Abstract: A liquid crystal display panel and manufacturing process thereof are provided. The liquid crystal display panel comprises a transparent substrate having a plurality of grooves, color filters of red, green and blue formed in the said grooves of the transparent substrate, a protective film formed on said color filters, and an electrode layer formed atop said protective film. A liquid crystal display panel having improved color reproduction and color characteristic can be obtained.

Abstract: A method for making an electro-optic device or electro-optic display system having enhanced performance over conventional flat-panel displays, wherein a planarizing polymeric resin layer is spin-cast on a flat-panel backplane containing pixel circuitry. The spin-cast layer is cured to provide a flat backplane. Vias are opened in the cured polymeric resin to each pixel. Metal is deposited to fill the vias and to form a confluent, overlying metal layer on the upper surface. The metal layer is patterned and etched to form individual mirrors over each pixel. The metal acts as both a switchable electrode and as a high aperture, highly reflective mirror over each pixel. Electro-optic devices which may be made using such a process are also disclosed.

Abstract: A method of manufacturing a thin film diode incorporated in a liquid crystal display, comprising a lower electrode connected with a signal electrode, an anodic oxidation film formed on the surface of the lower electrode, and an upper electrode formed so as to overlie the lower electrode via the anodic oxidation film and connected with a pixel electrode.

Abstract: A method for manufacturing a display, which includes first and second substrates, each having an inner light shielding region and an edge light shielding region, includes the steps of defining the edge light shielding region into a first portion and a second portion, and defining an area of the first substrate. The area includes the first portion of the edge light shielding region. The area including the first portion of the edge light shielding region is removed and leaves the second portion of the edge light shielding region. The first and second substrates are combined at the second portion of the edge light shielding region.

Abstract: An RIE method and apparatus for etching through the material layer of a transparent-electrode (ITO) in a single continuous step at a rate better than 100 .ANG./min and with a selectivity better than 20 to 1 is disclosed. Chamber pressure is maintained at least as low as 60 mTorr. A reactive gas that includes ethyl iodide C.sub.2 H.sub.5 I) is used alone or in combination with another gas such as O.sub.2. Plasma-induced light emissions of reaction products and/or the reactants are monitored to determine the time point of effective etch-through.

Abstract: There is provided a technique which prevents semiconductor devices under fabrication from being destroyed by pulse-like high potentials applied by plasma without adding any special fabrication step. A first line extending to a gate electrode of a thin film transistor is formed. A first insulation film is formed on the first line. A second line connected to a source region of the thin film transistor is formed on the insulation film. A second insulation film is formed on the second line. Then, a conductive pattern is formed on the second insulation film. A discharge pattern is formed the first and/or second line, and the first and/or second line is cut simultaneously with the formation of the conductive pattern.

Abstract: A method for forming a spatial light modulator (SLM) comprises forming a substrate (10) underneath a layer of Ferro-Electric crystal material (14) with a plurality of mirrored elements (12) disposed on the surface thereof. The process involves forming a layer of low stress oxide on the surface of the substrate over control pads or conductive strips (24) which are connected to underlying control elements. Openings (30) are formed in the oxide, followed by a formation of a conformal layer of aluminum (32). This is etched to form plugs (36) and then the substrate is subjected to a chemical/mechanical planarization step. This involves polishing the substrate to provide an optically flat surface. Thereafter, a layer of aluminum is then disposed on the surface of the substrate, patterned and etched to form the mirrored elements (12).

Abstract: A method of making a color filter array on a first substrate having an array of pixels, comprising the steps of: providing a transferable colorant on a second substrate and positioning such transferable layer in transferable relationship with the first substrate; transferring the colorant layer to the first substrate layer; applying a photoresist layer onto the colorant layer; and patterning the photoresist to form selected pads over pixels in the array; and etching the colorant layer through the openings in the patterned photoresist, leaving a portion of the colorant layer over the selected pixels.

Abstract: A method of fabricating a substrate includes the steps of providing a first substrate having a first thickness, providing a second substrate having a second thickness, providing an inner layer between the first and second substrates, assembling the first substrate, the second substrate, and the inner layer using an adhesive, and reducing the thickness of at least one of the first and second substrates.

Abstract: The invention pertains to a process for producing integrated active-matrix liquid crystal displays with a checkered silicon die subdivided into picture elements. Each picture element consists of a light-controlling element and an integrated, driving electronic switching element (20) which drives the translucent electrode (16) of the picture element. The array of picture elements is covered with glass layers (6, 12) with polarizing and analyzing layers on their outer faces. The invention in characterized in that the switching elements are integrated into a transparent silicon layer in which optic windows for the lighting-controlling elements are integrated. This is done by etching out a cavity in the rear side of the silicon die in the region of the liquid crystal display, leaving a thin layer of silicon or no silicon at all in the region of the optic window. On the thicker frame (10) of the silicon die there is a drive circuit.

Abstract: A liquid crystal device of the present invention includes a pair of substrates opposed to each other with a composite containing polymer regions and liquid crystal regions interposed therebetween, at least one of the substrates being transparent, wherein an insulator as a gap keeping member for keeping a gap between the substrates is formed in the polymer regions.

Abstract: A process for forming a light valve device comprises forming a semiconductor single crystal film to form a composite substrate by polishing a semiconductor single crystal substrate after an electric insulating substrate has been bonded thereto; forming a group of pixel electrodes for defining a pixel region and a group of switch elements for selectively energizing the pixel electrodes by integrating a pixel array portion over the composite substrate; forming a liquid crystal aligning means for the pixel region; superposing an opposed substrate over the composite substrate with a gap therebetween; and filling the gap with liquid crystal material.

Abstract: A method for forming a spatial light modulator (SLM) comprises forming a substrate (10) underneath a layer of Ferro-Electric crystal material (14) with a plurality of mirrored elements (12) disposed on the surface thereof. The process involves forming a layer of low stress oxide on the surface of the substrate over control pads or conductive strips (24) which are connected to underlying control elements. Openings (30) are formed in the oxide, followed by a formation of a conformal layer of aluminum (32). This is etched to form plugs (36) and then the substrate is subjected to a chemical/mechanical planarization step. This involves polishing the substrate to provide an optically flat surface. Thereafter, a layer of aluminum is then disposed on the surface of the substrate, patterned and etched to form the mirrored elements (12).

Abstract: One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking layer (208) is deposited on the active display area (402) of the substrate, leaving the bonding pads uncovered. The revealed bonding pads are then plasma etched, using the polyimide as an etch resist, and the top layer of ITO is selectively removed to reveal the underlying copper layer. The exposed copper layer (204) is then plated with a solderable metal to the desired thickness to form bonding pads that may be used with direct chip attachment schemes.

Abstract: A method for manufacturing a LCD device includes forming a first electrode on a lower substrate so as to be connected with an external terminal on the periphery of the lower substrate and forming a liquid crystal cell on a central portion of the lower substrate. A passivation layer is thereafter formed on the overall surface of the lower substrate. A first portion of the passivation layer which overlies a contact area of the first electrode is then removed using a laser beam directed through the lower substrate at the contact area of the first electrode and the overlying passivation layer. A conductive layer of paste is formed on the contact area of the first electrode, either before or after the removal of the first portion of the passivation layer, and an upper substrate is assembled to the lower substrate so that the conductive layer forms an electrical connection between the first electrode and a common electrode formed on an inner surface of the upper substrate.

Abstract: The present invention provides a method of forming a LCD in which the dissolution layer can be dissolved without the use of a strong etchant. The method according to the present invention uses alternating insulating layers and dissolution layers that are formed of different polymer resins. The polymer resin used for the insulting layer cannot be dissolved with a predetermined etchant, whereas the polymer resin used for the dissolution layer can be dissolved using the predetermined etchant. The predetermined etchant most advantageously used is water. A specific embodiment of the invention uses arabic rubber as the dissolution layer.

Abstract: A signal line structure for TFT-LCD and a method for fabricating the same are disclosed. The method comprises the steps of: forming a first metal and a second metal, in due order, on a glass substrate; defining the width (W.sub.1) of the second metal and subsequently, applying an etching process to the second metal; and depositing a third metal entirely on the resulting structure and defining the width (W.sub.2) of signal line so as to simultaneously remove the unnecessary portions of the first metal and said third metal. The signal line structure fabricated by the method is structured to comprise an insulating substrate; a first metal formed on the insulating substrate, having a good adhesiveness to said insulating substrate; a second metal formed on the first metal, having a low resistance; a third metal comprised of the same material that the first metal is, the third metal together with the first metal surrounding the second metal to prevent the oxidation of said second metal.

Abstract: A method of manufacturing liquid-crystal elements having two substrates on the surface of which a electrode group formed of stripe-shaped transparent electrodes and a metallic wiring pattern, and a liquid-crystal layer sandwiched between the two substrates, the method including the step of: repairing residue defects of the lower layer first and next residue defects of the upper layer by using etching solutions for selectively etching the transparent electrode or the metallic wiring pattern when etching residue defects between the stripe patterns of the transparent electrode and the metallic wiring are repaired.

Abstract: A plane of a treatment liquid holder having a number of through holes faces a treatment surface of a substrate. A treatment liquid is held between the treatment surface and the liquid holder by utilizing a surface tension of the treatment liquid. Since the treatment liquid is applied only to the treatment surface, an extremely small amount of treatment liquid suffices for the treatment. In addition, since a fresh treatment liquid can be used in every treatment, cross-contamination is suppressed and the treatment can be performed with safety at a low cost.

Abstract: A method for embodying a display cell with a counter-electrode contact pickup. Contact blocks 12 are separated from counter-electrode contacts 20 by passivation film 22. The electrodes linked between the counter-electrode and the contacts 20 are obtained by calcining the glue of the blocks so as to render them conductive by using a laser beam 30. In addition, the passivation film 22 is perforated by using the laser beam 30. This method finds particular application in the embodiment of liquid crystal display screens.

Abstract: A method of manufacturing a semiconductor device, which comprises steps of providing a substrate, forming an oxide layer of a metal material, which includes a tantalum or an alloy mainly containing a tantalum on the substrate, placing the substrate into a first chamber, activating an etching gas which includes a fluorine containing gas and an oxygen containing gas, in a second chamber, introducing the activated etching gas into the second chamber, and etching the oxide layer by the introduced gas selectively against the substrate.

Abstract: A description is given of a method and a device (1) for providing (replicating) a patterned resyntetic resin relief (37) on the surface (25) of a glass substrate (27). For this purpose, a UV-curable acrylate lacquer (33) is applied to the surface (25), after which a transparent mould (3) having a relief (13) is rolled-off over the surface (25). By means of a UV light source (17) and an elliptic mirror (21), the lacquer is cured at the location of the focal line (23), thereby forming said relief (37). The relief (13) of the mould (3) is replicated on the glass substrate (27). The method described enables a relief of small dimensions (10.times.10 .mu.m) to be seamlessly provided on a large fiat surface (1.times.1 m), without being hindered by large release forces.