Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Abstract: A spectrometer (10) for sample surface analysis by irradiation of the surface by primary particles and a corresponding method of surface analysis spectroscopy. The spectrometer (10) provides sample viewing and secondary charged particle collection substantially normal to the sample surface. A collection chamber (22) comprises a secondary charged particle lens arrangement (20) to focus the emitted particles in a downstream direction along a first normal axis (24) and thereby to define a charged particle optical crossover location (25); and a light-reflecting optical element (50) downstream of the lens arrangement and arranged to receive image light (41) and reflect it away from a second normal axis (42) for providing a viewable image of the surface.

Abstract: According to one aspect of the disclosure, the present invention provides methods and arrangements for milling the substrate of a semiconductor device and exposing a selected region in the substrate. A laser is directed at a selected area of the back side of the device to create a small marker to be used for alignment during the milling process. The substrate is then milled to expose the selected area within the substrate, using the marker as alignment.