Abstract: A keyboard includes a plurality of keys mechanically and electrically coupled to a printed circuit board, the plurality of keys are arranged in a keyboard defining air gaps around the plurality of keys. The keyboard also includes a keyboard housing for containing the printed circuit board, the keyboard housing further including an opening on at least a portion of a top surface thereof for usably exposing the plurality of keys therethrough. The keyboard also includes a heating element located within the keyboard housing, the heating element and the printed circuit board deriving power from a keyboard port of a computer when the keyboard is coupled to the computer.

Abstract: The method serves for drying an active part containing at least one winding and solid insulations. The active part is arranged in a vacuum-tight housing and is heated there to a final temperature value (Tfin) by means of warmed oil and by means of a current (I) carried in the winding. The warmed oil is sprayed in the housing at reduced pressure (p) and with the current (I) switched on. At the same time, water is extracted from the active part. The sprayed oil is collected on the housing bottom, after discharging heat to the active part, and, after rewarming, is sprayed once again in the housing at reduced pressure and with the current switched on. The active part is thus dried particularly quickly and carefully.

Abstract: A manufacture or cell (20) formed by a closed case (21) of fabric material (23) in which a multiple number of meltable plastic pellets (24) are disposed and with which an electrical line (25), here in the form of lines (25-1, 25-2), combine in an interwoven assembly. Heat is applied to the pellets (24) via the electrical line (25) to melt them into a mass of substance that solidifies into a solid wall or thickness while concurrently adhering to the fabric material (23) so that the resulting structure is in a cast condition, transformed from its flexible state prior to application of the heat to pellets (24) into a wall-like member. The cell (20) is useful in application of constructing a habitable temporary living housing or shelter for victims arising out of a catastrophe.

Abstract: A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

Abstract: A thermally controlled circuit board is provided. The circuit board includes a substrate, which carries a thermally controlled circuit. The thermally controlled circuit includes a heater, a logic unit and a thermostat. The heater includes planar resistive elements, which are embedded into the substrate. A power source is selectively coupled to the heater via control of the logic unit. The thermostat is programmed with a temperature set point, and outputs a control signal based on a measured temperature level relative to the temperature set point. The logic unit selectively couples the power source to the heater, based on the control signal output from the thermostat and selectively couples power to on-board components to control the temperature of the board and the components thereon to protect the components and insure reliable operation.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: A deicer for an air gap between the rotor and stator of a rotating machine having a rotor and stator combination includes a heating assembly preferably disposed in the stator adjacent the air gap to heat the air in the air gap. Heating assembly includes an electrically powered resistive heating element wound through armature slots of the stator. The disclosed device and method have principal applications in emergency-type devices like Ram Air Turbines (RAT) and other power conversion devices such as Hydraulic Motor Generators (HMG) and Electric Motor Pumps (EMP).

Abstract: A heater includes (a) at least one heat generator which converts electric power to heat, (b) at least one substrate on which the heat generator is formed, and (c) at least one lead through which electric power is applied to the heat generator and which supports the substrate. For instance, the substrate has two opposite sides from each of which the lead extends, and the lead is comprised of a first portion outwardly extending from a side of the substrate, a second portion downwardly extending from an end of the first portion, and a third portion extending outwardly from an end of the second portion.

Abstract: A CMOS integrated circuit for use in a semiconductor test system generates timing signals of high timing resolution and accuracy for testing semiconductor devices. The CMOS integrated circuit includes a heater circuit for generating heat based on electric current flowing there through, and a heater control circuit for detecting an amount of total electric current flowing through a timing generator block for generating timing signals, and a control circuit block for providing timing data to the timing generator block, and the heater circuit, and providing a control voltage to the heater circuit based on the amount of current detected to control the current flowing through the heater circuit through a negative feedback loop.

Abstract: An integrated heater formed as a field effect transistor in a semiconductor substrate, with the transistor having source and drain regions with a channel region extending therebetween to conduct current. The channel region has a resistance when conducting current to generate heat above a selected threshold. A dielectric layer is disposed on the channel region and a gate electrode is disposed on the dielectric layer to control the current of the channel region. A thermally insulating barrier may be formed in the semiconductor material extending about the transistor. The object to be heated is positioned to receive the heat generated by the resistance of the channel region; the object may be a fluid chamber.

Abstract: An optical component package, having an insulative buffer placed against the component, enclosing a first insulative cavity against a temperature-sensitive portion of the component. An outer package provides additional insulation for the component. The buffer may be formed of a soft insulative material, and pressed against the component by an inner surface of the outer package. For the PLC embodiments disclosed, the buffer is planar and includes a frame projecting from its perimeter toward the component to form the cavity. A heater may be positioned proximate the optical component to control its temperature, in which case a second buffer may be placed against the heater, enclosing a second insulative cavity against the heater, aligned with the temperature-sensitive portion of the component. The buffers and insulative cavities of the present invention provide important insulation for optical areas requiring precise temperature control for proper operation.

Abstract: Radiation source for emitting radiation in pulses with a duration and at intervals within chosen ranges, comprising at least one plate-shaped radiant element (1), and at least two electrical conductors coupled to the element(s). The source also includes at least one plate-shaped surrounding, thermally conductive element (2) being thermally coupled to a radiation element at its inner edge, and being thermally coupled to a cooling device (3) at its outer surface.

Abstract: The present invention relates to a motor and especially to a technique for maintaining constant power consumption in preheating a compressor motor in an air conditioner. An object thereof is to permit constant preheating of the motor irrespective of variations in receiving voltage. To accomplish this object, switching control of an inverter (15) that applies a three-phase current to a motor (30) is performed by a control circuit (20) in accordance with a duty based on detected values of voltage (Vm) and current (Im). This duty decreases with increasing receiving voltage.

Abstract: An optical component package, having an insulative buffer placed against the component, enclosing a first insulative cavity against a temperature-sensitive portion of the component. An outer package provides additional insulation for the component. The buffer may be formed of a soft insulative material, and pressed against the component by an inner surface of the outer package. For the PLC embodiments disclosed, the buffer is planar and includes a frame projecting from its perimeter toward the component to form the cavity. A heater may be positioned proximate the optical component to control its temperature, in which case a second buffer may be placed against the heater, enclosing a second insulative cavity against the heater, aligned with the temperature-sensitive portion of the component. The buffers and insulative cavities of the present invention provide important insulation for optical areas requiring precise temperature control for proper operation.

Abstract: A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: An apparatus for separating a liquid in a liquid metal micro-switch. In representative embodiments, the apparatus comprises a heater and a sub-channel inside a structure. The heater is located inside a cavity of the structure onto which the liquid metal micro-switch is fabricated. The sub-channel inside the structure connects the cavity to a main channel. The sub-channel has a cross-sectional area. The value of the cross-sectional area at the boundary between the sub-channel and the main channel is less than the value of the cross-sectional area at the boundary between the sub-channel and the cavity. The gas permeates the cavity and the sub-channel and is capable of extending into the main channel.

Abstract: A heating system for heating the interior of a motor vehicle including a combustion heater for burning fuel in order to heat air supplied to the vehicle interior and/or liquid in the vehicle in the cooling circuit of the engine. An electrical heating device is integrated into the combustion heater in order to supply heat to the air or liquid to be heated.

Abstract: The present invention provides an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured each by a small amount with a high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that the circuit board is heated by the heating device while held in contact with the stage member having an almost equal size to a size of one circuit board. Generation of losses can be reduced for compact circuit boards, and the heating can be carried out individually correspondingly to each kind of circuit boards. Manufacturing various kinds of circuit boards each by a small amount with the high productivity as compared with the conventional art is enabled accordingly.

Abstract: The present invention provides a circuit board/printed circuit board having pre-reserved conductive heating circuits, which comprises a plurality of metal circuit substrates and a plurality of layers of insulating material. The conductive heating circuits are disposed on the metal circuit substrates. Each of the conductive heating circuits has a plurality of direct heat-generating regions. The insulating material is disposed between the metal circuit substrates. When a current is provided to the conductive heating circuits, heat required for partly bonding and hardening can be generated so that the insulating material and the corresponding positions of the direct heat-generating regions on the metal circuit substrates can be bonded and hardened together. A pre-stacked multi-layer metal circuit board with partly bonding and hardening is thus finished.

Abstract: An integrated device based upon semiconductor technology, in particular a chemical microreactor, including a semiconductor body having a high-temperature operating portion and a low-temperature operating portion. The semiconductor body is provided with a thermal-insulation device including a dissipator element arranged between the high-temperature operating portion and the low-temperature operating portion. The dissipator includes a membrane connecting the high-temperature operating portion and the low-temperature operating portion, and a plurality of diaphragms that extend substantially orthogonal to the membrane and are parallel to one another.

Abstract: The invention discloses novel apparatus/methodology for writing/erasing high-density data on a digital recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the apparatus, particularly for realizing the methodology in a substantially thermal near-field mode. The invention provides advantages of data storage densities greater than that of diffraction limited systems, for example, data storage densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

Abstract: Semiconductor chip packages having molded plastic substrates and recessed I/O terminals are disclosed, along with methods of making such packages. In an exemplary embodiment, the molded plastic substrate includes a metal interconnect pattern and a plurality of indentations in a surface thereof. Each indentation may include at least one projection. The indentation and any projections therein are covered by a metal lining. A metal contact, which serves as an I/O terminal, is placed in each of the indentations and is fused to the metal lining thereof. A chip is mounted on the substrate and is electrically connected to the metal contacts by the interconnect pattern. The package further includes a lid or hardened encapsulant over the chip.

Abstract: An electronic heating module includes a heating transistor operated in its linear region as a current source. The temperature of the heating transistor is detected and used to control whether the heating transistor is turned on or off. Further control of the heating transistor is provided via a feedback control loop that monitors a voltage at one terminal of the heating transistor.

Abstract: In the heater member for mounting an object of heating, at least a part of a surface other than a surface mounting a substrate such as a semiconductor wafer or a substrate for liquid crystal, is mirror-finished. Accordingly, power fed to the heater for heating to a prescribed temperature can be reduced, and thus, a heater member for mounting an object of heating and a substrate processing apparatus using the heater member, that can heat the object with higher efficiency, can be obtained.

Abstract: An object of the present invention is to provide a hot plate which is superior in thermal conductivity, is superior in temperature-rising/dropping property, particularly in temperature-dropping property, and has high cooling thermal efficiency at the time of cooling. The hot plate of the present invention is a hotplate comprising: a ceramic substrate; and a resistance heating element formed on the surface of said ceramic substrate or inside said ceramic substrate, wherein said ceramic substrate has a leakage quantity of 10−7 Pa·m3/sec (He) or less by measurement with a helium leakage detector.

Abstract: A semiconductor transistor which is burned in by a burn-in signal having a burn-in frequency higher than a thermal transient response frequency of a transistor used at an operating frequency in the microwave region, and supplying the burn-in signal to the transistor, wherein the burn-in signal has a frequency lower than the operating frequency of the transistor and higher than a response frequency of impurities included in the transistor, and the operating frequency is higher than 1 GHz.

Abstract: A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: An improved TAB circuit is provided for use with ink jet printer cartridges, which carries electrical signals to an array of nozzles on a heater chip. The TAB circuit eliminates bent or broken electrical circuit traces before being bonded to the heater chip by creating a chip window that partially overlaps the edges of the heater chip, and by bringing the electrical circuit traces to the chip window and terminating these circuit traces at a PI (polyimide) edge, which defines the inner perimeter of the chip window. The circuit traces thus are not unsupported at their ends before being assembled to the heater chip, and are automatically correctly positioned to make contact with bond pads of the heater chip when the overall TAB circuit is in correct registration therewith. The TAB circuit also provides an improved tolerance for a covercoat placement that will tend to prevent corrosive ink from coming into contact with these metal traces.

Abstract: Disclosed is a method and apparatus to increase convection heat transfer in an electrical system. The increase in convection heat transfer is achieved by applying a heat source in the vicinity of an electronic element. This effectively increases the amount of airflow across the electronic element.

Abstract: Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multi-layer substrate to bond to a printed wiring board, and, for rework, the component includes a plurality of electric heaters arranged side by side on a bottom layer of the substrate. When energized with current, the heaters generate sufficient heat to weaken the adhesive or solder bond to the printed wiring board without delaminating the layers of the substrate, allowing the electronic semiconductor component to be pulled away from the printed wiring board for rework. Additional circuitry is included to automatically route heater current around, that is bypass, any current-interrupting break(s) as may form in any of the electric heaters giving the heaters a fault tolerance.

Abstract: It is an object of the present invention to provide a semiconductor-producing/examining device which can maintain a preferable connection state for a predetermined period of time and which can easily remove a ceramic substrate from a supporting case. The present invention is a semiconductor producing/examining device comprising: a ceramic substrate having a conductor layer formed on the surface thereof or inside thereof; and a supporting case; in which an external terminal is connected to the conductor layer, wherein a connection between the conductor layer and the external terminal is performed such that the external terminal is pressed on the conductor layer or the external terminal is pressed on another conductor layer connected to the conductor layer by using the elastic force and the like of an elastic body.

Abstract: A heater control apparatus used for a gas concentration sensor is provided which heats a sensor element a solid electrolyte body of up to a desired activation temperature. The heater control apparatus determines an actual resistance value of the sensor element, controls a power supply to the heater as a function of a difference between the actual resistance value and a target one, determines a power supplied to the heater, and determines a reference resistance value of the sensor element based on a predetermined fundamental relation between a power used in the heater and a resistance value of the sensor element to correct the target resistance value as a function of a difference between the reference resistance value and the actual resistance value.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework.

Abstract: A coating (626) comprising a ferroelectric, lossy dielectric, ferromagnetic or semiconductor material is disposed near an object (620). AC current flows through an electrical conductor (624), creating an electromagnetic field. The coating (626) absorbs energy from the electromagnetic field, thereby generating heat, which melts snow and ice on the object (620).

Abstract: A redundant package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar lightwave circuit (PLC), e.g., an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multilayer substrate to bond to a printed wiring board, and, for rework, the component includes a plurality of electric heaters arranged side by side on a bottom layer of the substrate. When energized with current, the heaters generate sufficient heat to weaken the adhesive or solder bond to the printed wiring board without delaminating the layers of the substrate, allowing the electronic semiconductor component to be pulled away from the printed wiring board for rework. Additional circuitry is included to automatically route heater current around, that is bypass, any current-interrupting break(s) as may form in any of the electric heaters giving the heaters a fault tolerance.

Abstract: A moisture control device and method has a heat generating source in electrical devices that is powered to operate independent of the electrical device for reducing, minimizing or preventing condensation, nucleation and degradations on electronic parts and circuit boards of the electrical device. A power supply is connected to the heat generating source and a switch connected to the power supply. The switch may be manually operable or automatic and is used for controlling operation of the heat generating source. A sensor senses on/off status of the electrical device and automatically operates the switch in response to the sensing. Power is supplied to the heat generating source when the electrical device powers down and disconnected when the electrical device powers on.

Abstract: A thermally controlled circuit board is provided. The circuit board includes a substrate, which carries a thermally controlled circuit. The thermally controlled circuit includes a heater, a logic unit and a thermostat. The heater includes planar resistive elements, which are embedded into the substrate. A power source is selectively coupled to the heater via control of the logic unit. The thermostat is programmed with a temperature set point, and outputs a control signal based on a measured temperature level relative to the temperature set point. The logic unit selectively couples the power source to the heater, based on the control signal output from the thermostat and selectively couples power to on-board components to control the temperature of the board and the components thereon to protect the components and insure reliable operation.

Abstract: A method for controlling the temperature of a DUT during a testing operation, includes a) measuring a parameter related to power consumption by the DUT during testing, such as current consumption; and b) using the parameter related to power consumption to operate a temperature control device to compensate for temperature change due to changes in power consumption by the DUT during testing. The control can be closed loop or open loop with control signals incorporated into a test program. Apparatus for controlling the temperature of a DUT during testing, includes a) a device for measuring a parameter related to power consumption by the DUT during testing; b) a temperature control device which operates to control the temperature of the DUT during test; and c) a device for controlling operation of the temperature control device according to the measured parameter related to power consumption.

Abstract: An electric heating system (1) is disclosed for the heating of the interior of an instrument cabinet and the like which is protected against explosion. The heating system includes a radiator (2) with a receiving cavity (3). A heating element (5) and a melting fuse (6) are connected in series as an excess-temperature fuse, whereby the heating element (5) and the excess temperature fuse (6) are disposed in receiving cavity where they are encapsulated. The heating element (5) and the excess-temperature fuse (6) are connected via connection lines (8, 14) to a temperature control (9). An environmental-temperature sensor (10) is also connected to the temperature control. According to the invention, a fuse-temperature sensor (11) is also encapsulated in the receiving cavity near the melting fuse which is connected to the temperature control (9). The current fuse temperature of the excess-temperature fuse (6) is determined by the fuse-temperature sensor (11) for comparison to a set changeover temperature.

Abstract: System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework.

Abstract: A CMOS integrated circuit to be used in a semiconductor test system for generating timing signals of high timing resolution and accuracy for testing semiconductor devices. The CMOS integrated circuit includes a heater circuit for generating heat based on electric current flowing there through, and a heater control circuit for detecting an amount of total electric current flowing through a timing generator block for generating timing signals, a control circuit block for providing timing data to the timing generator block, and the heater circuit and providing a control voltage to the heater circuit based on the amount of total current detected to control the current flowing through the heater circuit through a negative feedback loop.

Abstract: The invention relates to a method for heating glass sheets to be tempered or heat-strengthened, in which method glass sheets are heated in a preheating furnace (1) by applying a hot-air blast and convection heating produced thereby to the opposite sides of a glass sheet and the preheated glass sheet is transferred from the preheating furnace (1) into a radiation heating furnace (2) for heating the glass sheet to a tempering temperature. During the convection heating of a glass sheet, the rotating speed of a hot-air fan (5) is increased while adjusting the heating effect of heating resistances (6) so as to maintain the temperature of blasted air substantially constant. Thus, the diminishing temperature difference between glass and air is compensated for by controlling the coefficient of heat transfer.

Abstract: Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.

Abstract: System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework.

Abstract: A method for the electrical and/or mechanical interconnection of components of a microelectronic system includes at least one first component and at least one second component to be connected, and at least one local Joule-effect micro-heater is incorporated in one of the first and second components at a respective soldering point therebetween. The method includes supplying electrical energy to the micro-heater to utilize the heat produced therefrom by the Joule effect to solder the first and second components at the respective soldering point.

Abstract: A temperature stabilization scheme reduces the effects of temperature variations on the performance of an electronic system that is implemented on a circuit board. In the temperature stabilization scheme, the circuit has an isolated region that is coupled to a remainder ofthe circuit board by one or more electrical pathways. Associated with each of the electrical pathways is an incidental thermal conduction path between the isolated region and the remainder of the circuit board. A temperature sensitive component ofthe electrical system is coupled to a mounting site on the isolated region and interfaces with the remainder of the circuit board through the one or more electrical pathways. A series of heaters, thermally coupled to the isolated region provides a compensating thermal profile that opposes thermal instability caused by the incidental thermal conduction paths, where the opposition is over a portion of the isolated region that includes at least the mounting site of the temperature sensitive component.

Abstract: An apparatus having a heating circuit including a resistor layer and a patterned conductor layer is disclosed. The pattern defines a current path that includes at least one portion of the resistor layer. When current is applied to the current path, heat is generated in the portion of the resistor layer that is a part of the current path. The heat is used to reflow solder to connect two components such as an integrated circuit chip (IC) to a multi-chip module (MCM) module. This localized electric heating method may be used to package multiple chips on a module. The apparatus having the heating circuit may be fabricated by first depositing a resistor layer on to a substrate. Then, a conductor layer is deposited and etched to define the current path.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.