Abstract: A laser process in which stripe formation due to laser annealing is prevented and uniform laser annealing is made over the whole surface of a substrate. A laser beam having an energy distribution with an edge which has a nearly vertical shape l used, and when scanning of the laser beam is carried out, the scanning is carried out while the edge having the nearly vertical shape is made the front of the scanning.

Abstract: In a quartz glass, a mark is internally made such that a retardation generated in close proximity to the end of the mark is up to 20 nm. The internally marked quartz glass in which internal marks are created without sacrificing optical precision finds use as quartz glass substrates for optical members in the electronic industry.

Abstract: In a carbon dioxide laser machining method of a multilayer material of applying carbon dioxide laser light to a machined part of a multilayer material having an insulation layer and a first conductor layer and a second conductor layer deposited with the insulation layer between and removing the first conductor layer and the insulation layer of the machined part to form a blind hole or a groove arriving at the second conductor layer, the laser light is applied to the machined part like pulses at an energy density of 25 J/cm2 or more for beam ON time in the range of 1 &mgr;s to 10 &mgr;s.

Abstract: A sharp corner judgment means judges as to whether a corner of cut shape in a workpiece is a sharp corner is not on the basis of a machining program. When the corner is regarded as the sharp corner, an additional locus producing means for producing sharp corner produces an additional locus for producing sharp corner when machining on the corner regarded as the sharp corner, and a sharp corner machining execution means executes machining on the corner on the basis of the produced additional locus for producing sharp corner. Then, the additional locus for producing sharp corner can be automatically produced for the sharp corner so as to execute machining.

Abstract: The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.

Abstract: The die bonder which mounts dies piece by piece on a base has a laser machining part which causes laser light to become incident from the obverse surface of a wafer and forms a modified region in the interior of the wafer. In this manner, the die bonder itself has the function of dividing the wafer into individual dies. Thus, the dicing step before the die bonding step can be omitted.

Abstract: The laser beam dump is positioned in a housing. An absorbing glass plate means is operatively connected to the housing. A heat sync means for extracting heat from the absorbing glass plate means is operatively connected to the housing and operatively connected to the absorbing glass plate means.

Abstract: A microfilter design system for use with a laser drilling system producing multiple sub-beams for parallel drilling operations includes an optical intensity detector illuminated by the multiple sub-beams of the laser drilling system. An analysis module operates the optical intensity detector to produce intensity measurement data for each of the multiple sub-beams. A memory operable with a data processing system stores the intensity measurement data for analysis.

Abstract: An ablatable laminar imaging medium useful in the manufacture of a substantially transparent electrode assembly is disclosed. The laminar imaging medium comprises a substrate, a high-index metal oxide layer, an ablatable metallic conductive layer, a high-index conductive metal oxide layer, and an ablation enhancement layer. The ablation enhancement layer has an IR-absorption greater than the IR-absorption of said high-index conductive metal oxide layer and an IR-reflectivity less than the IR-reflectivity of said high-index conductive metal oxide layer. Presence in the laminar imaging medium of the ablation enhancement layer lowers the exposure threshold of the medium and improves ablation accuracy, both—when occasioned in the manufacture of LCD electrode patterns—resulting collectively and ultimately in a more reliably formed electrical architecture, less susceptible to unwanted “shorting”.

Abstract: A colored substrate is positioned between a material and a laser, and the material is scribed with a laser that has been directed through the colored substrate. By so doing, color is transferred to the material to form the color graphic without undesirably carbonizing, melting or burning through the material. The energy density per unit time can be defined as continuous power divided by the area of the spot and the speed.

Abstract: A non-contact method for adjusting static attitude in suspension for use in a rigid disk drive is disclosed. The method includes the use of one or more lasers as a heat source directed at a well-defined region on either or both sides of the gimbal outrigger. Irradiation by the laser causes thermal gradient across the thickness of the outrigger and simultaneously changes its residual stress distribution, which alters the static attitude change in suspension or head gimbal assemblies. In this present invention, initial pitch and roll static attitude is measured by the measurement apparatus, this result is then used to calculates the laser parameter required for irradiation on either or both side of the outrigger to achieve the desired static attitude condition. An adjustment is accomplished with irradiation on either or both sides of the outrigger with one or more lasers while suspension or head gimbal assemblies are in free-state.

Abstract: A method for manufacturing a liquid-discharging recording head can prevent deviation in the dimensions and the pitch of grooves, serving as liquid channels, and holes, serving as discharging ports, and generation of burrs around discharging ports while maintaining the grooves and the holes to desired sizes and without increasing a time required for the processing when forming the grooves and the holes by projecting a laser beam. When performing ablation processing of the liquid-channel grooves or the discharging ports in a top-plate blank by projecting the laser beam, the processing is performed by changing the energy density per unit time of the laser beam continuously or stepwise by adjusting the oscillation voltage or the oscillation frequency of the laser beam, attenuating the laser beam, or moving a substance to be processed along the optical axis.

Abstract: The present invention provides a method and apparatus for marking vehicles using a laser. In order to allow any part of the vehicle to be marked using a simple, strong laser beam delivery conduit, the laser is mounted on a structure 101 which extends over a vehicle station 102. The structure defines at least three laser mounting positions and preferably four laser mounting positions A, B, C, D, spaced apart from one another in two dimensions for mounting at least one laser apparatus 107. The laser apparatus 107 comprises a laser emitter 108 for producing a laser beam adapted to mark a part of the vehicle and laser beam delivery means 110 for delivering a laser beam from the laser emitter 108 to a selectable point of the vehicle station 102. The laser apparatus 107 is movable between at least two and preferably all four of the laser mounting positions A, B, C, and D.

Abstract: A sharp corner judgment means judges as to whether a corner of cut shape in a workpiece is a sharp corner is not on the basis of a machining program. When the corner is regarded as the sharp corner, an additional locus producing means for producing sharp corner produces an additional locus for producing sharp corner when machining on the corner regarded as the sharp corner, and a sharp corner machining execution means executes machining on the corner on the basis of the produced additional locus for producing sharp corner. Then, the additional locus for producing sharp corner can be automatically produced for the sharp corner so as to execute machining.

Abstract: A laser processing method for making an inkjet head, including a step of irradiating laser light to an inkjet head material for removing a part of the inkjet head material. The laser light is emitted from a solid laser and has a wavelength of not longer than 355 nm.

Abstract: Methods and apparatus for material modification using laser bursts including appropriately timed laser pulses to enhance material modification. In one implementation, a method for material modification comprises the steps of: providing bursts of laser pulses, wherein each burst comprises at least two laser pulses, wherein each laser pulse has a pulse duration within a range of between approximately 10 ps and 100 ns, wherein a time between each laser pulse of each burst is within a range of between approximately 5 ns and 5 &mgr;s; a time between successive bursts is greater than the time between each laser pulse comprising each burst; and directing the bursts upon a workpiece, wherein an intensity of a primary laser pulse of each burst exceeds a damage threshold of the workpiece.

Abstract: In the laser trimming of passive circuit elements such as resistors, capacitors and inductors, various trimming parameters must be selected. To select a parameter, such as a cut type or speed, a value of a parameter, such as the resistance or impedance of a resistor, of each of a plurality of elements is measured. The measured parameter value of each element is compared with a target value for the parameter to determine an offset value between the measured parameter value and the target value. The relevant trim parameters are then selected based on the determined offset values.

Abstract: A method for producing magnetoresistive heads includes the steps of placing a substrate having a plurality of transducers in an environment including a focused ion beam. The focused ion beam is directed onto the first MR element. A property level, generally the resistance associated with the MR stripe, of the first MR element is monitored until the resistance reaches a desired level. The focused ion beam is redirected onto a second area of the substrate which includes the second MR element. The electrical resistance of the second MR element is monitored as the focused ion beam acts on the second MR element until the resistance of the MR element reaches a desired level. Using this process, the resistivity of individual MR elements within the substrate can be tightly controlled.

Abstract: An apparatus is provided for fabrication of miniature structures which includes a substrate, a controllable energetic beam, a deposition layer supported on a material carrier element and a control unit operating the apparatus in either of “material removal” and “material transfer” modes of operation. In the “material removal” mode of operation, the control unit displaces the material carrier element away from an interception path with the energetic beam so that the energetic beam impinges in patterned fashion onto the surface of the substrate and disintegrates the surface material of the substrate. In the “material transfer” mode of operation, the control unit displaces the deposition layer to intercept with the energetic beam so that the material contained in the deposition layer is transferred and deposited on the surface of the substrate in a patterned fashion.

Abstract: A method and an apparatus are for rapidly processing dielectric substrates using laser beams. A pulsed laser beam having a pulse repetition frequency greater than approximately 50 kHz and having pulse lengths shorter than approximately 200 ns is used for this purpose. Given a suitable choice of the parameters which characterize the processing laser beam, it is possible to ensure both a high throughput of bored holes and a high hole quality. With the use of a Q-switched CO2 laser, a wavelength of approximately 9.2 &mgr;m and a pulse energy of approximately 0.7 mJ are used. As a result, by way of example, 500 holes per second can be bored into an LCP substrate having a thickness of 0.4 mm. The high throughput and the simultaneously high hole quality are a consequence of the wavelength chosen, the short pulse lengths, the high repetition rate and the pulse energy that is likewise high compared with conventional laser processing apparatuses in the area of electronic fabrication.

Abstract: A system and method for micromachining substrates containing glass employing a UV laser beam generated by outputting a sub-1000 nm pulsed laser beam that is frequency converted by third harmonic generation to have a wavelength within the range of 285 nm to 333 nm.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: A method for manufacturing a slider including a head for recording data into and reproducing data from a record carrier, and a floatation surface that floats above the record carrier includes the steps of setting an orthogonal coordinate system having an origin as a center of the floatation surface, and regulating a shape of the floatation surface by using laser to scan a rear surface of the floatation surface so that a flatness at each of plural positions set by the orthogonal coordinate system.

Abstract: A device and process for sintering a powder with a laser beam, and in particular, a rapid prototyping process involving selective laser sintering (SLS), with reduction in non-homogeneities, i.e., grooves or hollows due to complete melting of powder or poor material characteristics due to insufficient melting of powder. The problem is solved by a process and a device for homogenization of the temperature distribution in the part during its manufacture. For this, the temperature of the sinter powder is detected in the sinter point and the power of the laser is controlled depending upon the detected temperature. Geometric changes of the moveable detection area, as well as the changes in the chromatic adjustment, and beam correcting errors, all of which occur depending upon the position of the detection area on the upper surface of the powder bed, are taken into consideration. Thereby a more realistic determination of the temperature values is made possible from the measured temperature values.

Abstract: The present invention relates to a method of laser technology using in IC etching process, which uses by controlling the power of laser, repetition rate, timing of operation and modulation of laser beam's focus to apply in IC etching process to ablate the various materials on the surface of a wafer.

Abstract: The invention relates to a process and device for joining workpiece elements by means of an energy beam, especially a laser beam. The device comprises a wire feeding device for feeding a filler wire. In order to create optimum guidance of the wire relative to the laser beam and to the workpiece surface, the wire feeding device is mounted in a movable manner in the direction of the axis of the energy beam, in such a way that the wire tip melting in the energy beam is guided in a non-positive manner along the workpiece surface.

Abstract: A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. An apparatus for ablating a region of a sample with a laser beam. The apparatus comprises: 1) a source providing a pulsed laser beam of a certain energy, the source focusing the laser beam on the sample to ablate a region of the sample; and 2) a device for providing a flowing fluid over the region being ablated to remove the ablation products.

Abstract: The invention relates to a method of producing an aperture (2) in a metallic component (1), in which the aperture (2) comprises, at least in certain portions, a non-cylindrically formed funnel (9), extends from a first surface (5) to a second surface (6) of a component wall (3) and is formed by a laser beam (10), it being attempted to improve the dimensional accuracy and reduce the roughness of the surface of the aperture and/or funnel in that, by appropriate choice of the laser parameters, the metal is predominantly removed by sublimation during the formation of the funnel (9) and the funnel (9) is formed by laser removal of layers (11) of a substantially constant thickness (FIG. 3).

Abstract: When determining coordinates of a point of an object (2) in a reference system of coordinates and the orientation of the object in the space in a measuring position assumed by the object, the object is moved from a start position having known coordinates and a known orientation to a measuring position while detecting this movement. Said coordinates and the orientation of the object in the measuring position are calculated from information from this detection and about the start position. Furthermore, the acceleration and retardation of the object are measured during the movement, and the coordinates and the orientation of the object in the measuring position are calculated from information from this measurement.

Abstract: A method of accurately and precisely providing desired functionality to an electronic or opto-electronic component is disclosed in which a Femtosecond laser pulse is used to ablate material from a surface of or from within a component. The component is in active operation during the ablation process in order to facilitate the ablation process. The process also involves detection and feedback to indicate when a repair is sufficiently complete. The detection is also performed while the component is powered allowing in-situ detection and ablation. Of course, forms of facilitation other than feedback such as monitoring are also applicable to the invention.

Abstract: A method of laser drilling surgical needles. The method utilizes a diode pulsed laser to produce a laser beam consisting of a train of high energy pulses. The method produces laser drilled chamfered blind bore holes in surgical needles.

Abstract: The present invention is a method for repairing a TBC ceramic top coat in local regions that have experienced a mechanical or thermally-induced spallation event leaving the underlying bond coat intact. A novel combination of groove design (i.e. spacing, pattern and depth) and laser-surface incident angles fabricated into the remaining bond coat is used to achieve spallation resistance equal to or greater than baseline after applying and maintaining a TBC ceramic patch to the localized areas of spallation. The method is particularly useful, but not limited to, repair of coating systems comprised of physical vapor deposited (PVD) ceramic top coats.

Abstract: A laser working apparatus is provided with program analysis means for analyzing a work program and outputting a move command of each axis and an on/off command for turning on/off a laser beam, interpolation means for performing interpolation processing based on the move command and outputting a move distance to a servo amplifier, move distance setting means for setting a move distance for delay operation, and beam on/off delay means for delaying a beam on/off command output to a laser oscillator based on the actual move distance after the on/off command is output and the move distance for delay operation.

Abstract: A method of laser shock peening a metallic part by firing a laser on a coated laser shock peening surface of the part which has been covered with an explosive coating containing at least one explosive ingredient. Two or more explosive ingredients having different shock sensitivities may be used and the laser beam is fired with sufficient power to explode at least some amount of each of the explosive ingredients.

Abstract: In hardening with laser beam by irradiating laser beam. 29 on a workpiece 27, oscillating the laser beam so as to heat a workpiece with a hardening width W1, laser beam output in both end portions (times (1), (5), (6), (10) of FIG. 4, for instance) of amplitude of the laser beam is made lower than one of a center portion (times (3), (4), (7), (8) of FIG. 4, for instance) of the amplitude. Relative moving velocity of the laser beam with respect to workpiece is decreased, and the quantity of giving energy of the laser beam in both end portions of the amplitude where the density of giving energy of laser beam is high is decreased so as to equalize quantity of aiming energy in the whole hardening cycle. By doing so, a proper hardening action is possible.

Abstract: A method of manufacturing an antivibration device for motor vehicles, the device comprising at least one metal insert having at least one fixing surface bonded to an elastomer, the method including a cleaning step during which the fixing surface is scanned with a laser beam that is sufficiently powerful to eliminate the impurities present on said surface.

Abstract: A filler wire for laser-welding an aluminum alloy is described, which comprises a base material of Aluminum-Silicon based alloy and a flux of Aluminum-Potassium-Fluorine-based composition. The amount of the flux in the base material is greater than 0 (zero) wt. % and less than approximately 1.0 wt. %.

Abstract: A laser via drilling system, and a method of use thereof, is provided. The apparatus uses two or more laser systems to achieve processing parameter flexibility. The output beams from the independently controlled laser systems are combined using a beam splitter that combines the beams into single or multiple processing beams. The operational flexibility of the system can be further enhanced through the use of multiple EO modulators and a polarization sensitive beam splitter.

Abstract: An ultraviolet beam with high energy density is applied for forming an opening in an electric conductor layer 1 in a flexible wiring board whereas an ultraviolet beam with low energy density is applied for forming an opening in an electrically insulating layer 2 in the flexible wiring board. As a result, excessive heat energy applied for forming a via hole can be reduced, so that the problems can be reduced. In this manner, high quality of the via hole and delicate and accurate processability due to use of the ultraviolet laser beam can be combined to achieve formation of fine patterns densely in the flexible wiring board.

Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.

Abstract: A quasi-CW diode-pumped, A-O Q-switched solid-state harmonic laser system (10) synchronizes timing of the quasi-CW pumping with movement of the positioning system (36) to reduce pumping while the positioning system (36) is moving from one target area (31) to the next target area (31) to form multiple vias in a substrate at a high throughput. Thus, the available UV power for via formation is higher even though the loading to the laser pumping diodes (14) remains the same as that currently available through conventional CW pumping with conventionally available laser pumping diodes (14). The quasi-CW-pumping current profile can be further modified to realize a preferred UV pulse amplitude profile.

Abstract: An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.

Abstract: An apparatus and method for providing a substantially debris-free laser beam path for use during laser shock processing. The method and apparatus include a system for removing debris from the laser beam path and a system for preventing debris from entering the laser beam path.

Abstract: In an apparatus and a method for marking glass with a laser, the glass is first brought to a temperature above the transformation temperature of the glass. The glass is then acted upon by a laser pulse which produces a mark on the surface of the glass. The peak power of the laser pulse is preferably selected so that it is merely a thermal interaction with the glass surface which occurs. This has the advantage that the material properties of the marked glass remain unchanged compared with the unmarked product.

Abstract: A method and apparatus for creating ablation-free visible markings on a multi-layer hard disk magnetic storage media by laser-induced deformation while maintaining the integrity of the protective carbon layer, and without destroying the multi-layered structure of the media. The apparatus includes a laser generator, a rotatable optical plate and a beamsplitter by which the fluence of the beam can be controlled without altering the power setting to the laser generator, a beam sampler for determining the fluence of the beam, and an optical plate which acts with the beamsplitter to eliminate unwanted reflection of the laser beam. The laser beam is steered by a beamsteerer to a hard disk held in a material handling unit. This technique is highly suitable for marking or labeling finished hard disks for the purposes of identification and traceability, without creating any short-term or long-term contamination problems. The corresponding storage media so marked are also claimed.

Abstract: A Pulsed Electron Beam System is developed and applied for the surface modification of the metal and/or partial metal dentures. The system is consisted with an explosive emission cathode, accelerating gap formed by the cathode and plasma anode, and an electron collector where the metal and/or partial metal dentures are fixed, and placed into a magnetic field. The method can provide a modified metal and/or partial metal denture surface with high reflectance as a mirror polished surface and high corrosion resistance.

Abstract: Energy is applied to a portion of a conducting body. In preferred embodiments, relative motion between the conducting body and the energy source is created such that the energy source moves along a thermal diffusion front, thereby enhancing the thermal diffusion front in the direction of the relative movement. The energy is preferably applied in a portion of the conducting body with higher thermal mass and the enhanced thermal diffusion front is directed toward a portion with lower thermal mass. The lower thermal mass portion expands, thereby creating fissures in surrounding material, then melts, flows through the fissures and contacts another conductor, thereby forming a conductive link.

Abstract: A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.

Abstract: A method and apparatus for production of high-resolution laser-induced damage images by small etch points is based on generation of the initial electron density in the relatively large volume, creation of the breakdown at a small part of the said volume and control of the energy amount enclosed inside the plasma. The method uses two laser radiations: the first has comparatively long pulse width, its energy does not exceed damage threshold value, and it is focused at relatively large focal spot; the second has shorter pulse duration, it is focused at smaller spot and its energy exceeds appropriate threshold value. The system produces laser-induced damage images by joint using of an optical scanner (deflector) and a drive table for movement of article. The system works without interruption of article movement relative to the laser beam and creates image areas with different brightness by modulation of article replacement speed and frequency of scanning.

Abstract: Embodiments of methods and an apparatus for creating points or areas of laser-induced damage inside a transparent material are disclosed. One or more embodiments of the invention comprise a method and system for producing etch points by control of breakdown process development. In one embodiment, at the beginning an applied laser radiation level just exceeds an energy threshold for creating a plasma condition in the material, and thereafter the energy level of the applied laser radiation is just maintain the plasma condition and is applied before the plasma condition extinguishes, but after a shock wave associated therewith has passed. Other embodiments of the invention comprise a method and a system for producing etch points by controlling a space structure of laser beam. According to the invention a laser generates a TEMmn radiation. The values of the integers m and n are controlled and determined so as to reproduce particular gray shades for a particular point of an image.