Abstract: The present invention relates to a method for smoothing and polishing surfaces by treating them with energetic radiation, in particular laser radiation, in which the to-be-smoothed surface is remelted in a first treatment step using said energetic radiation and employing first treatment parameters at least once down to a first remelting depth of approx. 5 to 100 ?m, which is greater than a structural depth of the to-be-smoothed structures of said to-be-smoothed surface, wherein continuous radiation or pulsed radiation with a pulse duration of ?100 ?s is employed. The method makes it possible to automatically polish any three-dimensional surface fast and cost effective.

Abstract: A method in connection with laser use, wherein one or more laser beams emitted by one or more laser sources are focused by beam guiding elements on a fusing spot. A filler delivered to the fusing spot is melted, especially for performing a welding, coating, and/or piece manufacturing process. The filler includes a substantially solid-state, elongated filler material that is fed by a delivery system to the fusing spot. The fusing spot is centrally located relative to the one or more laser beams focusing on the fusing spot. The one or more laser beams are diverged with a multi-segment mirror, especially for maintaining the symmetry of the intensity distribution thereof, whereby beams or divisional beams, reflecting from its various segment elements in substantially divergent directions, are converged on the fusing spot by a condenser system included in the beam guiding elements.

Abstract: A printing plate making apparatus which scans a recording medium by light beam in a predetermined pixel pitch, thereby engraving a surface of the recording medium to make a printing plate, wherein an upper surface of a convex portion of light power of the light beam engraving all or part of an adjacent region which is adjacent to a convex portion which is to be left in a convex shape on a surface of the recording medium is set to an threshold engraving energy or less, and light power of light beam in a vicinity region in vicinity of outer side of a region defined as the adjacent region is brought higher than light power in the adjacent region.

Abstract: A device for preventive treatment of an optical surface designed to be exposed to a laser flow including a thermal excitation source for providing a localized thermal annealing of a site of the optical surface) by means of a beam applied to the site. The device further includes a measuring member for measuring, in real time said during said localized thermal annealing, a quantity representing the temperature of the site of the optical surface) and at least one control member for increasing the linear power density of the beam applied to the site by the excitation source and, when the quantity reaches a predetermined set point, for gradually decreasing the linear power density.

Abstract: A method and apparatus for remotely monitoring properties of gases and plasmas is disclosed. A laser beam is focused at a desired region within a gas or plasma to be analyzed, generating an ionized sample region in the gas or plasma. A beam of microwave radiation is directed toward the ionized sample region, and a portion of the microwave radiation is scattered by the ionized sample region and Doppler-shifted in frequency. The scattered, frequency-shifted microwave radiation is received by a microwave receiver, and is processed by a microwave detection system to determine properties of the gas or plasma, including velocities, temperatures, concentrations of molecular species, and other properties of the gas or plasma.

Abstract: Here is presented a versatile technique for machining of nanometer-scale features using tightly-focused ultrashort laser pulses. By the invention, the size of features can be reduced far below the wavelength of light, thus enabling nanomachining of a wide range of materials. The features may be extremely small (<20 nm) and are highly reproducible.

Abstract: The present invention concerns a method for manufacturing a needle, of the type used in the medical field. This needle is formed by a pulsed laser weld for joining a first portion having a pointed end and a second end having the shape of a tube and for receiving, in a subsequent step, the end of a suture thread. During the welding step, the needle and the incident laser beam are driven in a relative rotational movement whose speed is adjusted such that during the duration of a laser beam pulse, at least one complete revolution is carried out.

Abstract: A multi-beam laser device is used to make a microretarder plate, which comprises a plurality of first retardation state areas and second retardation state areas alternating with each other. The device comprises an infrared laser, a beam splitter, and a driving means. The beam splitter is used to split the laser beam into a plurality of equal intensity parallel beams and bring the parallel beams into focus. The driving mechanism is used to drive the beam splitter in one direction, and the beam splitter will scan a plurality of parallel scan lines by the direction on a surface.

Abstract: A laser anneal apparatus is provided with a laser source; a homogenizing optical system disposed in an optical path of laser light emitted from the laser source to homogenize an intensity distribution of the laser light in a section which is perpendicular to the optical path; a phase shifter disposed in the optical path of the laser light passed through the homogenizing optical system to produce an intensity distribution pattern of the laser light in the section which is perpendicular to the optical path; a photoreceptor device disposed in the optical path of the laser light passed through the phase shifter to intercept a part of the laser light and to measure a quantity of the intercepted laser light; and an image-forming optical system disposed in the optical path of the laser light passed through the photoreceptor device to focus the laser light on a substrate to be treated.

Abstract: A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles.

Abstract: In order to easily control the laser pulse width and perform high-precision processing, the method for processing a material by laser ablation according to the present invention is characterized in that the material having a region of which a double logarithmic chart shows a linearly-shaped line with a gradient of not more than 0.5, when a relationship between laser pulse width and ablation threshold is represented in the logarithmic chart with a laser pulse width in picosecond plotted along the horizontal axis and an ablation threshold in J/cm2 plotted along the vertical axis, is processed by the pulsed laser beam having the laser pulse width within the region.

Abstract: An energy collector is used to assist a laser coupling process by reducing the amount of output power of a laser that is used to modify a device attaching element. The energy collector includes an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process. The energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process and is formed from a material that converts this reflected energy to heat. Sufficient thermal coupling is created between the energy collector and a surface to provide a conductive pathway for the energy, which has been converted to heat, between the energy collector and the device attaching element.

Abstract: A process and a system for creating internal stress in a metallic workpiece by laser shock peening is provided. In the process, a first laser pulse is applied to a treatment site of the workpiece covered by a surface layer. A second laser pulse follows the first laser pulse in time, and is applied to the treatment site of the workpiece. A covering layer, such as flowing water, is provided over the treatment site during the application of the laser pulses.

Abstract: An on-the-fly analog switching method and system for providing a switching time of less than one second between energy levels and laser heads for laser shock peening applications. An analog switch is used with variable resistance devices that produce a switching time of less than one second. One advantage of the present invention is that a switching time of less than one second is provided which provides for an energy and time efficient system. The laser shock peening process is never delayed for switching purposes as the switching occurs during the standard pause between treated linear areas.

Abstract: A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained.

Abstract: Provided are a processing method and a processing apparatus which are capable of suppressing a disturbance attributable to a surface wave in a processing by interfered laser beams, in particular, a processing by the interfered laser beams of a pulsed laser having a pulse width of equal to or more than 1 fs and of equal to or less than 1 ps, in which the wavelength of a surface wave that propagates in a direction of the interference of the laser is made longer than a pitch of the interference of the laser on a surface of an object to be processed to process the object.

Abstract: Preferred embodiments of a system and methods to deliver different magnitudes of laser power density to a work piece while maintaining a constant focusing spot size are described. In particular, the system includes a laser, an optical focusing assembly and an overlay. The overlay receives a laser beam having a perimeter at a first magnitude of power and transmits the laser beam to the optical focusing assembly at about the same perimeter and at a magnitude lower than the first magnitude. In a preferred embodiment, the overlay can include an optically neutral blocking lens or a neutral density filter. A method of laser machining an orifice at a suitable average power density sufficient to machine the orifice with reduced heat affected zone, spatters, soots or recasts is described. A method of providing a focusing spot size of a generally constant effective area by a laser machining system is also described.

Abstract: A plurality of configurations is simultaneously formed in a material by a single laser beam having a desired distribution pattern of wavelengths. An input laser beam has an initial wavelength distribution pattern. The initial wavelength distribution pattern is adjusted or modified into a desired final wavelength distribution pattern. For example, the initial wavelength distribution pattern is a wide range of wavelengths in a single bell-curve distribution while the desired final wavelength distribution pattern has a specific number of sharp peaks each over a predetermined narrow range. The laser beam having the desired final wavelength distribution pattern is focused upon on a material. Because of the multiple peaks in the wavelength distribution, the laser beam is focused at a plurality of the focal distances. A number of structures is simultaneously formed in a material at the multiple focal points or at multiple locations/depths when the above laser beam is projected onto the material.

Abstract: The present invention relates to a method for producing, on the surface of a wall capable of being swept by a fluid, raised elements forming disruptions of the boundary layer. It is characterized in that laser shocks are applied to said surface so as to create peaks on the edge of the impact zones, the peaks forming said disruptive raised elements.

Abstract: A method for controlling the shape of the area machined by a pulse of laser light on a surface, such that the shape has a desired elliptical shape with its major axis aligned in a desired direction and the length of this major axis is less than or equal to a diameter of a beam spot. The pulse is generated and focused to the beam spot within a target area. The polarization of the pulse is adjusted to be elliptically polarized with an axis of the polarization ellipse oriented in the desired direction. The ellipticity of the polarization of the pulse is adjusted such that the pulse of laser light has contours of constant machining capacity on the workpiece surface, which have a similar shape to the desired shape. The fluence of the pulse light is controlled such that the area machined by the pulse is substantially the desired shape.

Abstract: A method for laser machining of material using a burst comprised of laser pulses. The method tailors the pulse width, pulse separation duration, wavelength and polarization of the multiple laser pulses included in a burst to maximize the positive effect of thermal and physical changes achieved by previous pulses that have impinged upon the machined material.

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: An improved apparatus and method for applying a plurality of raised features at select locations on a metallic substrate using a high-powered radiant energy source, such as a laser, in combination with powder metallurgy such that the resultant substrate surface exhibits increased slip-resistance resulting from the presence of the raised features on the substrate.

Abstract: A battery having a bundle of electrodes and separator which is made by winding a positive-electrode plate and a negative-electrode plate together with a separator therebetween, one of the positive- and negative-electrode plates being electrically connected to a power collecting body, the power collecting body being provided in and welded to an outer package can, wherein a welding portion of the outer package can and the power collecting body comprises a first layer and a second layer which are stacked in a thickness direction of the outer package can at the welding portion, and the second layer is in contact with a surface of the first layer and includes crystal grains that are minuter than crystal grains included in the first layer.

Abstract: A laser engraving system (10) for engraving a unengraved workpiece (20) and an engraving method are provided. The laser engraving system includes an image processor (12), an engraving controller (13), a mechanical arm (14), and a laser (15). The image processor is configured for building a workpiece model (22) corresponding to an unengraved workpiece, partitioning the workpiece model into at least one section (224), generating at least one two-dimensional pattern (223). The engraving controller receives the signals of the relative position values and the at least one two-dimensional pattern. The mechanical arm is electronically coupled to the engraving controller and controlled by the engraving controller. The laser is electronically coupled to the engraving controller and controlled by the engraving controller in such a manner that the laser engraves an unegraved workpiece according to the at least one two-dimensional pattern.

Abstract: A one step process for fabricating planar optical waveguides comprises using a laser to cut at least two channels in a substantially planar surface of a piece of dielectric material defining a waveguide there between. The shape and size of the resulting guide can be adjusting by selecting an appropriate combination of laser beam spatial profile, of its power and of the exposure time. A combination of heating and writing lasers can also be used to fabricate waveguides in a dielectric substrate, wherein the heating laser heats the substrate with a relatively broad focused spot, the power of the heating laser being controlled to raise the temperature heating the substrate just below the substrate's threshold temperature at which it begins to absorb electro-magnetic radiation, the writing laser, which yields a spot size smaller than the heating laser then melts the substrate within the focal spot of the heating laser.

Abstract: The invention relates to the use of a cobalt-chromium alloy in the manufacture of a dental prosthesis. The alloy contains: 43-68% by weight cobalt, 12-30% by weight chromium, 8-25% by weight tungsten, 0-13% by weight iron, 0-30% by weight manganese, 0-10% by weight molybdenum, 0-5% by weight of at least one of the elements aluminum, tantalum, rhenium, titanium and less than 0.1% by weight carbon. A dental prosthesis with favorable workability and a low corrosion rate is obtained by manufacturing the dental prosthesis by means of a laser melting and/or sintering process.

Abstract: A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles.

Abstract: A method for controlling a robot during an interpolation of a trajectory or motion to any prescribed position, comprises the steps of a) ignoring at least one of the three originally prescribed or interpolated tool center point orientation values; b) finding new tool center point orientation values that place the wrist center point of the robot closest to its base while c) maintaining the originally prescribed or interpolated tool center point location values and d) maintaining the original prescribed or interpolated tool center point orientation values not ignored. Said method can preferably be used for carrying a load with a plurality of robots. Its main advantage is an increase of the available working volume.

Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Abstract: A device manufacturing method is disclosed that includes the steps of moving a device at a constant speed while irradiating a laser beam on the device, and processing a part of the device with the laser beam.

Abstract: To provide a manufacturing apparatus of a semiconductor device, which does not use a stepper in a manufacturing process in the case where mass production of semiconductor devices is carried out by using a large-sized substrate. A thin film formed over a substrate having an insulating surface is selectively irradiated with a laser beam through light control means, specifically through an electro-optical device to cause ablation; accordingly, the thin film is partially removed, thereby processing the thin film in a remaining region into a desired shape. The electro-optical device functions as a variable mask by inputting an electrical signal based on design CAD data of the semiconductor device.

Abstract: In a method for controlling a laser body shell welding system, in which a scanning head is attached to a machine arm or is operated as an external tool of the machine arm, the scanning head having at least one scanning mirror for positioning a laser beam on a workpiece to be welded, and the operation of the laser welding system including time-critical functions for controlling the time-critical functions, an embedded control system or a memory-programmable control system is used.

Abstract: Laser pulses are selected from a group of closely spaced laser pulses with an optical modulator by adjusting pulse timing relative to an impingement interval. An adjusted pulse is moved from an impingement interval to a non-impingement interval and is blocked. The blocked laser source is stabilized by running nearly continuously. Pulse selection with multiple laser sources is achieved with a single acousto-optic modulator.

Abstract: Processing food with a laser. In one embodiment, the system includes a laser that creates holes in a food item with an output beam, and includes a post processing module that enables a substance to pass through the holes. The substance may include a flavoring, a vitamin, a medicine, a gas, steam, and the like. The holes facilitate cooking, cleaning, flavorizing, medicating, off-gassing, eating, or the like. The laser system may also perforate or score a food item shell to ease cracking and access to interior material. The system may also include one or more mirrors, focus heads, delivery optics, beam scanners, or the like, to control output beam characteristics, such as focus and positioning. In another embodiment, a dynamic control system may add computerized-feedback and control to the laser system. A position system may also control a position, orientation, or other characteristic of a food target.

Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: A via hole machining method for forming via holes, reaching bonding pads, in a wafer having a plurality of devices which are formed on a face side of a substrate and are provided with the bonding pads, by irradiation with a pulsed laser beam from a back side of the substrate, wherein the energy density per pulse of the pulsed laser beam is set at such a value that ablation of the substrate will occur but ablation of the bonding pad will not occur, and the time interval of pulses of the pulsed laser beam is set at a value of not less than 150 microseconds.

Abstract: The present invention relates to a soldering method and the like comprising a structure for making it possible to solder microsize objects to each other. The soldering method is a method realizing the soldering by using a fiber laser apparatus capable of minutely adjusting the spot size of outputted laser light, and prepares the fiber laser apparatus and a spatial optical system before soldering the objects. The fiber laser apparatus includes an amplification optical fiber having a single core structure and outputting amplified single-mode light, and a seed light source supplying seed light to the amplification optical fiber. The spatial optical system includes a collimator collimating the outputted laser light from the fiber laser apparatus, and a condenser lens converging the outputted laser light transmitted through the collimator to solder which is set.

Abstract: An operation control unit of a reception system includes a visitor ID information DB for storing therein visitor comparison information and visitor ID information including a phone number of a receiver of a visitor; an identifying unit for identifying the visitor when visitor information obtained by a camera or the like of the robot is identical to the visitor comparison information; a phone calling module for calling the phone number of a mobile terminal of the receiver via a phone network, when the visitor is identified; an informing content determining unit for determining an informing content to the receiver based on the visitor ID information, when the visitor is identified; and a speech generating part for converting the received information into a voice. The informing content is sent to the mobile terminal of the receiver via the phone network.

Abstract: A sequential lateral solidification device, for enhancing optical characteristics of the device and for preventing damage caused by an ablation of a crystallization thin film, is disclosed. The device includes a laser light source generating a laser beam, a projection lens focusing the laser beam generated from the laser light source onto a substrate, a laser beam splitter between the projection lens and the substrate that passes the laser beam generated from the laser light source to irradiate the substrate and that blocks the laser beam reflected back from the substrate towards the projection lens, and a stage having the substrate mounted thereon.

Abstract: When braking of a motion of a part of a first robot is assumed to be started at points in time, a first stop position of the first robot part is estimated at each point in time. When braking of a motion of a part of a second robot is assumed to be started at the points in time, an estimated second stop position of the second robot part is obtained at each point in time. When it is determined that the first stop position of the first robot part at one of the points in time and either the actual position or the second stop position of the second robot part for each interval at the one of the points in time are contained in the shared workspace, the first robot part is braked.

Abstract: A method and device for laser drilling in which the geometric form of the drill-hole wall is influenced by reciprocal action between a laser beam and a supplied process gas, which thereby is ionized to plasma. Furthermore, the outlet opening of the drill hole is influenced by a suitable arrangement of a backing.

Abstract: Systems and methods for stabilizing a CO2 laser are disclosed. The system includes a detector unit for measuring the power in a select portion of the output beam. The detector unit generates an electrical signal corresponding to the measured power. The modulation frequency of the signal used to modulate the relatively high-frequency radio-frequency (RF) pump signal is filtered from the electrical signal. The filtered electrical signal is then compared to a desired value for the output power in the output beam. Based on the comparison, a modulation control signal for modulating the RF pump signal is formed. The modulation control signal has a varying duty cycle that varies the amount of laser pump power to reduce or eliminate the measured variations in the output beam power. The result is an output beam power that remains stable over time.

Abstract: A robot laser processing system (10) comprises at least one robot controller (14) for controlling at least one robot, a host controller (12) connected to the robot controller through a first network (11) for overall control of the robot controller, and a plurality of laser oscillators (16-1 to 16-n) selectively connectable to the processing nozzle (35) mounted on each robot and connected to the robot controller through a second network (18-1 to 18-n). An instruction from the host controller is transmitted to the robot controller through the first network, so that the robot controller determines the laser oscillator to be controlled and directly controls the particular laser oscillator through the second network. As a result, a processing command can be issued directly to the laser oscillator from the robot controller without intervention by the host controller.

Abstract: A thin beam directional crystallization system configured to process a substrate comprises a laser configured to produce laser light, the laser configured to have a high energy mode and a low energy mode. The high energy mode is configured to produce light energy sufficient to completely melt a substrate coated with amorphous silicon film, while the low energy mode is configured to produce light energy that is not sufficient to completely melt a substrate coated with amorphous silicon film. The system further comprises beam shaping optics coupled to the laser and configured to convert the laser light emitted from the laser into a long thin beam with a short axis and a long axis, a stage configured to support the substrate and film, and a translator coupled with the stage, the translator configured to advance the substrate and film so as to produce a step size in conjunction with the firing of the laser.

Abstract: A hybrid compact sensing apparatus for generating signals usable for guiding a process robot as a function of an object detected in a scene. The apparatus comprises a laser light generator, two optical sensors, one or more ultrasound sensors, and a control unit, all integrated in a same housing. The laser light generator and the optical sensors form a detection arrangement having a limited detection range compared to that of the ultrasound sensors. The control unit has a processing circuit monitoring the distance of the object measured by the ultrasound sensors, and triggering on the laser light generator and triggering use of the depth profile signals produced by the optical sensors among the signals usable for guiding the process robot when the distance measured by the ultrasound sensors falls within the limited detection range. Integration of an audio and video sensing unit to the apparatus enables remote monitoring.

Abstract: A laser welding apparatus and method reproduces a welding state substantially identical to an actual operation of a robot at a manufacturing site even when an operating speed of the robot is changed. When a moving speed of the robot is, for example, 50% of an override ratio, a welding point speed, which is a resultant speed of a focus moving speed of the laser beam by movement of the robot having a scanner head and the focus moving speed of the laser beam by rotation of the laser scanning mirror, becomes identical to that when an override ratio is 100%. This is achieved by increasing a rotating speed of a laser scanning mirror within the scanner head.

Abstract: A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

Abstract: In a first embodiment a spark plug satisfying the relations: t?0.3 mm and St/Sw?7 in which t is the axial-direction shortest distance between a leading end surface 41a of a precious metal tip 41 and a joint portion 43, St is the surface area of the precious metal tip 41 and a joint portion 43 between the precious metal tip 41 and the ground electrode body 4a, and Sw is the area of the joint portion 43 between the ground electrode body 4a and the precious metal tip 41. In a second embodiment, the spark plug satisfies the relations t?0.3 mm and La>Lb; and in a third embodiment the spark plug satisfies the relations t>T and La>Lb, where T, La and Lb are as defined in the specification. The relation t?0.3 mm is specific to the first and second embodiments, and the relation St/Sw?7 is specific to the first embodiment only.