Abstract: The method for forming a tip of an array optical fiber disclosed is one in which an etching resistive material such as a photoresist is applied first on an end portion of a coated material covering constituent fibers of the array optical fiber, and then the ends of the constituent fibers are etched. Due to the presence of the etching resistive material, the etching solution does not dissolve the coated material. In an alternative method, the etching resistive material such as a photoresist is applied on a side surface of a tip portion of each constituent fiber of the array optical fiber exposed from the coated material, the tip portion is cut and flattened together with the etching resistive material, and the end faces of the constituent optical fibers are etched. The presence of the etching resistive material prevents the tip diameter of the constituent optical fiber from becoming small.

Abstract: A method for processing a layer of a silicon-based material on a wafer by which a sidewall protective film may be removed sufficiently and efficiently. An etching gas capable of yielding chlorine- or bromine-based chemical species and oxygen-based chemical species is used for dry etching a polycide film formed on a gate insulating film, plasma processing with an oxygen-based gas is then carried out for ashing the resist mask and removing carbonaceous components in the sidewall protective film. In addition, the sidewall protective film is oxidized so that the composition to that of stoichiometrically stable SiO.sub.2 is approached. Subsequently, the modified sidewall protective film is removed by processing with a dilute hydrofluoric acid solution. Since this sufficiently removes the sidewall protective film, it becomes possible to reduce the amount of dust and to improve coverage of a film to be formed by the next step.

Abstract: A method is provided for producing deep substantially vertical structures in silicon substrates, wherein in a first step, the silicon substrate is anisotropically plasma etched to a first predetermined depth, thereby creating a first structure. Subsequently, the surface of the substrate is covered conformally with an etch-resistant coating, and the horizontal parts of said coating are selectively removed. Following this removal, the substrate is anisotropically plasma etched at low temperatures to a second predetermined depth with a mixture of SF.sub.6 /O.sub.2, whereby a second structure is created. Finally, the vertical parts of the coating are removed.

Abstract: Improved film spacers for the sidewalls within semiconductor structures are disclosed. The spacers are made of non-conformal, organic materials, such as polyimides, acrylates, methacrylates, and various photoresist compositions. They are formed on the sidewalls by a process which involves the formation of overhang structures. The film spacers may be used for a variety of applications, such as sidewall imaging, control of dopant diffusion in an FET, formation of borderless contacts, and the manufacture of a resistor from an FET.

Abstract: A method for forming a residue free patterned conductor layer upon a high step height integrated circuit substrate. First, there is provided a semiconductor substrate having formed thereon a high step height patterned integrated circuit layer. Formed upon the high step height patterned integrated circuit layer is a blanket conductor layer, and formed upon the blanket conductor layer is a patterned photoresist layer. The portions of the blanket conductor layer exposed through the patterned photoresist layer are etched through an anisotropic etch process to leave remaining a patterned conductor layer upon the surface of the high step height patterned integrated circuit layer and conductor layer residues at a lower step level of the high step height patterned integrated circuit layer. The patterned photoresist layer is then reflowed to cover exposed edges of the patterned conductor layer.

Abstract: Sidewalls of patterned resist are reformed using a reforming agent selected from the group consisting of (a) a carbon trichloride radical, (b) a mixture of silicon ion and oxygen ion, (c) a mixture of carbon ion and carbon monoxide ion, (d) a chlorine radical, (e) aluminum trichloride liquid and (f) dibutyl magnesium liquid, and sidewall reformed portions are thus formed on the sidewalls of pattern resist. The not reformed portion of the patterned resist is removed away, and sidewall reformed portions are left on an object layer. The portion of object layer excluding the portion immediately below sidewall reformed portions is etched away, and fine patterns of object layer are formed as a result.

Abstract: This invention describes the use and methods of fabrication of a double destruction phase shift mask. The double destruction phase shift mask combines transparent phase shifting regions and attenuating phase shifting regions to form interference patterns in light projected through the mask which reduce the light intensity to nearly zero in the regions of the projected light corresponding to pattern elements. This eliminates the ghost line which can occur with conventional phase shifting masks. The double destruction phase shift mask provides improved depth of focus and edge definition.

Abstract: A process for forming self-aligned contact holes in a semiconductor device. In the process, a barrier layer for limiting an opened area of each contact hole is formed by use of a blanket etching process and a chemical vapor deposition process. This method eliminates the use of a mask patterning process upon formation of the selective metal layer to be used as the barrier layer, thereby minimizing the mask misalignment rate and the tolerance caused by the mask misalignment. By virtue of such features, the contact hole formation process enables formation of contact holes each having a minimum opened area enough to form a contact.

Abstract: A diamond body, such as a CVD diamond film, is etched by immersion of the body in a molten or partially molten metal, such as the rare earth metal La or Ce. While the body is being etched, various portions of a major surface of the body can be protected for various time durations by masks against the etching--whereby, after dicing the body, the resulting dies can be used as submounts for lasers with feedback.

Abstract: A process for forming a resist mask pattern includes the steps of forming a resist layer of organic material in a multilevel resist process on a layer to be etched, and selectively etching a planarizing lower layer used in the resist layer by using an etching gas of oxygen under a plasma condition, in which a compound gas of at least one element selected from the group consisting of B, Si, Ti, Al, Mo, W and S is added to the etching gas. For example, the compound gas comprises BCl.sub.3, BH.sub.3, TiCl.sub.4, S.sub.2 Cl.sub.2, SiCl.sub.4 or the like. During the etching, a compound oxide, e.g., B.sub.2 O.sub.3, SiO.sub.2 or the like, is deposited on sidewalls of the lower layer to form a protective layer which prevents undercutting.

Abstract: A method of patterning a film of PZT material comprises the steps of providing a mask over a selected surface portion of the PZT material; and, plasma etching unmasked portions of the thin film material. The method includes the steps of: introducing a gas mixture of halogenated gases into a chamber; ionizing the gas mixture into a plasma in the chamber by imposition of an electric field across the introduced gaseous mixture, chemically reacting the ionized gaseous mixture, chemically reacting the unmasked portions of the lead zirconate titanate thin film material to selectively remove such exposed portion of the thin film material. The gas mixture is a mixture of a chloride and a compound of fluorine. Preferably the compound of fluorine is a halocarbon or fluorocarbon. In particular, the fluorocarbon is a trifluoromethane, CHF.sub.3, and the chloride is boron trichloride BCl.sub.3.

Abstract: A mercury cadmium telluride (MCT) substrate 30 is immersed in a liquid 34 (e.g. 0.1 molar concentration hydrochloric acid) and illuminated with collimated radiation 24 (e.g. collimated visible/ultraviolet radiation) produced by a radiation source 20 (e.g. a 150 Watt mercury xenon arc lamp). A window 26 which is substantially transparent to the collimated radiation 24 allows the radiated energy to reach the MCT substrate 30. An etch mask 32 may be positioned between the radiation source 20 and the substrate 30. The MCT substrate 30 and liquid 34 may be maintained at a nominal temperature (e.g. 25.degree. C.). Without illumination, the MCT is not appreciably etched by the liquid. Upon illumination the etch rate is substantially increased. A further aspect is the addition of a passivant (e.g. iodine) to the liquid which forms a substantially insoluble passivation layer 36 on the substrate which is removed or partially removed by the radiation 24.

Abstract: A process in which micromechanical bushings can be made and the application of such process to making micromechanical devices. Bushings are made on a surface of a stationary structure extending from a planar surface. The bushings are separated from the stationary structure by a sacrificial layer. The stationary structure, the bushing and the planar surface are then further processed by coating with a second sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by a curved, undercut edge such as gear on stool. Final processing includes removing both sacrificial layers to free the movable structure, the bushing, and the stationary structure from each other. The bushing is trapped between the movable structure and the stationary structure but able to move freely.