Abstract: A method of sealing a surface crack in a member is provided includes steps of irradiating a region of the member at which the crack is produced with a heating laser beam so as to heat the region to a temperature lower than a melting point of the member, and then irradiating a region of the member at which the crack is produced with a welding laser beam subsequent to irradiation of the heating laser beam so as to heat the region to a temperature higher than or equal to the melting point of the member, thereby sealing an opening of the surface crack of the member.

Abstract: A method and apparatus is presented for obtaining high resolution positional feedback from motion stages 52 in indexing systems 10 without incurring the costs associated with providing high resolution positional feedback from the entire range of motion by combining low resolution/low cost feedback devices 72 with high resolution/high cost feedback devices 74, 76, 78, 80, 82, 84, 86, 88.

Abstract: Laser pulses are selected from a group of closely spaced laser pulses with an optical modulator by adjusting pulse timing relative to an impingement interval. An adjusted pulse is moved from an impingement interval to a non-impingement interval and is blocked. The blocked laser source is stabilized by running nearly continuously. Pulse selection with multiple laser sources is achieved with a single acousto-optic modulator.

Abstract: A laser dicing method includes: placing a workpiece substrate on a stage; generating a clock signal; emitting a pulse laser beam synchronous with the clock signal; switching irradiation and non-irradiation of the workpiece substrate with the pulse laser beam in a unit of light pulse in synchronization with the clock signal to perform first irradiation of the pulse laser beam on a first straight line by controlling the pulse laser beam using a pulse picker; performing second irradiation of the pulse laser beam on a second straight line, which is adjacent to the first straight line in a substantially parallel fashion, after the first irradiation; and forming a crack reaching a workpiece substrate surface on the workpiece substrate by the first irradiation and the second irradiation.

Abstract: This invention relates to a method producing a common rail excellent in fatigue strength from an inexpensive steel which uses as the material of the common rail a steel for high-strength liquid phase diffusion bonding having good toughness and fatigue strength, which steel contains, in mass %, C: 0.01 to 0.3%, Si: 0.01 to 0.5%, Mn: 0.01 to 3.0%, Cr: 1.0 to 12.0% and Mo: 0.1 to 2.0%, further contains, in mass %, V: 0.01 to 1.0%, B: 0.0003 to 0.01%, Ti: 0.01 to 0.05% and N: 0.001 to 0.01%, has P content limited to 0.03% or less, S content to 0.01% or less and O content to 0.01% or less, further has total content of grain boundary segregated embrittling elements As, Sn, Sb, Pb and Zn limited to 0.015% or less, and a balance of unavoidable impurities and Fe. The steel is used for liquid phase diffusion bonding.

Abstract: A new method of process control for fusion welding maintains a controlled weld pool size or volume, for example in some applications a substantially constant weld pool size or volume. The invention comprises a method of linking machine and process variables to the weld pool size or volume in real time, thereby enabling constant weld pool volume control. The invention further comprises a method of using thermal inverse models to rapidly process real-time data and enable models-based control of welding processes so as to implement constant weld pool volume control.

Abstract: A method for producing a pattern of depressions in the friction surface of a friction component for a frictionally operating device, preferably a multiplate clutch or multiplate brake. After the preparation of the friction component, the pattern of depressions is produced by nontraditional material removal, removal of material preferably being accomplished in a contactless manner, particularly preferably with the aid of a laser beam.

Abstract: A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction.

Abstract: A method of enhancing the quality of laser ablation by controlling the laser repetition rate during the ablation process, wherein the method enhances the quality of laser ablation of a photomask in order to improve the optical quality thereof. Also provided is a system employing the method of enhancing the quality of laser ablation.

Abstract: Described herein is a method for controlling the quality of a laser-welding process, for example, of laser welds of semifinished products constituted by elements of sheet metal of different thickness and/or properties (“tailored blanks”), of the type that comprises the steps of: detecting a radiation (E*) produced in the welding area and issuing signals (E*) indicating said radiation; acquiring and processing said signals (E*) indicating said radiation; making a division into blocks of said signals (E*) indicating said radiation; calculating for each block a block-mean value (u) and a value of block standard deviation (o); and in supplying input values comprising block-mean values (u) and values standard deviation (o) for identifying defects and/or porosities and insufficient penetration.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. An energy source for the optical system is typically a plurality of lasers, which are combined to form the energy field.

Abstract: A laser processing apparatus includes a chuck table for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece. A laser beam oscillating unit oscillates a laser beam and a focusing unit focuses the laser beam onto the workpiece. A reflecting unit is provided on the optical axis of the focusing unit. A wavelength detecting unit detects the wavelength of the plasma light reflected by the reflecting unit, and a controller determines the material of the workpiece according to a detection signal from the wavelength detecting unit, to control the laser beam applying unit.

Abstract: The time between illumination of adjacent zones of a workpiece edge is extended by a long cool-down period or delay, by interlacing a radiation beam scanning pattern. During the cool-down period, the beam successively scans (along the fast axis) two rows separated by about half the wafer diameter, and travels back and then forth (along the slow axis) across the distance between the two rows, while the radiation beam source continuously generates the beam.

Abstract: To further automate the manufacture of hearing aid component parts that are in part produced with a rapid prototyping method, a laser beam for curing material is generated by a laser, and a workpiece support that can be directly exposed by the laser is provided. The laser beam is deflected by an optic device so that the workpiece support can be indirectly exposed with the laser. Material can thereby be more easily applied in undercuts of workpiece blanks that form the basis of the hearing aid component parts.

Abstract: There is provided an improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. Thus, the present invention provides in a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the improvement comprising: providing a solid transparent to the wavelength of the laser, serving as an entrance window to the surface of the liquid; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam, thereby shock-hardening the surface of the workpiece.

Abstract: There is provided a high power laser system for performing high power laser operations and methods and systems for protecting optics and components of high power laser systems while performing laser operations from damage from carbon gettering migration.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A laser match honing system and method are provided for processing one of a pair of mechanically matching components (1, 2) having matching portions (12, 22, 16, 26) that will be fitted with each other. A dimension of the matching portion (12, 16) of the first component (1) is measured and is then used for calculating the desired dimension of the corresponding matching portion (22, 26) of the second component (2). An actual dimension of the matching portion (22, 26) of the second component (2) is also measured. Then, the matching portion (22, 26) of the second component (2) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Abstract: A heat source for a material processing operation, such as direct laser deposition, comprises a source of laser light, an optical element to modulate the laser light to provide a beam and means for traversing the beam over the substrate in use in a predetermined direction. The beam has a predetermined intensity distribution over its cross-sectional area so as to regulate the temperature distribution in the material resulting from the absorption of laser energy by the material.

Abstract: The invention relates to method for cutting a part using a laser beam, involving the use of laser beam generation means comprising at least one ytterbium-based fibre having a wavelength of between 1 and 4 ?m in order to generate the laser beam. The laser beam is selected to have a power of less than 100 kW, a power density of at least 1 MW/cm2, a focused beam diameter of at least 0.1 mm and a quality factor (BPP) of less than 10 mm·mrad.

Abstract: A system that allows a material to be marked while still on the CNC tooling table and allows an operator to input marking information just prior to, or even during, the tooling cycle. The present invention comprises a sequence controller associated with a computer readable medium and adapted for communication with the CNC controller. An HMI device and a marker controller are also connected with the sequence controller. A lifter assembly is connected with the sequence controller to raise and lower a marker assembly. The lifter assembly is connected to the gantry of the CNC tooling system with an adaptor block. The present invention provides the advantage of reduced time when compared to marking the part at a separate station remotely located from the CNC system, and allows the operator to input marking information just prior to or during the CNC tooling cycle.

Abstract: A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved.

Abstract: Marking of an SiC wafer with an identifier is realized by irradiation with a pulsed laser using a harmonic of a wavelength four times that of a YAG laser. A speed at which a laser head moves, an orbit in which the laser head moves, the output power and Q-switch frequency of a pulsed laser to be applied, and the like are determined such that pulse-irradiated marks formed as a result of irradiation with corresponding pulses of the pulsed laser do not overlap each other.

Abstract: A substrate cleaning apparatus includes a supporting plate supporting a substrate and a shielding unit that is disposed above the substrate to protect the substrate. A portion of the shielding unit, which is adjacent to a focal point where light for generating shock waves is focused, is switched. Therefore, the substrate cleaning apparatus prevents the concentration of plumes and residence beams, which are generated together with the shock waves, on a specific region of the shielding unit and further prevents the recontamination of the substrate by the damage of the shielding unit.

Abstract: A laser irradiation apparatus which is provided with: an environment isolation container, which houses a laser oscillator and is disposed in water; a laser irradiation head, which collects laser beams and irradiates a part to be machined with the laser beams; a light guide section which transmits the laser beams from the laser oscillator to the laser irradiation head; a power supply apparatus which supplies the laser oscillator with power; a cooling water supplying apparatus, which supplies the laser oscillator with cooling water through a cooling water supplying path; and a temperature sensor which measures the temperature inside of the environment isolation container. The temperature and/or the flow quantity of the cooling water to be supplied from the cooling water supplying apparatus is controlled on the basis of the measurement results obtained from the temperature sensor.

Abstract: An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.

Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Abstract: A manufacturing system is disclosed. The manufacturing system may have a laser source configured to generate a laser beam, and a delivery media operatively connected to the laser source. The manufacturing system may also have a gradient index lens located at a tip end of the delivery media to refract and focus the laser beam exiting the delivery media.

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Abstract: A method of forming articles having closed microchannels includes the steps of providing a substrate including a composite material, the composite having metal nanoparticles dispersed in a polymer matrix. The substrate is irradiated with a laser beam at an intensity and time sufficient to selectively remove the polymer below a surface of said substrate to form at least one microchannel, wherein the intensity and time is low enough to avoid removing the polymer above the microchannel, wherein an article having at least one closed microchannel is formed. A metal nanoparticle/polymer composite composition can have functionality that can undergo addition reactions to seal or join pieces of polymers or composites upon irradiation of the composition placed on one or more pieces.

Abstract: The water heater (2) or steam generator comprises a chamber (4) in two sections (5, 6) formed in particular by stamping. Inside this chamber a heating element (8) is arranged, which has a spiral-shaped main section (10) and two end sections (11, 12) passing through two circular openings of the chamber. The two end sections are welded to the chamber by a laser beam such that the weld obtained is continuous and ensures a good mechanical fixture of the heating element and an adequate tightness for the water heater or steam generator. For this purpose, a flange (18) is arranged at the periphery of each opening. Moreover, the two sections of the chamber have a widened edge (28) to allow them to be welded effectively.

Abstract: Systems and methods ablate electrically conductive links using laser pulses with optimized temporal power profiles and/or polarizations. In certain embodiments, the polarization property of a laser beam is set such that coupling between the laser beam and an electrically conductive link reduces the pulse energy required to ablate the electrically conductive link. In one such embodiment, the polarization is selected based on a depth of a target link structure. In another embodiment, the polarization changes as deeper material is removed from a target location. In addition, or in other embodiments, a first portion of a temporal power profile of a laser beam includes a rapid rise time to heat an upper portion of an electrically conductive link so as to form cracks in a passivation layer over upper corners of the electrically conductive link, without forming cracks at lower corners of the electrically conductive link.

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).

Abstract: Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract: Disclosed is a dry cleaning apparatus and method for removing contaminants on a surface of a workpiece. The disclosed dry cleaning apparatus comprises a laser cleaning unit having a laser beam generator for generating a laser induced shock wave in the atmosphere, the laser cleaning unit being suitable for removing an inorganic contaminant on the surface of the workpiece using the generated laser induced shock wave; and a flash cleaning unit having a flash generator for generating a flash having pulse wave, the flash cleaning unit being suitable for removing an organic contaminant on the surface of the workpiece using the generated flash.

Abstract: A method for fabricating a composition of Zr-rich bulk amorphous alloy includes providing a weld member and a base, both made of Zr-rich bulk amorphous alloy, and welding the weld portion of the weld member to the base by a pulsed laser in a protective gas environment. A maximum power of the pulsed laser exceeds or equals 3.5 kW, and a welding rate exceeds 2 mm/sec.

Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Abstract: An autofocus imaging apparatus (200) for three-dimensional imaging on a surface of a flexible media mounted on a cylindrical drum (104) includes a carriage (210) which moves parallel to a surface of the drum and an imaging stage (208) mounted on the carriage. The imaging stage includes a displacement sensor (112) for measuring a distance to the surface of the flexible media; imaging optics (216) for producing a three-dimensional image on the flexible media; and an autofocus drive (220) for changing a focus of the imaging optics. Encoders (256, 260) provide data on the drum and carriage position. A controller (116) receives and processes data from the displacement sensor and the encoders. A computer (236) receives data from the controller, processes controller data, and transmits instructions to the controller. The controller receives computer instructions and transmits focus commands to the autofocus drive or the imaging stage.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract: Embodiments of the present invention are generally directed to materials processing methods using femtosecond duration laser pulses, and to the altered materials obtained by such methods. The resulting nanostructured (with or without macro- and micro-structuring) materials have a variety of applications, including, for example, aesthetic applications for jewelry or ornamentation; biomedical applications related to biocompatibility; catalysis applications; and modification of, for example, the optical and hydrophilic properties of materials including selective coloring.

Abstract: The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L1, a second laser light source 102 for emitting a second pulsed laser light L2, half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed 1.

Abstract: The invention relates to a method for the generation of raised and/or recessed structures on workpieces comprising the steps: applying a pressure difference between one side of a wall of the workpiece and another side substantially opposite thereto; local heating of the wall of the workpiece to a softening temperature of the workpiece by a heat source in order to induce local deformation of the wall of the workpiece; and cooling of the workpiece. The invention relates, moreover, to an apparatus for carrying out this method.

Abstract: Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.

Abstract: A laser system for processing conductive link structures includes a seed laser generating a seed laser beam. The seed laser is sliced by a modulator into a user configurable series of pulses and the pulses are optically amplified and applied to a conductive link structure. Preferably, the bandwidth of the seed laser is less than 1 nm with an IR center frequency, and the frequency of the laser light of the pulses is doubled or quadrupled prior to application to the conductive structure. Preferably, the pulses are about 1-18 second pulsewidth and are separated by 100-400 ns.

Abstract: The invention relates to a method for material processing and/or material analysis of an object (18) made from condensed matter by means of a laser (12). A laser pulse (14) is generated by a laser, emitted in the direction of the object. The laser pulse is spatially and temporally focussed such as to give a peak power for the laser pulse at a point between the laser and the object which exceeds the critical power for a self-focussing effect of the laser pulse. The laser pulse thus forms a filament (88) of high power density. The filament (88) is directed at the object and generates an aggregation state change there (evaporation or plasma formation) for a part of the material of the object. The method can be applied to both material processing (cutting, drilling, welding, hardening) and material analysis (analysis of the plasma light).

Abstract: A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.

Abstract: Disclosed herein is a laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.

Abstract: An apparatus and a method for producing nanostructured surfaces are particularly suited for producing surfaces having very low roughness over large lateral extents. The method includes the following steps: providing an article having a surface to be structured; generating short-pulse laser radiation with laser pulses whose pulse durations lie in the subnanosecond range, preferably in the range of 100 fs to 300 fs, directing the short-pulse laser radiation onto the surface to be structured on the article, such that a fluence F of each individual pulse of the short-pulse laser radiation is less than a multishot threshold fluence Fth for a multishot laser ablation, but the fluence F is chosen to be high enough that defects can be produced by way of nonlinear interactions. Preferably, a fluence F in the range of 65% to 95% of the multishot threshold fluence Fth for a multishot laser ablation is used.

Abstract: A laser cleaning device, and a laser cleaning method using the same, for removing an electrolyte solution stuck to an electrolyte tab during a process of injecting the electrolyte solution are disclosed. The laser cleaning device for an electrode tab of a battery includes: a cleaning housing, in which a battery case for receiving an electrode group, an electrolyte solution and an electrode tab exposed to the outside are embedded; a laser generator which includes a laser source for generating a laser beam and an output controller for controlling output of the laser beam; a laser transmitter which transmits the laser beam generated by the laser generator; and a laser emitting unit which is installed inside the cleaning housing, and which irradiates the laser beam transmitted by the laser transmitter onto the electrode tab so as to remove liquid pollutants stuck to the electrode tab. The laser cleaning method comprises steps generally corresponding to the latter functions of the laser cleaning device.