Abstract: A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved.

Abstract: The present invention is directed to systems and methods for irradiating regions of a thin film sample(s) with laser beam pulses having different energy beam characteristics that are generated and delivered via different optical paths. An exemplary method includes generating laser beam pulses having energy beam characteristics, directing a first pulse onto a first optical path, modulating the pulse's energy beam characteristics, and irradiating at least a portion of a first region of the thin film with the pulse to induce crystallization of the portion of the first region. The method also includes directing a second pulse onto a second optical path, modulating the pulse's energy beam characteristics so as to be different from the energy beam characteristics of the first pulse, and irradiating at least a portion of a second region of the thin film with the second pulse to induce crystallization of the portion of the second region.

Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.

Abstract: A laser welding method for stacked workpieces. A laser irradiation diameter that is irradiated on a surface of one workpiece among two stacked workpieces is set such that a laser irradiation diameter at a weld ending-edge portion is equal to or greater than approximately 1.5 times a laser irradiation diameter at a weld starting-edge portion. Thus, at the weld ending-edge portion, the material is melted in a wider area compared to a conventional example, and therefore, the melted material is supplied to the center portion of the weld ending-edge portion while the weld ending-edge portion is solidifying. As a result, a depth of the recess at the weld ending-edge portion can be made shallow enough to guarantee the welding quality of each of the workpieces.

Abstract: A compound semiconductor is placed in a reaction vessel (12) of which the inner gas is subjected to replacement with a low-vapor-pressure gas (2) whose equilibrium vapor pressure at the melting point of the compound semiconductor is 1 atm or lower. The low-vapor-pressure gas is urged to flow along the surface of the compound semiconductor while keeping the internal pressure of the reaction vessel at a value not lower than that equilibrium vapor pressure. The surface of the compound semiconductor is irradiated with a pulsed-laser light (3) whose photon energy is higher than the band gap of the compound semiconductor. Thus, only that part of the compound semiconductor which is located at the pulsed-laser light irradiation position is instantly heated and melted while keeping the atmospheric temperature of the low-vapor-pressure gas at a room temperature or a temperature equal to or lower than the decomposition temperature.

Abstract: With many coated sheets, in particular zinc-coated sheets as used in the automobile industry, the coating material has a much lower boiling point than the material of the sheet. On welding said sheets together the above leads to explosive evaporation of coating material which seriously affects the quality of the connection. In order to improve the quality of the connection it has already been disclosed that narrow gaps between the sheets can be produced by means of spacers, through which the coating material can escape. The spacers can be produced for example, by means of laser bombardment of the sheets. A disadvantage is the relatively long time necessary for machining, which causes large costs in particular for serial production. The aim of the invention is to reduce the time necessary for machining the sheets whilst at least maintaining, preferably improving the quality of the machining.

Abstract: A laser lap welding method, for a galvanized steel sheet, includes preparing two steel sheets in lap configuration, at least one of which is the galvanized steel sheet, so that a galvanized layer thereof is located at an interface of the steel sheets; and irradiating a surface of any one of the two steel sheets in an overlapped region with a laser to perform lap welding. The welding is performed by applying the laser to travel at a predetermined power density and at a predetermined traveling velocity so as to partially and temporarily form an elongated hole in a molten pool extending backward from a laser irradiation spot at least in the steel sheet on the surface side, whereby metal vapor produced by laser irradiation is vented through the elongated hole backward in a laser traveling direction and in a laser irradiation source side.

Abstract: A laser beam machine includes a controller for outputting command pulse sets according to control parameter settings for controlling laser pulse output power, a thinning-out circuit, into which the command pulse sets are inputted, for thinning out pulses of the command pulse sets, based on predetermined setting values, an electric power supplying unit for generating, in response to command pulse sets outputted from the thinning-out circuit, pulsed electric power supplied to a load, and a generator for pumping, so as to output a laser beam, a laser medium with which a discharging space is filled, by electric discharge generated by the pulsed electric power supplied from the electric power supplying unit. A pulse width thereof can be considerably varied at low cost with the heat generated by the increase of the switching number of the electric power supplying unit being prevented.

Abstract: Provided are a laser apparatus of continuous oscillation that is capable of enhancing the efficiency of substrate processing, a laser irradiation method, and a manufacturing method for a semiconductor device using the laser apparatus. A portion of a semiconductor film that should be left on a substrate after patterning is grasped in accordance with a mask. Then, a portion to be scanned with a laser light is determined so that it is possible to crystallize at least the portion to be obtained through the patterning. Also, a beam spot is made to strike the portion to be scanned. As a result, the semiconductor film is partially crystallized. That is, with the present invention, the laser light is not scanned and irradiated onto the entire surface of a semiconductor film but is scanned so that at least an indispensable portion is crystallized.

Abstract: A system includes a cutting station having a laser cutter for cutting surface marks, score lines, holes, slots, flaps, panels, etc. into a selected substrate, an image capture device for capturing digital image data associated with the selected substrate, and a computing system for controlling the cutting process. The computing system 32 initiates a calibration test cycle that 1) cuts a test pattern into the selected substrate; and 2) analyzes the test pattern that was cut into the selected substrate. Based on the results of the analysis of the captured image, the system adjusts the operational parameters of the laser cutter during a subsequent packaging production run utilizing the same substrate type.

Abstract: A method for exposing the surface of a drum to patterned illumination from a pulsed laser source at a suitable energy density in order to cause ablation of the surface to form a dense, regular array of 3-D microstructures, comprising the steps locating a mask containing a line of different features on a fixed pitch relative to a target area; projecting a uniform line shaped laser beam through the mask in order to project an image made up of a multiplicity of the features on the mask onto the target area; de-magnifying the image carried by the beam between the mask and the target area; locating the surface of the drum for ablation in the target area; rotating the drum continuously so the surface moves in a first direction perpendicular to the axis of rotation of the drum and also simultaneously moving the projected beam with respect to the drum in a second direction parallel to the axis of rotation of the drum; tilting the projected array of microstructures to correspond to the helical path followed by the las

Abstract: It is an object to provide a laser apparatus, a laser irradiating method and a manufacturing method of a semiconductor device that can perform uniform a process with a laser beam to an object uniformly. The present invention provides a laser apparatus comprising an optical system for sampling a part of a laser beam emitted from an oscillator, a sensor for generating an electric signal including fluctuation in energy of the laser beam as a data from the part of the laser beam, a means for performing signal processing to the electrical signal to grasp a state of the fluctuation in energy of the laser beam, and controlling a relative speed of an beam spot of the laser beam to an object in order to change in phase with the fluctuation in energy of the laser beam.

Abstract: A laser processing machine head, a laser processing machine head monitoring system, and a method of monitoring an optical element of a laser processing machine feature a light-transmissive optical element and an optical element holder defining a cavity in which the optical element is retained against rotation. A light source mounted to the holder directs a beam of light into the optical element through a peripheral surface of the optical element. A light receiver is responsive to light from the light source reflected through the optical element. Monitoring a signal from the light receiver allows a status of the optical element to be assessed.

Abstract: A method of fabricating a conductive line provides a substrate having a blanket layer of conductive material disposed thereon, a removing of a first portion of the blanket layer of conductive material to form one or more gaps that define a first line, the gaps adjacent to the first line, the first line having at least a first segment of a first width and a second segment of a second width, the first and second widths being different, a first increasing of the width of a first gap of the one or more gaps, the first gap adjacent to the first segment, by a first amount, and a second increasing of the width of a second gap of the one or more gaps, the second gap adjacent to the second segment, by a second amount wherein the first and second increasing depend upon a desired electrical characteristic. The first amount and the second amount may be different from each other.

Abstract: Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool.

Abstract: A quality assurance system includes an internet/wide area network interface configured to provide bidirectional communication with user terminals; a wireless interface configured to provide bidirectional communication with mobile user terminals; and a quality assurance database cooperatively coupled with a database manager. The data base manager is configured to populate the quality assurance database with identifications of individual ones of a plurality of construction project welders, weld inspectors and a plurality of weld data logs individual ones of which are associated with a specific welding operation of a construction project. Each weld data log is configured to store information that is at least descriptive of a welder, material used during the specific welding operation, specifics of a completed weld including at least weld location, weld type and weld dimensions, and information descriptive of a weld examination.

Abstract: A coherent beam source, e.g., a laser having a cavity that is unstable in at least one direction, is used to produce a coherent beam having an initial intensity profile. The beam is passed through a relay having a Fourier plane containing a spatial filter that serves as a radiation defining mask. The filter has an aperture size and shape effective to modify the beam such that the modified beam forms an image on a substrate. The to image has an intensity profile that more closely approximates a super-Gaussian profile than the initial profile. For example, when the initial intensity profile is Gaussian, the spatial filter may allow passage of only unattenuated the central core of the beam and block completely blocks the wings of the Guassian profile. The modified beam may be more suitable for use in a scanning system used to anneal wafers or other substrates containing integrated circuits.

Abstract: The invention relates to a method for the manufacture of a molding through generative processing methods, in particular through selective laser melting, wherein a model of a molding is built from a powder material according to CAD data, wherein an application unit is used to apply a powder layer and the powder layer applied is fixed to a layer arranged there under or a base plate by means of radiation, characterized in that prior to applying a first layer onto a build platform or a base plate, a sensor assembly having a sensor level which is located in relation to the levelling level of a levelling assembly for the applied powder layer is allocated to the build platform or the base plate, the build platform or the base plate is moved in relation to the sensor assembly until the sensor assembly emits a signal for stopping the build platform to a drive in an intermediate position, and starting from the intermediate position, the build platform or the base plate is moved by a distance to adjust the layer thickne

Abstract: Methods for performing manual laser deposition are provided. In this regard, a representative method includes: directing a laser beam at a first deposit location of a substrate to re-melt: at least a portion of a first deposit of weld filler, at least a portion of a second deposit of weld filler located at a second deposit location that partially overlaps the first deposit, and at least a portion of the substrate.

Abstract: The present invention generally describes apparatuses and methods used to perform an annealing process on desired regions of a substrate. In one embodiment, pulses of electromagnetic energy are delivered to a substrate using a flash lamp or laser apparatus. The pulses may be from about 1 nsec to about 10 msec long, and each pulse has less energy than that required to melt the substrate material. The interval between pulses is generally long enough to allow the energy imparted by each pulse to dissipate completely. Thus, each pulse completes a micro-anneal cycle. The pulses may be delivered to the entire substrate at once, or to portions of the substrate at a time. Further embodiments provide an apparatus for powering a radiation assembly, and apparatuses for detecting the effect of pulses on a substrate.

Abstract: A system for producing at least one trench to improve film cooling in a sample is provided. The system includes at least one laser source outputting at least one pulsed laser beam. The pulsed laser beam includes a pulse duration including a range less than about 50 ?s, an energy per pulse having a range less than about 0.1 Joule, and a repetition rate with a range greater than about 1000 Hz. The system also includes a control subsystem coupled to the laser source, the control subsystem configured to synchronize a position of the sample with the pulse duration and energy level in order to selectively remove at least one of a thermal barrier coating, a bondcoat and a substrate metal in the sample to form the at least one trench.

Abstract: Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool.

Abstract: An apparatus for processing a work-piece (80) includes a laser source (102) and a first lens assembly (108). The laser source is configured for emitting laser beams. The first lens assembly is configured for adjustably focusing the laser beams onto the work-piece. The first lens assembly is disposed in optical alignment with the laser source and includes a first lens set having a positive refractive power and a second lens set having a negative refractive power. Because of the first lens assembly, the laser beams emitted from the laser source can be focused accurately onto the work-piece, and then the apparatus for processing the work-piece has accurately focused laser beams as a result.

Abstract: A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head. A workpiece processing system employs a common modular imaged optics assembly and an optional variable beam expander for optically processing multiple laser beams.

Abstract: The present invention incorporates one or more diode lasers for the high-power CO2 or Nd-YAG lasers currently used in closed-loop DMD systems. Being semiconductor-based, such devices are almost instantaneously responsive to the electrical input. As such, a DMD system driven by a diode laser according to the invention provides a much faster response compared to other sources. The faster response time, in turn, provides for enhanced dimensional control and capability to produce intricate components with better dimensional accuracy.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses.

Abstract: A device transfer method is provided. The device transfer method is disclosed by which, when a laser ablation technique is used to selectively exfoliate devices arranged on a substrate, the energy is transmitted efficiently to transfer the devices with a high degree of accuracy and at a high speed. A laser irradiation apparatus is used which includes a laser light source for generating a laser beam, a reflection section for reflecting the laser beam toward a required direction, and a control section for controlling whether or not the laser beam is to be irradiated in an interlocking relationship with the reflection section. The laser beam is selectively irradiated on a plurality of devices arranged on a transfer source substrate to cause laser ablation such that the selected devices are transferred to a transfer destination substrate by the selective laser ablation.

Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Abstract: A coating containing metal phosphate-based compounds and mixtures, mixed compounds, mixed salts or adducts which contain such compounds as pigments for the production of single-coloured or multi-coloured markings, inscriptions and/or decorations by means of laser light in and/or on ceramic, stoneware, pottery, earthenware, porcelain, ceramic glazes, engobe, glass or glass paste (enamel).

Abstract: A method and apparatus for remotely monitoring properties of gases and plasmas, and surface and sub-surface properties of materials, is disclosed. A laser beam is focused at a desired region within a gas, plasma, or material (e.g., solid or liquid) to be analyzed, generating an ionized sample region or a localized, enhanced free carrier region. A beam of microwave radiation is directed toward the ionized sample region or the free carrier region, and the microwave radiation is scattered. The scattered microwave radiation is received by a microwave receiver, and is processed by a microwave detection system to determine properties of the gas, plasma, or material, including surface and sub-surface properties.

Abstract: Laser conversion systems and methods for converting laser systems for operation in different laser safety classification modes are disclosed herein. In one embodiment, a laser system includes a laser configured to emit radiation greater than about 5 mW and an exterior housing containing the laser. The exterior housing has a section configured to be in a first arrangement in which the laser system is classified as a class I system and a second arrangement in which the laser system is classified as a class IV system. The laser system further includes a conversion module operably coupled to the laser system and the section. The conversion module is configured to enable one or more regulatory features required for class IV operation of the laser system when the section is in the second arrangement and disable the regulatory features required for class IV operation of the laser system when the section is in the first arrangement.

Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.

Abstract: The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whilst there is continuous relative displacement between the ring and the laser treatment device.

Abstract: A laser welding apparatus having a laser source outputting a laser beam and a light transmitting device being positioned downstream from the laser source. The light transmitting device transmits the laser beam therethrough. The laser beam exiting the light transmitting device has at least a zero order light lobe and a first order light lobe, wherein the zero order light lobe and the first order light lobe together defining an initial beam width. An optical device positioned downstream from the light transmitting device converges the first order light lobe with the zero order light lobe to define a final beam width that is narrower than the initial beam width.

Abstract: A method for executing water jet peening for giving an impact force to a surface of a structure member by a crushing pressure of a water jet and cavitation and improving residual stress, or washing, or reforming said surface, wherein said water jet peening is executed so as to make a natural frequency of oscillation of said structure member and a excitation frequency of oscillation of water jet peening different from each other.

Abstract: Methods and systems for laser soft marking, especially for semiconductor wafers and devices, are provided. A laser-marking system for marking a semiconductor wafer to form a softmark on the wafer is provided. The system includes a laser subsystem for generating one or more laser pulses and a controller operatively connected to the laser subsystem. The controller sets a laser pulse width of the one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths that affect the depth of a softmark that is to be formed. The mark depth is substantially dependent on the one or more set pulse widths. The controller further sets a pulse energy of the one or more output pulses to selectively provide the one or more output pulses having a set total output energy that is within an acceptable process energy window for producing the softmark.

Abstract: A method for laser beam machining, in particular laser beam welding of bodywork components (14), with the aid of a remote laser head (3). The laser head is guided by a robot (5) including a multi-axial robot hand (7). During the welding process, the emitted laser beam (12) is guided along the welding path (19) on the component (14) by orientation modifications and with a variable irradiation angle beta. said orientation modifications only being produced by pivoting displacements (7) of the manipulator hand (7) about at least one of its hand axes IV, V, VI.

Abstract: A method for welding includes providing a pair of substrates with no gap between them. The welding process uses lasers that are moveable through a locus of points relative to the substrates and each other to weld the substrate together. The moveable lasers assist in controlling a formation of a weld keyhole that assists in expelling gases that develop during the welding process.

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: The present invention relates to a technique that remarkably increases the processing speed of a conventional ultra-fast laser micro process having a very high processing accuracy. According to the present invention, a laser processing method based on transient changes in the status of laser-induced material couples a pulse of a ultrafast laser to a pulse of at least one auxiliary laser other than the ultrafast laser to reversibly change a material to be processed.

Abstract: A method of irradiating a target region containing at least one fullerene comprising molecule promotes the heating or combustion of the target region. The heating method can be employed in a variety of applications including: selective targeting and destruction of cancer cells, detonation of explosives, ignition of a combustible mixture, photolithographic processes, and writing of optical storage media.

Abstract: The present invention relates to a laser processing apparatus having a structure for effectively processing of objects by condensing a laser beam, and a laser processing method. A laser processing apparatus comprises a common mount surface on which plural objects are disposed in an array, a light source, a lens the reflection direction of which is changeable, and a condensing direction modifier. A laser beam from the light source arrives at the lens through a galvano-mirror. Herein, the galvano-mirror is arranged such that the reflection position thereof agrees with the front focal position of the lens. As the galvano-mirror reflects a laser beam toward the lens while the reflection direction is changed, the arriving position of the laser beam is scanned on the entrance surface of the lens. The condensing direction modifier modifies, according to the irradiation position of the laser beam arrived from the lens, an exit direction of the laser beam.

Abstract: The present invention relates to a surface modification method allowing the surface of a subject to be more effectively modified. In a pulsed-laser device suitable for use in this surface modification method, a semiconductor laser light source and a modulator constitute a seed light source. The seed light output from the seed light source is amplified by fibers for optical amplification, and the amplified light constitutes output from the pulsed-laser device. The pulsed-laser device allows the pulse width and repetition frequency of the output pulsed-laser light to be varied independently of each other. The pulse width of the pulsed-laser light output from the pulsed-laser device is preferably not more than 10 ns, and the repetition frequency is preferably at least 50 kHz.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A laser processing method for a transparent plate having a predetermined breaking line including the step of applying a pulsed laser beam to the transparent plate along the breaking line to thereby form a laser processed groove. The pulsed laser beam has an absorption wavelength to the transparent plate. The repetition frequency of the pulsed laser beam is set to 200 kHz or more and the energy density per pulse of the pulsed laser beam is set to 3.8 J/cm2 or more.

Abstract: Fiber lasers and methods for constructing and using fiber lasers for micro-/nano-machining with output beams including stacked pulses and combinations of continuous wave, pseudo-continuous wave and pulse sequence components.

Abstract: A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.

Abstract: Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Abstract: Pre-aligned, kinematically mounted modules including processing lasers, beam trains, and individually calibrated control beams are quickly and easily replaced on subassembly bases with minimal in situ alignment, and can maintain working-spot position to micron tolerances over ambient temperature variations of ±10° C. Subassembly bases, with features for kinematically mating to a plurality of pre-aligned laser modules and to a platform base incorporated in the laser processing tool, enable multi-module subassemblies to be quickly replaced with spare subassemblies of the same type, or swapped for subassemblies of a different type. The mating features and reversible locks are designed to mitigate thermal effects that are often a dominant cause of alignment drift in processing lasers.