Abstract: A heating/warming textile article (11) with a fabric body (13) with electrical resistance heating/warming elements (15) also contains a phase change component (17) which releases and absorbs latent heat in a cycle corresponding to ON/OFF operation of a power source (23), e.g., a battery, thus to conserve and extend useful battery life.

Abstract: An active heater control circuit for a deicing heater on a probe mounted on an aircraft, such as a pitot pressure sensing probe, a pitot-static pressure sensing probe, a total air temperature sensor, or engine inlet probe, controls power to the heater through a switch. When activated the switch sends electrical power to the heater until the probe temperature reaches a desired set point. A feature of the invention is an override pulse, which independently activates the switch to provide power to the heater at a selected period and duty cycle such that the aircraft current monitoring circuit receives current sufficiently often to avoid triggering a false heater failure alarm even when the probe temperature has reached its control set point. This feature allows the use of probes incorporating active heat control on existing aircraft configured for older probes having simple nickel-based resistive heater control.

Abstract: Display with a heater,

Abstract: A heater for a gas sensor has a first thermistor element and a second thermistor element arranged in an electrically parallel configuration. Each thermistor element may be deposited onto a substrate such that the first thermistor element extends about a perimeter of the substrate and the second thermistor element extends across a portion of the substrate intermediate the perimeter of the substrate. The thermistor elements are preferably fabricated of materials having differing thermal coefficients of resistivity. A method of heating the gas sensor includes disposing the two thermistor elements in an electrically parallel configuration over a surface of the substrate and passing an electric current through the elements.

Abstract: A thermal earmuff includes an inner cover having a circular partition formed with a first circular recess at one side thereof and a second circular recess at another side thereof, a circular member having two opposite circumferential edges provided with two curved shoulders and force-fitted within the second recess of the circular partition to support the inner cover, an outer side of the circular member being provided with a clamping device, a heating member secured on an outer side of the circular member and provided with a heating filament facing the through holes of the circular partition, an outer cover enclosing the inner cover, a head band having a plurality of teeth at two ends each of which is inserted into the slot with the teeth of the head band engaged with the teeth of the clip, and power supplying means electrically connected with the filament

Abstract: The component, located inside a corresponding package, is associated with a first heat sensor, located in proximity to the component inside the package, together with a second heat sensor. A thermal conditioning element is controlled in such a way as to keep the temperature of the first sensor at a level identified by a reference signal (rifv). The second sensor is associated with the package in such a way as to generate a second temperature signal indicating the external temperature, and the aforesaid reference signal (rifv;) is modified as a function of the said second temperature signal, providing effective temperature control of the component.

Abstract: The invention provides an aging socket, an aging cassette and an aging apparatus with which an aging system of a very low cost can be constructed and aging can be performed for any number of inspection object parts. The aging socket includes a base on which a mounting portion on which an imaging object part can be mounted is formed, and a heater and a temperature regulator incorporated in the base. A plurality of such aging sockets are disposed in a matrix on the aging cassette. One or a plurality of such cassettes on which such sockets are mounted are mounted in position into slots of the aging apparatus. Consequently, aging of any number of aging object parts mounted on the sockets of one or more cassettes can be performed by the aging apparatus.

Abstract: Apparatus for transferring and heat-treating divided solids comprises at least one transfer member (2) having a longitudinal axis (3) and a helical portion (4) mounted to rotate about its own longitudinal axis in a tubular case (1) and connected to the outlet shaft of a rotary drive motor (12). At least the helical portion (4) of the transfer member (2) is made in its bulk of an electrically conductive material, and the transfer member (2) has means (11) for connecting it to an electricity power supply so as to constitute heater means.

Abstract: The invention relates to an arrangement for heating an assembled printed circuit board to a specified temperature. A plurality of resistors are arranged on at least one surface of the printed circuit board in order to generate heat. The resistors are distributed approximately uniformly over the surface and are supplied with electronic energy from a separate source.

Abstract: An electric heater for a motor vehicle uses heat generated by power semiconductors as the heat source. The heat output by the power semiconductors is used directly for heating. The power semiconductors are regulated by circuit regulators to be able to adjust the heating power continuously. In addition, switching devices are provided which interrupt or shut down the respective branch circuits individually in the event of short circuits in the power semiconductors.

Abstract: An inventive system for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework. The resistive heating circuit is also incorporated into a Thin Small Outline Package (TSOP) between the TSOP's base and die cover. When the heating circuit in the TSOP heats up, it either cures an epoxy adhesive between the base and die cover to attach the die cover to the base, or it loosens the adhesive to detach the die cover from the base so a die inside the TSOP can be reworked. Thus, the inventive system eliminates the need for cumbersome curing ovens and, at the same time, provides a previously unavailable ability to rework certain semiconductor dice after they are packaged.

Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.

Abstract: A thermal analyzer scans temperature by thermally altering a sample and measuring a thermal change based on physical and chemical changes of the sample as a function of time and/or temperature. The thermal analyzer includes a heat-generating section for heating a sample. The heat-generating section includes a first semiconductor substrate of a first conductivity type forming a thin-film heater with a cavity section in a lower section thereof and a second semiconductor substrate of a second conductivity type connected to the first substrate. The cavity section forms a sample holding section for holding the sample. The thermal analyzer further includes a temperature detecting section for detecting a temperature of the sample holding section. The sample holding section and the temperature detecting section are monolithically formed on the thin-film heater or an area proximate the thin-film heater in a thin-film supporting section for supporting the thin-film heater.

Abstract: An apparatus is provided for permitting commercial-off-the-shelf (COTS) electronics to be utilized in harsh environments for which the COTS electronics are not designed, including environments having ambient temperature variations, ambient pressure variations, shock and vibration exposure, environmental contaminants and/or electromagnetic radiation which may be beyond the design specification of the COTS components. The device includes a sealed enclosure having racks or other suitable mounts for the COTS components and having an environmental controlled unit (ECU) which circulates a fluid such as air through the enclosure and through the mounts. The temperature in the enclosure is monitored and the ECU operated to heat or cool fluid passing therethrough to maintain temperature in the enclosure within the design limits of the COTS electronics. A flow channel for ambient fluid, which channel is sealed from the internally circulating fluid, may be provided for removing heat from a cooling unit of the ECU.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.

Abstract: A moisture control device and method has a heat generating source in electrical devices that is powered to operate independent of the electrical device for reducing, minimizing or preventing condensation, nucleation and degradations on electronic parts and circuit boards of the electrical device. A power supply is connected to the heat generating source and a switch connected to the power supply. The switch may be manually operable or automatic and is used for controlling operation of the heat generating source. A sensor senses on/off status of the electrical device and automatically operates the switch in response to the sensing. Power is supplied to the heat generating source when the electrical device powers down and disconnected when the electrical device powers on.

Abstract: A shape memory device includes a shape memory alloy member configured to have at least a portion of the shape memory alloy member be selectively activated. A heating device is coupled to the member and configured to provide heat to a selected section of the member and activate at least a portion of the selected section.

Abstract: A soldering apparatus is provided with a holding section for mounting and holding a board to which reflow solder is previously applied and in which a mounted part is mounted on the reflow solder, a moving section for automatically moving a holding part between a heating position and a board mounted position, a first heater for heating a face having no mounted part of the board at a temperature lower than a solder melting point and a second heater for heating a connection range of the board and the mounted part at a temperature higher than the solder melting point. The soldering apparatus also has a timer for setting a heating time of the first heater and the second heater.

Abstract: A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misalignments or shifting of the heat sink when it contacts the chip. Additionally, the block carries a temperature sensor that is resiliently loaded against a chip which the heat sink engages. A bore mounts the temperature sensor and is also connected to a source of helium to provide a layer of helium between a surface of the heat sink and the adjacent surface of the chip for modifying the thermal coupling between the heat sink and the chip.

Abstract: A gas sensor is disclosed in order to decrease the offset value to a degree in which no trouble occurs in the measurement without causing any reduction of NOx so that the measurement accuracy for NOx is improved. In the gas sensor, NOx contained in a measurement gas introduced into a second chamber is decomposed by means of catalytic action and/or electrolysis to pumping-process oxygen produced by the decomposition so that NOx is measured on the basis of a pumping current flowing through a measuring pumping cell thereby. The gas sensor has the following pattern of a heater. That is, a minute pitch is provided for a pattern at a portion corresponding to the forward end of a sensor element, a coarse pitch is provided for a pattern at a central portion, and a pattern is removed at a portion corresponding to the backward end of the sensor element. Thus, the measuring pumping cell is allowed to have a resistivity of electronic conduction of not less than 1 M&OHgr; after conversion into a resistance value.

Abstract: An improved enclosure for housing communications and electronics equipment comprises a heating element fabricated with a positive temperature coefficient material. The enclosure is particularly useful for housing communications equipment and cell site base stations for cellular telephone systems in the outdoors; it has self-regulating heating capabilities that are not dependent upon voltage parameters, thereby enabling its use in diverse geographic locations. In a preferred embodiment, a plurality of PTC heating elements are used and selectively located adjacent a plurality of circuitry regions. DC power may be used to energize the PTC heaters, and the enclosure may be used for telephone equipment operating with AC or DC power.

Abstract: A distributed activation system for a unitary sheet of electrically conductive or insulative shape memory alloy having a sufficiently small section to limit the lateral flow of heat including at least one heating element disposed on the shape memory alloy sheet for locally heating an adjacent portion of the sheet such that the adjacent portion assumes a predetermined shape when activated to its threshold temperature. The activation system may be configured for shape memory alloy apparatus and related methods in combination with a control system for selectively activating discrete-shape memory alloy portions with various combinations of at least one heating element that receive an adjustable current such that the resultant local heating causes the sheet to assume a desired overall shape. Methods of forming and selectively activating two-dimensional sheets of electrically conducive and insulative shape memory alloy are further provided.

Abstract: An electric heater for a motor vehicle uses heat generated by power semiconductors as the heat source. The heat output by the power semiconductors is used directly for heating. The power semiconductors are regulated by circuit regulators to be able to adjust the heating power continuously. In addition, switching devices are provided which interrupt or shut down the respective branch circuits individually in the event of short circuits in the power semiconductors.

Abstract: A printed circuit board (1) includes a multi-layered structure. One of the layers (3) provides a heating layer such that heat applied to that layer (3) is transferred to electronic components (2) mounted on the board (1). The components (2) can thus be maintained at a suitable operating temperature. The heat can be supplied by ohmic heating of a resistive element within the printed circuit board (1). In an exemplary embodiment of the invention, one of a conducting layer and a ground or earthing layer of the printed circuit board (1) provides the heating layer (3).

Abstract: An electronic device has a case enclosing at least one heat producing component. The at least one heat producing component is capable of transmitting heat energy outside of the case. The electronic device further has a thermal sensor connected to control logic that is capable of sensing the heat energy outside of the case. The control logic is coupled to the at least one heat producing component such that it is capable of regulating the heat energy from the at least one heat producing component in response to the sensed heat energy from the thermal sensor.

Abstract: The deposition strength is enhanced in the thermally deposited portion of thermoplastic resin molded product. In addition, in the test for obtaining the deposition strength, the shape and dimensions that can reach the purposed deposition strength is defined. If the annular groove (21) for fixing the heating element (30) is installed to the periphery of the deposited portion of lower case (20) and the annular rib (11) is fitted into the annular groove (21) is installed to the deposited portion of upper case (10) and if the diameter of heating element (30) to be used is considered to be D, then (a) the interval L between both the lateral walls in the annular groove 21 shall be set to 1.3 D L 1.6 D (b) the wall thickness T of annular rib shall be set to 1.1 D T 1.2 D (c) the height A of outside lateral wall in the annular groove shall be set to A 2 D (d) the height B of inside lateral wall in the annular groove shall be set to B 2 D, and (e) the height H of annular rib shall be set to H A.

Abstract: A heating/cooling apparatus for electronic components of a wireless base station is described. The apparatus includes a heat exchanger having a material-filled chamber and a plurality of extrusions. The chamber is located adjacent to the electronic components. A heater is provided within the chamber. The material within the chamber, which is preferably a liquid, serves to conduct heat from the electronic components to the extrusions. The heater serves to heat the material within the chamber, which in turn conducts that heat to the electronic components, when heat is required to maintain operation of the components with prescribed parameters.

Abstract: An apparatus 10 for controlling a temperature of an electronic device 40, comprising a temperature regulated surface 100 and an actuator 105 adapted to alternately pulse the temperature regulated surface 100 and electronic device 40 between thermally coupled and uncoupled positions, whereby a temperature of the electronic device 40 is controlled.

Abstract: The present invention relates to a heating method and a printed circuit board comprising a heating element which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor between the heating element and the component to be heated, the heat conductor receiving heat generated by the heating element and conducting the heat along the surface of the printed circuit board beneath the lower surface of the component to be heated. Furthermore, the printed circuit board comprises conductor parts which are narrower that the heat conductor, or which have a smaller cross-sectional surface area than does the heat conductor, and which restrict heat transfer away from the heat conductor to a component other than the one to be heated when the heat conductor functions as a ground plane or a signal path.

Abstract: A shape memory device includes a shape memory alloy member configured to have at least a portion of the shape memory alloy member be selectively activated. A heating device is coupled to the member and configured to provide heat to a selected section of the member and activate at least a portion of the selected section.

Abstract: A circuit breaker tank heating insulation unit blanket and circuit breaker insulation blanket wherein the insulation blanket is comprised of an elongated fibrous insulation encased within a fabric that is impervious to the outdoor environment. The insulation blanket is detachably secured over and encircling the circuit breaker tank. The insulation blanket includes an attachment means for detachably securing the insulation blanket to the circuit breaker tank. The heating insulation unit being comprised of an insulation blanket and a heating system wherein the heating system is positioned in contact with the tank of the circuit breaker and encircled by the insulation blanket.

Abstract: A local humidity control system and method are provided for a low temperature electronic device assembly wherein a surface of the low temperature electronic device assembly is maintained above an ambient dew point. The local humidity control system includes a first layer of thermal insulation at least partially surrounding and contacting the cooled electronic device, and a second layer of thermal insulation surrounding the first layer of thermal insulation and the cooled electronic device in which a volume is defined between the first and second layers of insulation. A heater assembly interfaces with the volume to heat the volume to a temperature sufficient to maintain the surface of the cooled electronic device above the ambient dew point.

Abstract: A distributed activation system for a unitary sheet of electrically conductive or insulative shape memory alloy having a sufficiently small section to limit the lateral flow of heat including at least one heating element disposed on the shape memory alloy sheet for locally heating an adjacent portion of the sheet such that the adjacent portion assumes a predetermined shape when activated to its threshold temperature. The activation system may be configured for shape memory alloy apparatus and related methods in combination with a control system for selectively activating discrete shape memory alloy portions with various combinations of at least one heating element that receive an adjustable current such that the resultant local heating causes the sheet to assume a desired overall shape. Methods of forming and selectively activating two-dimensional sheets of electrically conducive and insulative shape memory alloy are further provided.

Abstract: A cabinet for housing telecommunications equipment in outdoor locations includes an enclosure for containing the telecommunications equipment. A subrack is mounted within the enclosure. A duct directs ambient air from outside the cabinet to the subrack. The duct includes an inlet disposed in a lower portion of the cabinet and a subrack inlet plenum disposed immediately below the subrack. A subrack exit plenum is disposed above the electronic subrack for exhausting air heated by the electronics equipment. A fan draws ambient air into the inlet through the duct into the subrack inlet plenum, through the electronic subrack into the subrack exit plenum, and out of the enclosure through the subrack exhaust plenum. A heater is provided for heating inlet air when ambient temperatures are low. The fan and heater are controlled by a thermal controller. At low ambient temperatures, the air flow is maintained constant by the fans and power to the heater is varied to maintain the subrack inlet temperature constant.

Abstract: A housing for a microcell base station is provided that includes independent, selectively controlled heating elements for maintaining a desired range of operational temperatures within the housing. In particular, temperatures within the housing are sensed at different regions so as to provide a more accurate sensing of the temperature within the housing for independent control of the heating elements, despite hot or cold spots in the housing or the like.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus, are disclosed.

Abstract: A preferred embodiment of the housing incorporates an enclosure defining an interior cavity. A thermal bed is supported within the cavity and is configured to retain an optical integrated circuit within the cavity. First and second fiber members also are provided that each include a circuit end for engaging and optically communicating with the optical integrated circuit, and a coupling end for engaging a coupling. Preferably, the couplings are mounted to the enclosure so that an external fiber member can engage a coupling and optically communicate with the optical integrated circuit.

Abstract: An encapsulating device having a material encapsulated therein comprises a asic body provided with a recess for receiving therein the material and formed by microsystem technology in such a way that the material is fully arranged within the recess. A diaphragm extends across the basic body and is implemented in microsystem or thin-film technology. The diaphragm is used for encapsulating the material in the recess of the basic body in such a way that the diaphragm extends in spaced relationship with the material. An electrically actuable heating means is provided for destroying the diaphragm so as to expose the material.

Abstract: A multilayer circuit board and an associated heating apparatus is provided for heating electrical components. The multilayer circuit board includes a trace layer having at least one electrical trace terminating with a contact pad that is positioned to electrically contact a respective lead of an electrical component mounted upon the multilayer circuit board. The multilayer circuit board also includes a heating layer disposed in thermal contact with the electrical component mounted upon the multilayer circuit board. The heating layer includes a first electrically resistive heating element disposed upon an insulating substrate in general alignment with the electrical component mounted upon the multilayer circuit board. The electrically resistive heating element provides heat to maintain the operating temperature of the electrical component within a desired range.

Abstract: An inventive system for attaching a die to the die pad of a lead frame incorporates a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework. The resistive heating circuit is also incorporated into a Thin Small Outline Package (TSOP) between the TSOP's base and die cover. When the heating circuit in the TSOP heats up, it either cures an epoxy adhesive between the base and die cover to attach the die cover to the base, or it loosens the adhesive to detach the die cover from the base so a die inside the TSOP can be reworked. Thus, the inventive system eliminates the need for cumbersome curing ovens and, at the same time, provides a previously unavailable ability to rework certain semiconductor dice after they are packaged.

Abstract: A cabinet for housing telecommunications equipment in outdoor locations includes an enclosure for containing the telecommunications equipment. A subrack is mounted within the enclosure. A duct directs ambient air from outside the cabinet to the subrack. The duct includes an inlet disposed in a lower portion of the cabinet and a subrack inlet plenum disposed immediately below the subrack. A subrack exit plenum is disposed above the electronic subrack for exhausting air heated by the electronics equipment. A fan draws ambient air into the inlet through the duct into the subrack inlet plenum, through the electronic subrack into the subrack exit plenum, and out of the enclosure through the subrack exhaust plenum. A heater is provided for heating inlet air when ambient temperatures are low. The fan and heater are controlled by a thermal controller. At low ambient temperatures, the air flow is maintained constant by the fans and power to the heater is varied to maintain the subrack inlet temperature constant.

Abstract: The present invention relates to a method and device for functional protection of connectors where a heat-emitting means heats contact pins while certain selected parts of the pins are preferably covered with heat-insulating material (12) which furthermore can be contamination- and gas-tight. In this way contamination of the contact pins and condensation of moisture is counteracted which leads to a longer life because of less corrosion and leakage currents being prevented. These problems are specially common in connectors for electronic constructions which are cooled with exterior air and/or are used outdoors.

Abstract: There is provided a method of patterning a substrate with an atomic mask having a mask substrate and first atoms adsorbed on the mask substrate, the first atoms forming a mask pattern having a one-atomic thickness, including the steps, in sequence, of (a) depositing adatoms over a surface of a substrate to be patterned, the adatoms having low reactivity with second atoms of which the substrate is composed, and (b) placed the atomic mask close to the substrate in such a distance that the first atoms form a chemical bond with the adatoms, so that adatoms located nearest to the first atoms are desorbed out of the substrate to form a pattern on the substrate, the pattern being defined as an area where none of the adatoms exists. In accordance with the above mentioned method, it is possible to form a pattern on the sub-nanometer or nanometer order with high accuracy and in a short period of time, and it is also possible to repeatedly form the same pattern by using the atomic mask.

Abstract: A semiconductor device handler with a temperature controlled test area. Temperature control is provided in part through the use of temperature controlled air forced across the test area. For heating the test area, electrical resistance heaters are uniformly distributed through the test area and are controlled to provide the desired temperature. The handler has a close pitch between adjacent sockets such that is not possible to distribute refrigeration elements over the test area. Instead, a refrigeration element is placed on one side of the test area. To prevent formation of an undesirable temperature gradient, heat is injected at a specific location in the test area.

Abstract: A temperature sensor for the liquid crystal portion of a liquid crystal display assembly which includes a thin layer of transparent conductive material which is spread across the viewing area of the display. This layer of transparent conductive material can provide heat to warm up the display when a large voltage is put across it, and can also be used to measure liquid crystal temperature. It is known that the resistance of materials such as indium tin oxide (ITO) changes at a known rate with respect to temperature. By using this transparent layer of material in the stacked elements of a liquid crystal display assembly, an accurate reading of the liquid crystal temperature can be made.

Abstract: The present invention is based on the discovery that different carbon components are required in an electrically conductive exothermic coating in order to avoid break-down and especially if a constant temperature is to be maintained by the coating (self-regulating embodiment). It has been discovered that graphite permits heat to be generated by the coating when energized with a.c. power; however, the heat tends to run away which results in a break down of the coating. Carbon, on the other hand, permits more electrical conductivity by the coating. Both the graphite and carbon should be flake-like in structure. Such a combination of flake-like graphite and carbon pigments in particles sizes of about 5.mu. to 500.mu. should be used. The amount of such pigments should range from about 10 and 20 weight-% based on the non-volatile solids content of the coating formulation (e.g., without solvent and other components that evolve from the coating during drying and curing operations).

Abstract: A spacecraft electronics equipment module that is thermally independent of a core spacecraft structure to which it can be mounted. The module takes the form of a thermal radiation panel on which electronic components are directly mounted. The panel is attachable to the core structure and includes its own double-sided radiator for cooling of the electronics components, an integral heater for raising the temperature is needed, a thermal controller, for automatically regulating the temperature of the module components, and heatpipes for distributing the heat more uniformly across the radiating surfaces.

Abstract: A control apparatus controls a vehicular air-conditioning system to control a fuel-combustion heater for producing combustion heat to heat a heating medium in a heating medium circuit which heats air flowing through a duct having air outlets openable into a passenger compartment, through heat exchange between the heating medium and the air with a heat exchanger disposed in the duct. The control apparatus has a shutdown controller for temporarily shutting down the fuel-combustion heater and an extinguishing controller for extinguishing the fuel-combustion heater based on a signal from the shutdown controller. The shutdown controller includes a shutdown signal entering unit for entering a shutdown signal to temporarily shut down the fuel-combustion heater and a shutdown signal canceler for canceling the shutdown signal in response to a canceling signal entered to cancel the shutdown of the fuel-combustion heater within a predetermined period of time after the shutdown signal has been entered.

Abstract: A shape memory device includes a shape memory alloy member configured to have at least a portion of the shape memory alloy member be selectively activated. A heating device is coupled to the member and configured to provide heat to a selected section of the member and activate at least a portion of the selected section.