Beam Energy Control Patents (Class 219/121.61)
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Patent number: 9504608Abstract: An eye-surgical laser system includes a laser source, to generate a laser beam, an XY scanner, to scan a focal spot of a received laser beam in an XY direction essentially transverse to an optical axis of the laser system, and a lens group, disposed in the optical path between the laser source and the XY scanner, to receive the laser beam generated by the laser source, to precompensate an aberration of the laser beam, and to forward the precompensated laser beam to the XY scanner, the lens group having a movable lens, movable in a Z direction along an optical axis.Type: GrantFiled: July 29, 2009Date of Patent: November 29, 2016Assignee: ALCON LENSX, INC.Inventors: Ferenc Raksi, Jesse Buck
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Patent number: 9498849Abstract: A laser cutting device is configured for cutting an original product. The original product includes a stub bar and an optical element. The laser cutting device includes a support member and a cutting member. The original product is moveably placed on the support member. The cutting member includes a checking unit and a laser cutting unit, and defines a cutting area. The checking unit checks whether the original product moves in the cutting area. The laser cutting unit cuts the original product, thereby separating the stub bar from the optical element if the original product moves in the cutting area.Type: GrantFiled: April 15, 2014Date of Patent: November 22, 2016Assignee: ShenZhen Treasure City Technology Co., LTD.Inventor: Yung-Lun Huang
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Patent number: 9480529Abstract: An aesthetic treatment device including: a multi illumination system having at least one source in the visible region, disposed around a periphery of a predetermined area of skin; an imaging device, sensitive to the illumination system, to discern features on or in the skin within the predetermined area of skin to be treated; multiple treatment light sources mounted on an optical bench and aimed and focused to a point of treatment within the predetermined area of skin; a mechanical guidance system to guide the multiple treatment light sources; and a pulse generator to control power output of the multiple treatment light sources based upon the treatment to be applied to the predetermined area of skin.Type: GrantFiled: May 28, 2013Date of Patent: November 1, 2016Assignee: S & Y ENTERPRISES LLCInventors: Yehuda Poran, Oren Aharon
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Patent number: 9427827Abstract: Manufacturing method, welding arrangement and door frame structure for a door frame (21) of a windmill tower (10), wherein a hole (15) is made in the tower shell (10) for the door and a door frame is placed in the hole and welded on the shell. In the method, the shape of the door frame for the shell and the shape of the surface of the shell at the opening (15) to be made are measured with a measuring sensor (40). Based on the measurements, a cutting torch (41) is controlled so that an opening corresponding to the shape of the door frame is cut in the shell and bevels (16, 17) are cut in the edge of the opening on both sides. The door frame is welded on the shell with a weld (24), such as a double bevel, double J or square butt weld, from the inside and the outside of the shell.Type: GrantFiled: May 4, 2010Date of Patent: August 30, 2016Assignee: Pemamek OyInventors: Mikko Savolainen, Timo Tynkkynen
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Patent number: 9409256Abstract: To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source 101 controls a drive power source 51 by a laser light source controller 102, to switch among a pulse waveform among first to third pulse waveforms according to a PE value of the laser light L. In the case of a low PE value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and in the case of a high PE value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform.Type: GrantFiled: May 20, 2011Date of Patent: August 9, 2016Assignee: HAMAMATSU PHOTONICS K.K.Inventor: Ryuji Sugiura
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Patent number: 9402366Abstract: Systems and methods to treat a region of a cornea of an eye having an epithelial layer disposed over a stromal layer. The system comprises a device to map a thickness of the epithelial layer over the region of the cornea to generate a map of epithelial thickness over the region, and a laser to generate a laser beam of an ablative radiation. A movable scan component is coupled to the laser to scan the laser beam over the region. A processor system is coupled to the laser and the movable scan component, and the processor system is configured to arrange pulses of laser beam to ablate the epithelial layer of the region in response to the map of epithelial thickness.Type: GrantFiled: February 19, 2016Date of Patent: August 2, 2016Assignee: AMO Development, LLCInventors: Keith Holliday, Mark E. Arnoldussen
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Patent number: 9381752Abstract: An information processing apparatus includes a display unit, a storage unit, a display controller, an instruction receiver, and an instruction output unit. The storage unit stores coloring states of a laser irradiation target with respect to combinations of a plurality of conditions for laser irradiation, the coloring states being obtained when laser irradiation is executed under the conditions. The display controller causes the display unit to display the coloring states with respect to the combinations of the plurality of conditions. The instruction receiver receives, from an operator, a designation instruction for designating any of display portions of each of the coloring states displayed as for the display unit. The instruction output unit outputs, to the laser irradiation apparatus, a laser irradiation execution instruction for executing laser irradiation on the display portion, the designation instruction of which is received by the instruction receiver, in line with the plurality of conditions.Type: GrantFiled: March 25, 2015Date of Patent: July 5, 2016Assignee: Kyocera Document Solutions Inc.Inventor: Hiroshi Setoue
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Patent number: 9364684Abstract: An aesthetic treatment device including: a multi illumination system having at least one source in the visible region, disposed around a periphery of a predetermined area of skin; an imaging device, sensitive to the illumination system, to discern features on or in the skin within the predetermined area of skin to be treated; multiple treatment light sources mounted on an optical bench and aimed and focused to a point of treatment in the predetermined area of skin; a mechanical guidance system to guide the multiple treatment light sources; and a pulse generator to control power output of the multiple treatment light sources based upon the treatment to be applied to the predetermined area of skin.Type: GrantFiled: December 20, 2013Date of Patent: June 14, 2016Assignee: S & Y Enterprises LLCInventors: Yehuda Poran, Oren Aharon
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Patent number: 9338370Abstract: A visual system including a near-to-eye display supported by a frame adapted to be worn by a user such that each display is positioned proximate an eye of a wearer, a set of cameras supported by the frame, the cameras having different overlapping fields of view, and a processor coupled to receive images from the cameras and adapted to integrate and transform images from the set of cameras to provide a mosaic image for viewing on the display having a wider field of view than an individual camera provides.Type: GrantFiled: November 5, 2012Date of Patent: May 10, 2016Assignee: Honeywell International Inc.Inventors: Kwong Wing Au, Sharath Venkatesha
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Patent number: 9314871Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings may be precisely formed using a laser. Processing may be used to increase reflectivity of the markings.Type: GrantFiled: June 18, 2013Date of Patent: April 19, 2016Assignee: Apple Inc.Inventors: Michael S. Nashner, Peter N. Russell-Clarke
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Patent number: 9283638Abstract: A device forms grooves or slits in a material web as it moves in a longitudinal direction. The grooves or slits, which are spaced apart from one another in the longitudinal direction, are formed by a laser beam. A laser beam source generates a continuous laser beam and a deflection mirror directs the laser beam onto the material web. The mirror rotates about an axis of rotation and it is displaceable along the axis. The mirror has a first mirror face, the line of intersection of which with a sectional plane perpendicular with respect to the axis of rotation forms a circular arc which varies depending on the axial position of the sectional plane. A second mirror face deflects the laser beam towards an absorber. Focusing optics focus the laser beam, after reflection from the first mirror face, onto the moving material web.Type: GrantFiled: February 9, 2012Date of Patent: March 15, 2016Assignee: Rofin-Baasel Lasertech GmbH & Co. KGInventors: Armin Pollak, Günter Wurzer
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Patent number: 9283639Abstract: A laser dicing method is a laser dicing method which includes: switching irradiation and non-irradiation of the pulse laser beam on the work piece in light pulse units by controlling passing and blocking of the pulse laser beam using a pulse picker in synchronization with the clock signal; and forming a crack reaching a substrate surface of the work piece to be continuous in the substrate surface of the work piece, and which includes: a first crack forming step of irradiating the pulse laser beam on the work piece along a first line; and a second crack forming step of irradiating the pulse laser beam on the work piece along a second line orthogonal to the first line, and in which, in an area in which the first line and the second line cross, a light pulse density of the pulse laser beam is increased in the first crack forming step or the second crack forming step.Type: GrantFiled: July 5, 2013Date of Patent: March 15, 2016Assignee: Toshiba Kikai Kabushiki KaishaInventor: Shoichi Sato
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Patent number: 9261623Abstract: A target assembly for a radiation generator may include a target body and a beam dump. The target assembly may also include a temperature activated coupler between the target body and the beam dump to move the beam dump between a non-contact position with the target body and a contact position with the target body based upon temperature.Type: GrantFiled: September 16, 2012Date of Patent: February 16, 2016Assignee: Schlumberger Technology CorporationInventor: Frederic Gicquel
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Patent number: 9156721Abstract: A method for cutting chemically strengthened glass is provided. The chemically strengthened glass includes a first stress layer, a second stress layer, and a tension layer sandwich between the first stress layer and the second stress layer. The method includes: using a green pulsed laser to cut the first stress layer, wherein the green pulsed laser includes a first green pulsed laser having femtosecond level and a second green pulsed laser having nanosecond level; using a ultraviolet pulsed laser to cut the tension layer, wherein the ultraviolet pulsed laser includes a first ultraviolet pulsed laser having femtosecond level and a second ultraviolet pulsed laser having nanosecond level; and using the green pulse layer to cut the second stress layer.Type: GrantFiled: December 24, 2013Date of Patent: October 13, 2015Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Feng-Yuen Dai, Hung-Lien Yeh, Chung-Pei Wang
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Patent number: 9104194Abstract: A processing information acquisition system in a processing machine which feeds a processing point energy or material, the processing information acquisition system provided with a position information acquisition unit which acquires position information of a feed unit of energy or material, a feed rate control unit which receives a feed condition command of energy or material, converts the feed condition command to a control command which controls a feed of energy or material, and uses the converted control command to control a feed rate of energy or material from the feed unit, a feed rate estimation unit which acquires the control command from the feed rate control unit and calculates an estimated feed rate of energy or material which is fed to a processing point based on the control command, and an output unit which outputs the position information which the position information acquisition unit acquired and the estimated feed rate which the feed rate estimation unit calculated when the feed unit is locatType: GrantFiled: August 4, 2011Date of Patent: August 11, 2015Assignee: FANUC CorporationInventors: Atsushi Mori, Akinori Ohyama, Junichi Tezuka
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Patent number: 9059225Abstract: A method for manufacturing a semiconductor device is provided with: a step of preparing a semiconductor wafer (22) in a state where the circumference of the semiconductor wafer, which has been divided into semiconductor device parts, is adhered on a dicing sheet (21) supported by a wafer ring (23); a step of fixing the wafer ring (23) after transferring the wafer ring to a table (14) where laser printing is to be performed; and a step of marking on the main surface where the semiconductor material of the semiconductor device parts which configure the semiconductor wafer (22) is exposed, by radiating laser beams through the dicing sheet and an adhesive layer.Type: GrantFiled: February 25, 2010Date of Patent: June 16, 2015Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takanori Kato, Isao Nakatsuka
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Publication number: 20150136743Abstract: A method for machining and releasing closed forms from a transparent, brittle substrate includes using a burst of ultrafast laser pulses to drill patterns of orifices in the substrate. Orifices are formed by photoacoustic compression and they extend completely or partially in the transparent substrate. A scribed line of spaced apart orifices in the transparent substrate comprise a closed form pattern in the substrate. A heat source is applied in a region about said scribed line of spaced apart orifices until the closed form pattern releases from the transparent substrate.Type: ApplicationFiled: November 11, 2014Publication date: May 21, 2015Applicant: ROFIN-SINAR TECHNOLOGIES INC.Inventor: S. ABBAS HOSSEINI
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Patent number: 9018561Abstract: An apparatus and method of operation for a high power broad band elongated thin beam laser annealing light source, which may comprise a gas discharge seed laser oscillator having a resonance cavity, providing a seed laser output pulse; a gas discharge amplifier laser amplifying the seed laser output pulse to provide an amplified seed laser pulse output; a divergence correcting multi-optical element optical assembly intermediate the seed laser and the amplifier laser. The divergence correcting optical assembly may adjust the size and/or shape of the seed laser output pulse within a discharge region of the amplifier laser in order to adjust an output parameter of the amplified seed laser pulse output. The divergence correcting optical assembly may comprise a telescope with an adjustable focus. The adjustable telescope may comprise an active feedback-controlled actuator based upon a sensed parameter of the amplified seed laser output from the amplifier laser.Type: GrantFiled: September 17, 2008Date of Patent: April 28, 2015Assignee: Cymer, LLCInventors: Richard L Sandstrom, Daniel J. W. Brown, Thomas Hoffmann, Jason D Robinson, Craig W Unick
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Publication number: 20150108101Abstract: A method of marking components of an aircraft engine, especially turbine blades of a titanium aluminide intermetallic compound. A solid state laser generates a pulsed laser beam with a pulse width of less than 10 ps and the component is marked with the pulsed laser beam.Type: ApplicationFiled: December 23, 2014Publication date: April 23, 2015Inventors: KARL-HERMANN RICHTER, ROLAND MAYERHOFER, LUDGER MUELLERS
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Publication number: 20150096963Abstract: A method for heating an irregularly shaped target surface (28, 36) with an energy beam (12, 48) with a controlled power density as the beam progresses across the surface in order to control a cladding process. In one embodiment, widths (y) of respective rectangular diode laser beam images (22, 24, 26) are controlled in response to a local width of a gas turbine blade tip (20), and a power level of the diode laser is linearly controlled in response to the width of the respective image in order to maintain an essentially constant power density across the blade tip. In another embodiment, the width and power level of a continuous laser beam image (34) are controlled in response to changes in the local surface shape in order to produce a predetermined power density as the image is swept across the surface.Type: ApplicationFiled: October 4, 2013Publication date: April 9, 2015Inventors: Gerald J. Bruck, Ahmed Kamel
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Patent number: 9000326Abstract: An apparatus for laser processing a board is provided. The apparatus for laser processing a board includes a chip, a laser, a modulating device and a focus device. The chip receives a first frequency signal to generate a second frequency signal. The laser receives the first frequency signal to emit a first laser beam. The modulating device receives the second frequency signal and the first laser beam, and adjusts the first laser beam to emit a second laser beam. The focus device focuses the second laser beam to emit a third laser beam onto the board for forming plural dots on the board.Type: GrantFiled: July 31, 2011Date of Patent: April 7, 2015Assignee: Hortek Crystal Co. Ltd.Inventors: Yu-Lin Lee, Yung-Hsiang Huang, Tai-Wei Wu, Shun-Han Yang, Gong-Qian Wang
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Patent number: 8993919Abstract: The present application discloses a laser source for emitting laser light onto a work-piece. The laser source includes a generator configured to generate the laser light, and an adjuster configured to adjust an output of the laser light. The adjuster situated between the generator and the work-piece reduces output density of the laser light on the work-piece.Type: GrantFiled: April 13, 2011Date of Patent: March 31, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Koichi Kusukame, Shinichi Kadowaki, Hiroyuki Furuya, Kiminori Mizuuchi, Susumu Takagi
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Publication number: 20150083697Abstract: The invention relates to a method for laser remote processing of a component on a fillet, wherein a laser beam is directed by means of a scanner device onto the component and guided over said component. The working range of the laser beam on the workpiece is illuminated with illuminating radiation and is captured by at least one image capturing unit. The illuminating radiation is directed onto the component at an angle of attack which is set depending the fillet geometry of the component. The captured image data are evaluated automatically and, with the aid of the evaluation, if appropriate, an automatic correction of the path of the laser beam is carried out.Type: ApplicationFiled: September 24, 2014Publication date: March 26, 2015Inventors: Christian ROOS, Hans LANGRIEGER, Florian OEFELE
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Patent number: 8969755Abstract: A low-power laser and arc hybrid welding method includes the steps of matching laser pulses with arc phases, and inducing compress arcs by the laser pulses. A laser peak pulse is triggered from half of the positive half-wave to half of the negative half-wave of alternating arc current. The sum of laser peak pulse width and laser basic pulse width is equal to the time width from a laser pulse triggered point to a negative half-wave end point of the alternating arc current. A welding device for carrying out the method is disclosed. An angle formed by the axis of a laser beam (1) and the vertical direction is in the range of ?50°-50°. An angle formed by the axis of the laser beam (1) and the axis of an arc torch (2) is in the range of 20°-120°. Arc power density is adjusted minutely in the range of 103-105 by adjusting the alternating arc current, protrusion quantity of an electrode (3) and gas flow velocity of a nozzle. The method and the device can reduce the consumption and save the cost.Type: GrantFiled: December 21, 2010Date of Patent: March 3, 2015Assignees: Dalian University of Technology, Dalian Xinyu Tech Development Center Co., LtdInventors: Liming Liu, Gang Song, Zhaodong Zhang
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Patent number: 8969752Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.Type: GrantFiled: September 11, 2003Date of Patent: March 3, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama
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Publication number: 20150048062Abstract: Embodiments of the present invention generally relate to an optical valve that modifies a laser beam to allow more energy to be irradiated onto less absorbing areas on a substrate and less energy to be irradiated onto more absorbing areas on the substrate, thus creating a more uniform heating field. The optical valve is a layered structure comprising a reflective switch layer, an absorbing layer, a thermal resistor and a thermal bath.Type: ApplicationFiled: August 13, 2014Publication date: February 19, 2015Inventor: Bruce E. ADAMS
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Publication number: 20150044416Abstract: An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.Type: ApplicationFiled: October 22, 2014Publication date: February 12, 2015Applicant: ROFIN-SINAR TECHNOLOGIES INC.Inventor: S. ABBAS HOSSEINI
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Publication number: 20150034612Abstract: An apparatus, system and method for the processing of orifices in materials by laser filamentation that utilizes an optical configuration that focuses the incident laser light beam in a distributed manner along the longitudinal beam axis. This distributed focusing method enables the formation of filaments over distances, and the laser and focusing parameters are adjusted to determine the filament propagation and termination points so as to develop a single/double end stopped orifice, or a through orifice. Selected transparent substrates from a stacked or nested configuration may have orifices formed therein/therethrough without affecting the adjacent substrate. These distributed focusing methods support the formation filaments with lengths well beyond ten millimeters in borosilicate glass and similar brittle materials and semiconductors.Type: ApplicationFiled: August 2, 2013Publication date: February 5, 2015Inventors: S. Abbas Hosseini, Jung Un Na, Gilbert Albelo
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Publication number: 20150034613Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.Type: ApplicationFiled: July 21, 2014Publication date: February 5, 2015Applicant: ROFIN-SINAR TECHNOLOGIES INC.Inventor: S. ABBAS HOSSEINI
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Publication number: 20150037032Abstract: An optical communications system includes a first plurality of optical components having optical ports, a second plurality of optical components having optical ports and an optical cross-connect. The optical cross-connect includes a block of a single continuous construction and material having a first side adjacent the first optical components and a second side adjacent the second optical components, and a plurality of non-intersecting, continuous waveguides formed within the block and extending from the first side of the block to the second side of the block. The refractive index of each waveguide is different than the surrounding material of the block, and each waveguide changes direction at least once within the block. The waveguides are optically aligned with the optical ports of the first optical components at the first side of the block and with the optical ports of the second optical components at the second side of the block.Type: ApplicationFiled: August 5, 2013Publication date: February 5, 2015Inventors: Qing Xu, Robert Brunner, Stephane Lessard
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Publication number: 20150038313Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.Type: ApplicationFiled: July 21, 2014Publication date: February 5, 2015Applicant: ROFIN-SINAR TECHNOLOGIES INC.Inventor: S. ABBAS HOSSEINI
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Patent number: 8940218Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.Type: GrantFiled: August 20, 2012Date of Patent: January 27, 2015Assignee: Automated Assembly CorporationInventors: Scott Lindblad, David Neuman
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Publication number: 20150014286Abstract: Subject matter of the invention is a CO2 laser that permits a rapid power modulation, particularly a highly efficient Q-switching. The key concept is the sub-division of the resonator into a high-power branch, containing inter alia the active medium (1), and a low-power feedback branch (14), in which the power-sensitive beam-shaping elements, particularly the modulators, are arranged. This is made possible by a suitable arrangement of a polarisation beam splitter (5) and a ?/4-phase shifter (2). The free adjustability of an angle ? between said two components permits the extremely flexible realisation of various operating modes, particularly the optimisation of the feedback degree during pulse generation.Type: ApplicationFiled: January 31, 2013Publication date: January 15, 2015Inventor: Gisbert Staupendahl
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Patent number: 8933374Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.Type: GrantFiled: June 24, 2010Date of Patent: January 13, 2015Assignee: Toshiba Kikai Kabushiki KaishaInventor: Makoto Hayashi
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Patent number: 8933367Abstract: There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.Type: GrantFiled: February 8, 2012Date of Patent: January 13, 2015Assignees: Sumitomo Electric Industries, Ltd., National University Corporation Okayama UniversityInventors: Motoki Kakui, Hiroshi Kohda, Yasuomi Kaneuchi, Shinobu Tamaoki, Shigehiro Nagano, Yoshiyuki Uno, Yasuhiro Okamoto, Kenta Takahashi
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Patent number: 8927897Abstract: In one form a maintenance device includes a flexible member with an inspection end sized to be inserted through an inspection port of a workpiece such as a gas turbine engine or a blade of a gas turbine engine. The maintenance device includes a directed energy member that in one form is configured to produce a double pulse laser with an interval time between a first one of the pulses and a second one of the pulses greater than the time of either the first one of the pulses or the second one of the pulses. The first one of the pulses is sufficiently powerful to produce a quantity of debris upon irradiation of the workpiece. The debris produced from the first one of the pulses can be evaporated by the second one of the pulses to eliminate and/or reduce a recast layer on the workpiece.Type: GrantFiled: November 17, 2010Date of Patent: January 6, 2015Assignee: Rolls-Royce CorporationInventors: Raymond Ruiwen Xu, Timothy Paul Fuesting, William J. Brindley
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Publication number: 20150001194Abstract: A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.Type: ApplicationFiled: September 18, 2014Publication date: January 1, 2015Inventors: Mark A. Unrath, Andrew Berwick, Alexander A. Myachin
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Patent number: 8921733Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.Type: GrantFiled: April 13, 2012Date of Patent: December 30, 2014Assignee: Raydiance, Inc.Inventors: David Gaudiosi, Laurent Vaissie
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Patent number: 8921732Abstract: A method of scribing a graphic on a material is provided, in which laser output is applied to the material. The laser output is moved relative to the material at a high speed greater than 10 m per second, and at a high power greater than 500 W, to scribe a graphic on a surface of the material. Also provided is a system for scribing a graphic on a material. The method and system of the invention are especially useful in the scribing of building materials.Type: GrantFiled: June 12, 2008Date of Patent: December 30, 2014Assignee: Revolaze, LLCInventors: Darryl J. Costin, Darryl J. Costin, Jr., Kimberly L. Costin
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Patent number: 8916797Abstract: A crystallization apparatus that performs crystallization on a substrate using sequential lateral solidification (SLS) includes a laser generating device for emitting a laser beam, a first telescope lens module and a second telescope lens module at one side of the laser generating device for minimizing a divergent angle of a laser beam emitted by the laser generating device; and a main optical system at one side of the second telescope lens module for uniformizing and amplifying a laser beam transmitted through the second telescope lens module. The main optical system is rotatably formed with respect to the laser generating device.Type: GrantFiled: October 26, 2011Date of Patent: December 23, 2014Assignee: Samsung Display Co., Ltd.Inventor: Cheol-Ho Park
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Publication number: 20140360988Abstract: A laser dicing method includes: placing a workpiece substrate on a stage; generating a clock signal; emitting a pulse laser beam synchronous with the clock signal; switching irradiation and non-irradiation of the workpiece substrate with the pulse laser beam in a unit of light pulse in synchronization with the clock signal to perform first irradiation of the pulse laser beam on a first straight line by controlling the pulse laser beam using a pulse picker; performing second irradiation of the pulse laser beam on a second straight line, which is adjacent to the first straight line in a substantially parallel fashion, after the first irradiation; and forming a crack reaching a workpiece substrate surface on the workpiece substrate by the first irradiation and the second irradiation.Type: ApplicationFiled: August 22, 2014Publication date: December 11, 2014Inventor: Shoichi SATO
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Publication number: 20140360989Abstract: Embodiments of methods and systems for distributing laser energy are disclosed herein. A system for dispensing laser energy by one or more laser energy sources in accordance with one embodiment of the present technology includes a laser energy credit transferring component configured to communicate with a laser energy source. The laser energy source is configured for producing and dispensing laser energy. The laser energy credit transferring component is further configured to receive a request from the laser energy source for laser energy and transfer laser energy credits to the laser energy source. The laser energy credits enable the laser energy source to dispense a corresponding amount of laser energy.Type: ApplicationFiled: August 25, 2014Publication date: December 11, 2014Inventors: Yefim P. Sukhman, Michael L. Flanary, Stefano J. Noto, Christian J. Risser, Miesha T. Stoute, David John Zirbel, JR.
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Publication number: 20140360987Abstract: A laser apparatus includes: a laser which selectively irradiates a laser beam to a portion of a target based on a laser driving voltage, where an intensity of the laser beam is substantially stabilized within about 10 nanoseconds; a stage which controls a relative location between the target and the laser based on a stage driving voltage; and a controller which applies the stage driving voltage to the stage, and applies the laser driving voltage to the laserType: ApplicationFiled: May 30, 2014Publication date: December 11, 2014Applicant: Samsung Display Co., LTD.Inventors: Hee-Geun SON, Byoung-Kwon CHOO, Do-Yeob KIM
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Patent number: 8904635Abstract: According to one aspect of the invention, a method for in situ repair of a turbine part is provided. The method includes the steps of accessing the turbine part while assembled to other turbine components, wherein the turbine part includes a region with a structural flaw near a hole in the turbine part, and wherein the hole is configured to flow a cooling fluid. The method also includes welding the structural flaw without performing a heat treatment of the turbine part, wherein welding the structural flaw includes laser welding that maintains a structure of the region.Type: GrantFiled: November 4, 2010Date of Patent: December 9, 2014Assignee: General Electric CompanyInventors: Matthew Paul Berkebile, Srikanth Chandrudu Kottilingam, Gene Arthur Murphy, Jr.
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Publication number: 20140353295Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.Type: ApplicationFiled: May 29, 2013Publication date: December 4, 2014Inventor: Michael CLAERHOUT
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Patent number: 8897910Abstract: The invention relates to a new technology which uses a surface modification method for ultra-precision machining, and in particular relates to a particle beam-assisted ultraprecision machining method for single-crystal brittle materials. The invention, the particle beam-assisted ultra-precision machining method for single-crystal brittle materials, can significantly improve machining accuracy, reduce surface finish and greatly reduce tool wear during ultra-precision machining of brittle materials.Type: GrantFiled: June 14, 2011Date of Patent: November 25, 2014Assignee: Tianjin UniversityInventors: Fengzhou Fang, Yunhui Chen, Zongwei Xu, Zhongjun Qiu, Xiaodong Zhang, Tengfei Dai, Xiaotang Hu
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Publication number: 20140343687Abstract: An implant includes a microstructured hyperhydrophilic surface with protrusions and depressions in which a spacing between the protrusions as a statistical mean is in a range of 1 to 100 ?m and a profile height of the protrusions and depressions as a statistical mean is in the range of 1 to 80 ?m.Type: ApplicationFiled: December 16, 2012Publication date: November 20, 2014Inventor: Herbert Jennissen
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Publication number: 20140332507Abstract: The invention relates to a method for producing a moulded body by building up layers of powdered material, comprising the steps of: a) preparing a layer of powdered material, b) heating the layer using controlled radiation by irradiating selected points of the layer according to a cross-sectional pattern of the moulded body assigned to said layer according to the geometry description data of the moulded body, so that the powdered material is solidified by melting to form connecting regions according to the cross-sectional pattern of the moulded body, c) preparing a next layer of powdered material on the layer irradiated most recently and d) heating the most recently prepared layer using controlled radiation by radiating selective points of the layer according to a cross-sectional pattern of the moulded body assigned to said layer, so that the powdered material is solidified by melting to form connecting regions according to said cross-sectional pattern of the moulded body, and e) repeating steps c) and d) muType: ApplicationFiled: November 29, 2012Publication date: November 13, 2014Inventor: Matthias Fockele
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Patent number: 8884184Abstract: An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.Type: GrantFiled: August 11, 2011Date of Patent: November 11, 2014Assignee: Raydiance, Inc.Inventors: David Gaudiosi, Michael Greenberg, Michael Mielke, Tim Booth, Gordon Masor
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Patent number: 8884183Abstract: A welding arrangement and a welding process for forming a weld seam between two edge portions, wherein the edge portions form a Y joint having a root portion and a bevel portion, said root portion being welded by a hybrid laser electric arc welding process including directing a laser beam and an electric arc in a single interaction zone of plasma and molten metal. A hybrid laser electric arc welding head and welding submerged arc welding head are arranged on a common carrier structure for welding the Y joint.Type: GrantFiled: December 16, 2009Date of Patent: November 11, 2014Assignee: ESAB ABInventors: Johan Tolling, Kari Erik Lahti