Abstract: An auxiliary focusing tool for a laser marker for adjusting a distance between a laser focal lens and a work piece before laser marking, the tool comprises: a holding member provided on the laser marker, and a collapsible measuring kit provided on the laser marker at an outputting position of a light source, the measuring kit and the holding member get a predetermined length and are perpendicular to a working surface on the work piece after they are stretched out; and the measuring kit is collapsible to be received in the holding member when it is stored.

Abstract: A system for unveiling embedded targets in printed circuit board substrates includes a micro-machining device, a sensor, and a controller. The micro-machining device removes portions of an opaque layer overlaying an alignment target in a general region in which the target should be located, and the sensor senses whether the alignment target is located at selected locations where portions of the opaque layer have been removed. In response to sensing the presence or absence of an alignment target at the selected locations, the controller directs the micro-machining device to remove additional portions of the opaque layer.

Abstract: A laser beam machining apparatus includes a laser oscillator, a machining head which that machines a workpiece using the laser beam. An optical duct has an optical system to guide the laser beam from the laser oscillator to the machining head. Purge gas is supplied into the optical duct from a purge gas supply port, and the purge gas is output from a purge gas exhaust port. A detector detects presence of undesired gas in the optical duct.

Abstract: A method of accurately and precisely providing desired functionality to an electronic or opto-electronic component is disclosed in which a Femtosecond laser pulse is used to ablate material from a surface of or from within a component. The component is in active operation during the ablation process in order to facilitate the ablation process. The process also involves detection and feedback to indicate when a repair is sufficiently complete. The detection is also performed while the component is powered allowing in-situ detection and ablation. Of course, forms of facilitation other than feedback such as monitoring are also applicable to the invention.

Abstract: An apparatus and a method for laser machining with a gap or tracing control, capable of shortening time required for moving a machining head from a machining end point of one machining shape to a machining start point of next machining shape. The laser machining is performed with the gap or tracing control in which a gap amount between the machining nozzle and the workpiece is controlled to be constant. Driving of a Z-axis is started at a predetermined velocity when the machining nozzle reaches a machining end point of one machining shape. In the drive of the Z-axis, when the Z-axis is driven by a predetermined amount, driving of an X-axis and a Y-axis is started so that the machining nozzle moves to the next machining start point by rapid traverse. A direction of driving of the Z-axis is reversed at a middle point between the machining end point and the machining start point. The driving of the Z-axis may be discontinued at a retreated point.

Abstract: The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for evaluating the characteristics of the intermediate layer circuit is provided. The intermediate layer circuit is installed on the intermediate layer of the multilayer substrate and has a wiring and a grounding pad, holding grounding potential, formed in the vicinity of the wiring. The method includes steps of: irradiating a region of the upper layer substrate located above the grounding pad of the intermediate layer with a laser to ablate material to a predetermined thickness; polishing the upper layer substrate ablated to the predetermined thickness with a hard polishing tool to expose the wiring and/or grounding pad; and bringing a probe needle in contact with the exposed wiring and/or grounding pad to evaluate characteristics of the intermediate layer circuit.

Abstract: According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (xg, yg) for the removal of a layer (Si+1) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Abstract: A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are provided, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends (82) at the end surface (861) of a honeycomb structure body (86), a film (2) is attached to the end surface (861) of the honeycomb structure body (86) in such a manner as to cover the cell ends (82). The portion of the film (2) located at the cell ends (82) to be closed is thermally melted or burnt off thereby to form through holes (20). The end surface (861) is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends (82) by way of the through holes (20). After that, the slurry is hardened while at the same time removing the resin film (2).

Abstract: A method for qualifying airfoil blades includes securing an airfoil blade into a fixture, taking digital measurements of the airfoil blade, comparing the digital measurements of the airfoil blade with measurements of a target model, calculating deviations between the digital measurements of the airfoil blade and the measurements of the target model, determining a required treatment for the airfoil blade to conform with the measurements of the target model, directing a reworking system to provide the required treatment to the airfoil blade, and repeating the previous steps until it is determined that no further treatment is required.

Abstract: A chip scale marker including a laser system, a wafer holder supporting a wafer to be processed, and a camera moving above the wafer holder by being connected to an X-Y stage and monitoring the wafer supported on a center hole of the wafer holder, the chip scale marker includes a unit detachably arranged on a laser beam path from the laser system and reducing power density of a laser beam, and a screen arranged on a center hole of the wafer holder and indicating a position where a laser beam from the laser system is irradiated.

Abstract: A system for laser processing a work piece surface with a laser processing beam includes a processing beam delivery source (205) optics (210, 230) for focusing the processing beam at a surface of the work piece, a viewing camera (250) configured coaxially and coincidently focused with the processing beam (207) at beam impinge point (245) on the work piece (100). The system further includes a computer (510) and processor (512) for displaying an image of the work piece (100) and a cursor (600) superimposed thereon on a monitor (560). One or more movable mirrors (320, 325) are provided movably mounted on galvanometers (335, 340) controlled by the processor (512) to direct the processing beam to selected points on the work surface for processing, (e.g. by laser spot welding). The system further includes an input device such as a mouse (520) for positioning a movable cursor (600) on image points of the work piece image and for selecting the image point for laser processing.

Abstract: This invention relates to a method and apparatus for removing surface contamination on a flexible circuit 34 for an inkjet printer cartridge by pulsed laser irradiation in air. The contamination 3 around and inside the tiny inkjet nozzles 4 can be completely removed without any damage on the flexible circuit 34 by the laser irradiation. The cleaning mechanisms are laser-induced ablation of the contamination and fast momentum transferring from the laser beam to the contamination materials. Compared with chemical solution cleaning and plasma etching, this technique has high throughput and does not cause flexible circuit damage, due to the fact that there are no water and chemical solutions involved in the process. Meanwhile, the laser irradiation is only limited in a small area around the tiny inkjet nozzles 4. There is no laser interaction with the thin conductive circuit 34.

Abstract: A temperature control system for use in a selective laser sintering machine is provided that comprises a thermocouple disposed within a part bed of the selective laser sintering machine and a temperature transmitter in communication with the thermocouple. The temperature transmitter is incorporated into existing control circuitry of the selective laser sintering machine, and the control circuitry is in communication with control logic, which controls the part bed temperature, among other process parameters. In operation, the thermocouple senses and communicates the part bed temperature to the temperature transmitter, and the control circuitry communicates the part bed temperature to the control logic to control part bed temperature during a part build.

Abstract: A method for materials processing by means of plasma-inducing high-energy radiation, especially laser radiation, in which the instantaneous intensity of the plasma radiation is measured at plural locations of a vapor capillary. So that the method can also be performed with perfect welding results on workpieces of very small thickness, shapes of two spaced-apart peak intensity regions, or of another type of electromagnetic radiation emitted from the vapor capillary, and of a minimum region that can be formed between these two regions of extreme values are detected metrologically, the so detected shapes of the regions of extreme values are compared with predetermined region shapes, and control of the materials processing operation takes place as a function of deviations of the detected shapes from the predetermined region shapes.

Abstract: The invention relates to a laser spot welding process for executing a spot weld in two successive steps, namely a first step of preparing the surface state of the material to be welded and a second step of welding as such. The luminous energy (BR) reflected by the weld region of the material is measured in real time during the first step and then processed by a controller circuit (37) connected to a control circuit (30) of the laser source (31). In this way, the characteristics (LM) of the laser beam are adjusted in real time as a function of the measurements effected to allow effective control of the quality of the weld obtained, and in particular of its dimensions.

Abstract: There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.

Abstract: A method and apparatus for forming three dimensional objects by laser sintering that utilizes a broad area thermal vision system such as an infrared camera that can measure multiple temperatures across the target area and use that temperature data as feed back to a control system that both adjusts a zoned radiant heater system and adjusts scan speed and laser power to control temperatures across the target area.

Abstract: If a machining program is reproduced in a robot controller and a robot is moved on a machining route, then a detection signal of a distance sensor is fetched through a distance sensor amplifier, and tracer control is carried out so as to keep a distance between a laser machining head and a workpiece at a predetermined value. In an acceleration and decoration processing in a corner, a restriction means that restricts a maximum acceleration and a maximum jerk is used to control an acceleration and a jerk of the robot not to exceed respective predetermined values, and prevents generation of a vibration when the laser machining head passes through the corner.

Abstract: A method and apparatus for forming three dimensional objects by laser sintering that utilizes a broad area thermal vision system such as an infrared camera that can measure multiple temperatures across the target area and use that temperature data as feed back to a control system that both adjusts a zoned radiant heater system and adjusts scan speed and laser power to control temperatures across the target area.

Abstract: A method for monitoring the processing of a workpiece includes directing an incident laser beam onto the workpiece and measuring a signal emitted from the workpiece. At least two signals are generated by a detector based upon the emitted signal. A workpiece processing quality is determined based upon the ratio of the two output signals and a magnitude of one of the two outputs.

Abstract: A method for processing workpieces by means of high-energy radiation, wherein the radiation is focused by a processing optic onto a processing site. The light radiation emanating form the workpiece is received by the same processing optic and is analyzed by a detector. An optical measurement with respect to the surface of the workpiece is performed in a processing area of the workpiece by means of an external source of measuring light, utilizing measuring light reflected from the processing area. The same processing optic is used to focus radiation onto the processing site and to receive radiation emanating from the workpiece at the processing site.

Abstract: Laser beam radiating means has a center electrode at an inner periphery of an annular electrode. Center electrode potential control means controls potential of the center electrode so as to keep zero (0) or positive constant voltage, so that it is possible to absorb charged particles in plasma generating by radiation of laser beam through the center electrode, and dispersion of plasma can be restricted thereby. Even if a large volume of plasma is generated, a line of electric force from the annular electrode is not disturbed by plasma, and the variation of capacitance generating between the annular electrode and a workpiece can be prevented, thereby.

Abstract: A laser energy microinscribing system, comprising a semiconductor excited Q-switched solid state laser energy source; a cut gemstone mounting system, allowing optical access to a mounted workpiece; an optical system for focusing laser energy from the laser energy source onto a cut gemstone; a displaceable stage for moving said gemstone mounting system with respect to said optical system so that said focused laser energy is presented to desired positions on said gemstone, having a control input; an imaging system for viewing the gemstone from a plurality of vantage points; and a rigid frame supporting said laser, said optical system and said stage in fixed relation, to resist differential movements of said laser, said optical system and said stage and increase immunity to vibrational misalignments. The laser energy source is preferably a semiconductor diode excited Q-switched Nd:YLF laser with a harmonic converter having an output of about 530 nm.

Abstract: An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.

Abstract: A system for semiconductor wafer marking is provided. The system includes: (a) a first positioning subsystem for positioning a laser marking field relative to a wafer, the positioning along a first direction; (b) an alignment vision subsystem; (c) a laser marker including a laser for marking a location within the marking field with a laser marking beam; (d) a calibration program for calibrating at least one subsystem of the system; and (e) a controller. The marking field is substantially smaller than the wafer, and the laser marker includes a scan lens for optically maintaining a spot formed by the beam on the wafer within an acceptable range about the location within the marking field so as to avoid undesirable mark variations associated with wafer sag or other variations in depth within the field.

Abstract: A method is described that involves scanning a laser beam across and applying a stretching force to a fusion region that is formed by a neighboring pair of optical fibers that include a core and a cladding layer. The scanning and applying occurs while the optical permissiveness of an optical path that flows through the fusion region is monitored.

Abstract: To regulate a laser welding process, an optical sensor detects the seam flank angle and/or the seam position of the laser welded seam directly following its formation, the resulting actual measured information is compared with stored or externally provided nominal information to give a comparison result, and the position of the welding laser beam source is adjusted based on the comparison result to regulate-out any divergence between the actual measured information and the nominal information. The apparatus includes a laser welding device including a welding laser beam source that moves along the joint to be welded, an optical sensor arranged directly on or following the laser welding device, and a circuit including a comparator that compares the actual measured information with the stored or externally provided nominal information regarding the seam flank angle and/or the seam position.

Abstract: A weld checking apparatus for a laser welding machine having a welding head triggering laser beam to a welding object includes an auxiliary flash intercepting plate removably mounted on a flexible arm installed on the welding head to intercept a flash generated during a laser welding process, a weld-checking/eye-protecting glass assembly disposed on a center portion of the auxiliary flash intercepting plate to display a weld portion in an enlarged scale during the welding process while intercepting the flash by being opened and closed in synchronization with a laser beam trigger speed of the welding head, and an open/close control part for generating a trigger pulse and an open/close pulse synchronized with the trigger pulse and for providing the open/close pulse to the weld-checking/eye-protecting glass through the electric cable 50 to open and close the weld-checking/eye-protecting glass assembly.

Abstract: In a three-dimensional laser beam machine having a head structure in which a processing point is not moved when a rotation axis and an attitude axis are rotated, the machine has: means for storing information of current angles of the rotation axis and the attitude axis, and calculating a nozzle direction vector from the angles; means for, based on the nozzle direction vector, determining angles of a nozzle in a vertical direction and a horizontal direction consisting of a Z-axis of an orthogonal coordinate system; and means for displaying the determined nozzle angles.

Abstract: A laser assisted machining method and device comprise a tool mount on which a laser head is disposed. A digital thermometer is disposed in a machining tool or on the tool mount for feeding data to a system controller. A laser is used to enable the blade of the machining tool to heat and soften a workpiece instantaneously. As the machining process is in progress, the chip is rapidly removed. The temperature of the tool tip is monitored by the digital thermometer for automatic control of the temperature of heating the workpiece by the laser, thereby keeping the temperature of the tool tip in a specific allowable range. The efficiency of the machining process and the surface precision are thus enhanced.

Abstract: In a laser machining apparatus in which one laser beam is split into two laser beams by first polarizing means, one of the laser beams propagates by way of a mirror, another laser beam is scanned in two axial directions by a first galvanoscanner, and the two laser beams are guided to second polarizing means and then scanned by a second galvanoscanner to process a workpiece, an optical path is configured so that the laser beam which is transmitted through the first polarizing means is reflected by the second polarizing means, and the laser beam which is reflected by the first polarizing means is transmitted through the second polarizing means.

Abstract: Improved systems and methods for laser trimming annular resistors printed on a circuit board are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each annular resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each annular resistor with their respective target value. The laser drill uses the laser trim files to trim the annular resistors within each bin in accordance with the laser trim file assigned to that bin.

Abstract: The invention provides a method for measuring in situ the amount of material removed by laser ablation with ultrashort laser pulses. The method relies on the geometrical information provided by the backscattered light from the ablating laser. The temporal structure of the backscattered laser light is used to provide an accurate measure for the depth of the ablated area, since the round-trip time for the short laser pulses uniquely determines the distance to the object under illumination. For femtosecond laser pulses a depth resolution of a few micrometers can be achieved. According to the invention, imaging of the backscattered light from a single ablating pulse provides all the information necessary to derive a cross-sectional profile across the ablated region.

Abstract: A laser processing machine includes a measuring cell into which gas to be analyzed can flow, a means for decoupling diagnostic radiation from the laser radiation provided for material processing of a workpiece, and a sound detector for detecting the photo-acoustical effect produced in the measuring cell due to absorption of the diagnostic radiation by gas in the cell.

Abstract: The present invention relates to a method for writing an optical structure within a workpiece of a dielectric material using FLDM. In a first embodiment system parameters for the FLDM are determined in dependence upon the dielectric material, a predetermined volume element and a predetermined change of the refractive index of the dielectric material within the predetermined volume element. The system parameters are determined such that self-focusing of a pulsed femtosecond laser beam is inhibted by non-linear absorption of the energy of the pulsed femtosecond laser beam within the dielectric material. A pulsed femtosecond laser beam based on the determined system parameters is focused at a predetermined location within the workpiece for inducing a change of the refractive index through dielectric modification within the predetermined volume element, the volume element including the focus. Various embodiments enable writing of various different optical structures into a workpiece.

Abstract: A system for laser marking a gemstone (10) is provided. A pulsed laser (20) generates a laser pulse (40) which is then directed towards a focusing element (60) through optical means (30). Lens (60) focuses the laser pulse into focused pulse (70). The focused pulse (70) is projected onto a surface of gemstone (80) which is mounted in fixture (90). A computer control system (110) allows a user to input and control a predetermined path of displacement between the gemstone (80) and the focused laser pulse (70).

Abstract: A microdissection apparatus includes a laser light source to emit laser light, and a laser light irradiation optical system to irradiate a sample with the laser light from the laser light source. The laser light irradiation optical system includes an active optical element, which is allowed to form a pattern reflecting a necessary area, and sets a laser light irradiation area, to which the laser light is applied, based on the pattern formed on the active optical element.

Abstract: The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

Abstract: A method for safeguarding regions of an airfoil adjacent to a work area from collateral damage as a result of laser operations. The method utilizes apparatus that includes a sensor assembly. The sensor assembly is fixedly attached to the laser nozzle assembly and moves with the laser nozzle assembly. The laser operations are controlled by a preprogrammed CNC controller. A fixture is used to position the workpiece in relationship to the nozzle on a laser table, the table movable in response to instructions from the controller. A beam stop material is placed over the regions of the airfoil adjacent to the work area to prevent back wall burn or to absorb reflected laser beam energy and to protect the region from other collateral damage such as stray material. The beam stop material is held in place on the workpiece and the workpiece is held in position on the fixture by elastomeric bands.

Abstract: A laser weld monitoring system capable of assessing a weld quality of welding using a pulsed laser is provided. The system includes at least one sensor capable of capturing a weld characteristic of welding using said pulsed laser. The weld characteristic has multiple attributes. The system also includes data acquisition and processing equipment adapted for storing and analyzing the weld characteristic. A user first performs multiple welds to capture at least one weld characteristic for each weld. The user then determines the weld quality of each weld, and runs at least one of a library of algorithms associated with the attributes on said at least one weld characteristic for each weld to generate a single value output for the associated attribute. The user selects an attribute indicative of the weld quality by correlating the single value outputs of said at least one algorithm with the weld qualities of the welds.

Abstract: Method and apparatus for maintaining the focal point of a laser beam used for laser machining relative to a workpiece, including an optical distance measuring sensor having a measurement beam, a mirror for combining the measurement and laser beams into a predetermined optical path having a common axis for both beams, and a focusing element which may be in the form of a refractive lens or a reflective parabolic mirror located in the optical path, and a control means for controlling the location of the focal point of the laser beam based on the distance sensed by measurement beam. In drilling, once the hole breaks through the workpiece, the application of the laser beam can be stopped by observing a departure from the incremental distance measurement change.

Abstract: A laser sintering apparatus for realizing high-speed and high-precision forming. When a first position of an exposure unit is decided by an XY-positioning mechanism, a micromirror of a DMD is turned on and off in accordance with image data in a region corresponding to the first position and a laser beam in a predetermined region including ultraviolet is supplied to the DMD and modulated for each pixel in accordance with image data. A laser beam reflected in the direction of a reflection mirror is reflected therefrom in the direction of a surface of a powdered body. A region having a predetermined area on the surface of the powdered body is exposed by the laser beam, and the exposed portion is thereby cured. Similarly, by repeating movement of and exposure with the exposure unit, the entire surface of the powdered body is exposed.

Abstract: A system for laser machining includes a laser source for propagating a laser beam toward a target location, and a spatial light modulator having individual controllable elements capable of modifying a phase profile of the laser beam to produce a corresponding irradiance pattern on the target location. The system also includes a controller operably connected to the spatial light modulator for controlling the individual controllable elements. By controlling the individual controllable elements, the phase profile of the laser beam may be modified into a desired phase profile so as to produce a corresponding desired irradiance pattern on the target location capable of performing a machining operation on the target location.

Abstract: A laser beam welding apparatus includes a component holding unit which holds components that are to be welded. A laser irradiation unit performs welding of the components by irradiating a welding laser beam to a welding zone of the components. A stress detection unit detects stress data that indicate a stress condition of the components held by the component holding unit. A stress correction unit controls irradiation of a correcting laser beam to the welding zone, based on a result of comparison between reference stress data, detected when positions of the components are aligned in proper position before the welding, and post-welding stress data, detected after the welding is performed by the laser irradiation unit, so that the post-welding stress data, obtained after the irradiation of the correcting laser beam, matches with the reference stress data.

Abstract: An improved method of laser marking semiconductor wafers is provided wherein undesirable subsurface damage to a silicon semiconductor wafer is avoided while providing a relative improvement in marking speed for a predetermined spot diameter. A laser pulse of a laser beam has a predetermined wavelength, pulse width, repetition rate, and energy. The method further includes irradiating a semiconductor wafer with the pulsed laser beam over a spot diameter to produce a machine readable mark on the semiconductor wafer. The mark has a mark depth. The pulse width is less than about 50 ns, and the step of irradiating irradiates over the spot diameter to produce a mark having a mark depth substantially less than about 10 microns.

Abstract: A laser welding lens assembly for welding a first article to a second article at a weld zone includes a laser source outputting a laser beam. An optical fiber is operably coupled to the laser source to receive and transmit the laser beam. A lens is then positioned to receive the laser beam from the optical fiber. The lens includes a contoured face that is shaped to refract the laser beam to produce a generally uniform temperature profile across the weld zone.

Abstract: A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described herein.

Abstract: A microfilter design system for use with a laser drilling system producing multiple sub-beams for parallel drilling operations includes an optical intensity detector illuminated by the multiple sub-beams of the laser drilling system. An analysis module operates the optical intensity detector to produce intensity measurement data for each of the multiple sub-beams. A memory operable with a data processing system stores the intensity measurement data for analysis.

Abstract: Infrared reflection of a laser beam (LB3) irradiated on a welding part (WP) of work (5) is detected by a sensor (6a) high of elevation angle, where it is converted into an electrical signal, which is processed by a measuring circuit (MC) to be input to a quality monitor (QM), where it is stored as a data in a memory (7g), which data is processed by way of a spectral analysis, which calculates a spectral distribution of electrical signal, and a signal power sum in a particular frequency band, to be compared with a threshold value for decision on occurrence of a significant porous state.

Abstract: An image pickup camera is mounted on a soldering head for projecting a laser beam in such a manner that its optical axis coincides with that of the laser beam. An image of the object to be soldered, which is taken by the camera, is displayed on a monitor screen, and a projection spot, which is positioned on an optical axis of the laser beam, is displayed on the screen. While the positional relationship between the object to be soldered and the projection spot is observed on the monitor screen, the soldering head and the object to be soldered are moved relative to each other and the projection spot is positioned. Subsequently, the laser beam is projected from the soldering head, thus, performing soldering.