Beam Energy Control Patents (Class 219/121.61)
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Patent number: 10537965Abstract: Embodiments described herein relate to the rapid thermal processing of substrates. A fiber coupled laser diode array is provided in an optical system configured to generate a uniform irradiance pattern on the surface of a substrate. A plurality of individually controllable laser diodes are optically coupled via a plurality of fibers to one or more lenses. The fiber coupled laser diode array generates a Gaussian radiation profile which is defocused by the lenses to generate a uniform intensity image. In one embodiment, a field stop is disposed within the optical system.Type: GrantFiled: February 4, 2014Date of Patent: January 21, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Douglas E. Holmgren, Samuel C. Howells, Aaron Muir Hunter, Theodore P. Moffitt, Diwakar N. Kedlaya
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Patent number: 10527798Abstract: A fiber selector includes: a plurality of first reflecting members corresponding to a plurality of focusing optical systems which focus a laser beam from a collimating optical system, and equipped with a reflecting surface capable of reflecting the laser beam towards the focusing optical system; a rotary motor that rotationally moves the first reflecting member between a first position at which the laser beam reflects and a second position which does not block the laser beam, in which the fiber selector rotationally moves the plurality of first reflecting members between the first position and second position so as to selectively switch the propagating direction of the laser beam to any of the plurality of focusing optical systems, in which the reflecting surface of the first reflecting member is a plane perpendicular to the rotation axis of the shaft to which this first reflecting member is fixed, and is arranged so as to face the direction of the rotary motor that causes the shaft to which this first reflecType: GrantFiled: July 23, 2018Date of Patent: January 7, 2020Assignee: FANUC CORPORATIONInventors: Munekazu Matsuda, Hiroshi Takigawa
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Patent number: 10525553Abstract: A laser processing device includes: a laser light source emitting laser light; a converging optical system converging the laser light at an object to be processed; a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into 0th order light and ±nth order light (n is a natural number) including at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point; and a light blocking part blocking light to be converged at an outside with respect to the first processing light and the second processing light of the 0th order light and the ±nth order light to be converged at the object.Type: GrantFiled: March 30, 2015Date of Patent: January 7, 2020Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi Sakamoto, Yasunori Igasaki, Mamiko Matsunaga
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Patent number: 10518357Abstract: A machine device for learning a processing order of a laser processing robot, includes a state observation unit that observes, as a state variable, one of a plasma light from a laser processing point of the laser processing robot and a processing sound from the laser processing point of the laser processing robot; a determination data obtaining unit that receives, as determination data, a cycle time in which the laser processing robot completes processing; and a learning unit that learns the processing order of the laser processing robot based on an output of the state observation unit and an output of the determination data obtaining unit.Type: GrantFiled: November 10, 2017Date of Patent: December 31, 2019Assignee: FANUC CORPORATIONInventor: Yoshitake Furuya
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Patent number: 10512986Abstract: A method is disclosed for welding a first part and second part together. A spacer bead is first formed on the first part by directing a laser beam on one side of the first part. The second part is then assembled to the one side of the first part. The second part is then welded to the first part by directing a second laser beam in a partially circular pattern adjacent the spacer bead. An end portion of the weld terminates radially inside the partially circular pattern.Type: GrantFiled: February 7, 2017Date of Patent: December 24, 2019Assignee: FORD GLOBAL TECHNOLOGIES, LLCInventors: Matthew Gilloon, Arnon Wexler
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Patent number: 10493562Abstract: Selective laser solidification apparatus is described that includes a powder bed onto which a powder layer can be deposited and a gas flow unit for passing a flow of gas over the powder bed along a predefined gas flow direction. A laser scanning unit is provided for scanning a laser beam over the powder layer to selectively solidify at least part of the powder layer to form a required pattern. The required pattern is formed from a plurality of stripes or stripe segments that are formed by advancing the laser beam along the stripe or stripe segment in a stripe formation direction. The stripe formation direction is arranged so that it always at least partially opposes the predefined gas flow direction. A corresponding method is also described.Type: GrantFiled: February 13, 2014Date of Patent: December 3, 2019Assignee: RENISHAW PLCInventors: Marc Frank Dimter, Ralph Markus Mayer, Thomas Hess
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Patent number: 10493561Abstract: In a laser machining device, a laser emitter is inhibited from emitting a laser beam in a stop state, and can emit the laser beam in a machining state. A controller is configured to perform: in response to detecting opening of a door of a machining chamber, bringing the laser emitter into the stop state and disabling receipt of a release command via an interface; in response to detecting closing of the door while the laser emitter is in the stop state, determining whether the laser emitter is in the machining state when the opening of the door is detected; in response to determining that the laser emitter is not in the machining state, releasing the stop state of the laser emitter; and in response to determining that the laser emitter is in the machining state, enabling the receipt of the release command via the interface.Type: GrantFiled: March 30, 2017Date of Patent: December 3, 2019Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventor: Yasuhiro Kato
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Patent number: 10494290Abstract: Systems and methods utilizing two Airy beams to process a non-rounded edge of a glass substrate or to cleave a glass substrate are disclosed. The method includes generating first and second Airy beams and causing them to cross at a crossing to define a curved intensity profile in the vicinity of the crossing point where the first and second Airy beams have respective local radii of curvature RA and RB. The method also includes scanning the curved intensity profile either along the non-rounded outer edge or through the glass along a scan path to form on the glass substrate a rounded outer edge having a radius of curvature RE that is smaller than the first and second local radii of curvature RA and RB. The radius of curvature RE can be adjusted by changing a beam angle between the first and second Airy beams.Type: GrantFiled: January 12, 2017Date of Patent: December 3, 2019Assignee: Corning IncorporatedInventors: Minghan Chen, Ming-Jun Li, Anping Liu, Gaozhu Peng
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Patent number: 10471540Abstract: A laser welding method of the present disclosure includes the step of irradiating a workpiece with a laser beam in a helical shape along a weld part of the workpiece. The helical shape is a combination of a circular trajectory in which a laser beam is moved circularly, and a movement trajectory in which the laser beam is moved in a proceeding direction along the weld part. Furthermore, first energy of the laser beam moving so as to have a component of the proceeding direction in the circular trajectory is larger than second energy of the laser beam moving so as to have a component of an opposite direction to the proceeding direction in the circular trajectory.Type: GrantFiled: February 24, 2015Date of Patent: November 12, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Noriyuki Matsuoka, Yasushi Mukai, Atsuhiro Kawamoto, Junji Fujiwara, Tatsuyuki Nakagawa
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Patent number: 10477079Abstract: A visual inspection device includes a housing, a handle coupled to the housing that is grasped by a user while the device is in use, and an articulating camera unit coupled to the housing. The articulating camera unit includes a flexible cable with a first end coupled to the housing and a second end, a camera coupled to the second end of the flexible cable and operable to transmit image data through the flexible cable, and an articulation mechanism operable to articulate the camera relative to the flexible cable. The articulation mechanism includes a mount that is removably coupled to the housing. The articulating camera unit further includes a means for securing the mount to the housing in a plurality of different orientations relative to the housing. The visual inspection device further includes a display unit coupled to the housing to display an image transmitted by the articulating camera unit.Type: GrantFiled: July 6, 2017Date of Patent: November 12, 2019Assignee: MILWAUKEE ELECTRIC TOOL CORPORATIONInventors: Gareth Mueckl, Jason R. Crowe, Benjamin Oliver Ryan Cabot
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Patent number: 10434598Abstract: A method for monitoring the energy density of a laser beam using parameters of the laser beam including regularly applying the laser beam to a reference substrate and measuring, with each application, the resulting light intensity; identifying a change in the light intensity on the reference substrate between at least two measurements; and, when the change in the light intensity is higher than a predetermined threshold, determining the unstable parameter or parameters of the energy density of the laser beam.Type: GrantFiled: September 17, 2014Date of Patent: October 8, 2019Assignee: SAFRAN AIRCRAFT ENGINESInventors: Cyrille Baudimont, Julie Fouquet, Didier Monnet
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Patent number: 10383522Abstract: A pulse laser includes a laser medium, a charge storage unit, a power source unit configured to supply an electrical charge to the charge storage unit, an excitation unit configured to cause irradiation of the laser medium with excitation light onto the laser medium by being supplied the electrical charge stored in the charge storage unit, a switching unit configured to repeatedly supply the charge stored in the charge storage unit to the excitation unit, an energy monitoring unit configured to monitor energy stored in the charge storage unit, and a control unit configured to prevent the switching unit from supplying the electrical charge stored in the charge storage unit to the excitation unit when the energy monitored by the energy monitoring unit is larger than a threshold.Type: GrantFiled: June 25, 2014Date of Patent: August 20, 2019Assignee: CANON KABUSHIKI KAISHAInventor: Koichi Suzuki
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Patent number: 10357847Abstract: The invention relates to a interchangeable optics module for a laser processing machine as well as a laser processing machine including the optics module, wherein a beam guide is fixed to a support plate, and the beam guide includes a laser input coupling interface on one end that can be connected to a laser output coupling interface allocated to a laser source, and a processing head on the other end.Type: GrantFiled: May 17, 2016Date of Patent: July 23, 2019Assignee: TRUMPF Schweiz AGInventors: Arnd Szelagowski, Thomas Bewer, Adrian Gisler, Kilian Imhof
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Patent number: 10343339Abstract: The present invention discloses a method for laser welding of plastics, comprising the steps of providing a first plastic material to be welded comprising a compound capable of absorbing near-infrared light, positioning a second plastic material in intimate contact with the first plastic material, and activating a laser source emitting a wave length in the near-infrared spectrum to obtain attachments of the first and the second plastic material. The compound capable of absorbing near-infrared light is a dye derived from croconic acid.Type: GrantFiled: April 11, 2014Date of Patent: July 9, 2019Assignee: Københavns UniversitetInventors: Theis Brock-Nannestad, Michael Pittelkow, Helle Østergren Bak
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Patent number: 10338005Abstract: Provided is an apparatus for inspecting the back surface of an epitaxial wafer, capable of detecting defects in the back surface of an epitaxial wafer. An epitaxial wafer back surface inspection apparatus has an optical system including an annular fiber optic illuminator and an imaging unit which are placed perpendicular to the back surface of an epitaxial wafer; and a scanning unit operating the optical system in parallel with the back surface to scan the back surface. A light source of the annular fiber optic illuminator is composed of either blue LEDs or red LEDs.Type: GrantFiled: August 3, 2016Date of Patent: July 2, 2019Assignee: SUMCO CORPORATIONInventors: Tatsuya Osada, Hideaki Kinbara, Masahiko Egashira
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Patent number: 10328521Abstract: A laser processing device includes: a laser light source; a converging optical system; and a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point. In a case in which W1 is a radius of the first processing light at a front face of the object, W2 is a radius of the second processing light at the front face, and D is a distance between the first converging point and the second converging point when viewed from a direction orthogonal to the front face, the reflective spatial light modulator modulates the laser light such that D>W1+W2 is satisfied.Type: GrantFiled: March 30, 2015Date of Patent: June 25, 2019Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi Sakamoto, Yasunori Igasaki, Mamiko Matsunaga
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Patent number: 10315458Abstract: This invention aims at providing a decorated-part of which a design of three-dimensional effect is drawn onto the decorative-surface of a part material, thus improving design-quality. A design (4), consisting of a plurality of the same fine regularly arranged basic-pattern (5), is drawn onto the decorative-surface (3a) of the automobile interior-part (1) of this invention. The fine basic-pattern (5) consists of the first-graphic (8) drawn including the first laser-processed groove (6a) and of the second-graphic (9) located in the region surrounded by the first laser-processed groove (6a) and drawn including the second laser-processed groove (6b). The inner-surface roughness (Ra1) of the first laser-processed groove (6a) is greater than the decorative-surface roughness (Ra3) where the fine basic-pattern (5) does not exist on said decorative-surface (3a) (Ra1>Ra3).Type: GrantFiled: December 1, 2014Date of Patent: June 11, 2019Assignee: TRINITY INDUSTRIAL CORPORATIONInventors: Tokinobu Shimada, Yukihiro Goto
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Patent number: 10309447Abstract: A method for machining a surface of a metal component, in particular a connecting rod or a cam for a motor vehicle, including the following steps: providing a metal component which has a surface to be machined; premachining the surface to be machined; structuring the premachined surface by a laser beam in such a way that elevations but no depressions are formed as laser structures on the premachined surface with respect to the level thereof.Type: GrantFiled: March 24, 2017Date of Patent: June 4, 2019Assignee: Dr. Ing. h.c. F. Porsche AktiengesellschaftInventors: Peter Wels, Gerhard Flores
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Patent number: 10297710Abstract: A method of processing a wafer includes applying a laser beam having a wavelength that is transmittable through a sapphire substrate to the wafer while positioning a focused spot of the beam within the wafer in regions corresponding to projected dicing lines through a reverse side of the wafer, thereby forming a plurality of shield tunnels made up of a plurality of pores and an amorphous body surrounding the pores, at predetermined spaced intervals in the wafer along the projected dicing lines. A laser beam having a wavelength that is transmittable through the sapphire substrate to the wafer is applied while positioning a focused spot of the laser beam within the wafer in the projected dicing lines through the reverse side of the wafer, thereby forming modified layers between adjacent shield tunnels. Exerting external forces to the wafer divides the wafer into a plurality of optical device chips.Type: GrantFiled: April 25, 2018Date of Patent: May 21, 2019Assignee: Disco CorporationInventor: Naotoshi Kirihara
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Patent number: 10265967Abstract: Method of controlling a laser marking matrix system, the matrix system comprising an N×M matrix of lasers to produce the laser marking, the method comprising the sequential transformation of at least two images to be marked into a series of marking commands according to an N×M matrix of dots, which comprises the following phases: division of a first image into a fixed portion and a variable portion, transformation of the fixed portion into a fixed matrix and the variable portion into a variable matrix, combination of said fixed and variable matrices, laser marking of the first image, processing of a second image, obtaining a new variable matrix which is added to the previous fixed matrix, producing a complete new matrix, laser marking of the second image.Type: GrantFiled: May 24, 2017Date of Patent: April 23, 2019Assignee: MACSA ID, S.A.Inventors: Sven Alexander Vogler, Valenti Boira Plans, Joan Camps Claramunt, Francesc Bravo Montero
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Patent number: 10252375Abstract: A laser processing system including a laser processing unit, a controller controlling the processing unit according to a laser processing program, and a restart preparation apparatus performing a preparation process of the controller to resume the program execution after being suspended. The restart preparation apparatus includes an operating state judging section judging whether an operating state of the processing unit when suspending the program execution is in course of laser processing, and a restart condition specifying section specifying a restart condition of the processing unit when resuming the program execution, from among predetermined conditions, based on a judgment result.Type: GrantFiled: April 28, 2015Date of Patent: April 9, 2019Assignee: FANUC CORPORATIONInventor: Atsushi Mori
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Patent number: 10245677Abstract: Methods, devices and systems for laser decoating of coated metal sheets, in particular for removing a metal protective layer from a metal sheet by a laser beam. The laser beam is directed onto a surface of a metal sheet coated with a metal protective layer, such that the laser beam strikes the surface of the metal sheet at a laser spot and melts material of the metal protective layer. A gas is directed by a plurality of nozzles at a pressure of at least 3 bar and at an acute angle with respect to the laser beam onto the laser spot. The nozzles are arranged around the laser beam such that the gas directed from the nozzles blows away the melted material of the metal protective layer from the metal sheet.Type: GrantFiled: August 4, 2014Date of Patent: April 2, 2019Assignee: TRUMPF Laser- und Systemtechnik GmbHInventors: Severin Luzius, Florian Kiefer
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Patent number: 10195688Abstract: The present disclosure relates generally to a welding process for a battery module. In an embodiment, a system for welding two components in a battery module includes a laser source configured to emit a laser beam onto a workpiece having a first battery module component and a second battery module component. The system also has an actuator coupled to the laser source and configured to move the laser beam along a first axis and a second axis and a controller electrically coupled to the laser source and the actuator. The controller is configured to send a signal to the laser source and the actuator to form a sinusoidal lap weld on a surface of the workpiece, such that the first battery module component is electrically coupled to the second battery module component.Type: GrantFiled: February 25, 2015Date of Patent: February 5, 2019Assignee: Johnson Controls Technology CompanyInventor: John P. Dinkelman
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Patent number: 10195689Abstract: A method of laser welding a workpiece stack-up that includes at least two overlapping metal workpieces is disclosed. The method includes advancing a beam spot of a laser beam relative to a top surface of the workpiece stack-up and along a beam travel pattern to form a laser weld joint, which is comprised of resolodified composite metal workpiece material, that fusion welds the metal workpieces together. And, while the beam spot is being advanced along the beam travel pattern, between a first point and a second point, which may or may not encompass the entire beam travel pattern, at least one of the following laser beam parameters is repeatedly varied: (1) the power level of the laser beam; (2) the travel speed of the laser beam; or (3) the focal position of the laser beam relative to the top surface of the workpiece stack-up.Type: GrantFiled: July 11, 2016Date of Patent: February 5, 2019Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: David Yang, Wu Tao
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Patent number: 10182881Abstract: A dental laser system for treatment of hard and/or soft tissue includes a main chamber housing optical and primary fluid supply subsystems, for directing a laser beam and fluid to a treatment area. A hand piece affixable to the main chamber, includes mating optical and secondary fluid supply subsystems. The hand piece can be rotatable or re-orientable about an optical axis within the hand piece. A lock can maintain a selectable angular orientation of the hand piece relative to the main chamber. A coupling can maintain a fluidic communication between the primary and secondary fluid supply subsystems even when the hand piece is rotated or re-oriented. A sensor and controller can sense a selected angular orientation of the hand piece and adjust the main optical subsystem according to the sensed angular orientation, to align the two optical subsystems. The laser may be controlled using a variable speed foot pedal.Type: GrantFiled: February 4, 2014Date of Patent: January 22, 2019Assignee: Convergent Dental, Inc.Inventors: Nathan P. Monty, Charles H. Dresser, William H. Groves, Jr., Leonid A. Bafitos, Jon R. Quillard
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Patent number: 10144088Abstract: A method for laser processing of Silicon includes placing a Kerr material into engagement with the Silicon forming an interface therebetween. A laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength. The laser beam passes through a distributive lens focusing assembly and to the Kerr material. The first wavelength is modified to a plurality of second wavelengths, some of which are effective for processing Silicon. Photoacoustic compression processing is produced by the laser pulse energy by a portion of second wavelengths delivered through the interface and to the Silicon which initiates Kerr Effect self focusing which is propagated in the Silicon by additional energy input to the Silicon thus producing a filament within the Silicon.Type: GrantFiled: November 28, 2014Date of Patent: December 4, 2018Assignee: ROFIN-SINAR TECHNOLOGIES LLCInventor: S. Abbas Hosseini
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Patent number: 10119921Abstract: A method for detecting an internal crack in a wafer includes a first image recording step of applying near infrared light having a transmission wavelength to a reference wafer having the same configuration as a target wafer to be subjected to the detection of the internal crack, thereby obtaining a first image of the reference wafer having no internal crack and then recording the first image, a processing step of processing the target wafer, a second image recording step of applying the near infrared light to the target wafer, thereby obtaining a second image of the processed target wafer and then recording the second image, and an internal crack detecting step of removing the same image information between the first image and the second image from the second image to obtain a residual image, thereby detecting the residual image as the internal crack in the target wafer.Type: GrantFiled: June 21, 2017Date of Patent: November 6, 2018Assignee: DISCO CORPORATIONInventors: Noboru Takeda, Hiroshi Morikazu
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Patent number: 10010977Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.Type: GrantFiled: September 26, 2016Date of Patent: July 3, 2018Assignee: Micron Technology, Inc.Inventors: Charles M. Watkins, William M. Hiatt
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Patent number: 10003170Abstract: A soldering system that determines soldering quality of elements relative to a housing at the moment of soldering semiconductor laser elements. A soldering device that performs soldering of a semiconductor laser element to a semiconductor laser module, a robot that conveys the module, a camera, and a control device that controls the robot and camera based on imaging output of the camera. The robot conveys the module and changes the position and posture of the camera. The camera images the module. The control device calculates the position of the semiconductor laser element based on the imaging output, calculates parallelism between the housing of the module and the semiconductor laser element based on the change in light intensity related to the imaging output when changing the relative position between the camera and the subject, and determines the quality of soldering of the semiconductor laser element based on the position and parallelism.Type: GrantFiled: June 6, 2017Date of Patent: June 19, 2018Assignee: FANUC CORPORATIONInventor: Tetsuhisa Takazane
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Patent number: 9975199Abstract: The invention refers to a process for rapid manufacturing that uses a focused ultrasound beam according to the invention. The process is based on the local ultrasound welding of the material (2) grains that is under a powder form, welding that takes place solely in the focal spot of the focused ultrasound beam, the focal spot being scanned across the X-Y-Z directions within the powder (2) bed so as to 3D build the entire object (7) that is desired. The processes taking place in the focal spot region are local melting, local melting due to friction followed by filling of the gaps existing between grains, removal of the grain asperities, local inter-diffusion between neighboring grains as well as other phenomena that take place at the interfaces between materials when these are subjected to an ultrasound field.Type: GrantFiled: October 10, 2014Date of Patent: May 22, 2018Assignee: INSTITUTUL NATIONAL DE CERCETARE-DEZVOLTARE PENTRU MICROTECHNOLOGIE-IMTInventor: Gabriel Moagar-Poladian
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Patent number: 9964431Abstract: The various technologies presented herein relate to extracting a portion of each pulse in a series of pulses reflected from a target to facilitate determination of a Doppler-shifted frequency for each pulse and, subsequently, a vibration frequency for the series of pulses. Each pulse can have a square-wave configuration, whereby each pulse can be time-gated to facilitate discarding the leading edge and the trailing edge (and associated non-linear effects) of each pulse and accordingly, capture of the central portion of the pulse from which the Doppler-shifted frequency, and ultimately, the vibration frequency of the target can be determined. Determination of the vibration velocity facilitates identification of the target being in a state of motion. The plurality of pulses can be formed from a laser beam (e.g., a continuous wave), the laser beam having a narrow bandwidth.Type: GrantFiled: November 14, 2014Date of Patent: May 8, 2018Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Sean Moore, Daniel B. S. Soh
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Patent number: 9962557Abstract: An aesthetic treatment device including: a multi illumination system having at least one source in the visible region, disposed around a periphery of a predetermined area of skin; an imaging device, sensitive to the illumination system, to discern features on or in the skin within the predetermined area of skin to be treated; multiple treatment light sources mounted on an optical bench and aimed and focused to a point of treatment in the predetermined area of skin; a mechanical guidance system to guide the multiple treatment light sources; and a pulse generator to control power output of the multiple treatment light sources based upon the treatment to be applied to the predetermined area of skin.Type: GrantFiled: May 16, 2016Date of Patent: May 8, 2018Assignee: S & Y ENTERPRISES LLCInventors: Yehuda Poran, Oren Aharon
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Patent number: 9943907Abstract: An apparatus and method for the generative production of a component includes a movably dispensing structure for the disposal of a starting material layer; a bonding device, such as a laser, for the local bonding of this starting material layer to a cross section of the component being produced; a platform for supporting the component being produced, which can be displaced counter to a direction of layer buildup in a motor-driven manner; a position sensing device for sensing a position or change in position, such as vibration, of the platform in the direction of layer buildup with the capability of sensing interference as to whether the movement of the dispensing structure is not free of interference on the basis of the sensed position or change in position.Type: GrantFiled: February 23, 2015Date of Patent: April 17, 2018Assignee: MTU AERO ENGINES AGInventors: Thomas Hess, Alexander Ladewig, Christian Liebl, Steffen Schlothauer, Andreas Jakimov, Georg Schlick
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Patent number: 9919945Abstract: A laser processing method that can reduce warpage occurring in a glass and reduce a stress generated on the glass at a time of releasing a protective material from the glass. The laser processing method includes: forming the protective materials on both surfaces of the glass; processing the glass by radiating a laser beam onto the glass together with the protective materials after the protective material formation; and releasing the protective materials from the glass after the laser processing.Type: GrantFiled: October 10, 2014Date of Patent: March 20, 2018Assignee: Mitsubishi Electric CorporationInventors: Reona Hirayama, Shuichi Fujikawa, Tomotaka Katsura
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Patent number: 9905016Abstract: A robot identification system includes a robot having a rotatable arm, an imaging unit imaging the robot, an angle detector detecting a rotation angle of the arm, a model generator producing robot models representing the forms of the robot on the basis of the rotation angle detected by the angle detector, and an image identification unit that compares an image captured by the imaging unit with the robot models generated by the model generator to identify a robot image in the image.Type: GrantFiled: November 11, 2015Date of Patent: February 27, 2018Assignee: FANUC CORPORATIONInventor: Yasuhiro Amagata
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Patent number: 9814904Abstract: The apparatus includes a source of treatment radiation which is arranged to generate radiation at one of a plurality of radiation parameters (such as power levels), a control unit and a base unit. The control unit is arranged to removably dock with the base unit and includes a sensor which can sense one of a plurality of skin parameters, and an actuator for enabling a user to interface with the control unit. The control unit operates in a sensing mode, in which the control unit is undocked from the base unit to sense a parameter of skin to be treated (such as skin tone), and a control mode in which the control unit is docked to the docking unit and is arranged to select the power level of the radiation generated by the source.Type: GrantFiled: November 23, 2012Date of Patent: November 14, 2017Assignee: Cyden LimitedInventor: Stuart Terry Jones
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Patent number: 9761492Abstract: A processing method for optical device wafers includes a shielded tunnel forming step and a dividing step. In the shielded tunnel forming step, a sapphire substrate is irradiated with a pulse laser beam having such a wavelength as to be transmitted through the sapphire substrate along regions corresponding to planned dividing lines. The light focus point of the beam is positioned inside the substrate from the back surface side of the substrate. Fine pores and amorphous regions that shield the fine pores form shielded tunnels along the planned dividing lines. In the dividing step, an external force is applied to the optical device wafer, and the optical device wafer is divided into individual optical device chips along the planned dividing lines. In the shielded tunnel forming step, a spherical aberration is generated by causing the laser beam to be incident on a condensing lens with a divergence angle.Type: GrantFiled: October 12, 2016Date of Patent: September 12, 2017Assignee: Disco CorporationInventors: Takumi Shotokuji, Noboru Takeda, Naotoshi Kirihara
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Patent number: 9748182Abstract: Disclosed herein is a wafer processing method including a stacked member removing step of applying a laser beam having an absorption wavelength to a stacked member through a protective film along each division line formed on the front side of a wafer, thereby performing ablation to remove the stacked member present on each division line, a dividing step of applying an external force to the wafer to divide the wafer into individual device chips along each division line where a modified layer is previously formed, and a plasma etching step of supplying an etching gas in a plasma state to the wafer from the front side thereof after performing the stacked member removing step or after performing the dividing step, thereby removing damage due to the ablation in the stacked member removing step.Type: GrantFiled: December 6, 2016Date of Patent: August 29, 2017Assignee: Disco CorporationInventor: Masaru Nakamura
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Patent number: 9738093Abstract: Apparatus related to marking a metal surface are provided. The solution comprises receiving (600) control data comprising information on the marking of a pattern on the metal surface; controlling (604, 606) a temperature control unit and a gas unit to produce a temperature and atmosphere in space under a cover on the basis of the control data; controlling (602) the focus and bandwidth of a laser marking unit on the basis of the control data to produce the pattern defined in the control data on the metal surface; and controlling (608) a coating unit on the basis of the control data to produce a coating on the metal surface.Type: GrantFiled: April 16, 2014Date of Patent: August 22, 2017Assignee: CAJO TECHNOLOGIES OYInventors: Tomi Karsikas, Niko Karsikas
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Patent number: 9736342Abstract: A visual inspection device includes a housing, a handle coupled to the housing that is grasped by a user while the device is in use, an articulating camera unit coupled to the housing, and a display unit coupled to the housing to display an image transmitted by the articulating camera unit.Type: GrantFiled: October 18, 2013Date of Patent: August 15, 2017Assignee: Milwaukee Electric Tool CorporationInventors: Gareth Mueckl, Jason R. Crowe
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Patent number: 9728932Abstract: A fiber coupled modular laser system comprises a laser oscillator, at least one fiber pre-amplifier, and at least one free space solid state power amplifier. The output of the laser oscillator is fiber coupled with the input of the at least one fiber pre-amplifier or the at least one free space solid state power amplifier. The output or the input of the at least one fiber pre-amplifier is fiber coupled with the input or the output of the at least one free space solid state power amplifier.Type: GrantFiled: March 18, 2015Date of Patent: August 8, 2017Assignee: Advanced Optowave CorporationInventors: Xiaojie Zhao, Chun He
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Patent number: 9669583Abstract: A selective laser solidification apparatus including: a powder bed onto which a powder layer can be deposited, a gas flow unit for passing a flow of gas over the powder bed along a gas flow direction, a laser scanning unit for scanning a laser beam over the powder layer to selectively solidify at least part of the powder layer to form at least one object and a processing unit for selecting a scanning sequence of the laser beam based on the gas flow direction.Type: GrantFiled: February 12, 2014Date of Patent: June 6, 2017Assignee: RENISHAW PLCInventor: Ben Ian Ferrar
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Patent number: 9646898Abstract: Techniques herein include systems and methods that provide a spatially-controlled or pixel-based projection of light onto a substrate to tune various substrate properties. A given pixel-based image projected on to a substrate surface can be based on a substrate signature. The substrate signature can spatially represent non-uniformities across the surface of the substrate. Such non-uniformities can include energy, heat, critical dimensions, photolithographic exposure dosages, etc. Such pixel-based light projection can be used to tune various properties of substrates, including tuning of critical dimensions, heating uniformity, evaporative cooling, and generation of photo-sensitive agents. Combining such pixel-based light projection with photolithographic patterning processes and/or heating processes improves processing uniformity and decreases defectivity. Embodiments can include using a digital light processing (DLP) chip, grating light valve (GLV), or other grid-based micro projection technology.Type: GrantFiled: November 26, 2014Date of Patent: May 9, 2017Assignee: Tokyo Electron LimitedInventors: Anton J. deVilliers, Daniel Fulford, Gerrit J. Leusink
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Patent number: 9636774Abstract: A controller used for irradiating a laser beam to an object from a machining head at a reference gap position is provided. The controller includes a gap sensor for detecting an amount of gap between the machining head and the object, a gap position command calculation part for producing a gap position command, a servo mechanism for driving the machining head to the reference gap position, a servo position deviation reading part for reading an amount of position deviation of the servo mechanism, a position gain calculation part for calculating a corrected position gain of the servo mechanism, based on the amount of position deviation of the servo mechanism and a position gain replacing part for replacing the position gain of the servo mechanism with the corrected position gain.Type: GrantFiled: August 23, 2012Date of Patent: May 2, 2017Assignee: FANUC CorporationInventor: Takeshi Mochida
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Patent number: 9630363Abstract: A selective laser solidification apparatus including: a powder bed onto which a powder layer can be deposited, a gas flow unit for passing a flow of gas over the powder bed along a gas flow direction, a laser scanning unit for scanning a laser beam over the powder layer to selectively solidify at least part of the powder layer to form at least one object and a processing unit for selecting a scanning sequence of the laser beam based on the gas flow direction.Type: GrantFiled: February 12, 2014Date of Patent: April 25, 2017Assignee: RENISHAW PLCInventor: Ben Ian Ferrar
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Patent number: 9629629Abstract: Surgical instruments and control systems therefor are disclosed. A surgical instrument can comprise: a power circuit comprising a power source and a switch, a microcontroller coupled to the power circuit, a handle comprising an attachment portion, and a control circuit in signal communication with the microcontroller. The attachment portion can comprise a first electrical contact in signal communication with the microcontroller. The control circuit can comprise a sensor configured to detect an attachment state of the attachment portion. The control circuit can communicate the detected attachment state to the microcontroller, and the microcontroller can ignore signals from the first electrical contact when the control circuit communicates a detached state. The attachment portion can comprise a second electrical contact coupled to a second power circuit, and the second power circuit can decouple the second electrical contact and the second power source when the sensor detects the detached state.Type: GrantFiled: March 7, 2014Date of Patent: April 25, 2017Assignee: Ethicon Endo-Surgey, LLCInventors: Richard L. Leimbach, Mark D. Overmyer, Shane R. Adams
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Patent number: 9615411Abstract: The present invention relates to a backlight unit. The backlight unit includes a light source unit, a power supply unit, and a power transmitting wire. The light source includes at least one light source. The power supply circuit is configured to supply a power voltage to the light source unit. The power transmitting wire is configured to transmit the power voltage. The power transmitting wire includes at least two circuit patterns.Type: GrantFiled: January 28, 2014Date of Patent: April 4, 2017Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Min-Woo Kim, Sang Rock Yoon, On Sik Choi
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Patent number: 9607897Abstract: A method for manufacturing a semiconductor device is provided with: a step of preparing a semiconductor wafer (22) in a state where the circumference of the semiconductor wafer, which has been divided into semiconductor device parts, is adhered on a dicing sheet (21) supported by a wafer ring (23); a step of fixing the wafer ring (23) after transferring the wafer ring to a table (14) where laser printing is to be performed; and a step of marking on the main surface where the semiconductor material of the semiconductor device parts which configure the semiconductor wafer (22) is exposed, by radiating laser beams through the dicing sheet and an adhesive layer.Type: GrantFiled: March 2, 2015Date of Patent: March 28, 2017Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takanori Kato, Isao Nakatsuka
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Patent number: 9592636Abstract: An improved lamination molding apparatus which can maintain the inert gas environment in the chamber as well as remove the fume swiftly and efficiently away from the optical pathway of the laser beam, is provided.Type: GrantFiled: May 27, 2015Date of Patent: March 14, 2017Assignee: Sodick Co., Ltd.Inventors: Ichiro Araie, Katsutaka Muranaka, Shuichi Kawada, Shuji Okazaki
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Patent number: 9592158Abstract: Systems and methods for removing an epithelial layer disposed over a stromal layer in a cornea irradiate a region of the epithelial layer with a pulsed beam of ablative radiation. The ablative radiation is scanned to vary the location of the beam within the region in accordance with a pulse sequence. The pulse sequence is arranged to enhance optical feedback based on a tissue fluorescence of the epithelial layer. The penetration of the epithelial layer is detected in response to the optical feedback. The use of scanning with the pulse sequence arranged to enhance optical feedback allows large areas of the epithelium to be ablated such penetration of the epithelial layer can be detected.Type: GrantFiled: December 2, 2014Date of Patent: March 14, 2017Assignee: AMO Development, LLCInventors: Mark E. Arnoldussen, Jonathan Wong, Benjamin A. Logan, Leander Zickler