Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).

Abstract: A glass film laminate comprises a glass film (2) and a supporting glass (3) laminated to each other. At least one of the contacting surface of the glass film (2) and the contacting surface of the supporting glass (3) comprises a region with a relatively large surface roughness and a region with a relatively small surface roughness.

Abstract: An introducer assembly includes a sheath having a sheath proximal end and distal end, and a passage therethrough. The introducer assembly further includes a handle assembly that is mechanically and/or bonded coupled with a tubular sheath.

Abstract: Disclosed is a metal laminated substrate for forming an epitaxial growth film for forming a semiconductor element having high biaxial crystal orientation on a surface of a metal substrate and a method of manufacturing the metal laminated substrate. The manufacturing method includes the steps of activating at least one surface of a metal plate T1 by sputter etching or the like; activating at least one surface of a metal foil T2 made of Cu or a Cu alloy which is cold-rolled at a rolling reduction of 90% or more; laminating the metal plate and the metal foil such that an activated surface of the metal plate and an activated surface of the metal foil face each other in an opposed manner and applying cold rolling to the metal plate and the metal foil which are laminated to each other at a rolling reduction of 10% or less, for example; and biaxially orienting crystals of the metal foil by heat treatment at a temperature of not lower than 150° C. and not higher than 1000° C.

Abstract: The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

Abstract: A method of manufacturing a textile fabric article comprises the steps of: (i) applying an uncured silicone elastomer (10) requiring UV radiation to trigger curing thereof to at least one portion of a carrier element (12); (ii) feeding the carrier element (12) and a piece of textile fabric (14) between movable co-acting compression members (16,18) so that the uncured silicone elastomer (10) is located between the carrier element (12) and the piece of textile fabric (14); (iii) exposing the uncured silicone elastomer (10) on the carrier element (12) to UV radiation upstream of the co-acting compression members (16,18); (iv) curing the uncured silicone elastomer (10) or allowing the uncured silicone elastomer (10) to cure to bond the silicone elastomer (10) to at least the piece of textile fabric (14); and (v) applying pressure to the carrier element (12) and the piece of textile fabric (14) via the co-acting compression members (16,18) for at least part of the curing process.

Abstract: A method for laminating a film on to an optical article and a bi-layer adhesive for use in the method. The bi-layer adhesive includes a latex adhesive layer or a specific silane adhesive and an HMA layer sequentially disposed on the film and dried to form a solid layer of uniform thinness throughout to provide optical quality. Various types of films may be employed to provide an optical function. Following optional pre-treatment steps, the adhesives are coated on to the film. An optical hot press technique is used to deliver heat and pressure over a short period of time to form a functionally-enhanced optical article with high adhesive strength.

Abstract: Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers.

Abstract: Disclosed is an electronic shielding light-transmitting member having an adhesive (2) and an electromagnetic shielding material (3) between two release films (1) and (4). By removing one of the release films (1) and (4) from the electronic shielding light-transmitting member and bonding the member to an optical filter or a plasma panel, there can be obtained an optical filter or a plasma panel having an electromagnetic shielding layer of excellent transparency.

Abstract: Methods for improving adhesion between a shape memory alloy and a polymeric material include functionalizing a surface of the shape memory polymer with a phosphorous containing compound or an organosilane coupling agent. Other methods include surface texturing the shape memory alloy surface, independently or in combination with the functionalization.

Abstract: A method for manufacturing a oriented substrate for forming an epitaxial thin film thereon, having a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The clad textured metal substrate includes a metallic layer and a copper layer bonded to at least one face of the above described metallic layer, wherein the above described copper layer has a {100}<001> cube texture in which a deviating angle ?? of crystal axes satisfies ???6 degree. The substrate has an intermediate layer on the surface of the copper layer, to form the epitaxial thin film thereon.

Abstract: Fuel tank attachment, composed of a blend of a first plastic and a second plastic, wherein the first and second plastics are not miscible, wherein the blend contains a compatibilizer to render the first and second plastics miscible, wherein the first plastic is a fuel-resistant plastic, and wherein the second plastic is a non-fuel-resistant plastic, wherein the fuel tank attachment relates to a neck fitting, in particular, to a filler neck or a valve, in particular, a tank venting valve, or a cap element, wherein the fuel tank attachment is molded from a blend as one piece.

Abstract: Systems and methods for Indirect Evaporative Cooling and for Two Stage Evaporative Cooling for conditioning fluids such as air are disclosed. The Indirect Evaporative Cooling Systems comprise scalable indirect evaporative heat exchangers formed with polymer substrates that have been treated to render one surface substantially hydrophilic while the other is substantially hydrophobic, with channels for passage of primary (cooled) an secondary (cooling) air streams between them. The Two Stage Evaporative Cooling System comprise an indirect evaporation component where the fluid is pre-cooled indirectly with the abovementioned scalable heat exchangers, followed by a direct evaporation stage where the pre-cooled fluid is further cooled directly by adiabatic evaporative cooling. The device employing these systems is scalable, energy-efficient, uses aseptic materials, filters/clean incoming fluids (e.g. air), circulates disinfected evaporating liquid (e.g. disinfected water and has enhanced performance efficiency.

Abstract: Method for manufacturing a heat exchanger, wherein two neighboring metal tubes (1) are joined to one another in the overlap areas at their open ends by a U-shaped end tube (3), using an adhesive (5), wherein a) the adhesive is applied to the overlap areas of the U-shaped end tube, and wherein the adhesive is selected so that after being applied to the overlap areas of the U-shaped end tube and before being bonded to the metal tubes, the adhesive is solid and not tacky at temperatures below 30° C. and does not cure without an activation step, b) the end tube with the overlap area and the adhesive applied thereto is attached to the metal tubes or inserted into the metal tubes, and c) the adhesive is activated thermally or by bombardment with high-energy radiation either before or after step b), so that it cures after step b) and bonds the metal tube to the U-shaped end tube in the overlap area.

Abstract: The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina template is formed on the substrate. When a rigid substrate such as Si is used, the resulting anodic alumina film is more tractable, easily grown on extensive areas in a uniform manner, and manipulated without danger of cracking. The substrate can be manipulated to obtain free-standing alumina templates of high optical quality and substantially flat surfaces. PAA films can also be grown this way on patterned and non-planar surfaces. Furthermore, under certain conditions, the resulting PAA is missing the barrier layer (partially or completely) and the bottom of the pores can be readily accessed electrically.

Abstract: A chemical barrier lamination has a first fluoropolymer layer, and a second fluoropolymer layer laminated to the first fluoropolymer layer and forming a non-porous, chemically inert, moisture vapor transmission barrier lamination. A method for making a chemical barrier lamination is also shown and described.

Abstract: A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.

Abstract: A method for forming a micromachined device is disclosed that includes providing a first silicon layer and a second silicon layer. A coating is provided on a first portion of the first layer. The first layer and the second layer are bonded to each other to form a micromachined device, the coating being effective to prevent the coated first portion of the first layer from bonding to the second layer.

Abstract: Plasma etching of a polymeric dielectric material such as polyurethane results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.

Abstract: The invention provides a chemical-mechanical polishing system for polishing a substrate comprising (a) a polishing component selected from an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) an aqueous carrier, and (c) the halogen adduct resulting from the reaction of (1) an oxidizing agent selected from the group consisting of iodine, bromine, and a combination thereof, and (2) a carbon acid having a pKa of about 3 to about 14, wherein the halogen adduct is present in a concentration of about 0.01 mM or more in the aqueous carrier. The invention also provides a method of polishing a substrate comprising (i) providing the aforementioned chemical-mechanical polishing system, (ii) contacting the substrate with the polishing system, and (iii) abrading at least a portion of the surface of the substrate with the polishing system to polish the substrate.

Abstract: A mirror package is provided which can reflect a laser to an external screen according to a video signal when the laser enters from outside, and a method of manufacturing the mirror package. The mirror is packaged with a glass to protect from external contamination, an inlet and an outlet are formed by, for example, an anisotropic etching on the glass and blocks a reflected light reflected from the glass. The mirror package is formed as a set, combined on a wafer using a wafer level package and diced to individual chips. Subsequently, a productivity is improved and a ghost image or phenomenon is removed.

Abstract: A method includes contacting a treatment composition including a permanganic acid to a surface of a first substrate to form a treated substrate surface, wherein the first substrate comprises a polyarylenesulfide. The method further includes adhesively bonding the treated substrate surface to a second substrate surface.

Abstract: A method of etching a silicon substrate is described. The method includes bonding a first silicon substrate to a sacrificial silicon substrate. The first silicon substrate is etched. A pressure is applied at an interface of the first silicon substrate and the sacrificial silicon substrate to cause the first silicon substrate to separate from the sacrificial silicon substrate. An apparatus having metal blades can be used to separate the substrates.

Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).

Abstract: The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).

Abstract: A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate includes the step of applying a guard defining a plurality of recesses to the substrate so that each set is located within a respective recess. The substrate is then segmented.

Abstract: A manufacturing method of an ink jet recording head including a discharge port for discharging ink includes the step of forming the discharge port by performing dry etching of a discharge port forming member for forming the discharge port, wherein the discharge port forming member is formed of a Si including resin, and the step of dry etching is performed by using an etching gas including oxygen and chlorine as necessary components.

Abstract: The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The present invention provides a clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a silver layer bonded to at least one face of the metallic layer, wherein the silver layer has a {100}<001> cube texture in which a deviating angle ?? of crystal axes satisfies ???9 degree. The textured metal substrate can be manufactured by subjecting the silver sheet containing 30 to 200 ppm oxygen by concentration to the orienting treatment of hot-working and heat-treating, and bonding the metal sheet with the oriented silver sheet by using a surface activated bonding process.

Abstract: An etching method is disclosed. The etching method includes the steps of: preparing a substrate 5; forming first and second films 61, 62 each having predetermined internal stress on the substrate so that the internal stresses of the first and second films 61, 62 are canceled out or reduced with each other; forming a plurality of initial holes 63 in the first and second films 61, 62 to form a mask 6; and forming a plurality of concave portions 3 in the substrate 5 at portions corresponding to the plurality of initial holes 63 by subjecting the substrate 5 to an etching process using the mask 6.

Abstract: A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfaces are smooth. Thus, those areas for propagation of the signal on signal lines have the circuit lines smooth to maximize the signal propagation effect, while those areas where the signal propagation is not critical are rough, which improves the adhesion of one layer to another. On the voltage planes, the surface in those regions opposite the smooth surfaces of the signal planes is smooth. Thus, these areas of the voltage planes can be maintained smooth while the other areas of the surface of the voltage planes can be roughened, providing good adhesion to the adjoining dielectric material.

Abstract: A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layer 12 to form a metal circuit 12 on the at least one side of the ceramic substrate 10.

Abstract: A method of improving the ability of plastic layers of a multi-layered optical disc to bond to adhesive materials includes exposing the plastic layers to a plurality of ions. In one embodiment, one side of a plastic layer of a multi-layered optical disc is exposed to a plurality of non-reactive ions, an adhesive material is applied to the side of the plastic layer that was exposed to the plurality of ions, and a second layer of the optical disc is secured to the adhesive material. In another embodiment, a plurality of ions is formed by directing gas molecules through an electric field, and at least 25% of the width of the plastic layer of the multi-layered optical disc is exposed to the plurality of ions at about the same time. The plastic layer is positioned so that the ions contact the plastic layer while the ions still have a charge, and the disc is moved so that at least 25% of the surface of the plastic layer is exposed to the plurality of ions.

Abstract: The invention provides a forming method of an ink jet print head substrate and an ink jet print head substrate, and a manufacturing method of an ink jet print head and an ink jet print head, in which adhesion between a substrate for forming an ink discharging pressure generating element and an ink flow path forming member is increased to increase reliability even if an ink flow path forming member is formed covering a long distance. In a forming method of an ink jet print head substrate or the like, in which an ink flow path forming member is attached onto a substrate on which an ink discharging pressure generating element is formed, minute pit is formed on an attachment region of the substrate for attaching the liquid flow path forming member.

Abstract: Methods of bonding glass and silicon-containing articles are disclosed. Bonding is achieved without use of adhesives or high temperature fusion. A wide variety of glass and silicon-containing articles may be bonded by the methods of the invention.

Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt.

Abstract: A balloon catheter and a method of making the balloon catheter, having a balloon which is bonded to an elongated shaft, and which has a first layer and a second layer and an improved bond between the balloon and the shaft. One aspect of the invention is directed to a balloon in which the balloon first layer includes eUHMWPE and has at least a section that has been oxidized with a chromic acid solution to provide improved bondability.

Abstract: Methods of bonding glass and silicon-containing articles are disclosed. Bonding is achieved without use of adhesives or high temperature fusion. A wide variety of glass and silicon-containing articles may be bonded by the methods of the invention.

Abstract: There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film is subjected to exposure and development processes, by which a ground resin film patterned into a wiring pattern is obtained. Then, on the patterned ground resin film, a low-resistance metal film made of Cu is formed by electroless plating.

Abstract: The invention relates to an electrical bridging material in the form of a dispersion containing particles of an oxidation-resistant electrically conductive material and a dispersing medium, the particles having an average particle size ranging from about 0.1 &mgr;m to about 5 mm. Such a bridging material is useful for establishing electrical conductivity between two electrically conductive surfaces, at least one of the surfaces being covered with an oxide film. Alternatively, the particles can be used as a component of an electrical bridging member adapted to be disposed between the two electrically conductive surfaces for establishing electrical conductivity therebetween.

Abstract: A method of improving the ability of plastic layers of a multi-layered optical disc to bond to adhesive materials includes exposing the plastic layers to a plurality of ions. In one embodiment, one side of a plastic layer of a multi-layered optical disc is exposed to a plurality of non-reactive ions, an adhesive material is applied to the side of the plastic layer that was exposed to the plurality of ions, and a second layer of the optical disc is secured to the adhesive material. In another embodiment, a plurality of ions is formed by directing gas molecules through an electric field, and at least 25% of the width of the plastic layer of the multi-layered optical disc is exposed to the plurality of ions at about the same time. The plastic layer is positioned so that the ions contact the plastic layer while the ions still have a charge, and the disc is moved so that at least 25% of the surface of the plastic layer is exposed to the plurality of ions.

Abstract: A method of manufacturing an electrode for a secondary battery by depositing a thin film composed of active material on a current collector in which a surface-treated layer such as an antirust-treated layer is formed, including the steps of: removing at least part of the surface-treated layer by etching the surface of the current collector with an ion beam or plasma in order to improve the diffusion of the current collector material into the active material thin film; and depositing the thin film on the surface of the current collector subjected to the etching step.

Abstract: A method of tape automated bonding a heater chip of an ink jet printer to a flexible circuit includes the step of attaching an electrically conductive bonding pad to a first portion of a surface of the heater chip. A mask is applied to a second portion of the surface of the heater chip. An exposed surface of the bonding pad is chemical dry etched for a predetermined time period to thereby remove contaminants from the etched exposed surface. The chemical dry etching is terminated at an end of the predetermined time period such that substantially none of the bonding pad is removed. Lastly, the flexible circuit is electrically connected to the etched exposed surface.

Abstract: A method for surface marking a solid substrate (1), according to which, during an exposures sequence, said substrate is exposed to coherent monochromatic light (2) in order to strip said substrate over an indented surface (3), wherein the exposure conditions, including duration, are set in order to restrict said indented surface to simple abrasion designed for the bonding of a printing medium, and the exposure sequence is followed by a sequence of projecting in discrete form, during which particles (6) of said printing medium, the deposition of which subsequently defines a printing element (4), are projected in targeted fashion into the indented surface (3, 31). A device for marking a surface of a substrate is also provided.

Abstract: There is provided a grating fabrication device and method to form gratings on a semiconductor substrate. The substrate is loaded into a reactor filled with an etchant solution, and an array of parallel light of interference light with different periods is projected onto the substrate to etch the portion of the substrate that is exposed to the light via an oxidation-reduction reaction. At the same time, the inclination angle of the substrate is selectively varied to obtain the different grating periods.

Abstract: A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer are disclosed. The composition includes hydrogen peroxide, inorganic acid, at least two corrosion inhibitors.

Abstract: A surface treatment, especially for titanium and aluminum alloys, forms a Si—Y sol-gel film covalently bonded on the metal surface to produce strong, durable adhesive bonds between the metal and an organic adhesive without using toxic chemicals and while significantly reducing or eliminating rinse water requirements of traditional anodizing or etching processes. The sol should produce bonds in a single application comparable in strength and performance to standard anodize controls. Parameters affecting performance include the sol composition, the ratio of silicon to yttrium in the sol, the ratio of other sol ingredients, the concentration of the sol, the carrier solvent, solution age, catalysts, surface pretreatment, application method, curing process, and primer used.

Abstract: A continuous process for forming multilayer circuit structures which includes applying and curing a film forming polymer onto the matte side of a copper foil. The opposite (shiny) side of the foil is optionally but preferably cleaned, and applied with a photoresist which is then optionally but preferably dried. The photoresist is exposed, and developed to remove the nonimage areas but leave the image areas. The foil under the removed nonimage area is then etched to form a copper pattern, and the remaining photoresist is optionally but preferably removed. The foil is then cut into sections, and then optionally but preferably punched with registration holes. The copper pattern is then optionally but preferably treated with a bond enhancing treatment, optionally but preferably inspected for defects, and laminated onto a substrate to form a multilayered circuit structure.

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

Abstract: A surface treatment method for thinning a silicon based substrate obtains a milky-dull color on an overall surface uniformly of the silicon based substrate. To be more specific, a surface opposite to a circuit-formed surface is mechanically polished, then the surface is etched using inert gas such as argon gas for producing plasma. This etching forms micro dimples uniformly on the surface. Next, the surface is further etched using fluorine based gas for producing plasma. This etching obtains a milky-dull color uniformly on the surface. As a result, printed marks on the surface can be read with ease, and pick-up errors in die-bonding can be reduced.

Abstract: An object of the present invention is to provide a solid electrolytic capacitor with excellent electrostatic capacitance and reduced dispersion of capabilities by treating the surface of a chemically formed aluminum film to form a dielectric film which is in contact an electrically conducting substance provided thereon with sufficiently high adhesion. Another object of the present invention is to provide a method for producing the solid electrolytic capacitor, which includes providing an organic electrically conducting polymer as a solid electrolyte on a chemically formed aluminum substrate having thereon an aluminum oxide dielectric film, where a chemically formed aluminum substrate, which was cut into a predetermined shape, is treated with an aqueous acid solution to dissolve a part of the dielectric film on the substrate surface.