Forming Or Treating Optical Article Patents (Class 216/24)
  • Patent number: 11399709
    Abstract: An otoscopic tip element having an axisymmetric hollow body having a substantially conical shape and made from a moldable plastic material includes a distal opening, a proximal opening, an interior surface, and an exterior surface. To maximize light transmissivity, a distal portion of the interior surface is provided with a smooth or polished surface finish and a proximal portion of the interior surface and the outer surface is provided with a textured surface finish such that light from a light source of an otoscope can be axially directed through the hollow body for emission through the distal opening, as well circumferentially through the exterior surface. The surface finish and color/tint of the speculum tip element can be adjusted or tuned to promote axial, circumferential and total light output relative to an intended medical target.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: August 2, 2022
    Assignee: Welch Allyn, Inc.
    Inventors: Robert L. Vivenzio, Raymond A. Lia
  • Patent number: 11402580
    Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: August 2, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Hong Chern, Min-Hsiang Hsu
  • Patent number: 11373907
    Abstract: A method of manufacturing a device chip includes applying, from a front surface of a wafer formed with devices in a plurality of regions partitioned by a plurality of crossing division lines, a laser beam of such a wavelength as to be absorbed in the wafer along the division lines, to form V-shaped laser processed grooves along the division lines, the laser processed grooves becoming shallower toward outer sides in a width direction; adhering an adhesive tape to the front surface of the wafer formed with the laser processed grooves; and grinding the wafer held by a chuck table, with the adhesive tape interposed therebetween, from a back surface, to divide the wafer while thinning the wafer to a finished thickness, thereby forming a plurality of device chips having inclined surfaces at outside surfaces thereof.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: June 28, 2022
    Assignee: DISCO CORPORATION
    Inventor: Satoshi Kumazawa
  • Patent number: 11314143
    Abstract: An optical switch device includes a first semiconductor structure configured to operate as a first waveguide and a second semiconductor structure configured to operate as a second waveguide. The second semiconductor structure is located above or below the first semiconductor structure and separated from the first semiconductor structure. The second semiconductor structure includes a portion of a first doped region doped with dopants of a first type and a portion of a second doped region doped with dopants of a second type that is different from the dopants of the first type.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 26, 2022
    Assignee: PSIQUANTUM CORP.
    Inventors: Mihai Vidrighin, Nikhil Kumar, Gary Gibson
  • Patent number: 11300754
    Abstract: A micro-optical bench includes a substrate having a multi-layer trench and a micro-lens aligned by and mounted to the substrate in the multi-layer trench.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: April 12, 2022
    Assignee: HRL Laboratories, LLC
    Inventors: Pamela R. Patterson, Florian G. Herrault, Oleg M. Efimov, Keyvan R. Sayyah
  • Patent number: 11287573
    Abstract: An optical device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure supporting a first optical mode, the second element, fabricated on a planarized top surface of the first element, comprises a passive waveguide structure supporting a second optical mode, and the third element, at least partly butt-coupled to the first element, comprises an intermediate waveguide structure, positioned such that a top surface of the intermediate structure underlies a bottom surface of the passive waveguide structure. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the first optical mode and the second optical mode. Mutual alignments of the first, second and third elements are defined using lithographic alignment marks.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: March 29, 2022
    Assignee: Nexus Photonics LLC
    Inventors: Chong Zhang, Hyun Dai Park, Minh Tran, Tin Komljenovic
  • Patent number: 11279613
    Abstract: An actuator element of a MEMS device is provided, which is fabricated using surface micromachining on a substrate. An insulating layer having a first portion contacts the substrate while a second portion is separated from the substrate by a gap. A metallic layer contacts the insulating layer having a first portion contacting the first portion of the insulating layer and a second portion contacting the second portion of the insulating layer. The second portion of the metallic layer is prestressed. Alternately, the actuator element includes a first insulating layer separated from the substrate by a gap. A metallic layer has a first portion contacting the substrate and a second portion contacting the insulating layer. A second insulating layer contacts a portion of the second portion of the metallic layer opposite the first insulating layer, where the second insulating layer is prestressed.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 22, 2022
    Inventors: LaVern A. Starman, John P K Walton, Harris J Hall
  • Patent number: 11209592
    Abstract: A device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure comprising: one portion, of effective cross-sectional area A1, supporting a first optical mode; and a second portion, butt-coupled to the first portion, of effective cross-sectional area A2>A1. The second element comprises a passive waveguide structure supporting a second optical mode. The third element, at least partly butt-coupled to the second portion, comprises an intermediate waveguide structure supporting intermediate optical modes. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the first optical mode and one intermediate optical mode. No adiabatic transformation occurs between any intermediate optical mode and the first optical mode.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: December 28, 2021
    Assignee: Nexus Photonics LLC
    Inventors: Chong Zhang, Hyun Dai Park, Minh Tran, Tin Komljenovic
  • Patent number: 11186512
    Abstract: Provided is a mold manufacturing method that is capable of manufacturing a mold of a complex shape particularly of an optical element with sufficient shape accuracy and within a relatively short time. This mold manufacturing method includes: a step for forming a base made of metal into a first shape through machining; a step for coating the base with a resin layer; a step for forming the resin layer into a second shape; and a step for forming the base into a third shape through dry-etching.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: November 30, 2021
    Assignee: NALUX CO., LTD.
    Inventors: Kazuya Yamamoto, Tatsuya Murayama, Yukinobu Nishio, Kayoko Fujimura
  • Patent number: 11169326
    Abstract: Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: November 9, 2021
    Assignee: Invensas Bonding Technologies, Inc.
    Inventors: Shaowu Huang, Javier A. Delacruz, Liang Wang, Guilian Gao
  • Patent number: 11156579
    Abstract: A method of manufacturing an electrode structure includes providing an initial structure, the initial structure including at least two elevated regions extending from a substrate, wherein top portions of the two elevated regions are separated by a first lateral distance, depositing material onto the elevated regions by means of physical vapor deposition such that adjacent top portions of the deposited material are separated by a second lateral distance that is smaller than the first lateral distance, and applying electrodes onto the top portions of the material.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 26, 2021
    Assignees: Albert-Ludwigs-Universitaet Freiburg, Fachhochschule Vorarlberg GmbH
    Inventors: Stefan Partel, Stephan Kasemann, Can Dincer, Jochen Kieninger, Gerald Urban
  • Patent number: 11145524
    Abstract: An apparatus for treating a substrate using a process gas includes a chamber having a treatment space defined therein, a substrate support unit for supporting the substrate in the treatment space, a gas supply pipe disposed in a ceiling surface of the chamber for supplying the process gas to the treatment space, and an exhaust unit for exhausting the process gas in the treatment space, wherein the exhaust unit includes an exhaust plate having an exhaust hole defined therein through which the process gas is exhausted, and an adjustment plate overlapping the exhaust plate, wherein the adjustment plate is constructed to control an opened amount of the exhaust hole when viewed from above.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: October 12, 2021
    Assignee: SEMES CO., LTD
    Inventor: Sukhwan Chi
  • Patent number: 11137672
    Abstract: A method of forming a mask includes forming a reflective multilayer over a substrate; forming a capping layer over the reflective multilayer, in which the capping layer includes a ruthenium-containing material and a low carbon solubility material that has a carbon solubility lower than a carbon solubility of the ruthenium-containing material; forming an absorption layer over the capping layer; and etching the absorption layer until exposing the capping layer.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Yun-Yue Lin
  • Patent number: 11133437
    Abstract: An optoelectronic device including an active area capable of supplying an electromagnetic radiation and sandwiched between first and second semiconductor layers, the first semiconductor layer delimiting a surface and including a first portion in contact with the active area and delimiting a first part of the surface and extending in a second portion delimiting a second part of the surface, the second portion forming a single-mode waveguide, the optoelectronic device including an opaque portion reflective for the electromagnetic radiation covering the first part and including a diffraction grating on the second part capable of extracting the electromagnetic radiation from the second portion.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 28, 2021
    Assignee: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
    Inventors: François Templier, Salim Boutami
  • Patent number: 11020739
    Abstract: Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: June 1, 2021
    Assignee: Illumina, Inc.
    Inventors: Hui Han, Dajun A. Yuan, M. Shane Bowen
  • Patent number: 11009663
    Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: May 18, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Hong Chern, Min-Hsiang Hsu
  • Patent number: 10930885
    Abstract: A display device includes a substrate, a circuit layer on the substrate, a display layer on the circuit layer, at least one hole in a display area of the substrate that penetrates the substrate, the circuit layer, and the display layer, and at least two grooves that surround the at least one hole, where each of the at least two grooves has an undercut structure. The substrate includes a first substrate, a first inorganic layer, a second substrate, and a second inorganic layer, which are sequentially stacked, and each of the at least two grooves extends down from the display layer into the second substrate.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: February 23, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD
    Inventors: Seunghun Kim, Sooyoun Kim, Wooyong Sung, Seungho Yoon, Moonwon Chang
  • Patent number: 10840309
    Abstract: A method of fabricating a color filter is provided. In the method of fabricating the color filter, a patterned sacrificial layer having a thickness difference is formed on a substrate such that a patterned black photosensitive spacing material layer is formed by a single-tone photomask or a half-tone photomask and has effects of an original black matrix, a main spacer, and a sub-spacer. Thus, production costs can be reduced and a high yield can be carried out.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: November 17, 2020
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Jiangjiang Song
  • Patent number: 10830961
    Abstract: In one embodiment, there is provided an optical fiber sound pickup device including: a housing having a substantially cylindrical structure; a vibration diaphragm mounted to an end face of a first side end of the housing; a ferrule including a main body of a substantially cylindrical shape, at least a part of the main body being mounted in the housing by cooperating with an inner wall of the housing, a head end of the main body that is close to the vibration diaphragm being separated from the vibration diaphragm by a distance; and an optical fiber fixedly extending through into the ferrule, a head face of the optical fiber being flush with an end face of the head end. A method and an equipment for manufacturing an optical fiber sound pickup device are also provided.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: November 10, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Saihua Chen
  • Patent number: 10795173
    Abstract: Optical grating components and methods of forming are provided. In some embodiments, a method includes providing an optically transparent substrate, and forming an optical grating layer on the substrate. The method includes forming an optical grating in the optical grating layer, wherein the optical grating comprises a plurality of angled components, disposed at a non-zero angle of inclination with respect to a perpendicular to a plane of the substrate. A first sidewall of the optical grating may have a first angle, and a second sidewall of the grating has a second angle different than the first angle. Modifying process parameters, including selectivity and beam angle spread, has an effect of changing a shape or dimension of the plurality of angled components.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: October 6, 2020
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Morgan Evans, Rutger Meyer Timmerman Thijssen, Joseph Olson, Peter Kurunczi
  • Patent number: 10795080
    Abstract: An optical receiver may include a planar lightwave circuit with an optical path and a tapered reflection surface to direct an optical beam toward a top surface of the planar lightwave circuit. The optical receiver may include a photodiode disposed onto the top surface of the planar lightwave circuit such that a receive portion of the photodiode is aligned to the optical path, wherein a gap between the photodiode and the planar lightwave circuit is less than 5 microns.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: October 6, 2020
    Assignee: Lumentum Operations LLC
    Inventors: Yujian Bao, Zhaoming Li
  • Patent number: 10782468
    Abstract: The present invention relates to a method for manufacturing an optical device comprising forming a first trench in a glass plate and a second trench perpendicular to the first trench, wherein the first trench has an end opening into the second trench. The trenches are treated with hydrofluoric acid. The first trench is filled with a material to form a waveguide, and a mirror is formed on the wall of the second trench opposite the waveguide. An encapsulation layer is deposited over the glass plate, waveguide and second trench.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: September 22, 2020
    Assignee: STMICROELECTRONICS SA
    Inventors: Folly Eli Ayi-Yovo, Cédric Durand, Frédéric Gianesello
  • Patent number: 10782451
    Abstract: A method for producing a reflection-reducing layer system is disclosed. In an embodiment, a method includes depositing an organic layer on the substrate, generating a nanostructure in the organic layer by a plasma etching process, applying a cover layer to the nanostructure, wherein the organic layer, the nanostructure and the cover layer together form a reflection-reducing structure, wherein the cover layer comprises an inorganic material or an organosilicon compound, and wherein the cover layer is at least 5 nm thick and performing a post-treatment after applying the cover layer, wherein a material of the organic layer is at least partially removed, decomposed or chemically converted, and wherein an effective refractive index neff,2 of the reflection-reducing structure after the post-treatment is smaller than an effective refractive index neff,1 of the reflection-reducing structure before the post-treatment.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: September 22, 2020
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Ulrike Schulz, Peter Munzert, Sabrina Wolleb, Friedrich Rickelt, Heiko Knopf
  • Patent number: 10773993
    Abstract: A cover glass and a manufacturing method thereof are provided, the method includes: coating a first organic layer on a transparent substrate; forming first via holes on the first organic layer at intervals, heating and melting the first organic layer to flow; wet-etching the transparent substrate having the first organic layer to form a first microstructure on a region of the transparent substrate not shielded by the first organic layer; and removing the first organic layer form the transparent substrate. The present disclosure breaks the limitation for preparing microstructures with size below 5 ?m in the existing photolithography process, the organic material in wet-etching process can be controlled by heating to make the organic material melted to flow. The size of the microstructure can be reduced and flexibly adjusted according to the pixel size of display panel, the speckle effect of the display device caused by anti-glare treatment can be reduced.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: September 15, 2020
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yong Yang, Yingbao Yang
  • Patent number: 10756507
    Abstract: A process of forming a semiconductor optical device is disclosed. The semiconductor optical device provides a waveguide structure accompanied with a heater for varying a temperature of the waveguide structure. The process includes steps of: (a) forming a striped mask on a semiconductor substrate; (b) selectively growing a dummy layer on the semiconductor substrate; (c) removing the patterned mask; (d) burying the dummy layer by a supplemental layer; (e) exposing a portion of the dummy layer by etching a portion of the supplemental layer; (f) and removing the dummy layer by immersing the dummy layer within a solution that shows an etching rate for the dummy layer enough faster than an etching rate for the supplemental layer and the substrate so as to leave a void in a region the dummy layer had existed.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: August 25, 2020
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Device Innovations, Inc.
    Inventors: Toshimitsu Kaneko, Takuya Fujii, Masami Ishiura, Taro Hasegawa, Toshiyuki Taguchi
  • Patent number: 10746937
    Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: August 18, 2020
    Assignee: Corning Incorporated
    Inventors: Douglas Llewellyn Butler, Stephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov, James Scott Sutherland
  • Patent number: 10718898
    Abstract: An optical device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure supporting a first optical mode, the second element comprises a passive waveguide structure supporting a second optical mode, and the third element, at least partly butt coupled to the first element, comprises an intermediate waveguide structure. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the first optical mode and the second optical mode. Mutual alignments of the first, second and third elements are defined using lithographic alignment marks.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 21, 2020
    Assignee: Nexus Photonics LLC
    Inventor: Hyundai Park
  • Patent number: 10712481
    Abstract: A method for fabricating a diffraction grating includes generating an ionized gas, passing the ionized gas through a gating structure to selectively directed gas toward a substrate, injecting an etchant gas into the directed gas, and exposing a surface of the substrate to the directed gas and the injected etchant gas to form grating structures on the surface of the substrate.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: July 14, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Nihar Ranjan Mohanty, Giuseppe Calafiore, Matthew E. Colburn, Austin Lane, Matthieu Charles Raoul Leibovici
  • Patent number: 10707965
    Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: July 7, 2020
    Assignee: Infinera Corporation
    Inventors: Timothy Butrie, Michael Reffle, Xiaofeng Han, Mehrdad Ziari, Vikrant Lal, Peter W. Evans, Fred A. Klsh, Jr., Donald J. Pavinski, Jie Tang, David Coult
  • Patent number: 10698167
    Abstract: A connector device for connecting optical fiber endpieces comprising an optoelectronic chip, a fiber end piece holder and a reflection surface. The chip is oriented for emitting and/or detecting optical signals along a first propagation direction normal to a circuit board. The reflection surface changes a propagation direction of optical signals from the first propagation direction to a different, second propagation direction and/or vice versa. The connector device comprises a layered optical stack mounted to the circuit board and designed for propagation of optical signals along the first propagation direction. The connector device further comprises a coupling adapter piece mounted to the layered optical stack that holds and/or secures the fiber end piece holder in an orientation enabling propagation of signals radiation along the second propagation direction. The reflection surface for changing between both propagation directions is comprised in the coupling adapter piece.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: June 30, 2020
    Assignee: Corning Optical Communcations LLC
    Inventors: Jeffery Alan DeMeritt, Wojciech Piotr Giziewicz, Christopher Paul Lewallen, James Phillip Luther, Jerald Lee Overcash, Rebecca Kayla Schaevitz
  • Patent number: 10690831
    Abstract: A diffraction grating includes a substrate and an array of triangular ridges extending from the substrate. The ridges run parallel to one another and have triangular cross-sections such that first sides of the ridges face in a first direction and adjacent second sides of the ridges face in a second, different direction. An array of grating lines is disposed over the first sides of the array of ridges, each grating line of the array of grating lines comprising a slab of transparent material supported by the first side of a corresponding ridge of the array of ridges. A refractive index of the array of grating lines is different from a refractive index of the array of ridges.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: June 23, 2020
    Assignee: Facebook Technologies, LLC
    Inventor: Giuseppe Calafiore
  • Patent number: 10684407
    Abstract: Techniques for fabricating a slanted structure are disclosed. In one embodiment, a method of fabricating a slanted structure in a material layer includes injecting a first reactive gas into an reactive ion source generator, generating a plasma that includes reactive ions in the reactive ion source generator, extracting at least some of the reactive ions from the plasma to form a collimated reactive ion beam towards the material layer, and injecting a second reactive gas onto the material layer. The collimated reactive ion beam and the second reactive gas etch the material layer both physically and chemically to form the slanted surface-relief structure.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: June 16, 2020
    Assignee: Facebook Technologies, LLC
    Inventor: Nihar Ranjan Mohanty
  • Patent number: 10670806
    Abstract: Method for preparing micro-optical structure on a film based on chemical mechanical polishing etching, combining photolithography technology with chemical mechanical polishing technology to make preparation and large-scale integration of large-size high-quality micro optical devices on-chip possible. The method comprises coating metal on film surface, selectively removing the metal film by photolithography (such as femtosecond laser selective ablation, ultraviolet photolithography, electron beam etching, ion beam etching, and reactive ion etching), chemical mechanical polishing, chemical corrosion or over polishing and other steps. Micro-optical devices on-chip prepared by the method have extremely high surface finish and extremely low optical loss.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: June 2, 2020
    Assignee: Shanghai Institute of Optics And Fine Mechanics, Chinese Academy of Sciences
    Inventors: Ya Cheng, Rongbo Wu, Jintian Lin, Jianhao Zhang, Min Wang
  • Patent number: 10668569
    Abstract: Disclosed herein is a laser processing apparatus including a controller. The controller includes a target pattern detecting section performing matching between patterns formed in each device imaged and a key pattern to thereby detect a target pattern included in each device, a spacing detecting section detecting the spacing in a Y direction between the target pattern and an ablation groove formed along each division line by ablation, and a map creating section creating a map showing the spacing in the Y direction between each target pattern and the ablation groove for the plural devices arranged along the ablation groove.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: June 2, 2020
    Assignee: DISCO CORPORATION
    Inventors: Kentaro Odanaka, Hironari Ohkubo, Zentaro Kawasaki
  • Patent number: 10558070
    Abstract: A transmissive-type liquid crystal display device includes a base material having transmissivity, a light-shielding body having a grid pattern in a plan view seen from a thickness direction of the base material, a pixel electrode, a first insulator that is provided to cover the light-shielding body and has transmissivity, and a second insulator that is disposed in contact with the first insulator between the base material and the pixel electrode and has transmissivity. A refractive index of the second insulator is higher than a refractive index of the first insulator. An outer edge of a surface of the second insulator on the pixel electrode side overlaps the light-shielding body in the plan view.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: February 11, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Yukihiro Sugiura
  • Patent number: 10545293
    Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 28, 2020
    Assignee: Corning Incorporated
    Inventors: Stephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov, Douglas Llewellyn Butler, James Scott Sutherland
  • Patent number: 10535565
    Abstract: A workpiece dividing method includes: a laser processing step of forming along each street a plurality of minute holes extending in a pulsed laser beam application direction; and a dividing step of pressing the streets by a pressing member to divide a wafer along the streets. The minute hole has one end opening at least one of a front surface and a back surface of the wafer and is decreased in diameter from the one end toward the other end. In the dividing step, the pressing member is pressed against that surface of the front surface and the back surface of the wafer at which the one end of the minute hole is not opening.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: January 14, 2020
    Assignee: DISCO CORPORATION
    Inventor: Nao Hattori
  • Patent number: 10488697
    Abstract: Embodiments of the present disclosure provide a pixel structure, including a plurality of sub-pixels arranged in an array, each sub-pixel including a display region and a non-display region, the non-display region of each sub-pixel being formed with a thin film transistor therein, the display region of each sub-pixel being formed therein with a sub-wavelength grating for transmitting therethrough light in a predetermined wavelength range. Embodiments of the present disclosure further provide a method of manufacturing a pixel structure, an array substrate including the pixel structure and a display device.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: November 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Zhidong Wang
  • Patent number: 10386553
    Abstract: An optical element (transmissive or reflective) includes a transmissive layer comprising two different optical media arranged among discrete volumes arranged along the layer. The discrete volumes are arranged to approximate a desired phase function (typically modulo 2?) and are smaller than an operational wavelength in order to provide a range of phase delays needed to adequately approximate the desired phase function.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: August 20, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Thomas W. Mossberg, Christoph M. Greiner, Dmitri Iazikov
  • Patent number: 10381029
    Abstract: A heat-assisted magnetic recording (HAMR) write apparatus includes a laser for providing energy and resides in proximity to a media during use. The HAMR write apparatus includes a write pole that writes to a region of the media, coil(s) for energizing the write pole and a waveguide optically coupled with the laser. The waveguide includes at least one multi-mode interference (MMI) device. The MMI device has at least one input, a plurality of outputs, a propagation section and a multi-mode interference (MMI) section. Energy from the laser propagates through the propagation section before the MMI section. The propagation section expands the energy from the laser to a plurality of modes. A first portion of the outputs is output from the propagation section. The MMI section is between the propagation section and a second portion of the plurality of outputs.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 13, 2019
    Assignee: WESTERN DIGITAL (FREMONT), LLC
    Inventors: Jianwei Mu, Sergei Sochava, Michael V. Morelli
  • Patent number: 10353240
    Abstract: A display apparatus includes a wire grid pattern layer and a capping layer. The wire grid pattern layer includes protrusions having the same shape and spaced at uniform intervals to form a wire grid. The capping layer is on the wire grid pattern layer. The protrusions include metal, and the capping layer includes metal oxide which is an oxide of the metal.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: July 16, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seon-Il Kim, Sungwon Cho, Ji Hun Kim, Yunjong Yeo, Sanggab Kim
  • Patent number: 10350791
    Abstract: There is provided a new and improved master manufacturing method, master, and optical body enabling more consistent production of optical bodies having a desired haze value, the master manufacturing method including: forming a first micro concave-convex structure, in which an average cycle of concavities and convexities is less than or equal to visible light wavelengths, on a surface of a base material body that includes at least a base material; forming an inorganic resist layer on the first micro concave-convex structure; forming, on the inorganic resist layer, an organic resist layer including an organic resist and filler particles distributed throughout the organic resist; and etching the organic resist layer and the inorganic resist layer to thereby superimpose and form on the surface of the base material a macro concave-convex structure and a second micro concave-convex structure.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: July 16, 2019
    Assignee: DEXERIALS CORPORATION
    Inventors: Shunichi Kajiya, Hideki Terashima, Yuichi Arisaka
  • Patent number: 10345533
    Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: July 9, 2019
    Assignee: CORNING INCORPORATED
    Inventors: Stephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov, Douglas Llewellyn Butler, James Scott Sutherland
  • Patent number: 10324031
    Abstract: A photonic processing module (100) comprises a high index-contrast waveguide device comprising a substrate (102), a first layer (104) disposed on the substrate having a first refractive index, and a relatively thin second layer (106) disposed on the first layer. The second layer has a second refractive index providing a high index-contrast with the first layer, and the device includes at least one thin-ridge waveguide element (108) formed in the second layer which supports a guided mode in a longitudinal direction. An optical input port (110) is configured to direct an input beam into a slab mode of the second layer, the beam being directed to propagate at a predetermined angle ? to the longitudinal direction of the thin-ridge waveguide element. The angle ? is associated with a resonant coupling between the slab mode of the second layer and the guided mode of the thin-ridge waveguide element.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: June 18, 2019
    Assignee: Royal Melbourne Institute of Technology
    Inventors: Arnan Mitchell, Thach G. Nguyen, Kiplimo Yego, Anthony Hope
  • Patent number: 10302826
    Abstract: Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle ? relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ? between the ion beam and a surface normal of the gratings. The gratings have slant angles ?? relative to the surface normal of the substrates. The rotation angles ? selected by an equation ?=cos?1 (tan(??)/tan(?)).
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: May 28, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rutger Meyer Timmerman Thijssen, Morgan Evans, Joseph C. Olson
  • Patent number: 10288980
    Abstract: Embodiments are directed to a (quasi) one-dimensional photonic crystal cavity. This cavity comprises a set of aligned pillars, where the pillars are embedded in a cladding. At least one of the pillars has a sandwich structure, wherein a layer of nonlinear optical material is between two layers of materials having, each, a refractive index that is higher than the refractive index of the nonlinear optical material. Embodiments can further include an all-optical modulator or an all-optical transistor, comprising a photonic crystal such as described above. Finally, embodiments are further directed to methods for modulating an optical signal, using such a photonic crystal cavity.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: May 14, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stefan Abel, Paul F. Seidler
  • Patent number: 10217916
    Abstract: A transparent light emitting diode (LED) includes a plurality of III-nitride layers, including an active region that emits light, wherein all of the layers except for the active region are transparent for an emission wavelength of the light, such that the light is extracted effectively through all of the layers and in multiple directions through the layers. Moreover, the surface of one or more of the III-nitride layers may be roughened, textured, patterned or shaped to enhance light extraction.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: February 26, 2019
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Shuji Nakamura, Steven P. DenBaars, Hirokuni Asamizu
  • Patent number: 10204644
    Abstract: A recording head includes a magnetic write transducer proximate a near-field transducer. The magnetic write transduce includes a yoke extending in a direction normal to a media-facing surface and a having an edge facing and recessed from the media-facing surface. A write pole extends beyond the first end of the yoke towards the media-facing surface and overlaps a first surface of the yoke that faces the near-field transducer. The write pole has a stepped edge facing away from the media-facing surface. Two or more coil turns are stacked relative to one another in a down-track direction. The two or more coils face a second surface of the yoke that is opposed to the first surface.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: February 12, 2019
    Assignee: Seagate Technology LLC
    Inventors: Mourad Benakli, Kirill Aleksandrovich Rivkin, Huaqing Yin, Hua Zhou, Tae-Woo Lee
  • Patent number: 10197737
    Abstract: Embodiments of the present disclosure are directed toward an optical apparatus that includes a semiconductor layer to propagate light from at least one light source. The optical apparatus may further include a curved echelle grating with a plurality of grating teeth, the echelle grating at an outer side of the semiconductor layer. The curved echelle grating may include a plurality of grating teeth, and a grating tooth of the plurality of grating teeth may have a grating facet and a shadow facet. A shadow facet may have an angle of grating greater than 0 degrees with respect to a normal of a curve of the curved echelle grating. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 5, 2019
    Assignee: Intel Corporation
    Inventor: Wenhua Lin
  • Patent number: 10134603
    Abstract: In an embodiment, a method of planarizing a surface includes applying a first layer to a surface including a protruding region including at least one compound semiconductor and a stop layer on an upper surface such that the first layer covers the surface and the protruding region, removing a portion of the first layer above the protruding region and forming an indentation in the first layer above the protruding region, the protruding region remaining covered by material of the first layer, and progressively removing an outermost surface of the first layer to produce a planarized surface including the stop layer on the upper surface of the protruding region and an outer surface of the first layer.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: November 20, 2018
    Assignee: Infineon Technologies AG
    Inventors: Albert Birner, Helmut Brech