Abstract: Methods are provided for obtaining hollow nano-structures which include the steps of providing a suspended film starting layer on a support substrate, depositing on the starting layer a sacrificial layer, performing, in progressive sequence, a complete erosion phase of said support substrate and starting layer and performing an at least partial erosion phase of the sacrificial layer previously deposited on the starting layer so as to obtain holes passing through the starting layer and passing or non passing through the sacrificial layer, depositing, on the side of the support substrate opposite to that where the starting layer is put, at least one covering layer arranged to internally cover the holes created by the progressive erosion. Hollow nano-structures formed by such methods are also provided.

Abstract: As track densities increase, it becomes increasingly important, while writing in a given track, not to inadvertently write data in adjoining tracks. This problem has been overcome by limiting the width of material in the ABS plane to what it is at the write gap. The part of the lower pole that is wider than this is recessed back away from the ABS, thereby greatly reducing its magnetic influence on adjacent tracks. Four different embodiments of write heads that incorporate this notion are described together with a description of a general process for their manufacture.

Abstract: Method of forming a semiconductor structure which includes forming first conductive spacers on a semiconductor substrate; forming second conductive spacers with respect to the first conductive spacers, at least one of the second conductive spacers adjacent to and in contact with each of the first conductive spacers to form combined conductive spacers; recessing the second conductive spacers with respect to the first conductive spacers so that the first conductive spacers extend beyond the second conductive spacers; depositing an ILD to cover the first and second spacers except for an exposed edge of the first conductive spacers; patterning the exposed edges of the first conductive spacers to recess the edges of the first conductive spacers in predetermined locations to form recesses with respect to the ILD; and filling the recesses with an insulating material to leave unrecessed edges of the first conductive spacers as vias to subsequent wiring features.

Abstract: A microarray formed in a planar surface of a moldable slab, the microarray including a plurality of microwell sets comprising a plurality of microwells formed in the planar surface of the moldable slab, each microwell being sized to contain at least a single cell, and a plurality of microchannels formed in the planar surface of the moldable slab, the plurality of microchannels being configured to permit liquid from a first region of the microarray to transit to a second region of the microarray.

Abstract: A housing includes a substrate, a connecting member and a latching member. The connecting member is formed on the substrate. The connecting member is made of phenylene pulfide. The latching member is formed on the connecting member. The latching member is made of polycarbonate.

Abstract: A method for fabricating a magnetic recording transducer is described. The transducer has an ABS location and a nonmagnetic intermediate layer having a pole trench. The method includes depositing at least one magnetic pole layer having a top surface and a pole tip portion proximate to the ABS location. A first portion of the magnetic pole layer(s) resides in the pole trench. The magnetic pole layer(s) have a seam in the pole tip portion that extends to the top surface. The method also includes cathodically etching a second portion of the magnetic pole layer(s) from the seam at a rate of not more than 0.1 nanometers/second, thereby forming a seam trench in the magnetic pole layer(s). The method also includes refilling the seam trench with at least one magnetic refill layer. At least an additional magnetic pole layer is deposited on the top surface and the magnetic refill layer(s).

Abstract: To provide a method for producing a filtration filter that can simplify the process for providing clean water or freshwater. By etching silicon substrate 1 using masking film formed on a surface of substrate 1 and having numerous openings to expose portions of the surface, numerous circular holes 2 with an approximate diameter of 100 nm are formed in substrate 1. Diameter (D1) at minimum-diameter portions 4 near the openings of circular holes 2 to be reduced by silica film 3 is adjusted to be 1 nm˜100 nm by depositing silica film 3 on the inner surfaces of circular holes 2.

Abstract: A method or forming a wrapped-around shielded perpendicular magnetic recording writer pole is disclosed. A structure comprising a leading shield layer and an intermediate layer disposed over the leading shield layer is provided, the intermediate layer comprising a pole material and a dielectric material. A trench is formed in the dielectric material. A non-magnetic layer in the trench is removed via an ion beam etching process. A seed layer is deposited in the trench and over the pole material. A magnetic material comprising a side shield layer is deposited on at least a portion of the seed layer.

Abstract: Embodiments hereof relate to a guidewire formed from an elongated shaft, at least a portion of the shaft having an outer layer, a plurality of channels formed through the outer layer, and an inner core. The outer layer is formed from a material non susceptible to erosion by an erosion agent and the inner core is formed from a radiopaque material susceptible to erosion by the erosion agent. When exposed to the erosion agent, core material adjacent to the channels is removed to form a pattern of integral radiopaque segments or markers with a plurality of voids therebetween. By controlling the location of channels and the rate of erosion of the core material, the pattern of integral radiopaque segments and voids allow for in situ measurement when viewed under fluoroscopy.

Abstract: A dry adhesive and a method of forming a dry adhesive. The method includes forming an opening through an etch layer and to a barrier layer, expanding the opening in the etch layer at the barrier layer, filling the opening with a material, removing the barrier layer from the material in the opening, and removing the etch layer from the material in the opening.

Abstract: A catheter die is provided and includes a device layer defining a cavity and including a piezoresistive pressure sensor operably disposed proximate to the cavity and an insulator having an opening and being disposed on an upper surface of the device layer such that a portion of the piezoresistive pressure sensor is exposed through the opening. The catheter die further includes an insulation layer bonded to a lower surface of the device layer and first and second bond pads, the first bond pad being electrically coupled to the portion of the piezoresistive pressure sensor via the opening and the second bond pad being disposed on the insulation layer.

Abstract: Methods for fabricating sub-lithographic, nanoscale microstructures in line arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.

Abstract: The invention relates to a method (3) of fabricating a mould (39, 39?, 39?) that includes the following steps: a) providing (10) a substrate (9, 9?) that has a top layer (21, 21?) and a bottom layer (23, 23?) made of electrically conductive, micromachinable material, and secured to each other by an electrically insulating, intermediate layer (22, 22?); b) etching (11, 12, 14, 2, 4) at least one pattern (26, 26?, 27) in the top layer (21, 21?) as far as the intermediate layer (22, 22?) to form at least one cavity (25, 25?) in said mould; c) coating (6, 16) the top part of said substrate with an electrically insulating coating (30, 30?); d) directionally etching (8, 18) said coating and said intermediate layer to limit the presence thereof exclusively at each vertical wall (31, 31?, 33) formed in said top layer. The invention concerns the field of micromechanical parts, in particular, for timepiece movements.

Abstract: A thin-film magnetic head is constructed such that a main magnetic pole layer, a lower shield layer, an upper shield layer and a thin-film coil are laminated on a substrate. A method of manufacturing the thin-film magnetic head has a lower shield layer forming step. This step comprises a step of forming a first lower shield part in a lower shield planned area, including a planned line along the medium-opposing surface, a step of forming a partial lower seed layer having a partial arrangement structure in which the partial lower seed layer is arranged on a lower formation zone except a lower exception zone including the planned line, a step of forming a second lower shield part on the partial lower seed layer.

Abstract: Disclosed are a nano patterning method for fabricating a surface plasmon color filter having a transmissive pattern which selectively transmits light of specific wavelengths, and methods for fabricating a surface plasmon color filter and a liquid crystal display (LCD) device using the same. Used are a stamp which provides a partial electrification region, and a template, thiol-terminated nanospheres which can be self-assembled, thereby fabricating nano holes having a two-dimensional period and arranged in a hexagonal lattice. This may be applied onto a large area of a substrate, and may implement simplified processes and reduced fabrication costs.

Abstract: A method of fabricating a c-aperture or E-antenna plasmonic near field source for thermal assisted recording applications in hard disk drives is disclosed. A c-aperture or E-antenna is built for recording head applications. The technique employs e-beam lithography, partial reactive ion etching and metal refill to build the c-apertures. This process strategy has the advantage over other techniques in the self-alignment of the c-aperture notch to the c-aperture internal diameter, the small number of process steps required, and the precise and consistent shape of the c-aperture notch itself.

Abstract: Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction techniques to form superimposed, pitch-reduced patterns of crossing elongate features that can be consolidated into a single layer. Planarizing techniques using a filler layer and a protective layer are disclosed. Portions of an integrated circuit having different heights can be etched to a common plane.

Abstract: An image can be formed onto a device such as a cell phone or a tablet by laser engraving the image onto a housing of the device. A coloring agent can then be applied to the engraved image to modify the color of the image. The coloring agent can darken the engraved image. The coloring agent can include multiple colors of ink (e.g., UV curing ink) that can be applied to form a multi-color image. The coloring agent can be applied without requiring the use of a masking layer, for example, by aligning the laser engraved image with a coloring agent applicator so that the coloring agent is applied to substantially only the engraved image on the device.

Abstract: The invention relates to a method of manufacturing an electrostatic clamp configured to electrostatically clamp an article to an article support in a lithographic apparatus. The method includes providing a first layer of material, etching a recess in the first layer of material, and disposing an electrode in the recess of the first layer of material.

Abstract: A method of manufacturing a perpendicular magnetic write head capable of precisely narrowing a side gap is provided. A tip portion having a cross sectional geometry of an inverted trapezoid is formed in an opening portion of a non-magnetic layer and thereafter, the non-magnetic layer is etched with the tip portion as a mask. Thereby, a portion adjacent to the tip portion in a writing track width direction remains and an outermost edge portion of the tip portion in that direction is located on a plane which coincides with an etching face (side face) of the non-magnetic layer. When a gap layer is formed with a vapor phase growth such as a sputtering method to cover the side face of the non-magnetic layer and thereafter a side shield layer is formed adjacently to the tip portion therethrough, a thickness of the gap layer becomes extremely thin and is reproduced precisely. Therefore, the side gap is narrowed with high precision.

Abstract: Porous nano-imprint lithography templates may include pores, channels, or porous layers arranged to allow evacuation of gas trapped between a nano-imprint lithography template and substrate. The pores or channels may be formed by etch or other processes. Gaskets may be formed on an nano-imprint lithography template to restrict flow of polymerizable material during nano-imprint lithography processes.

Abstract: An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.

Abstract: A method of fabricating a patterned magnetic recording medium, comprises steps of: (a) providing a layer stack including an uppermost non-magnetic interlayer; (b) forming a resist layer on the interlayer; (c) forming a first pattern comprising a first group of recesses extending through the resist layer and exposing a first group of spaced apart surface portions of the interlayer; (d) filling the first group of recesses with a layer of a hard mask material; (e) selectively removing the resist layer to form a second pattern comprising a second group of recesses extending through the hard mask layer and exposing a second group of spaced apart surface portions of the interlayer; and (f) filling the second group of recesses with a layer of a magnetically hard material forming a magnetic recording layer.

Abstract: Methods of replacing/reforming a top oxide around a charge storage element of a memory cell and methods of improving quality of a top oxide around a charge storage element of a memory cell are provided. The method can involve removing a first poly over a first top oxide from the memory cell; removing the first top oxide from the memory cell; and forming a second top oxide around the charge storage element. The second top oxide can be formed by oxidizing a portion of the charge storage element or by forming a sacrificial layer over the charge storage element and oxidizing the sacrificial layer to a second top oxide.

Abstract: A method of forming a magnetic head comprises the steps of: selectively exposing through the use of a photomask a photoresist layer unpatterned; forming a pattern for forming a pole layer by developing the photoresist layer after the exposure; and forming the pole layer through the use of the pattern. The photomask includes first to third regions. The first region has such a perimeter that a projection image thereof is shaped along a perimeter of an ideal shape of the top surface of the pole layer. The second region touches the perimeter of the first region, and is located outside the first region. The third region is located inside the first region without touching the perimeter of the first region. The third region suppresses deviation of the pole layer from its desired shape which may be caused by the effect of light reflected while the photoresist layer is exposed.

Abstract: A method for processing a wafer to form a plurality of hollow microneedles projecting from a substrate includes forming, by use of a dry etching process, a number of groups of recessed features, each including at least one slot deployed to form an open shape having an included area and at least one hole located within the included area. The internal surfaces of the holes and the slots are then coated with a protective layer. An anisotropic wet etching process is then performed in such a manner as to remove material from outside the included areas while leaving a projecting feature within each of the included areas. The protective layer is then removed to reveal the microneedles.

Abstract: An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

Abstract: A method for fabricating a magnetic transducer having a nonmagnetic intermediate layer is described. A trench is provided in the intermediate layer. The trench has a profile and location corresponding to a pole. A first nonmagnetic gap layer is provided. At least part of the first nonmagnetic gap layer resides in the trench. A pole including magnetic material(s) is provided. At least part of the pole resides in the trench and on the part of the nonmagnetic layer in the trench. At least part of the intermediate layer adjacent to the pole is removed and a second nonmagnetic gap layer provided. The second nonmagnetic gap layer is thicker than the first nonmagnetic gap layer. Part of the second nonmagnetic layer and part of the first nonmagnetic layer adjacent to the pole form a side gap. A side shield, a gap, and a top shield are also provided.

Abstract: A plurality of micro three-dimensional structure elements each having a movable structure fixed on a sacrifice layer, and fixation portions of the micro three-dimensional structure elements for the sacrifice layer are arranged into a film-like elastic body, and then the sacrifice layer is removed. Thus, a three-dimensional structure in which the individual micro three-dimensional structure elements are arranged independently of one another within the elastic body is manufactured.

Abstract: A method of forming a device with a controlled electrode gap width includes providing a substrate, forming a functional layer on top of a surface of the substrate, forming a sacrificial layer above the functional layer, exposing a first portion of the functional layer through the sacrificial layer, forming a first spacer layer on the exposed first portion of the functional layer, forming an encapsulation layer above the first spacer layer, and vapor etching the encapsulated first spacer layer to form a first gap between the functional layer and the encapsulation layer.

Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

Abstract: Methods for fabricating arrays of nanoscaled alternating lamellar or cylinders in a polymer matrix having improved long range order utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.

Abstract: A mold manufacturing method of an embodiment of the present invention includes the steps of: (a) providing a mold base; (b) partially anodizing the aluminum layer to form a porous alumina layer, the porous alumina layer having a porous layer which defines a plurality of minute recessed portions and a barrier layer which is provided at a bottom of each of the plurality of minute recessed portions; and (c) after step (b), performing etching, thereby enlarging the plurality of minute recessed portions of the porous alumina layer, wherein in step (c) the etching is performed such that an average depth of the plurality of minute recessed portions increases but does not exceed a 1/7 of an average thickness of the barrier layer before the etching.

Abstract: A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Abstract: A method and system for fabricating a microelectric device are described. A write pole of an energy assisted magnetic recording head or a capacitor might be fabricated. The method includes depositing a resist film and curing the resist film at a temperature of at least 180 degrees centigrade. A cured resist film capable of supporting a line having an aspect ratio of at least ten is thus provided. A portion of the cured resist film is removed. A remaining portion of the resist film forms the line. An insulating or nonmagnetic layer is deposited after formation of the line. The line is removed to provide a trench in the insulating or nonmagnetic layer. The trench has a height and a width. The height divided by the width corresponds to the aspect ratio. At least part of the structure is provided in the trench.

Abstract: Methods for fabricating sub-lithographic, nanoscale linear microchannel arrays over surfaces without defined features utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the methods use a multi-layer induced ordering approach to align lamellar films to an underlying base film within trenches, and localized heating to anneal the lamellar-phase block copolymer film overlying the trenches and outwardly over the remaining surface.

Abstract: A mold having an open interior volume is used to define patterns. The mold has a ceiling, floor and sidewalls that define the interior volume and inhibit deposition. One end of the mold is open and an opposite end has a sidewall that acts as a seed sidewall. A first material is deposited on the seed sidewall. A second material is deposited on the deposited first material. The deposition of the first and second materials is alternated, thereby forming alternating rows of the first and second materials in the interior volume. The mold and seed layer are subsequently selectively removed. In addition, one of the first or second materials is selectively removed, thereby forming a pattern including free-standing rows of the remaining material. The free-standing rows can be utilized as structures in a final product, e.g., an integrated circuit, or can be used as hard mask structures to pattern an underlying substrate. The mold and rows of material can be formed on multiple levels.

Abstract: Methods for fabricating sublithographic, nanoscale microstructures arrays including openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. In some embodiments, the films can be used as a template or mask to etch openings in an underlying material layer.

Abstract: A plasma processing method for processing a target substrate uses a plasma processing apparatus which includes a vacuum evacuable processing vessel for accommodating the target substrate therein, a first electrode disposed in the processing vessel and connected to a first RF power supply for plasma generation and a second electrode disposed to face the first electrode. The method includes exciting a processing gas containing fluorocarbon in the processing vessel to generate a plasma while applying a negative DC voltage having an absolute value ranging from about 100 V to 1500 V or an RF power of a frequency lower than about 4 MHz to the second electrode. The target layer is etched by the plasma, thus forming recesses on the etching target layer based on the pattern of the resist layer.

Abstract: In one embodiment, a method of manufacturing a mold includes: forming a first layer having an affinity to a second polymer on a substrate having an affinity to a first polymer; forming first and second openings in the first layer; filling a resist in the second openings and hardening the resist to obtain a hardened resist; and forming a second layer containing a block copolymer and causing it to self-assemble.

Abstract: There is provided a thin-sheet glass substrate laminate which is approximately 100% impermeable to gas or vapor and has a high transparency and a thin thickness, and a method of manufacturing the same. A support is temporarily attached to one surface of a glass substrate after forming a pattern P on the one surface, the glass substrate is thinned by etching another surface of the glass substrate, a film base is temporarily attached to the etched another surface, the temporarily attached support is peeled off from the one surface of the glass substrate, the one surface from which the support is peeled off is laminated to a surface of a cover glass, and the temporarily attached film base is peeled off from the another surface.

Abstract: A method of manufacturing a mechanical part includes the steps of providing a micro-machinable substrate; etching a pattern which includes the part through the entire substrate using photolithography; mounting the etched substrate on a support so as to leave the top and bottom surfaces of said substrate accessible for coating; depositing a tribological quality improving coating of on the outer surface of the part; and releasing the part from the substrate.

Abstract: An opening in a substrate is formed, e.g., using optical lithography, with the opening having sidewalls whose cross section is given by segments that are contoured and convex. The cross section of the opening may be given by overlapping circular regions, for example. The sidewalls adjoin at various points, where they define protrusions. A layer of polymer including a block copolymer is applied over the opening and the substrate, and allowed to self-assemble. Discrete, segregated domains form in the opening, which are removed to form holes, which can be transferred into the underlying substrate. The positions of these domains and their corresponding holes are directed to predetermined positions by the sidewalls and their associated protrusions. The distances separating these holes may be greater or less than what they would be if the block copolymer (and any additives) were to self-assemble in the absence of any sidewalls.

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods may include forming a first block on a nanodot material, forming a first spacer on the first block, removing the first block to form a free standing spacer, removing exposed portions of the nanodot material and then the free standing spacer to form nanowires, forming a second block at an angle to a length of the nanowires, forming a second spacer on the second block, forming a second free standing spacer on the nanowires by removing the second block, and removing exposed portions of the nanowires and then the second free standing spacer to form an ordered array of nanodots.

Abstract: A capacitor forming method includes forming an electrically conductive support material over a substrate, forming an opening through at least the support material to the substrate, and, after forming the opening, forming a capacitor structure contacting the substrate and the support material in the opening. The support material contains at least 25 at % carbon. Another capacitor forming method includes forming a support material over a substrate, forming an opening through at least the support material to the substrate, and, after forming the opening, forming a capacitor structure contacting the substrate and the support material in the opening. The support material contains at least 20 at % carbon. The support material has a thickness and the opening has an aspect ratio 20:1 or greater within the thickness of the support material.

Abstract: A device housing includes a stainless steel substrate having a first metallic coating and a second metallic coating formed thereon and in that order. The stainless steel substrate has at least one recess defined in an outer surface. The first metallic coating and a second metallic coating have different colors. The first metallic coating is left exposed in the recesses but covered elsewhere by the second metallic coating to form a desired symbol, logo, or pattern on the device housing. A method for making the present device housing also is provided.

Abstract: An ultrasonic transducer fabrication method including: depositing a conductive material on an insulating layer, partially etching the conductive material to form lower electrodes; depositing an insulating material to cover the lower electrodes to form a first insulating layer and depositing a sacrificial material thereon, performing etching, to create cavities and a channel-shaped sacrificial layer to communicate the cavities; depositing an insulating material on the first insulating layer to form a second insulating layer; partially etching the second insulating layer to form holes; etching and removing the sacrificial layer through the holes to form the cavities and channels; depositing a conductive material on the second insulating layer to plug the holes and form a conductive film; partially etching the conductive film to form upper electrodes and sealing portions which plug the holes; and forming a protective film on the second insulating layer to cover the upper electrodes and the sealing portions.

Abstract: The present invention uses externally applied electromagnetic stimulus to control and heat porous magnetic particles and material associated with the particles. The particles contain magnetic material, such as superparamagnetic iron oxide and are infused with a material. Application of a DC magnetic field allows them to be moved with their infused material, and application of an AC RF electromagnetic field allows them to be heated with their infused material. The material can be infused into pores of the particles and the particles can also adhere to an aqueous droplet. The present invention also provides a multi-layer porous magnetic particle. The particle includes a host layer having pores sized to accept magnetic nanoparticles. Magnetic nanoparticles are infused within pores of the host layer. An encoding layer includes pores that define a spectral code. The pores in the encoding layer are sized to substantially exclude the magnetic nanoparticles.

Abstract: A method fabricates a transducer having an air-bearing surface (ABS). The method includes providing at least one near-field transducer (NFT) film and providing an electronic lapping guide (ELG) film substantially coplanar with a portion of the at least one NFT film. The method also includes defining a disk portion of an NFT from the portion of the at least one NFT film and at least one ELG from the ELG film. The disk portion corresponds to a critical dimension of the NFT from an ABS location. The method also includes lapping the at least one transducer. The lapping is terminated based on a signal from the ELG.

Abstract: In a method for transferring nanostructures into a substrate, the following order of steps is used: decorating a substrate with nanomaterials (13), etching the substrate (10), applying a coating (15), removing the nanomaterials (13), and etching the substrate (10).