Beam Energy Control Patents (Class 219/121.61)
  • Patent number: 9504608
    Abstract: An eye-surgical laser system includes a laser source, to generate a laser beam, an XY scanner, to scan a focal spot of a received laser beam in an XY direction essentially transverse to an optical axis of the laser system, and a lens group, disposed in the optical path between the laser source and the XY scanner, to receive the laser beam generated by the laser source, to precompensate an aberration of the laser beam, and to forward the precompensated laser beam to the XY scanner, the lens group having a movable lens, movable in a Z direction along an optical axis.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: November 29, 2016
    Assignee: ALCON LENSX, INC.
    Inventors: Ferenc Raksi, Jesse Buck
  • Patent number: 9498849
    Abstract: A laser cutting device is configured for cutting an original product. The original product includes a stub bar and an optical element. The laser cutting device includes a support member and a cutting member. The original product is moveably placed on the support member. The cutting member includes a checking unit and a laser cutting unit, and defines a cutting area. The checking unit checks whether the original product moves in the cutting area. The laser cutting unit cuts the original product, thereby separating the stub bar from the optical element if the original product moves in the cutting area.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: November 22, 2016
    Assignee: ShenZhen Treasure City Technology Co., LTD.
    Inventor: Yung-Lun Huang
  • Patent number: 9480529
    Abstract: An aesthetic treatment device including: a multi illumination system having at least one source in the visible region, disposed around a periphery of a predetermined area of skin; an imaging device, sensitive to the illumination system, to discern features on or in the skin within the predetermined area of skin to be treated; multiple treatment light sources mounted on an optical bench and aimed and focused to a point of treatment within the predetermined area of skin; a mechanical guidance system to guide the multiple treatment light sources; and a pulse generator to control power output of the multiple treatment light sources based upon the treatment to be applied to the predetermined area of skin.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: November 1, 2016
    Assignee: S & Y ENTERPRISES LLC
    Inventors: Yehuda Poran, Oren Aharon
  • Patent number: 9427827
    Abstract: Manufacturing method, welding arrangement and door frame structure for a door frame (21) of a windmill tower (10), wherein a hole (15) is made in the tower shell (10) for the door and a door frame is placed in the hole and welded on the shell. In the method, the shape of the door frame for the shell and the shape of the surface of the shell at the opening (15) to be made are measured with a measuring sensor (40). Based on the measurements, a cutting torch (41) is controlled so that an opening corresponding to the shape of the door frame is cut in the shell and bevels (16, 17) are cut in the edge of the opening on both sides. The door frame is welded on the shell with a weld (24), such as a double bevel, double J or square butt weld, from the inside and the outside of the shell.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: August 30, 2016
    Assignee: Pemamek Oy
    Inventors: Mikko Savolainen, Timo Tynkkynen
  • Patent number: 9409256
    Abstract: To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source 101 controls a drive power source 51 by a laser light source controller 102, to switch among a pulse waveform among first to third pulse waveforms according to a PE value of the laser light L. In the case of a low PE value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and in the case of a high PE value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: August 9, 2016
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Ryuji Sugiura
  • Patent number: 9402366
    Abstract: Systems and methods to treat a region of a cornea of an eye having an epithelial layer disposed over a stromal layer. The system comprises a device to map a thickness of the epithelial layer over the region of the cornea to generate a map of epithelial thickness over the region, and a laser to generate a laser beam of an ablative radiation. A movable scan component is coupled to the laser to scan the laser beam over the region. A processor system is coupled to the laser and the movable scan component, and the processor system is configured to arrange pulses of laser beam to ablate the epithelial layer of the region in response to the map of epithelial thickness.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: August 2, 2016
    Assignee: AMO Development, LLC
    Inventors: Keith Holliday, Mark E. Arnoldussen
  • Patent number: 9381752
    Abstract: An information processing apparatus includes a display unit, a storage unit, a display controller, an instruction receiver, and an instruction output unit. The storage unit stores coloring states of a laser irradiation target with respect to combinations of a plurality of conditions for laser irradiation, the coloring states being obtained when laser irradiation is executed under the conditions. The display controller causes the display unit to display the coloring states with respect to the combinations of the plurality of conditions. The instruction receiver receives, from an operator, a designation instruction for designating any of display portions of each of the coloring states displayed as for the display unit. The instruction output unit outputs, to the laser irradiation apparatus, a laser irradiation execution instruction for executing laser irradiation on the display portion, the designation instruction of which is received by the instruction receiver, in line with the plurality of conditions.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: July 5, 2016
    Assignee: Kyocera Document Solutions Inc.
    Inventor: Hiroshi Setoue
  • Patent number: 9364684
    Abstract: An aesthetic treatment device including: a multi illumination system having at least one source in the visible region, disposed around a periphery of a predetermined area of skin; an imaging device, sensitive to the illumination system, to discern features on or in the skin within the predetermined area of skin to be treated; multiple treatment light sources mounted on an optical bench and aimed and focused to a point of treatment in the predetermined area of skin; a mechanical guidance system to guide the multiple treatment light sources; and a pulse generator to control power output of the multiple treatment light sources based upon the treatment to be applied to the predetermined area of skin.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: June 14, 2016
    Assignee: S & Y Enterprises LLC
    Inventors: Yehuda Poran, Oren Aharon
  • Patent number: 9338370
    Abstract: A visual system including a near-to-eye display supported by a frame adapted to be worn by a user such that each display is positioned proximate an eye of a wearer, a set of cameras supported by the frame, the cameras having different overlapping fields of view, and a processor coupled to receive images from the cameras and adapted to integrate and transform images from the set of cameras to provide a mosaic image for viewing on the display having a wider field of view than an individual camera provides.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: May 10, 2016
    Assignee: Honeywell International Inc.
    Inventors: Kwong Wing Au, Sharath Venkatesha
  • Patent number: 9314871
    Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings may be precisely formed using a laser. Processing may be used to increase reflectivity of the markings.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: April 19, 2016
    Assignee: Apple Inc.
    Inventors: Michael S. Nashner, Peter N. Russell-Clarke
  • Patent number: 9283638
    Abstract: A device forms grooves or slits in a material web as it moves in a longitudinal direction. The grooves or slits, which are spaced apart from one another in the longitudinal direction, are formed by a laser beam. A laser beam source generates a continuous laser beam and a deflection mirror directs the laser beam onto the material web. The mirror rotates about an axis of rotation and it is displaceable along the axis. The mirror has a first mirror face, the line of intersection of which with a sectional plane perpendicular with respect to the axis of rotation forms a circular arc which varies depending on the axial position of the sectional plane. A second mirror face deflects the laser beam towards an absorber. Focusing optics focus the laser beam, after reflection from the first mirror face, onto the moving material web.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: March 15, 2016
    Assignee: Rofin-Baasel Lasertech GmbH & Co. KG
    Inventors: Armin Pollak, Günter Wurzer
  • Patent number: 9283639
    Abstract: A laser dicing method is a laser dicing method which includes: switching irradiation and non-irradiation of the pulse laser beam on the work piece in light pulse units by controlling passing and blocking of the pulse laser beam using a pulse picker in synchronization with the clock signal; and forming a crack reaching a substrate surface of the work piece to be continuous in the substrate surface of the work piece, and which includes: a first crack forming step of irradiating the pulse laser beam on the work piece along a first line; and a second crack forming step of irradiating the pulse laser beam on the work piece along a second line orthogonal to the first line, and in which, in an area in which the first line and the second line cross, a light pulse density of the pulse laser beam is increased in the first crack forming step or the second crack forming step.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: March 15, 2016
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Shoichi Sato
  • Patent number: 9261623
    Abstract: A target assembly for a radiation generator may include a target body and a beam dump. The target assembly may also include a temperature activated coupler between the target body and the beam dump to move the beam dump between a non-contact position with the target body and a contact position with the target body based upon temperature.
    Type: Grant
    Filed: September 16, 2012
    Date of Patent: February 16, 2016
    Assignee: Schlumberger Technology Corporation
    Inventor: Frederic Gicquel
  • Patent number: 9156721
    Abstract: A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: October 13, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Feng-Yuen Dai, Hung-Lien Yeh, Chung-Pei Wang
  • Patent number: 9104194
    Abstract: A processing information acquisition system in a processing machine which feeds a processing point energy or material, the processing information acquisition system provided with a position information acquisition unit which acquires position information of a feed unit of energy or material, a feed rate control unit which receives a feed condition command of energy or material, converts the feed condition command to a control command which controls a feed of energy or material, and uses the converted control command to control a feed rate of energy or material from the feed unit, a feed rate estimation unit which acquires the control command from the feed rate control unit and calculates an estimated feed rate of energy or material which is fed to a processing point based on the control command, and an output unit which outputs the position information which the position information acquisition unit acquired and the estimated feed rate which the feed rate estimation unit calculated when the feed unit is locat
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: August 11, 2015
    Assignee: FANUC Corporation
    Inventors: Atsushi Mori, Akinori Ohyama, Junichi Tezuka
  • Patent number: 9059225
    Abstract: A method for manufacturing a semiconductor device is provided with: a step of preparing a semiconductor wafer (22) in a state where the circumference of the semiconductor wafer, which has been divided into semiconductor device parts, is adhered on a dicing sheet (21) supported by a wafer ring (23); a step of fixing the wafer ring (23) after transferring the wafer ring to a table (14) where laser printing is to be performed; and a step of marking on the main surface where the semiconductor material of the semiconductor device parts which configure the semiconductor wafer (22) is exposed, by radiating laser beams through the dicing sheet and an adhesive layer.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: June 16, 2015
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Takanori Kato, Isao Nakatsuka
  • Publication number: 20150136743
    Abstract: A method for machining and releasing closed forms from a transparent, brittle substrate includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate. Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate. A scribed line of spaced apart orifices in the transparent substrate comprise a closed form pattern in the substrate. A heat source is applied in a region about said scribed line of spaced apart orifices until the closed form pattern releases from the transparent substrate.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 21, 2015
    Applicant: ROFIN-SINAR TECHNOLOGIES INC.
    Inventor: S. ABBAS HOSSEINI
  • Patent number: 9018561
    Abstract: An apparatus and method of operation for a high power broad band elongated thin beam laser annealing light source, which may comprise a gas discharge seed laser oscillator having a resonance cavity, providing a seed laser output pulse; a gas discharge amplifier laser amplifying the seed laser output pulse to provide an amplified seed laser pulse output; a divergence correcting multi-optical element optical assembly intermediate the seed laser and the amplifier laser. The divergence correcting optical assembly may adjust the size and/or shape of the seed laser output pulse within a discharge region of the amplifier laser in order to adjust an output parameter of the amplified seed laser pulse output. The divergence correcting optical assembly may comprise a telescope with an adjustable focus. The adjustable telescope may comprise an active feedback-controlled actuator based upon a sensed parameter of the amplified seed laser output from the amplifier laser.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: April 28, 2015
    Assignee: Cymer, LLC
    Inventors: Richard L Sandstrom, Daniel J. W. Brown, Thomas Hoffmann, Jason D Robinson, Craig W Unick
  • Publication number: 20150108101
    Abstract: A method of marking components of an aircraft engine, especially turbine blades of a titanium aluminide intermetallic compound. A solid state laser generates a pulsed laser beam with a pulse width of less than 10 ps and the component is marked with the pulsed laser beam.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Inventors: KARL-HERMANN RICHTER, ROLAND MAYERHOFER, LUDGER MUELLERS
  • Publication number: 20150096963
    Abstract: A method for heating an irregularly shaped target surface (28, 36) with an energy beam (12, 48) with a controlled power density as the beam progresses across the surface in order to control a cladding process. In one embodiment, widths (y) of respective rectangular diode laser beam images (22, 24, 26) are controlled in response to a local width of a gas turbine blade tip (20), and a power level of the diode laser is linearly controlled in response to the width of the respective image in order to maintain an essentially constant power density across the blade tip. In another embodiment, the width and power level of a continuous laser beam image (34) are controlled in response to changes in the local surface shape in order to produce a predetermined power density as the image is swept across the surface.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Inventors: Gerald J. Bruck, Ahmed Kamel
  • Patent number: 9000326
    Abstract: An apparatus for laser processing a board is provided. The apparatus for laser processing a board includes a chip, a laser, a modulating device and a focus device. The chip receives a first frequency signal to generate a second frequency signal. The laser receives the first frequency signal to emit a first laser beam. The modulating device receives the second frequency signal and the first laser beam, and adjusts the first laser beam to emit a second laser beam. The focus device focuses the second laser beam to emit a third laser beam onto the board for forming plural dots on the board.
    Type: Grant
    Filed: July 31, 2011
    Date of Patent: April 7, 2015
    Assignee: Hortek Crystal Co. Ltd.
    Inventors: Yu-Lin Lee, Yung-Hsiang Huang, Tai-Wei Wu, Shun-Han Yang, Gong-Qian Wang
  • Patent number: 8993919
    Abstract: The present application discloses a laser source for emitting laser light onto a work-piece. The laser source includes a generator configured to generate the laser light, and an adjuster configured to adjust an output of the laser light. The adjuster situated between the generator and the work-piece reduces output density of the laser light on the work-piece.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: March 31, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Koichi Kusukame, Shinichi Kadowaki, Hiroyuki Furuya, Kiminori Mizuuchi, Susumu Takagi
  • Publication number: 20150083697
    Abstract: The invention relates to a method for laser remote processing of a component on a fillet, wherein a laser beam is directed by means of a scanner device onto the component and guided over said component. The working range of the laser beam on the workpiece is illuminated with illuminating radiation and is captured by at least one image capturing unit. The illuminating radiation is directed onto the component at an angle of attack which is set depending the fillet geometry of the component. The captured image data are evaluated automatically and, with the aid of the evaluation, if appropriate, an automatic correction of the path of the laser beam is carried out.
    Type: Application
    Filed: September 24, 2014
    Publication date: March 26, 2015
    Inventors: Christian ROOS, Hans LANGRIEGER, Florian OEFELE
  • Patent number: 8969755
    Abstract: A low-power laser and arc hybrid welding method includes the steps of matching laser pulses with arc phases, and inducing compress arcs by the laser pulses. A laser peak pulse is triggered from half of the positive half-wave to half of the negative half-wave of alternating arc current. The sum of laser peak pulse width and laser basic pulse width is equal to the time width from a laser pulse triggered point to a negative half-wave end point of the alternating arc current. A welding device for carrying out the method is disclosed. An angle formed by the axis of a laser beam (1) and the vertical direction is in the range of ?50°-50°. An angle formed by the axis of the laser beam (1) and the axis of an arc torch (2) is in the range of 20°-120°. Arc power density is adjusted minutely in the range of 103-105 by adjusting the alternating arc current, protrusion quantity of an electrode (3) and gas flow velocity of a nozzle. The method and the device can reduce the consumption and save the cost.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: March 3, 2015
    Assignees: Dalian University of Technology, Dalian Xinyu Tech Development Center Co., Ltd
    Inventors: Liming Liu, Gang Song, Zhaodong Zhang
  • Patent number: 8969752
    Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: March 3, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama
  • Publication number: 20150048062
    Abstract: Embodiments of the present invention generally relate to an optical valve that modifies a laser beam to allow more energy to be irradiated onto less absorbing areas on a substrate and less energy to be irradiated onto more absorbing areas on the substrate, thus creating a more uniform heating field. The optical valve is a layered structure comprising a reflective switch layer, an absorbing layer, a thermal resistor and a thermal bath.
    Type: Application
    Filed: August 13, 2014
    Publication date: February 19, 2015
    Inventor: Bruce E. ADAMS
  • Publication number: 20150044416
    Abstract: An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.
    Type: Application
    Filed: October 22, 2014
    Publication date: February 12, 2015
    Applicant: ROFIN-SINAR TECHNOLOGIES INC.
    Inventor: S. ABBAS HOSSEINI
  • Publication number: 20150034612
    Abstract: An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 5, 2015
    Inventors: S. Abbas Hosseini, Jung Un Na, Gilbert Albelo
  • Publication number: 20150034613
    Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.
    Type: Application
    Filed: July 21, 2014
    Publication date: February 5, 2015
    Applicant: ROFIN-SINAR TECHNOLOGIES INC.
    Inventor: S. ABBAS HOSSEINI
  • Publication number: 20150037032
    Abstract: An optical communications system includes a first plurality of optical components having optical ports, a second plurality of optical components having optical ports and an optical cross-connect. The optical cross-connect includes a block of a single continuous construction and material having a first side adjacent the first optical components and a second side adjacent the second optical components, and a plurality of non-intersecting, continuous waveguides formed within the block and extending from the first side of the block to the second side of the block. The refractive index of each waveguide is different than the surrounding material of the block, and each waveguide changes direction at least once within the block. The waveguides are optically aligned with the optical ports of the first optical components at the first side of the block and with the optical ports of the second optical components at the second side of the block.
    Type: Application
    Filed: August 5, 2013
    Publication date: February 5, 2015
    Inventors: Qing Xu, Robert Brunner, Stephane Lessard
  • Publication number: 20150038313
    Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.
    Type: Application
    Filed: July 21, 2014
    Publication date: February 5, 2015
    Applicant: ROFIN-SINAR TECHNOLOGIES INC.
    Inventor: S. ABBAS HOSSEINI
  • Patent number: 8940218
    Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: January 27, 2015
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman
  • Publication number: 20150014286
    Abstract: Subject matter of the invention is a CO2 laser that permits a rapid power modulation, particularly a highly efficient Q-switching. The key concept is the sub-division of the resonator into a high-power branch, containing inter alia the active medium (1), and a low-power feedback branch (14), in which the power-sensitive beam-shaping elements, particularly the modulators, are arranged. This is made possible by a suitable arrangement of a polarisation beam splitter (5) and a ?/4-phase shifter (2). The free adjustability of an angle ? between said two components permits the extremely flexible realisation of various operating modes, particularly the optimisation of the feedback degree during pulse generation.
    Type: Application
    Filed: January 31, 2013
    Publication date: January 15, 2015
    Inventor: Gisbert Staupendahl
  • Patent number: 8933374
    Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: January 13, 2015
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Makoto Hayashi
  • Patent number: 8933367
    Abstract: There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: January 13, 2015
    Assignees: Sumitomo Electric Industries, Ltd., National University Corporation Okayama University
    Inventors: Motoki Kakui, Hiroshi Kohda, Yasuomi Kaneuchi, Shinobu Tamaoki, Shigehiro Nagano, Yoshiyuki Uno, Yasuhiro Okamoto, Kenta Takahashi
  • Patent number: 8927897
    Abstract: In one form a maintenance device includes a flexible member with an inspection end sized to be inserted through an inspection port of a workpiece such as a gas turbine engine or a blade of a gas turbine engine. The maintenance device includes a directed energy member that in one form is configured to produce a double pulse laser with an interval time between a first one of the pulses and a second one of the pulses greater than the time of either the first one of the pulses or the second one of the pulses. The first one of the pulses is sufficiently powerful to produce a quantity of debris upon irradiation of the workpiece. The debris produced from the first one of the pulses can be evaporated by the second one of the pulses to eliminate and/or reduce a recast layer on the workpiece.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: January 6, 2015
    Assignee: Rolls-Royce Corporation
    Inventors: Raymond Ruiwen Xu, Timothy Paul Fuesting, William J. Brindley
  • Publication number: 20150001194
    Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
    Type: Application
    Filed: September 18, 2014
    Publication date: January 1, 2015
    Inventors: Mark A. Unrath, Andrew Berwick, Alexander A. Myachin
  • Patent number: 8921733
    Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: December 30, 2014
    Assignee: Raydiance, Inc.
    Inventors: David Gaudiosi, Laurent Vaissie
  • Patent number: 8921732
    Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: December 30, 2014
    Assignee: Revolaze, LLC
    Inventors: Darryl J. Costin, Darryl J. Costin, Jr., Kimberly L. Costin
  • Patent number: 8916797
    Abstract: A crystallization apparatus that performs crystallization on a substrate using sequential lateral solidification (SLS) includes a laser generating device for emitting a laser beam, a first telescope lens module and a second telescope lens module at one side of the laser generating device for minimizing a divergent angle of a laser beam emitted by the laser generating device; and a main optical system at one side of the second telescope lens module for uniformizing and amplifying a laser beam transmitted through the second telescope lens module. The main optical system is rotatably formed with respect to the laser generating device.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: December 23, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventor: Cheol-Ho Park
  • Publication number: 20140360988
    Abstract: A laser dicing method includes: placing a workpiece substrate on a stage; generating a clock signal; emitting a pulse laser beam synchronous with the clock signal; switching irradiation and non-irradiation of the workpiece substrate with the pulse laser beam in a unit of light pulse in synchronization with the clock signal to perform first irradiation of the pulse laser beam on a first straight line by controlling the pulse laser beam using a pulse picker; performing second irradiation of the pulse laser beam on a second straight line, which is adjacent to the first straight line in a substantially parallel fashion, after the first irradiation; and forming a crack reaching a workpiece substrate surface on the workpiece substrate by the first irradiation and the second irradiation.
    Type: Application
    Filed: August 22, 2014
    Publication date: December 11, 2014
    Inventor: Shoichi SATO
  • Publication number: 20140360989
    Abstract: Embodiments of methods and systems for distributing laser energy are disclosed herein. A system for dispensing laser energy by one or more laser energy sources in accordance with one embodiment of the present technology includes a laser energy credit transferring component configured to communicate with a laser energy source. The laser energy source is configured for producing and dispensing laser energy. The laser energy credit transferring component is further configured to receive a request from the laser energy source for laser energy and transfer laser energy credits to the laser energy source. The laser energy credits enable the laser energy source to dispense a corresponding amount of laser energy.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Inventors: Yefim P. Sukhman, Michael L. Flanary, Stefano J. Noto, Christian J. Risser, Miesha T. Stoute, David John Zirbel, JR.
  • Publication number: 20140360987
    Abstract: A laser apparatus includes: a laser which selectively irradiates a laser beam to a portion of a target based on a laser driving voltage, where an intensity of the laser beam is substantially stabilized within about 10 nanoseconds; a stage which controls a relative location between the target and the laser based on a stage driving voltage; and a controller which applies the stage driving voltage to the stage, and applies the laser driving voltage to the laser
    Type: Application
    Filed: May 30, 2014
    Publication date: December 11, 2014
    Applicant: Samsung Display Co., LTD.
    Inventors: Hee-Geun SON, Byoung-Kwon CHOO, Do-Yeob KIM
  • Patent number: 8904635
    Abstract: According to one aspect of the invention, a method for in situ repair of a turbine part is provided. The method includes the steps of accessing the turbine part while assembled to other turbine components, wherein the turbine part includes a region with a structural flaw near a hole in the turbine part, and wherein the hole is configured to flow a cooling fluid. The method also includes welding the structural flaw without performing a heat treatment of the turbine part, wherein welding the structural flaw includes laser welding that maintains a structure of the region.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: December 9, 2014
    Assignee: General Electric Company
    Inventors: Matthew Paul Berkebile, Srikanth Chandrudu Kottilingam, Gene Arthur Murphy, Jr.
  • Publication number: 20140353295
    Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.
    Type: Application
    Filed: May 29, 2013
    Publication date: December 4, 2014
    Inventor: Michael CLAERHOUT
  • Patent number: 8897910
    Abstract: The invention relates to a new technology which uses a surface modification method for ultra-precision machining, and in particular relates to a particle beam-assisted ultraprecision machining method for single-crystal brittle materials. The invention, the particle beam-assisted ultra-precision machining method for single-crystal brittle materials, can significantly improve machining accuracy, reduce surface finish and greatly reduce tool wear during ultra-precision machining of brittle materials.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: November 25, 2014
    Assignee: Tianjin University
    Inventors: Fengzhou Fang, Yunhui Chen, Zongwei Xu, Zhongjun Qiu, Xiaodong Zhang, Tengfei Dai, Xiaotang Hu
  • Publication number: 20140343687
    Abstract: An implant includes a microstructured hyperhydrophilic surface with protrusions and depressions in which a spacing between the protrusions as a statistical mean is in a range of 1 to 100 ?m and a profile height of the protrusions and depressions as a statistical mean is in the range of 1 to 80 ?m.
    Type: Application
    Filed: December 16, 2012
    Publication date: November 20, 2014
    Inventor: Herbert Jennissen
  • Publication number: 20140332507
    Abstract: The invention relates to a method for producing a moulded body by building up layers of powdered material, comprising the steps of: a) preparing a layer of powdered material, b) heating the layer using controlled radiation by irradiating selected points of the layer according to a cross-sectional pattern of the moulded body assigned to said layer according to the geometry description data of the moulded body, so that the powdered material is solidified by melting to form connecting regions according to the cross-sectional pattern of the moulded body, c) preparing a next layer of powdered material on the layer irradiated most recently and d) heating the most recently prepared layer using controlled radiation by radiating selective points of the layer according to a cross-sectional pattern of the moulded body assigned to said layer, so that the powdered material is solidified by melting to form connecting regions according to said cross-sectional pattern of the moulded body, and e) repeating steps c) and d) mu
    Type: Application
    Filed: November 29, 2012
    Publication date: November 13, 2014
    Inventor: Matthias Fockele
  • Patent number: 8884184
    Abstract: An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: November 11, 2014
    Assignee: Raydiance, Inc.
    Inventors: David Gaudiosi, Michael Greenberg, Michael Mielke, Tim Booth, Gordon Masor
  • Patent number: 8884183
    Abstract: A welding arrangement and a welding process for forming a weld seam between two edge portions, wherein the edge portions form a Y joint having a root portion and a bevel portion, said root portion being welded by a hybrid laser electric arc welding process including directing a laser beam and an electric arc in a single interaction zone of plasma and molten metal. A hybrid laser electric arc welding head and welding submerged arc welding head are arranged on a common carrier structure for welding the Y joint.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: November 11, 2014
    Assignee: ESAB AB
    Inventors: Johan Tolling, Kari Erik Lahti