Mechanically Forming Pattern Into A Resist Patents (Class 216/44)
  • Patent number: 8557130
    Abstract: In forming a pattern on a substrate with reduced pattern error using a mold having an area smaller than an area of the substrate, a first resin pattern is formed on at least a first of a plurality of regions of an etching object layer by imprinting resin applied to the etching object layer using a first mold The etching object layer is then etched using the first resin pattern as an etching mask. A second resin pattern is formed on at least a second of the plurality of regions by imprinting resin applied to the etching object layer using a second mold. The etching object layer is again etched using the second resin pattern as an etching mask.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: October 15, 2013
    Assignee: Samsumg Electronics Co., Ltd.
    Inventors: Young Tae Cho, Suk Won Lee, Sin Kwon, Jung Woo Seo, Jeong Gil Kim
  • Patent number: 8551348
    Abstract: A magnetic recording medium has magnetic patterns formed of a patterned ferromagnetic layer, and a non-magnetic layer including a component of the ferromagnetic layer and separating the magnetic patterns, in which a thickness “a” of the non-magnetic layer and a thickness “b” of the magnetic patterns satisfy a relationship of: a<b.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: October 8, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yosuke Isowaki, Satoshi Shirotori, Yoshiyuki Kamata, Kaori Kimura, Masatoshi Sakurai
  • Patent number: 8536270
    Abstract: To provide a resist composition including: at least one polymerizable compound having a viscosity of 100 mPa·s or less at 25° C.; a fluorine-containing compound A having a viscosity of 5,000 mPa·s or greater at 25° C., and a fluorine content of 10% by mass or greater; and a fluorine-containing compound B having a viscosity of 2,000 mPa·s or less at 25° C., and a fluorine content of 10% by mass or greater.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: September 17, 2013
    Assignee: FujiFilm
    Inventor: Tadashi Omatsu
  • Patent number: 8522411
    Abstract: A method of fabricating a piezoelectric resonator includes providing a bottom electrode and a piezoelectric layer coupled to the bottom electrode. A bottom metal layer of a top electrode is deposited on the piezoelectric layer. A top metal layer of the top electrode is deposited on the bottom metal layer. A photoresist layer is deposited on the top metal layer. The photoresist layer is patterned and etched. The top metal layer is patterned and etched while the etched photoresist layer remains. The bottom metal layer is patterned and etched such that an entire perimeter side surface of the top metal layer is recessed relative to a perimeter edge of the bottom metal layer. The etched photoresist layer is removed. A passivation layer is deposited on the top and bottom metal layers such that the top and bottom metal layers are isolated from a subsequent metal etch step.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: September 3, 2013
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Guillaume Bouche, Ralph N. Wall
  • Patent number: 8506830
    Abstract: A pattern is formed by: forming a first imprint mask layer on a processed member; forming a first imprint pattern of the first imprint mask layer using a first template; forming a second imprint mask layer made of a material having a different etching rate from the first imprint mask layer on the first imprint pattern; forming a second imprint pattern of the second imprint mask layer using a second template different from the first template; and etching the processed member using as a mask the second imprint mask layer on which the second imprint pattern is formed and the first imprint mask layer on which the first imprint pattern is formed.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: August 13, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kenji Furusho
  • Patent number: 8486288
    Abstract: A pattern forming method including: (a) forming a porous layer above an etching target layer; (b) forming an organic material with a transferred pattern on the porous layer; (c) forming, by use of the transferred pattern, a processed pattern in a transfer oxide film that is more resistant to etching than the porous layer; and (d) transferring the processed pattern to the etching target layer by use of the transfer oxide film as a mask.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: July 16, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takashi Ohashi
  • Patent number: 8465655
    Abstract: A fabrication method for forming polymer nanopillars using an anodic aluminum oxide (AAO) membrane and an imprint process. A substrate is cleaned and a water soluble tape is applied to the substrate to define a coating area. The substrate is spin-coated with a polymer solution and an AAO membrane is placed on top of the coated area on the substrate and turned over whereby a silicon wafer is attached onto the AAO membrane forming an AAO membrane assembly, which is pressed in an imprintor. Then, the AAO membrane assembly is removed from the imprintor, it is disassembled, and the AAO membrane is dissolved in a NaOH solution forming a polymer substrate with nanopillars.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: June 18, 2013
    Assignee: University of Massachusetts
    Inventors: Hongwei Sun, Sai Liu
  • Patent number: 8414788
    Abstract: A reverse acting rupture disc is provided having a laser defined electropolished line-of-weakness recess, and an improved method of forming an electropolished line-of-weakness recess in a reverse acting rupture disc that assures full opening of the disc upon reversal. A rupture disc blank is pre-bulged, final bulged, and then provided with a layer of resist material. A laser is used to remove at least a portion of the layer of resist material corresponding to a desired line-of-weakness recess in the concave face of the bulged rupture disc. The disc is then subjected to an electropolishing operation to remove metal from the lased area of the rupture disc, thereby forming a lustrous polished line-of-weakness recess in the disc of desired configuration and of a predetermined depth that is related to material thickness.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: April 9, 2013
    Assignee: Fike Corporation
    Inventors: Bon F. Shaw, Bradford T. Stilwell, Michael D. Krebill, Brent W. Leonard
  • Patent number: 8410193
    Abstract: A method of preparing a ceramic-resin composite material for bone repair, including preparing a predetermined amount of pH controlled substantially anhydrous coupling agent by mixing a liquid silane material, alcohol and organic acid, producing particulate bioactive glass having a desired particle size of less than about 53 mesh, measuring a desired quantity of the particulate bioactive glass into a mixing vessel, heating the mixing vessel and particulate bioactive glass to about 100 degrees Celsius, mixing the heated quantity of particulate bioactive glass and spraying a predetermined amount of substantially anhydrous coupling agent into the heated quantity of particulate bioactive glass to define an admixture, mixing the admixture for sufficient time to define a quantity of substantially evenly coated particles, heating the quantity of substantially evenly coated particles for sufficient time to evolve excess solvent therefrom, and incorporating the quantity of substantially evenly coated particles into a r
    Type: Grant
    Filed: February 7, 2009
    Date of Patent: April 2, 2013
    Inventor: Thomas E. Day
  • Patent number: 8394282
    Abstract: Adaptive imprint planarization provides a surface having desired shape characteristics. Generally, topography of a first surface is mapped to provide a density map. The density map is evaluated to provide a drop pattern for dispensing polymerizable material on the first surface. The polymerizable material is solidified and etched to provide a second surface having the desired shape characteristics. Additionally, adaptive imprint planarization compensates for parasitic effects of the imprinting process.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: March 12, 2013
    Assignee: Board of Regents, The University of Texas System
    Inventors: Avinash Panga, Sidlgata V. Sreenivasan
  • Patent number: 8365371
    Abstract: Methods are disclosed for manufacturing tuning-fork type piezoelectric vibrating devices. In an exemplary method a metal film is formed on both surfaces of a piezoelectric wafer, followed by application of photoresist. A first metal-film-etching step etches the metal film after removal of the photoresist layer outside the profile outline of the devices. A first piezoelectric-etching step etches the wafer surface but not through to the rear surface; thus, outside the profile outline the metal film is removed. A second metal-film-etching step etches the metal film after removal of the photoresist layer from first groove regions. A second piezoelectric-etching step etches outside the profile outline and the groove regions through to the rear surface.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: February 5, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Yoshiaki Amano
  • Patent number: 8361336
    Abstract: An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: January 29, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shingo Okushima, Junichi Seki, Haruhito Ono, Nao Nakatsuji, Atsunori Terasaki
  • Patent number: 8349241
    Abstract: The present invention is directed to a method of and a mold for arranging features on a substrate to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate. It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material on the substrate. Thereafter, a plurality of features is formed in a region of the flowable material. The plurality of features are arranged to provide a substantially uniform fill factor in the region.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: January 8, 2013
    Assignee: Molecular Imprints, Inc.
    Inventors: Sidlgata V. Sreenivasan, Michael P. C. Watts
  • Patent number: 8329052
    Abstract: A method of making an imprint template includes providing a transfer layer on a substrate and providing a layer of imprintable medium on the transfer layer, using a master imprint template to imprint a pattern into the imprintable medium, polymerizing the imprintable medium by exposing it to actinic radiation, then etching the resulting polymer layer, the transfer layer and the substrate such that the imprinted pattern is transferred to the substrate, the substrate thereby becoming an imprint template bearing a pattern which is the inverse of a pattern provided on the master imprint template.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: December 11, 2012
    Assignee: ASML Netherlands B.V.
    Inventors: Sander Frederik Wuister, Johan Frederik Dijksman, Yvonne Wendela Kruijt-Stegeman, Ivar Schram
  • Patent number: 8329089
    Abstract: A resist composition used for the imprint lithography process, a method for forming resist pattern using the same, an array substrate manufactured using the same, and method of fabricating the array substrate includes an additive and the adhesion promoter inducing the chemical bond of the base layer contacting to the UV curable resin. As a result, it is possible for the resist composition to form a high-resolution pattern and to improve the durability of the mold for molding a UV curable resin.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: December 11, 2012
    Assignee: LG Display Co., Ltd.
    Inventors: Jin Wuk Kim, Yeon Heui Nam
  • Patent number: 8323541
    Abstract: A chuck apparatus for holding a substrate is the disclosed. The chuck apparatus includes a first surface portion on which the substrate is to be held and a second surface portion adjacent to the first surface portion and extending at least partially around an edge of the first surface portion and which, in use, is arranged to deflect gas over the first surface portion and thus the substrate that is to be held on the first surface portion.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: December 4, 2012
    Assignee: ASML Netherlands B.V.
    Inventors: Ivar Schram, Johan Frederik Dijksman, Sander Frederik Wuister, Yvonne Wendela Kruijt-Stegeman, Jeroen Herman Lammers, Richard Joseph Marinus Schroeders
  • Patent number: 8308965
    Abstract: According to one embodiment, a stamper manufacturing method includes forming a conductive material concentration gradient layer including the projections pattern, and a composition ratio of a buffering agent to a conductive material in the conductive material concentration gradient layer reducing in a thickness direction from a master side.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: November 13, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masatoshi Sakurai, Satoshi Shirotori, Seiji Morita, Shinobu Sugimura, Takuya Shimada, Yoshiyuki Kamata
  • Patent number: 8293125
    Abstract: A structure having a pattern is manufactured. An elastically deformable process target is elastically deformed in an inplane direction from a first state. A first pattern is formed on the process target deformed. The elastically deformed process target is made close to or returned to the first state, thereby to form a second pattern having a size and a shape at least one of which differs from those of the first pattern.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: October 23, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Aya Imada, Toru Den, Takashi Nakamura
  • Patent number: 8252189
    Abstract: A method for manufacturing a nano structure includes forming a stamp having a line pattern on a surface thereof, positioning the stamp upon a substrate, forming at least one protruded portion in the substrate substantially corresponding to the line pattern of the stamp, forming a protective coating layer on at least a portion of the at least one protruded portion, and removing a portion of the substrate by etching at least another portion of the at least one protruded portion not covered with the protective coating layer.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: August 28, 2012
    Assignee: Korea University Research and Business Foundation
    Inventor: Kwangyeol Lee
  • Publication number: 20120187085
    Abstract: Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.
    Type: Application
    Filed: April 6, 2012
    Publication date: July 26, 2012
    Applicant: Molecular Imprints, Inc.
    Inventors: Cynthia B. Brooks, Dwayne L. LaBrake, Niyaz Khusnatdinov, Michael N. Miller, Sidlgata V. Sreenivasan, David James Lentz, Frank Y. Xu
  • Patent number: 8222153
    Abstract: A method for fabricating a textured single crystal including depositing pads made of metal on a surface of a single crystal. A protective layer is deposited on the pads and on the single crystal between the pads; and etching the surface with a first compound that etches the metal more rapidly than the protective layer is carried out. Processing continues with etching the surface with a second compound that etches the single crystal more rapidly than the protective layer; and etching the surface with a third compound that etches the protective layer more rapidly than the single crystal. The textured substrate may be used for the epitaxial growth of GaN, AlN or III-N compounds (i.e. a nitride of a metal the positive ion of which carries a +3 positive charge) in the context of the fabrication of LEDs, electronic components or solar cells.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: July 17, 2012
    Assignee: Saint-Gobain Cristaux et Detecteurs
    Inventors: Fabien Lienhart, Guillaume Lecamp, François-Julien Vermersch
  • Publication number: 20120168404
    Abstract: A method of fabricating a nanoimprint stamp includes forming a resist pattern having a nano size width on a stamp substrate by performing imprint processes repeatedly. In the imprint processes, resist layers that are selectively etched are sequentially used. The stamp substrate is etched using the resist pattern as an etch mask.
    Type: Application
    Filed: July 13, 2011
    Publication date: July 5, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Du-hyun LEE, Byung-kyu LEE, Woong KO
  • Patent number: 8196285
    Abstract: A method and system for providing a PMR pole in a transducer including an intermediate layer are disclosed. A mask including line(s) having side(s) is provided. A hard mask is provided on the mask. Portions of the hard mask reside on the line side(s) and intermediate layer surface. The hard mask includes a wet-etchable layer and a high removal ratio layer on the wet-etchable layer. Part of the hard mask on the side(s) of the line is removed, exposing part of the line. The high removal ratio layer has a low angle removal rate on the line side(s) and a high angle removal rate on the intermediate layer surface. The low angle removal rate is at least four times the high angle removal rate. The line is removed, providing an aperture in the hard mask. A trench is provided in the intermediate layer. A PMR pole is provided.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: June 12, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Jinqiu Zhang, Liubo Hong
  • Publication number: 20120114559
    Abstract: Functional nanoparticles may be formed using at least one nanoimprint lithography step. In one embodiment, sacrificial material may be patterned on a multilayer substrate including one or more functional layers between removable layers using an imprint lithography process. At least one of the functional layers includes a functional material such as a pharmaceutical composition or imaging agent. The pattern may be further etched into the multilayer substrate. At least a portion of the functional material may then be removed to provide a crown surface exposing pillars. Removing the removable layers releases the pillars from the patterned structure to form functional nanoparticles such as drug or imaging agent carriers.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 10, 2012
    Applicants: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM, MOLECULAR IMPRINTS, INC.
    Inventors: Vikramjit Singh, Frank Y. Xu, Sidlgata V. Sreenivasan
  • Publication number: 20120097640
    Abstract: Disclosed are: a resin composition for pattern formation, which enables the stable formation of a pattern at a level of the wavelength of light; a method for forming a pattern having a sea-island structure using the composition; and a process for producing a light-emitting element that can achieve high luminous efficiency properties.
    Type: Application
    Filed: May 12, 2010
    Publication date: April 26, 2012
    Applicants: ASAHI KASEI E-MATERIALS CORPORATION, KABUSHIKI KAISHA TOSHIBA
    Inventors: Koji Asakawa, Ryota Kitagawa, Akira Fujimoto, Yoshiaki Shirae, Tomohiro Yorisue, Akihiko Ikeda
  • Patent number: 8156621
    Abstract: The subject processes are for making piezoelectric vibrators, particularly those having a tuning-fork configuration. An exemplary process includes preparing a flat plate of piezoelectric crystal material exhibiting anisotropic etching properties. A corrosion-resistant film is formed on both major surfaces of the piezoelectric material. A first coating of photoresist is formed on the surfaces of the corrosion-resistant film. A lithographic exposure is performed of the pattern of a piezoelectric vibrating device on only one side of the piezoelectric plate. Then, the corrosion-resistant film, appearing unprotected on the one surface, is removed after developing the photoresist. A first etching is performed of the piezoelectric material appearing unprotected after removal of the corrosion-resistant film.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: April 17, 2012
    Assignee: Nihon Dempa Kogyo, Ltd.
    Inventor: Yu Iwai
  • Patent number: 8128832
    Abstract: A method of forming an image. The method includes: a transfer layer on a substrate; forming on the transfer layer, an etch barrier layer; pressing a template having a relief pattern into the etch barrier layer; exposing the etch barrier layer to actinic radiation forming a cured etch barrier layer having thick and thin regions corresponding to the relief pattern; removing the template; removing the thin regions of the cured etch barrier layer; removing regions of the transfer layer not protected by the etch barrier layer; removing regions of the substrate not protected by the transfer layer and any remaining etch barrier layer; and removing remaining transfer layer. The transfer layer may be removed using a solvent, the etch barrier layer may include a release agent and an adhesion layer may be formed between the transfer layer and the etch barrier layer. A reverse tone process is also described.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: March 6, 2012
    Assignee: International Business Machines Corporation
    Inventors: Richard Anthony DiPietro, Mark Whitney Hart, Frances Anne Houle, Hiroshi Ito
  • Patent number: 8097539
    Abstract: A pattern is formed on a mask substrate. Positional deviation information between an actual position of the pattern formed on the mask substrate and a design position decided at the time of designing the pattern is calculated. A heterogeneous layer of which a volume expands more greatly than that of surrounding mask substrate region is formed in a predetermined position within the mask substrate so that volume expansion of the heterogeneous layer according to the positional deviation information is achieved.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: January 17, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Masamitsu Itoh
  • Publication number: 20110317160
    Abstract: Broad band structures for surface enhanced Raman spectroscopy are disclosed herein. Each embodiment of the structure is made up of a metal layer, and a dielectric layer established on at least a portion of the metal layer. The dielectric layer has a controlled thickness that varies from at least one portion of the dielectric layer to at least another portion of the dielectric layer. Nanostructures are established on the dielectric layer at least at the portion and the other portion, the nanostructures thus being configured to exhibit variable plasmon resonances.
    Type: Application
    Filed: March 13, 2009
    Publication date: December 29, 2011
    Inventors: Zhiyong Li, Min Hu
  • Patent number: 8070967
    Abstract: A method for manufacturing a patterned magnetic recording medium that allows processing only required sites with high precision, in a dry etching process during formation of an uneven pattern in an interlayer. The method includes forming sequentially, on a substrate, a soft magnetic layer, an etching stop layer, a seed layer, an interlayer, a hard mask layer and a resist; obtaining a resist pattern by patterning the resist; obtaining a patterned hard mask layer by etching the hard mask layer using the resist pattern as a mask; stripping the resist pattern; obtaining a patterned interlayer by etching the interlayer using the patterned hard mask layer as a mask; stripping the patterned hard mask layer; and forming a magnetic recording layer by forming a perpendicular orientation section on the patterned interlayer, and forming a random orientation section on the seed layer.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: December 6, 2011
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Katsumi Taniguchi
  • Publication number: 20110290759
    Abstract: A pattern is formed by: forming a first imprint mask layer on a processed member; forming a first imprint pattern of the first imprint mask layer using a first template; forming a second imprint mask layer made of a material having a different etching rate from the first imprint mask layer on the first imprint pattern; forming a second imprint pattern of the second imprint mask layer using a second template different from the first template; and etching the processed member using as a mask the second imprint mask layer on which the second imprint pattern is formed and the first imprint mask layer on which the first imprint pattern is formed.
    Type: Application
    Filed: March 3, 2011
    Publication date: December 1, 2011
    Inventor: Kenji FURUSHO
  • Patent number: 8048323
    Abstract: A method for manufacturing a magnetic recording medium (30) having magnetically separate magnetic recording patterns on at least one surface of a nonmagnetic substrate (1), includes the steps of forming a magnetic layer (2) on the nonmagnetic substrate, forming a mask layer (3) on the magnetic layer, forming a resist layer (4) on the mask layer, transferring negative patterns of the magnetic recording patterns to the resist layer using a stamp (5), removing portions of the mask layer which correspond to the negative patterns of the magnetic recording patterns, implanting ions in the magnetic layer from a resist layer-side surface to partly demagnetize the magnetic layer, and removing the resist layer and the mask layer.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: November 1, 2011
    Assignee: Showa Denko K.K.
    Inventors: Masato Fukushima, Akira Sakawaki
  • Patent number: 8043516
    Abstract: According to one embodiment, a method of manufacturing a magnetic recording medium includes forming protruded magnetic patterns on a substrate, depositing a nonmagnetic material in recesses between the magnetic patterns and on the magnetic patterns, and etching back the nonmagnetic material using an oxygen-containing etching gas while reforming a surface of the nonmagnetic material.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: October 25, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kaori Kimura, Yoshiyuki Kamata, Satoshi Shirotori, Masatoshi Sakurai
  • Patent number: 8017023
    Abstract: According to one embodiment, a method of manufacturing a magnetic recording medium includes forming a resist on a magnetic recording layer, imprinting a stamper to the resist to transfer patterns of protrusions and recesses, and partially etching the magnetic recording layer in areas not covered with patterns of the resist used as masks by ion beam etching using a mixed gas of He and N2 as well as modifying a remainder of the magnetic recording layer to leave behind a nonmagnetic layer having a reduced thickness.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: September 13, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Kamata, Kaori Kimura, Yousuke Isowaki, Masatoshi Sakurai
  • Patent number: 8012382
    Abstract: Chemically or biochemically active agents or other species are patterned on a substrate surface by providing a micromold having a contoured surface and forming, on a substrate surface, a chemically or biochemically active agent or fluid precursor of a structure. A chemically or biochemically active agent or fluid precursor also can be transferred from indentations in an applicator to a substrate surface. The substrate surface can be planar or non-planar. Fluid precursors of polymeric structures, inorganic ceramics and salts, and the like can be used to form patterned polymeric articles, inorganic salts and ceramics, reactive ion etch masks, etc. at the surface. The articles can be formed in a pattern including a portion having a lateral dimension of less than about 1 millimeter or smaller. The indentation pattern of the applicator can be used to transfer separate, distinct chemically or biochemically active agents or fluid precursors to separate, isolated regions of a substrate surface.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: September 6, 2011
    Assignee: President and Fellows of Harvard College
    Inventors: Enoch Kim, Younan Xia, Milan Mrksich, Rebecca J. Jackman, Xiao-Mei Zhao, Stephen P. Smith, Christian Marzolin, Mara G. Prentiss, George M. Whitesides
  • Patent number: 8012394
    Abstract: A sub-master template is patterned to provide at least double the density of features of a master template. The sub-master template and master template may employ the use of alignment marks during the patterning process.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: September 6, 2011
    Assignee: Molecular Imprints, Inc.
    Inventor: Sidlgata V. Sreenivasan
  • Patent number: 8002997
    Abstract: According to one embodiment, a method of manufacturing a magnetic recording medium includes forming a resist on a magnetic recording layer, imprinting a stamper to the resist to transfer patterns of protrusions and recesses, and partially etching the magnetic recording layer in areas not covered with patterns of the resist used as masks by ion beam etching using a mixed gas of He and N2 as well as modifying a remainder of the magnetic recording layer to leave behind a nonmagnetic layer having a reduced thickness.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: August 23, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Kamata, Kaori Kimura, Yousuke Isowaki, Masatoshi Sakurai
  • Publication number: 20110189438
    Abstract: According to one embodiment, first convex patterns and second convex patterns are provided in a mesa region of a template. The second convex patterns are provided spaced apart from the first convex patterns to have the height of bases equal to that of the first convex patterns. The height of the second convex patterns is different from that of the first convex patterns.
    Type: Application
    Filed: December 28, 2010
    Publication date: August 4, 2011
    Inventor: Kenji FURUSHO
  • Publication number: 20110171432
    Abstract: A method for applying a patterned coating of resist onto a surface of a substrate, includes embossing flowable resist at least once, wherein the flowable resist is respectively embossed between a patterned surface of a stamp and a carrier, whereby the stamp surface is provided with a patterned resist surface. The stamp carrying a first patterned part of the resist coating and the carrier carrying a second part of the resist coating are separated from each other. The patterned resist coating is transferred, wherein the first patterned part of the resist coating on the surface of the stamp is pressed against the surface of the substrate and the patterned resist coating is transferred onto the surface of the substrate. The first patterned part of the resist coating is cured and a demolding step is performed by separating the stamp from the first patterned part of the resist coating.
    Type: Application
    Filed: February 25, 2011
    Publication date: July 14, 2011
    Inventors: Namil Koo, Jung Wuk Kim, Christian Moormann
  • Patent number: 7972523
    Abstract: According to one embodiment, a method of manufacturing a magnetic recording medium includes forming a magnetic recording layer, an oxidation inhibiting layer, a hard mask layer includes carbon on a substrate, coating the hard mask layer with a resist, transferring patterns of protrusions and recesses to the resist by imprinting to form resist patterns, sequentially performing etching of the hard mask layer using the resist patterns as masks, etching of the oxidation inhibiting layer, and etching and/or magnetism deactivation of the magnetic recording layer to form patterns of the magnetic recording layer, and sequentially performing stripping of the resist patterns, stripping of the hard mask layer and stripping of the oxidation inhibiting layer, in which ion beam etching is used for stripping the oxidation inhibiting layer.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: July 5, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kaori Kimura, Yousuke Isowaki, Yoshiyuki Kamata, Masatoshi Sakurai
  • Patent number: 7967993
    Abstract: According to one embodiment, a method of manufacturing a magnetic recording medium includes forming a hard mask and a resist on a magnetic recording layer, imprinting a stamper on the resist to transfer patterns of protrusions and recesses, removing resist residues left in the recesses of the patterned resist, etching the hard mask using the patterned resist as a mask to transfer the patterns of protrusions and recesses, stripping the resist, and performing ion beam etching to remove the remaining hard mask and to modify a surface of the magnetic recording layer uncovered with the remaining hard mask.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: June 28, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yousuke Isowaki, Kaori Kimura, Yoshiyuki Kamata, Masatoshi Sakurai
  • Patent number: 7947608
    Abstract: Methods of imprint lithography are described. Generally, the methods include imprinting, via a patterned mold, a pattern into a polymerizable fluid composition on a substrate to form a patterned imprinting layer. A conformal layer is overlayed on the patterned imprinting layer. A portion of the conformal layer is used as a hard mask for subsequent processing. The imprinted pattern may be transferred to the substrate by a plurality of etches.
    Type: Grant
    Filed: November 15, 2010
    Date of Patent: May 24, 2011
    Assignee: Molecular Imprints, Inc.
    Inventor: Sidlgata V. Sreenivasan
  • Publication number: 20110073563
    Abstract: A patterning method for a carbon-based substrate is provided. The patterning method for the carbon-based substrate includes the following steps. The carbon-based substrate is provided. An atmospheric pressure plasma is produced from a plasma gas under an open air environment. The plasma gas includes oxygen. The carbon-based substrate is etched by the atmospheric pressure plasma.
    Type: Application
    Filed: September 25, 2009
    Publication date: March 31, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Chiang Chang, Chin-Jyi Wu, Shu-Jiuan Huang, Wen-Tung Hsu, Chih-Ming Hu, Shin-Liang Kuo
  • Publication number: 20110056911
    Abstract: Methods of imprint lithography are described. Generally, the methods include imprinting, via a patterned mold, a pattern into a polymerizable fluid composition on a substrate to form a patterned imprinting layer. A conformal layer is overlayed on the patterned imprinting layer. A portion of the conformal layer is used as a hard mask for subsequent processing. The imprinted pattern may be transferred to the substrate by a plurality of etches.
    Type: Application
    Filed: November 15, 2010
    Publication date: March 10, 2011
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventor: Sidlgata V. Sreenivasan
  • Publication number: 20110042352
    Abstract: An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed.
    Type: Application
    Filed: August 1, 2008
    Publication date: February 24, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Shingo Okushima, Junichi Seki, Haruhito Ono, Nao Nakatsuji, Atsunori Terasaki
  • Patent number: 7867406
    Abstract: Patterned magnetic recording media and associated methods of fabrication are described. The patterned magnetic recording media includes a perpendicular magnetic recording layer that is patterned into a plurality of discrete magnetic islands. The patterned magnetic recording media also includes an exchange bridge structure formed from magnetic material that connects the islands of the perpendicular magnetic recording layer. Connecting the islands with magnetic material increases exchange coupling between the islands, which makes the islands more magnetically stable.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: January 11, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands, B.V.
    Inventors: Thomas R. Albrecht, Manfred E. Schabes
  • Patent number: 7858528
    Abstract: Methods of patterning a substrate including creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions are described. A polymerizable material composition is dispense on the patterned layer defining a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: December 28, 2010
    Assignee: Molecular Imprints, Inc.
    Inventor: Sidlgata V. Sreenivasan
  • Publication number: 20100310830
    Abstract: There are provided an etching mask which has a superior thermal imprinting characteristic and also a good anti-etching characteristic, a base material with the etching mask, a microfabricated product to which those etching mask and base material are applied, and a production method of the microfabricated product. The etching mask formed of a thermoplastic resin containing at least one kind of skeleton expressed by a chemical formula (1) or a chemical formula (2) in a main chain wherein R1, R2, R3, R4, R5, R6, R7, R8 in the formulae (1), (2) can be different or same one another, each of which is a hydrogen atom, a deuterium atom, a hydrocarbon group having a carbon number of 1 to 15, a halogen atom, or a substituent group containing a hetero atom like oxygen or sulfur, and may form a ring structure one another and wherein m and n are integers equal to or greater than 0.
    Type: Application
    Filed: November 13, 2008
    Publication date: December 9, 2010
    Applicant: MARUZEN PETROCHEMICAL CO., LTD.
    Inventors: Yoshiaki Takaya, Takuro Satsuka, Yoshihisa Hayashida, Takahisa Kusuura, Anupam Mitra
  • Patent number: 7846346
    Abstract: A processing method for transferring a relief pattern of a mold to a resist includes the steps of compressing the mold having the relief pattern against the resist on a substrate, irradiating an exposure light onto the resist through the mold, vibrating the mold and the substrate relative to each other during the irradiating step, and releasing the mold from the resist.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: December 7, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Eigo Kawakami, Hirohisa Ota, Takashi Nakamura, Kazuyuki Kasumi, Toshinobu Tokita
  • Patent number: 7846345
    Abstract: The method of manufacturing an imprinting template according to the present invention utilizes a semiconductor manufacturing process and comprises a step of etching an oxide layer having a thickness of from 1000 to 8000 angstroms on a substrate by a microlithography and etching process, to form a pattern having a plurality of pillar-shaped holes, thereby forming an imprinting plate having a plurality of pillar-shaped holes. A material layer may be filled into the holes and a part of the oxide layer is removed to form an imprinting template having a plurality of pillar-shaped protrusions. Alternatively, a silicon substrate may be used instead of the substrate and the oxide layer. The imprinting template according to the present invention has advantages of mass production, fast production, and low cost, and is suitable to serve as the imprinting plate for making photonic crystals.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: December 7, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Pei-Yu Chou, Jiunn-Hsiung Liao