Abstract: A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscillators by a laser oscillator switch portion of a main body section. An optical path forming member is disposed such that the first or second laser beam, whichever is irradiated, will take the same optical path and reach a sample, after passing a common slit, to perform laser processing on the sample. Further, an objective lens is configured to be switched to an objective lens having a magnification corresponding to a wavelength of the laser beam irradiated from the laser oscillation section by an objective lens switch section of an objective lens section.

Abstract: Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.

Abstract: A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The laser beam propagates along a beam path having an axis extending from a laser to a laser beam spot at a location on or within the semiconductor substrate. The method generates, based on at least one measured characteristic of the laser beam, at least one signal to control an adjustable optical element of the machine effecting the laser beam path. The method also sends said at least one signal to the adjustable optical element. The method then adjusts the adjustable optical element in response to said at least one signal so as to improve static alignment of the laser beam path axis.

Abstract: A method for displaying laser irradiation state and a system of displaying laser irradiation state, enabling to monitor laser irradiation state correctly and rapidly even when a laser irradiation direction varies, and a scanner head and a work are relatively apart, characterized that laser light is irradiated at the surface of a work, in a specified pattern shape different from a process pattern from a scanner head, in advance of process by irradiation of laser light at a work by a scanner head mounted at a robot hand.

Abstract: A laser processing machine for processing workpieces includes a beam guide containing a gas atmosphere, and also includes an apparatus for investigating the gas atmosphere in the beam guide for impurities. The investigation apparatus makes use of the photoacoustic effect. The measuring apparatus has a measuring chamber and at least one measuring head, where the beam guide acts as the measuring chamber. As a measuring chamber, the beam guide contains the gas atmosphere that is to be investigated and also a modulated laser beam modulated. The measuring head(s) are integrated into the beam guide and are used to detect the photoacoustic effect in the measuring chamber.

Abstract: A system for identifying a laser machining nozzle on insertion of the laser machining nozzle into a laser machining head is provided. On its region insertable into the laser machining head, the laser machining nozzle has a shaping. Means for detecting or sensing the shaping are provided in the receiving region of the laser machining head provided for the laser machining nozzle.

Abstract: A plasma cutting device performs cutting in a plurality of stages. In a first cutting sub-process, a manufactured product is cut out from a base material upon a stage according to an NC program. Next, images of respective regions in the vicinities of proper positions at two corner points of the manufactured product which has been cut out are photographed by an image sensor, the actual positions of these two corner points of the manufactured product are detected from these images which have been photographed, and the translation distances and the rotational angle between the actual positions which have been detected and the proper positions are calculated. The NC program is corrected. And, in a subsequent cutting sub-process, additional cutting for beveling is carried out upon cutting surfaces at the outer circumference of the manufactured product, according to the corrected NC program.

Abstract: A laser beam machining apparatus including a beam oscillator; a beam adjusting unit disposed between the beam oscillator and a condenser lens and by which the beam diameter and the divergence angle of the beam oscillated from the beam oscillator are adjusted; and a beam diameter and divergence angle detecting unit for detecting the beam diameter and the divergence angle of the beam having passed through the beam adjusting unit. The apparatus further includes a control unit which computes the beam diameter and the divergence angle of the beam, based on detection signals from the beam diameter and divergence angle detecting unit, and which controls the beam adjusting unit, based on the computed beam diameter and divergence angle of the beam and the beam diameter and the divergence angle of the laser beam incident on the beam diameter and divergence angle detecting unit.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a pulse laser beam to the workpiece held on the chuck table, and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, wherein the machine further comprises a feed amount detection means for detecting the processing-feed amount of the chuck table and a control means for controlling the laser beam application means based on a detection signal from the feed amount detection means, and the control means outputs an application signal to the laser beam application means for each predetermined processing-feed amount based on a signal from the feed amount detection means.

Abstract: A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase. An apparatus for ablating a region of a sample with a laser beam. The apparatus comprises: 1) a source providing a pulsed laser beam of a certain energy, the source focusing the laser beam on the sample to ablate a region of the sample; and 2) a device for providing a flowing fluid over the region being ablated to remove the ablation products.

Abstract: The present invention relates to a method for determining a lateral relative movement between a processing head and a workpiece during processing the workpiece as well as a device to carry it out. In the method a surface of the workpiece (12) is illuminated in the region of the processing head with an optical radiation (2). The optical radiation (3) reflected from the surface of the workpiece (12) in the region of the processing head is repeatedly detected in a locally resolved manner by an optical detector (9), which is firmly fixed mechanically to the processing head, to obtain optical reflection patterns. The repeated detection occurs in temporal intervals in which the temporally successive reflection patterns of overlapping surface regions of the workpiece (12) are obtained. The lateral relative movement is determined by comparing the temporally successive reflection patterns.

Abstract: An apparatus for both detecting and repairing a shunt defect in a solar cell substrate. A shunt detection module detects the shunt defect in the substrate, using at least one of lock-in thermography and current-voltage testing. A process diagnostic module determines whether the substrate should be passed without further processing by the apparatus, rejected without further processing by the apparatus, or repaired by the apparatus. A shunt repair module electrically isolates the shunt defect in the substrate. In this manner, a single apparatus can quickly check for shunts and make a determination as to whether the substrate is worth repairing. If it is worth repairing, then the apparatus can make the repairs to the substrate.

Abstract: A method and a device for producing a tear line in a vehicle interior trim part, in which a laser beam is guided along a tear line and a material ablation in the form of holes with a residual wall thickness is effected. On the side facing the laser beam, the complete extent of the tear line is detected by a stationary matrix camera. In the machining at a machining site, only pixels of a CMOS matrix camera that are known in advance, for which the incidence of a measurement radiation is expected at this machining site, are read out. The laser is preferably scanned and non-adjacent machining sites are machined successively.

Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

Abstract: A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 ?m high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.

Abstract: An abnormality determination and estimation device for a weld product in a welding process includes a jig device and an AE sensor. The jig device holds the product by a holding face, through which the jig device and the product are in close contact with each other. The AE sensor detects an elastic wave in the jig device. Accordingly, abnormality detection accuracy can be improved, and abnormalities can be discriminated.

Abstract: A method for real-time optical diagnostics in laser ablation and laser processing of layered or structured materials or material structures. Diagnostics is provided during laser ablation that is utilized regularly in laser processing and/or chemical analysis of structured materials, by means of measuring optical emission generated as a result of the pulsed laser-material interaction in real time. The method can involve a single-layer-film or a stack of multiple layers or a structure of different domains. The method is particularly beneficial in fabrication of thin-film structures, such as photovoltaic and electronic devices or circuits of devices.

Abstract: A laser processing machine head, a laser processing machine head monitoring system, and a method of monitoring an optical element of a laser processing machine feature a light-transmissive optical element and an optical element holder defining a cavity in which the optical element is retained against rotation. A light source mounted to the holder directs a beam of light into the optical element through a peripheral surface of the optical element. A light receiver is responsive to light from the light source reflected through the optical element. Monitoring a signal from the light receiver allows a status of the optical element to be assessed.

Abstract: A method for removing coating from a substrate may include: locating an edge of a substrate; directing a laser beam along a first path to a first position on a surface of the substrate proximate to an edge of the substrate at an angle of incidence suitable to redirect the laser beam along a second path, through the substrate, to a second position on a second surface of the substrate corresponding to the located edge of the substrate, where the second surface can include a coating; and ablating at least a portion of coating at the second position on the second surface of the substrate.

Abstract: There is provided a laser energy measuring unit whose laser energy measuring range is widened. The laser energy measuring unit has a filter provided within an optical path of a laser to attenuate energy of the laser, a calculating section for measuring the energy of the laser passing through the filter, and a condenser lens provided on one side of the filter for condensing the laser. The filter has a shading portion for blocking a center part of the laser beam from being transmitted through the filter at a position coincident with the center of the laser. The center part of the laser where its energy is large is cut by the shading portion, and the calculating section measures the part where its energy is not so large. Thereby, it is possible to widen the laser energy measuring range.

Abstract: A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

Abstract: A process for preweakening the inside of an automotive trim piece cover layer of various constructions by use of a laser beam so as to enable formation of an air bag deployment opening in the trim piece formed at the time the air bag deploys. The laser beam impinges the inside surface of the cover to form a groove scoring or spaced perforations to form a preweakening pattern. A robot arm may be used to move a laser generator so as to form the preweakening pattern. The laser beam can be controlled in accordance with sensed conditions to achieve accurate preweakening, and may also be used to trim substrate panels and to perform other cutting operations.

Abstract: A laser energy microinscribing system, comprising a semiconductor excited Q-switched solid state laser energy source; a cut gemstone mounting system, allowing optical access to a mounted workpiece; an optical system for focusing laser energy from the laser energy source onto a cut gemstone; a displaceable stage for moving said gemstone mounting system with respect to said optical system so that said focused laser energy is presented to desired positions on said gemstone, having a control input; an imaging system for viewing the gemstone from a plurality of vantage points; and a rigid frame supporting said laser, said optical system and said stage in fixed relation, to resist differential movements of said laser, said optical system and said stage and increase immunity to vibrational misalignments. The laser energy source is preferably a semiconductor diode excited Q-switched Nd:YLF laser with a harmonic converter having an output of about 530 nm.

Abstract: Acceptance/rejection of a deposition condition is judged by detecting an exothermic quantity of a deposition portion 3 by using an infrared beam sensor 2 during laser deposition of a resin material 4 having transmissibility to a laser beam and a resin material 5 having absorptivity to the laser beam L. The exothermic condition of the deposition portion is detected by using an infrared beam sensor matching with a wavelength of an infrared beam having a high transmission factor from infrared beam transmission characteristics of the transmissible resin to judge whether or not suitable energy is applied to the deposition portion and whether or not the deposition portion is formed. The exothermic quantity of the transmissible resin is detected by an infrared beam sensor 2A to judge acceptance or rejection of the deposition portion even when the applied energy changes.

Abstract: A bend bar is available for use in a quality control test for testing for a consistency of residual stress effects in a particular material using a given a laser peening process. The bar is composed of the particular material to be tested and has a bar length and a bar thickness. The particular material has a characteristic maximum stress penetration depth for compressive residual stresses that can be formed in using the given laser peening process. The bar thickness is chosen so as to be at least twice the characteristic maximum stress penetration depth. The bar has a test surface that extends parallel to the bar length and perpendicular to the bar thickness. After forming a spot pattern on the test surface using the given laser peening process, the deflection generated in the bar due to the compressive residual stresses induced by laser peening can then be measured and used as a quality control measurement.

Abstract: A laser beam machine includes a controller for outputting command pulse sets according to control parameter settings for controlling laser pulse output power, a thinning-out circuit, into which the command pulse sets are inputted, for thinning out pulses of the command pulse sets, based on predetermined setting values, an electric power supplying unit for generating, in response to command pulse sets outputted from the thinning-out circuit, pulsed electric power supplied to a load, and a generator for pumping, so as to output a laser beam, a laser medium with which a discharging space is filled, by electric discharge generated by the pulsed electric power supplied from the electric power supplying unit. A pulse width thereof can be considerably varied at low cost with the heat generated by the increase of the switching number of the electric power supplying unit being prevented.

Abstract: Three dimensional nano structures created on copper or aluminum base metal through the use of a laser pulse device which results in an increase in radiation sensitivity of the metal. The base metal is used to manufacture RFID antennae after receiving a pulse of sharply focused laser ablation energy. The result is an increase in gain and range of the antennae. Furthermore, the antennae do not detune in the proximity of other antennae and are readable in a non perpendicular orientation.

Abstract: A laser processing machine head, a laser processing machine head monitoring system, and a method of monitoring an optical element of a laser processing machine feature a light-transmissive optical element and an optical element holder defining a cavity in which the optical element is retained against rotation. A light source mounted to the holder directs a beam of light into the optical element through a peripheral surface of the optical element. A light receiver is responsive to light from the light source reflected through the optical element. Monitoring a signal from the light receiver allows a status of the optical element to be assessed.

Abstract: A quality assurance system includes an internet/wide area network interface configured to provide bidirectional communication with user terminals; a wireless interface configured to provide bidirectional communication with mobile user terminals; and a quality assurance database cooperatively coupled with a database manager. The data base manager is configured to populate the quality assurance database with identifications of individual ones of a plurality of construction project welders, weld inspectors and a plurality of weld data logs individual ones of which are associated with a specific welding operation of a construction project. Each weld data log is configured to store information that is at least descriptive of a welder, material used during the specific welding operation, specifics of a completed weld including at least weld location, weld type and weld dimensions, and information descriptive of a weld examination.

Abstract: A medical laser system and related methods of monitoring optical fibers to determine if an optical fiber cap on the optical fiber is in imminent danger of failure. The laser system includes a photodetector for converting returned light from the optical fiber cap to an electronic signal for comparison to a trigger threshold value known to be indicative imminent fiber cap failure. The returned light can be the main laser treatment wavelength, an auxiliary wavelength such as an aiming beam or infrared wavelengths generated by a temperature of the optical fiber cap. In the event the electronic signal reaches the trigger threshold value, the laser system can be temporarily shut-off or the power output can be reduced.

Abstract: The invention relates to an arrangement (1) for the on-line monitoring of the quality of a laser process exerted on a workpiece (3), comprising a laser source transmitting a laser beam (4) to the workpiece (3), the thermal process of the laser beam (4) causing emission of electromagnetical radiation (7) from the process zone on the workpiece (3); a heat detection camera (8) for detecting the electromagnetical radiation emitted from the process zone of the workpiece (3), wherein the arrangement (1) is provided with a tilted non-focussing mirror (5) such that the laser beam (4) which is transmitted by the laser source is let through the tilted non-focussing mirror (5) towards the working piece (3), and the electromagnetical radiation (7) emitted from the process zone on the workpiece (3) is reflected by the tilted non-focussing mirror (5) towards the heat detection camera (8). The invention further relates to a method using such an arrangement (1).

Abstract: A method of dividing a wafer, comprising the steps of forming a deteriorated layer along streets in the inside of the wafer; affixing an adhesive film to the rear surface of the wafer; affixing the adhesive film side of the wafer to a dicing tape mounted on an annular frame; dividing the wafer into individual devices along the streets where the deteriorated layer has been formed by expanding the dicing tape; forming a dividing groove along the outer periphery of each individual device in the adhesive film by applying a laser beam through the spaces between adjacent devices while the dicing tape is expanded by carrying out the first tape expanding step; and dividing the adhesive film along the dividing grooves by further expanding the dicing tape from the state in which the first tape expanding step has been carried out.

Abstract: The invention relates to a method for production of a multi-layer analysis element for liquid samples, with at least one test field for the analysis of the liquid samples, in which method an analysis element blank composed of at least two superposed material layers is made available. The multi-layer analysis element or a constituent part of the multi-layer analysis element is cut out from the analysis element blank by means of laser radiation. The laser radiation cuts through different material layers in at least two areas and has a laser power which is effective for the cutting and which is varied as a function of the thickness and the material of the different material layers to be cut in the areas.

Abstract: A laser system (99) for patterning a mold insert includes a laser source module (10), a feedback module (20), and a controlling module (30). The laser source module includes a laser source (11) for emitting laser beams, and a lens module (10) with a changeable focal length configured for focusing the laser beams on the surface of the mold insert. The feedback module (20) is configured for receiving the laser beams reflected from the surface of the mold insert and generating a corresponding feedback signal according to the received laser beams. The controlling module is configured for receiving the feedback signal from the feedback module thereby controlling the laser source according to the feedback signal. A method for manufacturing the mold insert is also provided.

Abstract: A laser shock peening system including a workpiece is provided. The laser shock peening system includes a workholding fixture configured to hold the workpiece. The laser shock peening system also includes a laser source configured to emit multiple laser beam pulses on the workpiece. The laser shock peening system further includes an absorptive layer disposed on the workpiece, the absorptive layer configured to absorb the laser beam pulses from the laser source into the workpiece. The laser shock peening system also includes a transparent constraining layer disposed between the laser source and the absorptive layer. The transparent constraining layer is also configured to provide a pressure medium configured to direct multiple reflected laser generated shock waves from the workpiece back into the workpiece. The laser shock peening system also includes a transducer disposed on the workholding fixture and configured to detect multiple acoustic signals emitted from the workpiece.

Abstract: In a laser annealing system for workpieces such as semiconductor wafers, a pyrometer wavelength response band is established within a narrow window lying between the laser emission band and a fluorescence emission band from the optical components of the laser system, the pyrometer response band lying in a wavelength region at which the optical absorber layer on the workpiece has an optical absorption coefficient as great as or greater than the underlying workpiece. A multi-layer razor-edge interference filter having a 5-8 nm wavelength cut-off edge transition provides the cut-off of the laser emission at the bottom end of the pyrometer response band.

Abstract: At least one exemplary embodiment is directed to a laser processing apparatus that can use the shape of a plurality of reflected light fluxes to adjust the position of workpiece relative to an optical system, where the laser processing apparatus facilitates both the viewing of the workpiece and a focusing of a processing laser into the workpiece.

Abstract: A system and associated method of marking a molded vehicle tire with laser engraved information to provide both human visible and machine readable data concerning the tire. Information contained in a barcode on the tire is read at a first station and supplied to a control unit. The physical location of human visible information previously molded into the tire is read from the tire at a second station and supplied to the control unit which uses this information to position a laser located at a third station for engaging additional human visible information pertaining to the manufacture of the tire adjacent the existing visible information to satisfy the Department of Transportation (DOT) tire marking requirements. The additional information also can be laser engraved into the tire in a machine readable encoded format, such as 2D symbols, for subsequent control and verification throughout the life of the tire.

Abstract: The invention provides a method of rapidly machining multiple, often similar or nearly identical, features using a LASER machining system. During LASER machining, light of a wavelength and intensity that will modify the workpiece to be machined is directed at the workpiece and interacts to produce the desired change. If several features are to be machined, the processing speed can be increased by operating on a multiplicity of features at once. In one embodiment of the invention, this is achieved by separating the LASER beam into multiple beams and machining the desired features simultaneously.

Abstract: A difference between each position command data outputted in a form of a step signal from a high-level controller and its corresponding detected position data of a movable body is integrated by an integral compensator to position the movable body. Assuming, for example, that the movable body is a steerable mirror, digital filters are arranged to compensate the value of an initial state of an angular displacement and the value of an initial state of an angular velocity, respectively, and respective impulse responses of the digital filters as additional input elements are added to an output terminal of the integral compensator. For higher effectiveness, internal state variables of the digital filters can desirably be cleared to zero whenever an angle (position) command data is received.

Abstract: Methods and apparatus for remotely measuring temperature of a specular surface. Method takes two measurements of P-polarized radiation emitted at or near Brewster angle from the surface. First measurement (SA) collects and detects first amount of radiation emitted directly from a surface portion using a collection optical system. Second measurement (SB) includes first amount of radiation and adds quantity of radiation collected at or near at/near Brewster angle and reflected from the surface with a retro optical system with a round-trip transmission t2 that retro-reflects a quantity of radiation received from surface portion back to same surface portion where it reflects and combines with first amount of radiation collected by collection optical system. Measurements SA and SB and t2 are used to determine surface emissivity (?). Calibration curve is used that relates ratio of the first measurement SA to surface emissivity (SA/?), to surface temperature.

Abstract: According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (xg, yg) for the removal of a layer (Si+1) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Abstract: A method and apparatus for performing laser thermal processing (LTP) using a two-dimensional array of laser diodes to form a line image, which is scanned across a substrate. The apparatus includes a two-dimensional array of laser diodes, the radiation from which is collimated in one plane using a cylindrical lens array, and imaged onto the substrate as a line image using an anomorphic, telecentric optical imaging system. The apparatus also includes a scanning substrate stage for supporting a substrate to be LTP processed. The laser diode radiation beam is incident on the substrate at angles at or near the Brewster's angle for the given substrate material and the wavelength of the radiation beam, which is linearly P-polarized. The use of a two-dimensional laser diode array allows for a polarized radiation beam of relatively high energy density to be delivered to the substrate, thereby allowing for LTP processing with good uniformity, reasonably short dwell times, and thus reasonably high throughput.

Abstract: A crystallization method and system are provided which improve a crystallization process by deciding a best-fit focal plane for a laser beam using a test mask and then applying the decided best-fit focal plane to the crystallization process. The crystallization method includes loading a test mask on a mask stage; deciding a best-fit focal plane by performing a crystallization test using the test mask, checking the test result and deciding conditions of a best-fit focal plane from the test result; moving the mask stage to a position corresponding to the best-fit focal plane; loading a mask for crystallization process onto the moved mask stage; and performing the crystallization process using the mask for crystallization process.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: The invention provides a focus adjuster for laser beam machine which adjusts focus by detecting reflected light of a laser beam in a laser beam machine. A laser beam outputted from a laser oscillator device 550 is reflected by a mirror 570 via an output mirror 560 and introduced into a laser machining tool. The laser beam collected by a machining lens 62 is reflected by a reflector plate M1 and sensed by a reflection detector 580. Automatic focus adjustment is achieved by sensing output of the reflected light as well as changes in focal position due to contamination of the machining lens 62.

Abstract: The plate-making apparatus according to an aspect of the present invention includes an exposure head which engraves a surface of a plate material by emitting a light beam toward the plate material; a scanning device which performs exposure scanning by relatively moving the plate material and the exposure head; a correction profile generation device which generates a correction profile for correcting an emission amount of the light beam emitted by the exposure head according to a characteristic difference of the plate material; and an exposure control device which, when a correction profile for a plate material to be used is generated by the correction profile generation device, uses the correction profile for the plate material to be used to control the emission amount of the light beam.

Abstract: A method for machining a transparent material by the non-linear absorption of pulsed laser radiation, in the region of a laser focus, includes the following steps: a laser wavelength of between 300 and 1000 ?m is selected; and laser impulses having a temporally flat beam profile are applied. The method is characterized in that the irradiation intensity is selected from an interval predetermined for the material to be machined, in which plasma is formed without plasma luminescence. An apparatus for laser treating a transparent material includes structure to set an irradiance and inspect the treatment as being within a defined interval.

Abstract: A process for resurfacing a monocrystalline or directionally solidified metallic piece, having a thickness (Ws), in which a laser beam and a flux of metallic powder, whereof the nature is the same as that of the metallic piece, is applied to the piece to produce at least one layer of metal, monocrystalline or directionally solidified, from the piece, the laser beam being sent out at a power “P”, and moving along the piece at a speed “v”, wherein the laser beam and the flux of powder are applied coaxially on the piece and the P/v ratio is within the range defined on the figure.

Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.