Abstract: A main heater controller is adapted to control operation of the LCD heater. A temperature controlled override switch is adapted to disable the LCD heater, independent of the main heater controller, upon a temperature reaching a shut-off temperature above a normal operating temperature of the LCD. The temperature controlled switch has a current flow path made of a material whose conductivity is a function of temperature. A cavity in which the temperature controlled switch is located is also provided. The cavity is adapted to transfer heat in air emanating from the LCD heater to the temperature controlled switch. The housing which forms the cavity also includes a vent system for the cavity.

Abstract: A main heater controller is adapted to control operation of the LCD heater. A temperature controlled override switch is adapted to disable the LCD heater, independent of the main heater controller, upon a temperature reaching a shut-off temperature above a normal operating temperature of the LCD. The temperature controlled switch has a current flow path made of a material whose conductivity is a function of temperature. A cavity in which the temperature controlled switch is located is also provided. The cavity is adapted to transfer heat in air emanating from the LCD heater to the temperature controlled switch.

Abstract: An apparatus connected to an energy storage device for powering an electric motor and optionally providing a warming function for the energy storage device is disclosed. The apparatus includes a circuit connected to the electric motor and the energy storage device for generating a current. The apparatus also includes a switching device operably associated with the circuit for selectively directing the current to one of the electric motor and the energy storage device.

Abstract: Aspects of a portable computer system capable of warming a user's hands are described. The portable computer system includes a lid, the lid housing a display screen and a base, the base hingedly coupled to the lid and housing processing hardware beneath a keyboard unit. The base further includes an adjustable ventilation interface that allows an alteration to a direction of warm air dispersing heat generated by operation of the processing hardware. The ventilation interface includes a plurality of vent openings and a mechanical controller substantially adjacent to the plurality of vent openings to adjust closure of the plurality of vent openings.

Abstract: An electric heating system for motor vehicles including one or several electric heating elements; a control circuit provided for controlling the power dissipated by the heating elements; the control circuit including one or several power semiconductors arranged on a circuit board; the circuit board is by means of a solid matter connection connected by the side facing away from the power semiconductors to a metal plate intended to be mass potential; the metal plate being electrically insulated from conductor paths located on the underside of the circuit board and intended to carry a voltage in relation to the ground potential; the control circuit being arranged in a housing. One or several heat sinks are provided outside the housing. The metal plate is connected with the heat sinks arranged outside the housing by thermally conductive connectors.

Abstract: A control circuit (20) for controlling electrostatic discharge in an electric component includes a heater (28) that is thermally coupled to the component. A sensor (30) is used for sensing a sensed condition. A controller is coupled to the heater and the sensor. The controller (24) heats the component in response to the sensed condition. The sensor (30) may include an electron flux level near the component or a surface potential of the component itself.

Abstract: Disclosed is a DC thermal energy generator for heating localized regions of an integrated circuit. The integrated circuit includes a pair of static circuits whose outputs are shorted, and are in contention. Contention causes current to flow through the circuits, generating heat. Integrated-circuit temperatures can be varied by turning on more or fewer thermals energy generators. The thermal resistance of a, packaged integrated circuit is computed using a well-known relationship integrated circuit's measured temperature, power consumption, and the ambient temperature.

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract: A surface-heating element for a curved surface and method of producing a heating element is provided. The heating element includes a continuous, planar conductor arranged along a longitudinal axis including a plurality of turns connected by regions being generally transverse to the longitudinal axis. The conductor including end portions each having a terminal for receiving electrical current. The heating element also includes a film applied to one side of the conductor and configured to substantially follow an outer contour of the conductor. The film and the conductor form a continuous web generally centered about the longitudinal axis, and at least one turn connecting two generally transverse regions extends beyond the continuous web. The heating element may also include an adhesive layer on the other side of the heating element sealingly engaging the film.

Abstract: A high-sensitivity, separation microcolumn assembly for a microgas chromatograph and the like is provided. The assembly has an ultra-low mass complete with integrated heaters. The assembly uses multiple zones for temperature control, and microstructures that permit very rapid heating and cooling of the microcolumn.

Abstract: One or more heating elements comprise a heating element. One or more elongated beams comprise an elongated beam. The heating element is coupled with the elongated beam and induces a time-varying thermal gradient in the elongated beam to cause one or more oscillations of one or more of the one or more elongated beams.

Abstract: A thermal testing control system for notebook computers, remotely controlled by a control means, is described. An enclosure can test notebook computers in its inner space under a predetermined temperature. A temperature sensor, mounted in the testing room is electrically connected to the control means. A blower is mounted in one opening, and electrically connected to the control means. If the temperature measured by the temperature sensor is higher than the predetermined temperature, the blower begins to operate.

Abstract: A semiconductor device is described in which an integrated circuit executes dummy operating cycles in order to generate heat if the temperature of the semiconductor device drops below a lower limit value. In this manner the semiconductor device can be rated for lower temperatures than the construction tolerances of the semiconductor device would allow.

Abstract: A sensor may comprise a first electrode and a second electrode in mutual ionic communication with an electrolyte, a first socket disposed near a rear portion of a sensor element, a first lead disposed in electrical communication with the first electrode and in physical contact with the first socket and configured for electrical communication with a first terminal element, a second socket disposed near the rear portion of the sensor element, and a second lead disposed in electrical communication with the second electrode and in physical contact with the second socket and configured for electrical communication with a second terminal element. The first socket is disposed through at least one of an edge and an end of the sensor element, and the second socket is disposed through at least one of the edge and the end of the sensor element.

Abstract: A television and oven combination device includes an oven having a back wall, front wall, a pair of side walls and a top wall. A flat-panel monitor has a viewing side, a rear side, a bottom edge, a top edge and a pair of side edges. At least one monitor support is attached to the back wall of the oven. The at least one monitor support includes an elongated member having an upper end and a lower end. The elongated member is vertically orientated. A coupler is attached to the upper end for coupling the elongate member to the flat-panel monitor.

Abstract: A shape memory alloy (SMA) actuator includes a groove formed in a surface of a shape memory alloy (SMA) substrate establishing a trace pattern for a layer of conductive material formed over an electrically insulative layer. The trace pattern includes a first end, a second end, and a heating element disposed between the first and second ends. The SMA substrate is trained to deform at a transition temperature achieved when electricity is conducted through the conductive material via first and second interconnect pads terminating the first and second ends of the trace pattern.

Abstract: A temperature sensor is integrated together with an integrated circuit on a chip, the sensor delivering a temperature-dependent measuring signal or at least emitting a signal when the chip temperature falls below a specific prescribed value. For such an eventuality, the chip includes a special circuit device thereon, by which a current flow is generated through a provided structure of electrical conductors that keeps the temperature of the integrated circuit above a prescribed minimum temperature.

Abstract: A gas sensor radiation source includes a filament in which microcavities having an opening diameter of about half of the absorption spectrum wavelength of a gas whose concentration is to be measured and a depth of twice or more greater than the opening diameter and a bulb enclosing, at a reduced pressure or with a noble gas enclosed therein, a filament. Thus, radiation can be efficiently made in accordance with the absorption spectrum of the gas to be detected.

Abstract: A main heater controller is adapted to control operation of the LCD heater. A temperature controlled override switch is adapted to disable the LCD heater, independent of the main heater controller, upon a temperature reaching a shut-off temperature above a normal operating temperature of the LCD. The temperature controlled switch has a current flow path made of a material whose conductivity is a function of temperature. A cavity in which the temperature controlled switch is located is also provided. The cavity is adapted to transfer heat in air emanating from the LCD heater to the temperature controlled switch. The housing which forms the cavity also includes a vent system for the cavity.

Abstract: In order to maintain a semiconductor device under test at a generally constant temperature, the temperature change of the device under test is characterized as the device under test undergoes changes in power level in response to an electrical testing sequence. Additionally, the temperature change of the device under test is characterized in response to changes in power level of a thermal head associated with the device under test. This information is used to select power levels of the thermal head during the electrical testing sequence so that the device under test remains at a substantially constant temperature during the electrical testing sequence.

Abstract: Representative embodiments provide for a prosthetic device, including a pointer region, an electrically conductive touch pad supported by the pointer region and configured for selectively contacting a touch-screen display, and an electric heating circuit which is configured to selectively heat the electrically conductive touch pad in response to an actuation of a switch. Also provided is a method for using a prosthetic device including using prosthesis of a user to support at least a portion of the prosthetic device that includes an electrically conductive touch pad, warming the electrically conductive touch pad in response to a user input to the prosthetic device, and selectively contacting the touch-screen display using the electrically conductive touch pad in response to a user manipulation of the prosthetic device.

Abstract: Representative embodiments provide for a prosthetic device, including a pointer region, an electrically conductive touch pad supported by the pointer region and configured for selectively contacting a touch-screen display, and an electric heating circuit which is configured to selectively heat the electrically conductive touch pad in response to an actuation of a switch. Also provided is a method for using a prosthetic device including using prosthesis of a user to support at least a portion of the prosthetic device that includes an electrically conductive touch pad, warming the electrically conductive touch pad in response to a user input to the prosthetic device, and selectively contacting the touch-screen display using the electrically conductive touch pad in response to a user manipulation of the prosthetic device.

Abstract: Disclosed is a flexible printed circuit board for use in a control handle. The circuit board includes resistive heating elements for heating electrical components in the circuit to limit the formation of frost and condensation on the components.

Abstract: A warmth-keeping structure of cold cathode lamp comprises a cold cathode lamp, a soft electric heating component and two insulating components. The soft electric heating component is wound around the surface of the cold cathode lamp. Two ends of the soft electric heating component are joined at two sides of the cold cathode lamp with the two insulating components slipped onto the joint portions, respectively. Through holes are formed on the insulating components so that different power sources can be provided for the soft electric heating component and the cold cathode lamp via conducting wires. The soft electric heating component can heat the cold cathode lamp in advance before the cold cathode lamp radiates to let the cold cathode lamp raise its ambient temperature in a few seconds and keep a fixed working temperature, hence stabilizing the brightness thereof and dissipating less power.

Abstract: According to one exemplary embodiment, a method for establishing a relationship between Joule heating in a conductor and a current density in the conductor is implemented by performing wafer level measurements. According to this exemplary embodiment, wafer level measurements are performed to arrive at a temperature coefficient of resistance in the conductor. The method also includes determining a thermal resistance of the conductor. The thermal resistance is then utilized to establish a relationship between Joule heating in the conductor and the current density in the conductor. The relationship so obtained is then utilized to determine design rules, mean time to fail, and other information to aid in the design of reliable semiconductor devices. According to another exemplary embodiment, a wafer level measurement system is utilized to establish a relationship between Joule heating in a conductor and a current density in the conductor.

Abstract: The invention relates to a heated steering wheel having a steering wheel rim with a heating device arranged on the steering wheel rim. A shell has two or more shell parts that each extend at least part of the way around the periphery of the steering wheel rim in radial cross-section. The shell parts are joined together by an adhesive intentionally applied only to mutually contacting surfaces of said shell parts. The invention also relates to a method of manufacturing a heated steering wheel.

Abstract: A circular filament lamp comprises a filament supported within an envelope which comprises a tube formed as the major part of a circle. The ends of the tube terminate in pinch seals through which extend current carrying assemblies connected to the filament. The pinch seals overlap one another circumferentially of the lamp, and are offset from one another on either side of a plane containing the axis of the filament.

Abstract: A main heater controller is adapted to control operation of the LCD heater. A temperature controlled override switch is adapted to disable the LCD heater, independent of the main heater controller, upon a temperature reaching a shut-off temperature above a normal operating temperature of the LCD. The temperature controlled switch has a current flow path made of a material whose conductivity is a function of temperature. A cavity in which the temperature controlled switch is located is also provided. The cavity is adapted to transfer heat in air emanating from the LCD heater to the temperature controlled switch.

Abstract: A control circuit (20) for controlling electrostatic discharge in an electric component includes a heater (28) that is thermally coupled to the component. A sensor (30) is used for sensing a sensed condition. A controller is coupled to the heater and the sensor. The controller (24) heats the component in response to the sensed condition. The sensor (30) may include an electron flux level near the component or a surface potential of the component itself.

Abstract: A liquid crystal display (LCD) includes an LCD panel providing a surface. A flexible heating system of the invention includes a substantially transparent flexible sheet substrate disposed adjacent the surface of the LCD panel and a substantially transparent resistive heating element formed on the flexible sheet substrate. One or more serpentine shaped thermal sensors are formed in the resistive heating element. Control circuitry coupled to the serpentine shaped thermal sensors and to the substantially transparent resistive heating element and other heaters controls the heating element and other heaters based resistances of the serpentine shaped thermal sensors.

Abstract: Display with a heater, a) the display having at least one display glass, b) the heater having an electrically operated heating element connected to a voltage supply (UB, GND), c) the heating element comprising a thin layer, d) the layer being made of a material forming an electrical resistance, and e) the layer being applied over a surface area to the at least one display glass or being embedded over a surface area in the display.

Abstract: An electric heating system is disclosed for the heating of the interior of an instrument cabinet which includes a radiator having a receiving cavity with a heating element and a melting fuse connected in series as an excess-temperature fuse encapsulated in the receiving cavity. The heating element and the excess-temperature fuse are connected to a temperature control. An environmental-temperature sensor and a fuse-temperature sensor are encapsulated in the receiving cavity near the melting fuse connected to the temperature control. The current fuse temperature of the excess-temperature fuse is determined by the fuse-temperature sensor. The temperature control operates in a first control algorithm within a fuse temperature range below a preset changeover temperature. The temperature control switches over to a second control algorithm when the changeover temperature has been reached or exceeded and lowers the heating performance of the heating element for the protection of the excess-temperature fuse.

Abstract: A communication device (100, 200) capable of transmitting information provides the means for regulating the temperature (116) of one or more heat-sensitive modules or components (160) of the communication device through the adaptive and dynamic control of the flow of transmissions by the communication device, thereby eliminating the need for stored thermal profiles of heat-sensitive modules of the communication device. In addition to the heat-sensitive module(s), the communication device has a multi-logic controller block (110) and a transmission flow control block (140). The multi-logic controller block (110) receives the temperature of the heat-sensitive module (116) and a first control clock (112) and utilizes multi-value logic to generate a flow control signal having hysteresis (126).

Abstract: A sensor assembly includes an integral heating unit. The sensor assembly includes a sensor housing which can be attached to an exterior surface of a vehicle. A transducer is seated in the sensor housing. The transducer is configured to receive interrogation signals from a controller and to transmit signals in response to the interrogation signals. A heating unit is positioned in the sensor housing. The heating unit includes a shell including a recess which is sized and configured to receive the transducer. A heating coil formed of a high resistance wire is embedded in the shell. The heating coil is configured to radiate heat to warm the transducer to melt built up ice and snow which can block signals emitted by the transducer.

Abstract: A housing is provided for maintaining a planar lightguide circuit at a temperature within a predetermined temperature range independent of ambient temperature. The housing includes a planar heating arrangement supporting and in thermal contact with the planar lightguide circuit. Also included is a frame assembly having a first surface on which the planar heating arrangement is fixed. The frame assembly has at least one opening through which extends at least one optical fiber coupled to the planar lightguide circuit. An overmold, which is molded around the frame assembly, includes at least one strain relief member through which the optical fiber extends.

Abstract: The present invention relates to an apparatus for supplying heat to directly cooled electronics. To ensure that directly cooled electronics are maintained at a temperature above 0° C., a circulation fan is provided in a transverse junction between an outlet duct and an inlet duct, for a recirculation flow of supplied cooling air, whereby outgoing hot air from the electronics, when necessary, may be mixed with the cold air, so as to raise the temperature of the cooling air to be supplied to the electronics.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: An apparatus and method for attaching a flip chip configured semiconductor die to a substrate as well as removing the die and replacing it on the substrate with another flip chip configured semiconductor die by way of an electrically resistive thermal supply circuit that provides heat to soften or melt an electrical connection material of discrete conductive elements connecting the two components, as well as providing heat to release a dielectric underfill material, if present. Methods for designing a thermal supply circuit and are also disclosed. Semiconductor die and substrate configurations incorporating thermal supply circuits as well as thermal supply circuit configurations and design approaches are also disclosed.

Abstract: System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework.

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract: An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so that the optical device can avoid performance degradation due to nonuniform temperature distribution. The amount power consumption can be reduced and excellent workability can be ensured.

Abstract: Construction of a micro-thermocouple sensor designed to be incorporated in a mass flow meter for the circulation of gaseous fluids, includes of the following steps: depositing an insulating layer of several microns by electron gun on the sensor tube, then depositing the components of the thermocouple, by the electron gun, through the nickel masks, at a residual pressure lower than 10−6 torr, at a thickness of several thousand Angstroms, annealing of the capillary tube for one hour, then the mounting of a heating element on the capillary tube treated in this manner.

Abstract: A high-sensitivity, separation microcolumn assembly for a microgas chromatograph and the like is provided. The assembly has an ultra-low mass complete with integrated heaters. The assembly uses multiple zones for temperature control, and microstructures that permit very rapid heating and cooling of the microcolumn.

Abstract: An electrical device includes a package having an array of connections, a thermally conductive, electrically insulative substrate in the package, a plurality of polymeric positive temperature coefficient (PPTC) resistors in the package in thermal contact with the substrate, and, at least one heating element such as a power field effect transistor in thermal contact with the substrate, for indirectly heating the PPTC resistors in response to a control current, thereby to trip the PPTC resistors from a low resistance state to a very high resistance state. A method for controlling a plurality of electrical loads is also disclosed.

Abstract: An electrical device includes a package having an array of connections, a thermally conductive, electrically insulative substrate in the package, a plurality of polymeric positive temperature coefficient (PPTC) resistors in the package in thermal contact with the substrate, and, at least one heating element such as a power field effect transistor in thermal contact with the substrate, for indirectly heating the PPTC resistors in response to a control current, thereby to trip the PPTC resistors from a low resistance state to a very high resistance state. A method for controlling a plurality of electrical loads is also disclosed.

Abstract: A multi-functional cabinet for warming and adding fragrance to an infant's towel and clothing for a predetermined duration as well as providing soothing music. The cabinet is a box-shaped enclosure with a removable lid having an upper compartment for receiving towels and clothing with a sidewall pocket for receiving a fragrance such as baby powder or baby lotion, and a pair of lower compartments for housing a heating element/blower fan and a music source, such as a music box, a compact disc player or tape player. A timer is connected to the heating element, and may also be connected to the music source.

Abstract: A package for optical components includes an inner package enclosing the optical component, and an outer package enclosing the inner package. A heater may be disposed in the inner package proximate the optical component to control its temperature, and to maintain this temperature control, the outer package creates an isolated air pocket around the inner package, which thermally insulates the inner package from the outside environment. The outer package is formed of a material having low thermal conductivity, to promote this insulating function. This package is especially useful if the optical component comprises a planar light-wave circuit (PLC), e.g. an arrayed waveguide grating (AWG), which requires tight temperature control and structural integrity to maintain the integrity of the optical paths.

Abstract: A housing is provided for maintaining a planar lightguide circuit at a temperature within a predetermined temperature range independent of ambient temperature. The housing includes a planar heating arrangement supporting and in thermal contact with the planar lightguide circuit. Also included is a frame assembly having a first surface on which the planar heating arrangement is fixed. The frame assembly has at least one opening through which extends at least one optical fiber coupled to the planar lightguide circuit. An overmold, which is molded around the frame assembly, includes at least one strain relief member through which the optical fiber extends.

Abstract: A method for controlling the temperature of a DUT during a testing operation, includes a) measuring a parameter related to power consumption by the DUT during testing, such as current consumption; and b) using the parameter related to power consumption to operate a temperature control device to compensate for temperature change due to changes in power consumption by the DUT during testing. The control can be closed loop or open loop with control signals incorporated into a test program. Apparatus for controlling the temperature of a DUT during testing, includes a) a device for measuring a parameter related to power consumption by the DUT during testing; b) a temperature control device which operates to control the temperature of the DUT during test; and c) a device for controlling operation of the temperature control device according to the measured parameter related to power consumption.

Abstract: Methods and apparatuses are disclosed for automatic process control of firing and biasing a heated-electrode refrigerant sensor for use in a refrigerant detector. An unfired sensor may be mounted in a manufacturing station, and while remaining mounted may be electrically heated by applying current and adjustably controlling the amount of power to gradually increase the temperature. Once the sensor reaches a suitable temperature, the sensor is fired, and while the temperature of the sensor is elevated, the sensor is biased. The temperature increase may take place at a first rate until substantially all the moisture is removed, and then at a second rate. Upon reaching the bias temperature, the temperature may be held generally constant for a first period of time before increasing to a second bias temperature for a second period of time.