Abstract: A method of monitoring a welding process, comprising detecting a selected portion of a light spectrum of plasma plume of a fusion welding process with a photo detector, processing the detected portion of the spectrum, comparing the detected portion of the spectrum with an expected spectra to determine whether a weld is acceptable, providing a signal to a welder control, and adjusting the weld process based on the signal.

Abstract: The invention relates to a method for monitoring a processing region of a workpiece (10) on which laser processing is being carried out, in which method the radiation emitted by the processing region (11) is detected by a detector system (22) in a space-resolved manner, wherein the radiation of the processing region (11) is detected for each elemental area of the processing region (11) imaged onto the detector system at least two wavelengths simultaneously. Accurate process monitoring may thereby be carried out.

Abstract: A method and apparatus for remotely monitoring properties of gases and plasmas, and surface and sub-surface properties of materials, is disclosed. A laser beam is focused at a desired region within a gas, plasma, or material (e.g., solid or liquid) to be analyzed, generating an ionized sample region or a localized, enhanced free carrier region. A beam of microwave radiation is directed toward the ionized sample region or the free carrier region, and the microwave radiation is scattered. The scattered microwave radiation is received by a microwave receiver, and is processed by a microwave detection system to determine properties of the gas, plasma, or material, including surface and sub-surface properties.

Abstract: A method for controlling the quality of an industrial process, of the type that comprises the steps of: providing one or more reference signals for the industrial process; acquiring one or more real signals that are indicative of the quality of said industrial process; and comparing said one or more reference signals with said one or more real signals in order to identify defects in said industrial process.

Abstract: A method of removing unwanted coating material from cooling passages of a turbine component includes determining coordinates of the position and orientation of cooling passages at the surface of the turbine component and determining reference points in the region of the cooling passages. After coating of the turbine component, the reference points are measured once again and the thickness of the coating is calculated. In a basic processing program, the data for the position, passage orientation and coating thicknesses and also CAD data for the cooling passages are interlinked and a laser processing program is automatically adapted for each individual cooling passage. Using the laser processing program, a pulsed laser is guided over disk-shaped volume segments of the unwanted coating material and the material is removed in the process.

Abstract: A system for machining objects using a laser, including a supply of objects, an object support tray, a galvanometric head, a laser source, and a computer on which a shape recognition software is installed. The galvanometric head includes a first wide field camera, with a first filter located at the output of the first camera, a second narrow field camera, with a second filter located at the output of the second camera, guide mirrors, and a lens that displays at least one object or the part to be machined, located on the support tray.

Abstract: Since the size of a plate for issuing gas used for a conventional laser irradiation apparatus is large and the distance between an optical system through which a laser light lastly passes and the plate is not enough, it is difficult to check the state of laser light delivered from the optical system which the laser light lastly passes through. A laser irradiation apparatus includes a laser oscillator, an optical system shaping laser light produced by the laser oscillator, a plate having an opening for issuing a gas, a stage provided below the blower, means for maintaining a constant distance between the blower and the stage above the stage, and means provided between the optical system and the blower for observing the laser light transmitted through the optical system are provided.

Abstract: An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.

Abstract: Systems and methods are disclosed for shaping laser light as a line beam for interaction with a film that may have an imperfect, non-planar surface. The system may include a beam stop that defines an edge; a sensor that measures a distance between a selected point on a surface of the film and a reference plane and generates a signal representative of the measured distance; and an actuator coupled to the beam stop and responsive to the signal to move a portion of beam stop edge. Movement of the beam stop edge portion shifts a corresponding portion of the focused line beam in a direction normal to the reference plane to produce a line beam that more closely conforms to the surface profile of the film.

Abstract: The invention provides a device which optically checks a nozzle tip of a laser machining tool. A camera unit 450 which is raised and lowered in opposing relation to a nozzle 65 of a laser beam machine has a camera chamber 454 and is sealed by protective glass 456, where the camera chamber 454 contains a CCD camera body 460 and lens 462. While a ring light 470 illuminates a surface of the nozzle 65, the CCD camera body 460 checks the nozzle 65 optically.

Abstract: A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: A laser beam having an annular spot shape with which a workpiece is irradiated is reflected on an upper surface and a lower surface of the workpiece. The reflected light having the annular spot shape which is reflected on the lower surface of the workpiece is intercepted by a pinhole mask, whereas the reflected light having the annular spot shape which is reflected on the upper surface of the workpiece is permitted to pass through the pinhole mask, and the intensity of light received is detected based on the latter reflected light. Therefore, the height position of the upper surface of a workpiece can be detected even where the workpiece is transmissive to visible rays. In this case, with regard to the reflected light having the annular spot shape which is reflected on the upper surface of the workpiece, the intensity of the light after diffusion by a laser beam diffusing unit is detected by a photodetector having a detecting surface with a predetermined area.

Abstract: In a method for controlling a laser body shell welding system, in which a scanning head is attached to a machine arm or is operated as an external tool of the machine arm, the scanning head having at least one scanning mirror for positioning a laser beam on a workpiece to be welded, and the operation of the laser welding system including time-critical functions for controlling the time-critical functions, an embedded control system or a memory-programmable control system is used.

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path.

Abstract: Pulsed laser drilling is used to produce bore holes having a small diameter, for example, in hollow workpieces. Turbine blades, e.g., have a multitude of fine cooling air bore holes, which are able to be produced by this method, e.g., with high positional accuracy and in an automated manner. A checking method is provided by which drilling faults, e.g., with regard to piercing and bore-hole geometry, may be detected in a more reliable manner. A method is for checking a bore hole introduced in a workpiece by laser pulses, in which characteristic signals from the area of the bore hole are received with the aid of a sensor and compared to setpoint values and only signals received in a characteristic time interval following a laser pulse are taken into account.

Abstract: In a system where scribe lines are formed by a series of partially-overlapping ablation spots, discontinuities can be detected by capturing an intensity of light generated during each instance of ablation for a respective spot. In any instance where the intensity of light given off falls below a desired threshold, such that the ablation spot might not sufficiently overlap any adjacent spot, the position of that instance can be captured such that another attempt at ablation can be carried out at that location.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: A wafer laser processing method for forming deteriorated layers along a plurality of streets in the inside of a wafer having a device area where a plurality of areas are sectioned by the plurality of streets arranged in a lattice pattern on the front surface and devices are formed in the sectioned areas and having a peripheral excess area surrounding the device area, the surface of the device area being formed to be higher than the surface of the peripheral excess area, by applying a laser beam to the front surface of the wafer along the streets with its focal point set to the inside of the wafer, comprising a first deteriorated layer forming step for forming a deteriorated layer along the streets in the insides of the peripheral excess area and the device area by applying a laser beam to the peripheral excess area and the device area along the streets with its focal point set to the insides of the peripheral excess area and the device area from the front surface side of the wafer; and a second deteriorated l

Abstract: A coordinate detecting device includes a resistive film formed on a substrate and a common electrode for applying a voltage to the resistive film, wherein a potential distribution is created in the resistive film, an electric potential of the resistive film at a contact position is detected, and a position of the contact position of the resistive film is detected. In a manufacturing apparatus, a laser light source irradiates laser light to remove a part of the resistive film to form a resistive film removed part, an optical system converges the laser light, a plurality of probes measure electric potentials of a surface of the resistive film with the common electrode providing the voltage to the resistive film, an X-Y table moves the substrate at least two-dimensionally, and a control part controls the X-Y table and the laser light source.

Abstract: When laser beam welding one or more work pieces faults may occur, which lead to unacceptable losses in quality. A check process is provided, which reliably recognizes seam faults in a seam which is introduced into one or more workpieces by means of laser beam welding. Characteristic signals are detected from the region of the seam using a sensor and compared with an index value or set value, and only signals are taken into consideration which are detected in a characteristic time interval following the laser beam welding, which begins, at the earliest, following the solidification of the seam.

Abstract: Disclosed is a method and apparatus for processing signals in a satellite/laser positioning system capable of generating location coordinates from received satellite signals and a received laser signal. A height coordinate bias value is maintained by a filter processor during periods when the laser signal is available. The height coordinate bias value represents an estimated difference between a satellite signal derived height coordinate and a laser signal derived height coordinate. During periods when the laser signal is available, the laser signal derived height coordinate is output. During periods when the laser signal is not available, a corrected height coordinate value is generated by applying the height coordinate bias value to the satellite signal derived height coordinate.

Abstract: Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process. A series of lasers (602, 622) can be used to concurrently remove material from multiple positions on the workpiece (104). Each laser (602, 622) can have at least one scanning device (614, 630, 632) positioned along a beam path thereof in order to adjust a position of the laser output relative to the workpiece (104). By adjusting the beam or pulse positions using the scanning devices (614, 630, 632) while translating the workpiece (104), substantially any pattern can be scribed into at least one layer of the workpiece (104) without the need for any rotation of the workpiece (104).

Abstract: A plasma cutting device performs cutting in a plurality of stages. In a first cutting sub-process, a manufactured product is cut out from a base material upon a stage according to an NC program. Next, images of respective regions in the vicinities of proper positions at two corner points of the manufactured product which has been cut out are photographed by an image sensor, the actual positions of these two corner points of the manufactured product are detected from these images which have been photographed, and the translation distances and the rotational angle between the actual positions which have been detected and the proper positions are calculated. The NC program is corrected. And, in a subsequent cutting sub-process, additional cutting for beveling is carried out upon cutting surfaces at the outer circumference of the manufactured product, according to the corrected NC program.

Abstract: A laser processing machine includes a measuring cell into which gas to be analyzed can flow, a means for decoupling diagnostic radiation from the laser radiation provided for material processing of a workpiece, and a sound detector for detecting the photo-acoustical effect produced in the measuring cell due to absorption of the diagnostic radiation by gas in the cell.

Abstract: A method for controlled remelting of or laser metal forming on the surface (5) of an article (1) can include moving a light source and a signal capturing apparatus over the article (1). The light source having a specific power can be used to melt the surface (5) of the article (1) locally and to form a melt pool (7). Thereby an optical signal (13) is captured by the signal capturing apparatus from the melt pool (7), and the monitored optical signal (13) is used for the determination of temperature and temperature fluctuations as properties of the melt pool (7). Furthermore, a control system (16) with a feedback circuit is used to adjust at least one process parameter such as the power of the light source such that desired melt pool properties are obtained. Subsequently the melt pool (7) solidifies.

Abstract: The present invention relates to a method and a device to monitor and control the Selective Laser Powder Processing. A Selective Laser Powder Processing device comprising a feedback controller to improve the stability of the Selective Laser Powder Processing process is presented. A signal reflecting a geometric quantity of the melt zone is used in the feedback controller to adjust the scanning parameters (e.g. laser power, laser spot size, scanning velocity, . . . ) of the laser beam (4) in order to maintain the geometric quantity of the melt zone at a constant level. The signal reflecting the geometric quantity of the melt zone can also be displayed in order to monitor the Selective Laser Powder Processing process. The present invention allows for the production of three-dimensional objects from powder material and improves the state of the art by compensating variations of the border conditions (e.g.

Abstract: The present invention provides a laser drilling system for drilling holes or cavities in a solid, in particular a solid dosage form. The system includes a loading zone, firing zone, inspection zone and delivery zone. The system also includes optional components such as a process validation system, solids detector, color detector, solids rejection/repositioning means, accepted products receptacle, rejected products receptacle and/or solids inspection system. Operation of the laser device in the firing zone and of other optional equipment is synchronized with movement of a continuous solids indexer by way of an electronic synchronizer. A solids handling system includes an optional fill level detector that directly or indirectly controls solids loading means that fills a solids reservoir. The system can be run continuously, semicontinuously or batchwise.

Abstract: A method and apparatus for remotely monitoring properties of gases and plasmas is disclosed. A laser beam is focused at a desired region within a gas or plasma to be analyzed, generating an ionized sample region in the gas or plasma. A beam of microwave radiation is directed toward the ionized sample region, and a portion of the microwave radiation is scattered by the ionized sample region and Doppler-shifted in frequency. The scattered, frequency-shifted microwave radiation is received by a microwave receiver, and is processed by a microwave detection system to determine properties of the gas or plasma, including velocities, temperatures, concentrations of molecular species, and other properties of the gas or plasma.

Abstract: An automated system for setting the linear distance from a mounting surface of a pivot cartridge to critical features on actuator arms is disclosed. This distance is set to eliminate the tolerance incurred via normal manufacturing of these components. The system adjusts for every component to customize each actuator and/or pivot assembly to meet the functionality requirements for disk drives.

Abstract: Determination of the relative positioning of a laser machining beam and a process gas jet on a laser machine tool are accomplished by motion of detections made while moving the machining beam and gas jet in relation to a detection element. In some cases actions of the beam and gas jet themselves are detected, such as by cutting light response and sensor deflection caused by the gas jet. Relative head positions at the time of the deflections are used to calculate misalignment between the laser beam and gas jet.

Abstract: A laser processing machine includes a laser processing head including a beam guide for deflecting and/or focusing laser radiation onto a workpiece; a thermo-sensitive monitoring sensor system for an optical component of the beam guide; and an evaluation unit connected to a machine control of a laser generator that produces the laser radiation and configured to receive and process the data acquired by the monitoring sensor system. The evaluation unit attributes an increase in the temperature of the optical component of the beam guide due to laser radiation reflected from the workpiece to defective cutting.

Abstract: Preferred embodiments of a system and methods to deliver different magnitudes of laser power density to a work piece while maintaining a constant focusing spot size are described. In particular, the system includes a laser, an optical focusing assembly and an overlay. The overlay receives a laser beam having a perimeter at a first magnitude of power and transmits the laser beam to the optical focusing assembly at about the same perimeter and at a magnitude lower than the first magnitude. In a preferred embodiment, the overlay can include an optically neutral blocking lens or a neutral density filter. A method of laser machining an orifice at a suitable average power density sufficient to machine the orifice with reduced heat affected zone, spatters, soots or recasts is described. A method of providing a focusing spot size of a generally constant effective area by a laser machining system is also described.

Abstract: A laser shock peening system including a workpiece is provided. The laser shock peening system includes a workholding fixture configured to hold the workpiece. The laser shock peening system also includes a laser source configured to emit multiple laser beam pulses on the workpiece. The laser shock peening system further includes an absorptive layer disposed on the workpiece, the absorptive layer configured to absorb the laser beam pulses from the laser source into the workpiece. The laser shock peening system also includes a transparent constraining layer disposed between the laser source and the absorptive layer. The transparent constraining layer is also configured to provide a pressure medium configured to direct multiple reflected laser generated shock waves from the workpiece back into the workpiece. The laser shock peening system also includes a transducer disposed on the workholding fixture and configured to detect multiple acoustic signals emitted from the workpiece.

Abstract: The invention relates to an arrangement (1) for the on-line monitoring of the quality of a laser process exerted on a workpiece (3), comprising a laser source transmitting a laser beam (4) to the workpiece (3), the thermal process of the laser beam (4) causing emission of electromagnetical radiation (7) from the process zone on the workpiece (3); a heat detection camera (8) for detecting the electromagnetical radiation emitted from the process zone of the workpiece (3), wherein the arrangement (1) is provided with a tilted non-focussing mirror (5) such that the laser beam (4) which is transmitted by the laser source is let through the tilted non-focussing mirror (5) towards the working piece (3), and the electromagnetical radiation (7) emitted from the process zone on the workpiece (3) is reflected by the tilted non-focussing mirror (5) towards the heat detection camera (8). The invention further relates to a method using such an arrangement (1).

Abstract: Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor.

Abstract: The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece (12) with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region (13) containing the impact point of the machining beam (1) on the workpiece (12) is illuminated at least approximately coaxially to the machining beam (1) by means of additional optical radiation (2). Radiation (3) reflected by the machining region (13) is detected, parallel to an incidence direction of the optical radiation (2) or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (13).

Abstract: A light beam is used to cut a slot in a first side of substrate. An optical sensor monitors a surface of a second side of the substrate that is opposite the first side while cutting the slot. If the light beam breaks through the surface of the second side, the sensor detects the light beam.

Abstract: A laser machining apparatus that excels in precision in terms of machining position and shape is provided with an optical axis adjusting unit disposed on a basal optical axis of a laser beam outputted from a laser oscillator so as to adjust the laser beam outputted from the laser oscillator onto a workpiece. The laser machining apparatus is provided further with mirrors, disposed between the laser oscillator and the optical axis adjusting unit, for freely deflecting the optical axis of the laser beam. The laser machining apparatus also includes an optical axis position detecting means, disposed between the optical axis adjusting unit and the optical axis deflecting means, for detecting the position of the optical axis of the laser beam. The apparatus aligns the optical axis of the laser beam incident on the optical axis adjusting unit with the basal optical axis by means of the mirrors based on a result detected by the optical axis position detecting means.

Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

Abstract: A monitoring device by laser shadowscopy, which comprises a light emitter (5) and receiver (6), mounted on an arm (8) oscillating at will around two joints (13, 14), in order to restore the image of the monitored profile more accurately. An important application relates to welding methods and especially in hollow beveled edges.

Abstract: A laser condensing optical system of the present invention includes a laser beam source which emits a laser beam, a condensing optical system arranged between the laser beam source and a medium, the condensing optical system condensing the laser beam in the medium and recondensing light from a condensing point, a photodetector which detects the light recondensed by the condensing optical system, and a laser divergence point moving unit which moves the position of a laser divergence point of the laser beam along an optical axis of the laser beam in accordance with the refractive index of the medium in which the laser beam is condensed and the distance from a surface of the medium to a condensing position.

Abstract: A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey.

Abstract: The object of this invention is to provide a method and system for real-time monitoring and controlling the height of a deposit by using image photographing and image processing technology in a laser cladding and laser-aided direct metal manufacturing process. This invention also provides a method of controlling the intensity of laser power, which is one of the most important process variables, regardless of the operational condition of a laser power unit (401). The method and system of this invention controls the height of a deposit (205) by real-time monitoring the position and the height of a melt pool (203) and controlling the process variables using the image photographing and image processing technology in such a laser cladding and laser-aided direct metal manufacturing process based on a laser surface modification technology, such as laser surface alloying and laser cladding, or a laser-aided direct metal manufacturing technology.

Abstract: Disclosed is the design and working principle of a welding monitoring system that can monitor the spectra of zinc and iron in the plasma generated during a welding process involving zinc-coated steel. The monitoring system is capable of monitoring multiple parameters, including spectral line intensity, electron temperature, and ratio of zinc and iron composition in the plasma. The results can then be used individually or in combination to predict resulting weld quality and generate appropriate feedback control signals.

Abstract: Voltage fluctuating time integrating means integrates voltage fluctuating time when voltage of a sensor electrode fluctuates as a voltage fluctuation integrated time, and voltage fluctuation occurrence rate computing means computes a rate of occurrence of voltage fluctuation for time on the basis of the voltage fluctuation integrated time integrated. By doing so, quantity of generated plasma can be taken as the rate of occurrence of voltage fluctuation, and plasma detection judging means can easily detect large volume of generated plasma on the basis of the computed voltage fluctuation occurrence rate. Then, it is not necessary to provide a circuit for measuring electric resistance between the sensor electrode and a workpiece as a conventional way, thereby avoiding complexly structured plasma detector.

Abstract: An energy beam machining system includes an emitter for emitting an energy beam and beam adjusting optics, such as a zoom telescope, for adjusting the pupil size of the system to multiple values. The adjusting of the pupil size can be carried out automatically, semi-automatically, or manually. In manual modes, instructions can be presented to the operator (e.g., via a monitor or pre-programmed audio instruction) indicating how to adjust pupil size. A focus lens focuses the adjusted beam directed along each path at a different focal point within a scan field encompassed in the field of view of the focus lens. Beam directing optics are configured to enable multiple scan fields within the field of view of the focus lens.

Abstract: An apparatus for measuring the height of a work held by a chuck table provided in a machining apparatus, including: a white light source for emitting a white beam of light; a chromatic aberration lens for condensing the white beam emitted from the white light source; a beam splitter which is disposed between the white light source and the chromatic aberration lens and by which a reflected beam of the white beam irradiating the work therewith is split; a first condenser lens for condensing the reflected beam split by the beam splitter; a diffraction grating by which the reflected beam condensed by the first condenser lens is converted into a diffracted beam; a second condenser lens for condensing the diffracted beam diffracted by the diffraction grating; and a wavelength detecting unit for detecting the wavelength of the diffracted beam condensed by the second condenser lens.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.