Abstract: A method for making multi-layer electronic circuit board including a pre-circuit assembly 12 and a ground layer 14 which are automatically aligned and bonded together by use of solder material or deposits 26, 28.

Abstract: There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the relationship y≧0.232x−0.185 holds between the concentration y (g/L) of dimethylamine borane and an area x (dm2/L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.

Abstract: In the method for manufacturing a semiconductor device according to the present invention, after forming a BPSG film 110 on a silicon substrate 100, a preparatory hole 120 that reaches a specific depth and has a larger diameter than a contact hole 118 is formed at a position where the contact hole 118 (see FIG. 4) is to be formed at the BPSG film 110. Thus, polysilicon side walls 114 (see FIG. 4) formed at side portions of a polysilicon film 112 (see FIG. 4) are also formed at the side walls of the preparatory hole 120. As a result, the contact hole 118 (see FIG. 4) free of shape defects can be formed by using an etching mask 116 (see FIG. 4) constituted of the polysilicon film 112 and the polysilicon side walls 114. This structure prevents defects related to the shape of the hole and reduces electrical defects such as shorting.

Abstract: A method of providing adhesion to a fluorinated polymer including exposing at least a portion of the surface of the fluorinated polymer to plasma discharge in an atmosphere containing an organic amine.

Abstract: The present invention relates to a bulletproof glass window, in particular for use as a windscreen of a motor vehicle, fitted into a frame (9), the bulletproof glass window comprising several laminated glass panes (1,2) in a compound, of which at least one glass pane (1) juts out above the other glass pane(s) (2) with a projecting section (12) within a marginal area of the bulletproof glass window, to form a grading or stepped portion (14) from the projecting section to the other glass pane(s) in the direction of the inner side of the bulletproof glass window; the bulletproof glass window with the projecting section (12) of the at least one glass pane (1) is fixed to the frame (9), wherein the surface in the area of the grading or stepped portion (14) is fitted with an edging (10) made of synthetic material that holds back glass splinters.

Abstract: A thermochemical process is disclosed that readily produces significantly roughened surfaces on densely sintered alumina. The alumina is reacted with cryolite (Na3AlF6) at a temperature of 300° C.-2075° C. for a time sufficient to produce the desired degree of roughness. This treatment causes controlled dissolution of alumina, controlled cavitation of grain boundaries, and formation of a thin film-reaction product. The resulting surface irregularities enhance subsequent micromechanical or chemical bonding of the densely sintered alumina component. The resulting roughened alumina components have numerous uses in the dental restorative and orthodontic fields, including orthodontic brackets, crowns, onlays, inlays, veneers, and the like. The technique is readily adapted to be used in either a dental office or a laboratory environment.

Abstract: A method of removing a ceramic coating (18), and particularly zirconia-containing thermal barrier coating (TBC) materials such as yttria-stabilized zirconia (YSZ), that has been either intentionally or unintentionally deposited on the surface of a component (10). The method entails subjecting the ceramic coating (18) to an aqueous solution containing an acid fluoride salt, such as ammonium bifluoride (NH4HF2) or sodium bifluoride (NaHF2), and a corrosion inhibitor. The method is capable of completely removing the ceramic coating (18) without removing or damaging the underlying substrate material, which may include a metallic bond coat (16).

Abstract: A method of removing a ceramic coating, such as a thermal barrier coating (TBC) of yttria-stabilized zirconia (YSZ), from the surface of a component, such as a gas turbine engine component. The method generally entails subjecting the ceramic coating to an aqueous solution of ammonium bifluoride, optionally containing a wetting agent, such as by immersing the component in the solution while maintained at an elevated temperature. Using the method of the invention, a ceramic coating can be completely removed from the component and any cooling holes, with essentially no degradation of the bond coat.

Abstract: The present invention is for a method wherein a printed circuit board can be fabricated in an electroless process with a minimum number of manufacturing steps using mild etchant conditions on an intermediary seed layer to produce low-defect, fine conductive line printed circuit boards.

Abstract: A method of preparing a supporting substrate of an optical subassembly for metal-oxide bonding an optical element to the substrate. The method includes providing a supporting substrate including a metalized region for metal-oxide bonding an optical element to the substrate and rinsing the substrate in a potassium hydroxide solution. The potassium hydroxide solution removes any excess metal oxide or other contaminants from the surface of the metalized region.

Abstract: This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.

Abstract: A thin film inductive write head has minimal organic insulation material in contact with the encapsulating overcoat. The process for its fabrication includes a reactive ion etching (RIE) process to remove the organic insulative material while still allowing the head top pole piece to be planar. The organic insulation material is removed by RIE down to the head gap layer in the region between the ABS and the coil. The etching is done with the top or second pole piece acting as a mask so that the planarized organic insulation material is still maintained over the portion of the coil that is located between the two pole pieces. Thus the organic insulation material is still present in this region as the planarization layer onto which the ferromagnetic layer for the second pole piece was deposited.

Abstract: A method of manufacturing a 2-layered flexible substrate includes forming an underlying metal layer on an insulation film with a deposition layer formed by a dry plating method using at least one of nickel, copper-nickel alloy, chromium and chromium oxide and a copper deposition layer formed by a dry plating method on the noted deposition layer, then forming a primary electric copper plated deposition layer on the underlying metal layer, then applying a treatment using at least one alkaline solution selected from inorganic alkaline solutions and organic alkaline solutions, then forming an electroless copper plated deposition layer as an intermediate metal layer on the primary electric copper plated deposition layer and, finally, forming a secondary electric copper plated deposition layer on the intermediate metal layer, thereby finally forming a copper conductor layer of 1 to 35 .mu.m thickness on the insulation film.

Abstract: A catheter with at least one integrated lumen and methods of its manufacture and use are provided. A method of manufacture includes: (1) covering a primary mandrel with a first layer, (2) disposing a second layer on the first layer, wherein the second layer has at least one removable secondary mandrel substantially embedded therein, (3) fusing the first layer to the second layer, (4) removing the secondary mandrel from the second layer to form a secondary lumen, and (5) removing the primary mandrel from the first layer to form a primary lumen. The method may further include forming an inflatable balloon at the surface of the second layer where the secondary lumen forms an opening. Also, auxiliary apparatus, such as snare instruments and bundles of optical fibers, may be inserted through the secondary lumen before or during use of the catheter.

Abstract: Compliant universal (CU) substrates and techniques for forming the same facilitate growth of epitaxial layers comprised of materials which are highly lattice mismatched with the substrate material. The CU substrates employ very thin (e.g., 1-20 nm or less) substrate layers which are loosely bonded to a thick bulk material base layer. Because of the loose bonding, the bonding energy of the atoms in the thin substrate layer is reduced, thus greatly increasing the flexibility of the thin substrate layer. This enables the substrate layer to absorb strain or stress imparted during the growth of lattice mismatched epitaxial layers, thus avoiding the formation of defects in the epitaxial layers. The "loose" bonding of the thin substrate layer to the base layer can be achieved in any of a number of ways. First, the thin substrate layer can be bonded at an angle relative to the base layer so that screw dislocations form which provide the desired reduction in bonding energy and increase in flexibility.

Abstract: Nitrogen atoms on the surface of a first body are terminated by hydrogen atoms after the surfaces of the first body and a second body to which it is to be bonded are cleaned. The surface of the first body terminated by the hydrogen atoms and the surface of the second body are bonded to each other so that hydrogen bonds are formed between the nitrogen atoms and the bonded hydrogen atoms on the surface of the first body and the atoms on the surface of the second body. Using these hydrogen bonds, the surface of the first body and the surface of the second body are strongly bonded to each other. When the surface of the second body is formed with nitride or oxide, strong hydrogen bonds of N--H .sup.- - - N or N--H .sup.- - - O are formed between the first body and the second body. Thus, the method does not require bonding under high temperature or high pressure.

Abstract: A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

Abstract: A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Abstract: An improved process is provided for aligning and bonding channel and heater substrates together to form a thermal ink jet printhead. A thick film polyimide layer is formed over the heater substrate and is patterned to provide a plurality of tacking pits. The channel substrate has alignment holes formed in peripheral edge areas. A UV curable adhesive is deposited into the alignment hole and UV irradiated to produce a cured tacking column in the underlying pits formed in the thick film layer. Due to the sloping walls of the etched alignment recess, some portion of the adhesive is not fully cured and, during a subsequent curing process, tends to initiate a capillary flow along the interface between channel substrate and the thin film layer. This flow, in prior art designs, sometimes proceeds to the point where the adhesive is squeezed out onto electrode connections formed on an adjacent heater substrate.

Abstract: A method for manufacturing printed circuit plates, which includes laminating an aluminum rolled leaf on a surface of an insulator base, forming an etching resist coat film on the surface of the aluminum rolled leaf, and then dissolving and removing an unnecessary aluminum leaf in the non-resist area with an etching liquid. The etching liquid is an aqueous solution containing (1) 0.1 to 15 mol/liter of acid of an amine hydrofluoride and (2) 0.02 to 10 mol/liter of a hydrogen peroxide, wherein the amine is one of an aliphatic amine having 12 carbon atoms or less and a heterocyclic amine, the amine having no other acid group or basic group than amino group, the etching liquid having a pH within the range from 4 to 9, wherein the hydrogen peroxide oxidizes aluminum into an aluminum oxide which is dissolved by the amine hydrofluoride.

Abstract: An insulating resin composition for the build-up of multilayer circuits by the procedure of copper foil lamination and a method for the production of a multilayer printed circuit board by the use of the insulating resin composition are disclosed. The insulating resin composition comprises at least one species of epoxy resin having a softening point of not more than 110.degree. C., a monomer or an oligomer possessing an unsaturated double bond, an epoxy resin curing agent, and a photopolymerization initiator. The insulating resin composition is applied to a printed circuit board throughout the entire area thereof so as to cover conductor patterns formed thereon and then irradiated with UV light. Subsequently a copper foil is superposed on the applied layer of the insulating resin composition on the printed circuit board by means of a heated pressure roller to effect lamination thereof.

Abstract: Two copper containing surfaces are bonded together by microetching at least one of the surfaces, followed by abutting the two surfaces together, and then laminating them at a temperature of at least about 300.degree. C. and below the decomposition temperature of the copper-containing surfaces, and at a pressure of at least about 1500 psi.

Abstract: The adhesion between a polymeric fluorocarbon film and a substrate is improved by providing a non-volatile carbide-forming metallic layer intermediate the substrate and the polymeric fluorocarbon film, and exposing the substrate to ion-bombardment in a noble gas/polymerizing gas atmosphere prior to providing the fluorocarbon films.

Abstract: A head gimbal assembly for disk drives is attached to an actuator arm using an adhesive. An etch pattern is formed in the mount plate of the head gimbal assembly, defining a mating surface area. An actuator arm is received by the mating surface area, the two members are suitably aligned, and an adhesive is introduced into the various channels that comprise the etch pattern through an access opening that is located outside of the mating surface area. By locating the access opening outside of the mating surface area, the adhesive may be introduced after a final alignment is achieved between the head gimbal assemblies and the actuator arms. Such manner of attachment may be used with individual actuator arms as well as when connecting head gimbal assemblies to an actuator comb assembly.

Abstract: A process for producing a partially transparent, visually discernible surface pattern with surface elements which diffusely scatter, reflect or diffract light incident on the surface pattern commences with a base foil which may include a carrier foil and a lacquer layer, and also an intermediate layer between these two layers to provide for good adhesion. Before or after application of the microscopically fine relief structures in the lacquer layer, the free surface thereof is covered over its entire area with a reflection layer. A printed image is then printed with an etching agent for the reflective material on the reflection layer in such a way that, at surface portions corresponding to the printed image, the reflection layer is removed and the surface of the lacquer layer is exposed again.

Abstract: A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength of the bond and the electrical characteristics of the bond joint.

Abstract: A process for roughening a metal surface is provided comprising applying a coating to the metal surface wherein the coating is a temporary barrier to an etchant attacking the metal surface and the coating is susceptible to the etchant gradually removing the coating, and then etching the coated metal surface with an aqueous bath containing the etchant effective to produce a roughened metal surface.

Abstract: An etchant primer composition is provided which includes (a) a compound hng the formulaRN (CH.sub.2 YCO.sub.2 M).sub.2 (I)whereinR=R.sup.1 or R.sup.2 ;R.sup.1 =an aromatic group;R.sup.2 =a conjugated aliphatic group;Y=a single bond, CH.sub.2, CHCH.sub.3 or C.dbd.CH.sub.2 ; and each M is independently H, an alkali metal, an alkaline earth metal, aluminum, a transition or redox metal or an alkyl group having 1 to 18 carbon atoms, with the proviso that when both M groups are alkyl groups, the compound corresponding to formula I be capable of being easily hydrolyzed, displaced or exchanged with other reagents present in the etchant/primer composition and (b) a polar solvent system. An etchant/primer/adhesive monomer composition is also provided which includes the etchant/primer composition and an adhesive monomer system. One and two step simplified methods for adhering and for preparing a substrate surface, such as a dental substrate surface, to a polymeric material are also provided.

Abstract: The process for the preparation of a waveguide buried in a glass substrate according to the invention consists of the following stages:a stage of producing a waveguide (28, 38) by ion exchange on the surface of each of two glass substrates (22, 32),a stage of aligning both substrates, so that the surfaces in which the waveguides have been produced face one another,a direct wafer bonding stage of the two substrates.

Abstract: A process for direct bonding similar or dissimilar materials at low temperatures in which a material surface is rendered hydrophilic and reactive by creating nitrogen based radicals on the surface, the surface is direct bonded to a second surface, and the bonded surfaces are annealed at a temperature below approximately 500.degree. C. A nitrogen based constituent is combined with an activator to render the surface hydrophilic and reactive through ammonia plasma activation or activation by use of hydrofluoric acid.

Abstract: A glass ply having a chemically strengthened surface, for example a chemically etched surface, for use in a laminated glazing is treated by hot melting a thermoplastic material onto such strengthened glass surface prior to incorporation of the glass ply into the required laminate. The thermoplastic material may be polyvinylbutyral but is preferably polyurethane.

Abstract: A method for forming a tappered first metal wiring layer is described incorporating a substrate, a second metal layer formed as the upper layer on the first metal layer, a third metal layer having a diffusion coefficient lower than the diffusion coefficients of the above two metal layers formed between the first and the second metal layers, a resist pattern formed on the second metal layer, wherein the first metal layer is etched using the patterns of the second and the third metal layers and the resist pattern as etching masks to form a tapered cross-sectional pattern of the first metal wiring layer.

Abstract: A component for a laminated window, the component comprising a glass sheet having an etched hydrated surface and a protective layer of plastics material covering the etched surface, the protective layer being selected so as to be bondable to a plastics interlayer material. The invention also provides a laminated window including a first ply comprising a glass sheet having an etched hydrated surface and a protective layer of plastics material covering the etched surface and a second ply to which the first ply is bonded by a plastics interlayer, the material of the interlayer and of the protective layer being selected so as to be bondable together. The present invention further provides a method of producing a pre-product glass sheet having improved bending strength.

Abstract: A dissolved wafer micromachining process is modified by providing an etch control seal around the perimeter of a heavily doped micromechanical structure formed on a substrate. The micromechanical structure is fabricated on a wafer using conventional methods including the formation of a trench that surrounds and defines the shape of the micromechanical structure in the substrate. The etch control seal comprises a portion of the substrate in the form of a raised ring extending around the perimeter of the micromechanical structure and its defining trench. Selected raised areas of the heavily doped micromechanical structure and the top of the raised etch control seal are bonded to a second substrate. A selective etch is then used to dissolve the first substrate so that the heavily doped micromechanical structure remains attached to the second substrate only at the bonded areas.

Abstract: Bodies of at least one material are held in a contacting holder 12 in a vacuum chamber. The surfaces of the bodies are cleaned by a low energy ion etching. Water vapor from a pure water bottle is supplied through a nozzle as a water molecule beam so that water molecules and hydroxide groups are chemically adsorbed on the surfaces of the bodies. A plasma beam or microwaves are applied to the surfaces of the bodies to remove the water molecules and leave only hydroxide groups remaining on the surfaces. The holder is operated to bring the surfaces of the bodies into contact with each other, to thereby obtain direct bonding of the bodies.

Abstract: A method for roughening a principal surface (12) of a halocarbon film (11). The halocarbon film (11) is treated with a colloidal suspension wherein the colloidal suspension includes light metal atoms. The light metal atoms combine with halogen atoms of the halocarbon film, thereby toughening the principal surface (12) and giving the principal surface (12) a burnt appearance.