Utilizing Inorganic Cyanide-containing Bath Patents (Class 205/306)
  • Patent number: 11932959
    Abstract: This application provides a copper plating solution for a composite current collector, including a leveling agent represented by a general formula (1) where an anion X is F?, Cl?, or Br?; R1, R2, and R3 are each independently selected from O or S; and R4, R5, and R6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: March 19, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Jia Peng, Mingling Li, Xin Liu, Qisen Huang
  • Patent number: 10793956
    Abstract: The present invention provides an additive for high-purity copper electrolytic refining and a method of producing high-purity copper using the additive. The additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in electrolytic refining for producing high-purity copper. The additive includes a main agent formed of a non-ionic surfactant which has a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, and a stress relaxation agent formed of a polyvinyl alcohol or a derivative thereof.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: October 6, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Kubota, Yoshie Tarutani, Kiyotaka Nakaya
  • Patent number: 10428434
    Abstract: The present invention provides an additive for high-purity copper electrolytic refining, a method of producing high-purity copper, and a high-purity electrolytic copper. This additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in copper electrolytic refining. The additive includes a silver and chlorine reducing agent of electrolytic copper which is formed of tetrazoles which is one of a tetrazole and a tetrazole derivative.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 1, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya
  • Patent number: 9234291
    Abstract: Techniques for electrodepositing zinc (Zn)-containing films are provided. In one aspect, a method of preparing a Zn electroplating solution is provided. The method includes the following steps. The solution is formed from a mixture of at least one zinc salt, a sulfonic acid and a solvent. The sulfonic acid is quenched with a base. A pH of the solution is adjusted to be either less than about 3.5 or greater than about 8.0. The pH of the solution can be adjusted by adding additional sulfonic acid to the solution to adjust the pH of the solution to be less than about 3.5 or by adding a second base to the solution to adjust the pH of the solution to be greater than about 8.0. A Zn electroplating solution and an electroplating method are also provided.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: January 12, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Patent number: 6749953
    Abstract: A zinc whiskerless galvanized product has a multi-layer rust prevention film that provides excellent rust prevention, self-repair ability, and coating adhesion. A manufacturing method provides a zinc whiskerless galvanized product having the multi-layer rust prevention film. The multi-layer rust prevention film can be provided without the use of chemicals injurious to the environment such as sexivalent chrome. The multi-layer rust prevention film can be applied to various electronic components including computer equipment, communication equipment, or the like.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: June 15, 2004
    Assignee: Sambix Corporation
    Inventors: Akira Sawatari, Ryouichi Muroi, Takazumi Katano, Eiki Mizuno
  • Patent number: 5953306
    Abstract: A micro needle probe apparatus that includes a probe and its associated electronic circuit. The electronic circuit is formed in a substrate and includes at least one metal interconnection layer. The probe is cantilevered over the electronic circuit and is composed of a metal probe arm, a support post that anchors one end of the probe arm to the substrate, and a micro needle mounted adjacent the moveable end of the probe arm. The probe apparatus may be used as the read/write mechanism of the moving-medium type memory device.
    Type: Grant
    Filed: April 25, 1997
    Date of Patent: September 14, 1999
    Assignee: Hewlett-Packard Company
    Inventor: You-Wen Yi
  • Patent number: 5203986
    Abstract: A method for manufacturing an electrogalvanized steel sheet excellent in spot weldability, which comprises the steps of: adding, into an acidic electrogalvanizing solution containing an oxidizer, a complexing agent, which is capable of forming a stable complex with zinc, in an amount within a range of from 0.001 to 10 moles per liter of the electrogalvanizing solution, or a pH buffer, which has a pH buffering effect in a solution having a pH value within a range of from 5 to 12, in an amount within a range of from 1 to 50 g per liter of the electrogalvanizing solution; and electrogalvanizing a steel sheet in the resultant acidic electrogalvanizing solution containing the complexing agent or the pH buffer in addition to the oxidizer, to form a galvanizing layer comprising zinc oxide or zinc hydroxide on the surface of the steel sheet.
    Type: Grant
    Filed: February 19, 1991
    Date of Patent: April 20, 1993
    Assignee: NKK Corporation
    Inventors: Yukimitsu Shiohara, Masaki Abe