture thereof, and between approximately 1 and 2 grams per liter of one or more polyethyleneglycol alkyl-3-sulfopropyl diethers. In another aspect, a method includes electroplating tin with a current density of greater than approximately 30 mA/cm2 and a plating efficiency of greater than approximately 95%.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: January 1, 2008
    Assignee: Intel Corporation
    Inventors: Ming Fang, Valery M. Dubin, Scott M. Haight
  • Patent number: 7041820
    Abstract: There is provided a method by which various compounds (1) having a carboxyl group in the molecule have the carboxyl group converted to a (dioxolenon-4-yl)methyl ester at low cost, in a simple way and at high yield. The process for producing compounds of formula (3) according to the reaction scheme shown below comprises reacting carboxylic acids of formula (1) with 4-chloromethyldioxolenone compounds of formula (2) in a solvent in the presence of both a phase transfer catalyst and a metal iodide: [where Q represents an organic group, M represents a hydrogen atom, an alkali metal, an alkaline earth metal or a transition metal, R1 and R2 represent a hydrogen atom, an optionally substituted (C1-6 alkyl group or phenyl group)].
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: May 9, 2006
    Assignees: Nippon Soda Co., Ltd., Daiichi Asubio Pharma Co., Ltd.
    Inventors: Toshiyuki Watai, Mitsuru Takase, Takahiro Sagae, Shigeo Mori, Noriaki Kawahara
  • Patent number: 6923899
    Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: August 2, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Neil D. Brown, Angelo Chirafisi, Peter R. Levey
  • Patent number: 6911138
    Abstract: A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: June 28, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akihiro Motoki, Shoichi Higuchi, Yoshihiko Takano, Kunihiko Hamada
  • Patent number: 6860981
    Abstract: The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: March 1, 2005
    Assignee: Technic, Inc.
    Inventors: Robert A. Schetty, III, Winnie Ruth Vickers
  • Publication number: 20040251143
    Abstract: A tin electroplating solution, characterized in that it has a pH of 1.5 to 6.0 and comprises the following components: (1) 5 to 60 g/L of a tin (II) ion, (2) a complexing agent, (3) a surfactant and (4) 0.01 to 0.5 g/L of a bismuth (III) ion; and a method for the tin plating of electronic parts or the like which comprises using the tin electroplating solution are disclosed. The tin electroplating solution exhibits a soldering wettability being comparable with or superior to a conventional tin-lead alloy (solder) without the use of hazardous lead or an organic brightening agent.
    Type: Application
    Filed: February 27, 2004
    Publication date: December 16, 2004
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Suda Kazuyuki, Makoto Kondo
  • Publication number: 20040232000
    Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.
    Type: Application
    Filed: June 21, 2004
    Publication date: November 25, 2004
    Applicant: Shipley Company, L.L.C.
    Inventor: Jeffrey N. Crosby
  • Patent number: 6821681
    Abstract: An interchangeable electrolyte contains an additive that promotes interchangeable use between batteries and electroplating cells by limiting dendritic deposition in battery cells and promoting a smooth finish in an electroplating cell, such that fresh or spent electrolyte can be used interchangeably in these type of cells.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: November 23, 2004
    Inventor: Johan C. Fitter
  • Patent number: 6773568
    Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: August 10, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
  • Publication number: 20040149587
    Abstract: A solution for use in connection with the deposition of one or more metals on electroplatable substrates. This solution includes water; a metal ion; and a complexing agent. The complexing agent is advantageously an organic compound having between 4 and 18 carbon atoms which includes at least two hydroxyl groups and a five or six membered ring that contains at least one oxygen atom. The compound is present in an amount sufficient to complex the metal in the solution and inhibit oxidation of the metal. In particular, the complexing agent and metal ion are present in a concentration ratio of between about 3:1 and 9:1 to reduce or minimize agglomeration of the substrates during electroplating. If necessary, a suitable pH adjusting agent can be included in the solution to maintain the pH of the solution in the range of between about 3.5 to 5.5.
    Type: Application
    Filed: January 22, 2004
    Publication date: August 5, 2004
    Inventor: George Hradil
  • Publication number: 20040104122
    Abstract: A method for coating zinc, zinc plated, or steel articles with a hydroxy benzoic acid protective coating by coating a cleaned zinc, zinc plated, or steel with a hydoxy benzoic acid composition having a pH of about 2.0 to 5.0; and coating cleaned tin surfaced articles with a composition having a PH of 2.0 to 12.0, and the composition having as its essential ingredients proteins, amino acids, amino acid—protein compounds and amine alcohols; and the articles produced thereby along with the coated articles having an appropriate paint thereon.
    Type: Application
    Filed: December 2, 2002
    Publication date: June 3, 2004
    Inventor: John W. Bibber
  • Patent number: 6736954
    Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Publication number: 20040086697
    Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;, &pgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Application
    Filed: July 16, 2003
    Publication date: May 6, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
  • Patent number: 6730209
    Abstract: In accordance with the invention, the volatility of a solder plating bath with volatile brighteners such as aldehydes has its volatility reduced by the addition of diols to the bath. The diols are advantageously 1,3 propanediol or 1,2 propanediol and are accompanied by lower molecular weight alcohols. In a preferred embodiment, a diol along with low alcohol is added to a bath comprising sulfonic acid, surfactant, grain refiner and brightening agents comprising an aromatic aldehyde and a carboxylic acid.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: May 4, 2004
    Assignee: Lucent Technologies Inc.
    Inventors: Joseph A. Abys, Frank Stanley Humiec, Kenneth J. Murski, Yun Zhang
  • Patent number: 6706418
    Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: March 16, 2004
    Assignee: Shipley Company L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
  • Publication number: 20040040860
    Abstract: A method for determining whether effective coverage of the interior of a bottle with a sprayed sanitizer in a bottle fill-and-cap operation is attained by using a fluorescing solution, preferably comprising riboflavin and sucrose dissolved in water, that is sprayed on the interior of the bottle by the same spray system by which the sanitizer is sprayed. After application of the fluorescing solution, UV light is applied to the bottle interior to activate the fluorescing solution and thus make evident the spray pattern. Spray pattern adjustments can be made as needed, in order to be certain that the entirety of the inside surface of the bottle is coated. Once the spray pattern is thus set, the equipment is qualified to be used for production, with the sanitizer being sprayed according to the same spray pattern.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 4, 2004
    Inventors: Tammy Foster, Christine Jansen, James D. Schuman
  • Publication number: 20030226759
    Abstract: Provided for is a solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combination thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxidation of divalent tin ions. Also provided for is a method for electroplating comprising electroplating a substrate using an electroplating solution comprising a hydroxy benzene sulfonic acid or salt thereof in an amount effective to decrease the oxidation of tin ions.
    Type: Application
    Filed: March 5, 2003
    Publication date: December 11, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Neil D. Brown, Angelo Chirafisi, Peter R. Levey
  • Publication number: 20030201188
    Abstract: The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less. Advantageously, the tin deposits are provided during electroplating from a specially formulated plating solution.
    Type: Application
    Filed: April 30, 2002
    Publication date: October 30, 2003
    Inventors: Robert A. Schetty, Winnie Ruth Vickers
  • Patent number: RE39476
    Abstract: Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: January 23, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Neil D. Brown, George A. Federman, Angelo B. Chirafisi, Gregory Lai