Muffle-type Enclosure Patents (Class 219/390)
  • Patent number: 11521868
    Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: December 6, 2022
    Assignees: BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD, MATTSON TECHNOLOGY, INC.
    Inventors: Rolf Bremensdorfer, Johannes Keppler, Michael X. Yang, Thorsten Hülsmann
  • Patent number: 11492698
    Abstract: A pedestal for a thermal treatment chamber is disclosed that includes a body consisting of an optically transparent material. The body includes a first plate with a perforated surface having a plurality of nozzles formed therein, a first portion of the plurality nozzles formed in the body at an angle that is orthogonal to a plane of the first plate, a second portion of the plurality of nozzles formed in the body in an azimuthal orientation and at an acute angle relative to the plane of the first plate, and a third portion of the plurality nozzles formed in the body in a radial orientation and at an acute angle relative to the plane of the first plate.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: November 8, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Wolfgang R. Aderhold, Abhilash J. Mayur
  • Patent number: 11450540
    Abstract: An apparatus for treating a substrate includes a housing having a treatment space therein, a plate that supports the substrate in the housing, a heating unit having a heating wire that is provided inside the plate and that heats the substrate, a main temperature sensor that directly measures temperatures of the plate, and an auxiliary temperature sensor that measures temperatures of the heating wire.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: September 20, 2022
    Assignee: Semes Co., Ltd.
    Inventors: Donghyuk Seo, Sung Yong Lee
  • Patent number: 11420228
    Abstract: The present disclosure provides an apparatus for removing bubbles in a flexible substrate. The flexible substrate includes a baseplate and a polyimide layer coated on the baseplate. The apparatus includes a chamber including a top wall, a sidewall, and a bottom wall, wherein the top wall, the sidewall, and the bottom wall define an accommodation space; a heating plate disposed in the accommodation space; and a cooling conduit embedded in at least one of the top wall and the sidewall of the chamber.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: August 23, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Haiyang Shen
  • Patent number: 11384982
    Abstract: A dual-purpose sintering furnace including a furnace body having a furnace chamber, a first furnace mouth and a second furnace mouth which are communicated with the furnace chamber, a furnace door hinged to the furnace body and configured for closing the first furnace mouth, a blocking member lap-jointed inside the furnace chamber and configured for blocking the second furnace mouth, a sample stage, an ejection rod fixedly arranged on a sample placement face of the sample stage, a lifting device configured for driving the sample stage to raise or lower, so that the ejection rod pushes the blocking member until the second furnace mouth is opened, and so that the sample stage enters the furnace chamber through the second furnace mouth. The dual-purpose sintering furnace can complete a large amount of sintering as conventional sintering and also implement rapid sintering.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: July 12, 2022
    Assignee: LIAONING UPCERA CO., LTD.
    Inventors: Lingling He, Yao Xu, Ying Guo, Huailing Li, Jialing Li
  • Patent number: 11333290
    Abstract: A hollow-cylindrical heat shield includes at least one graphite foil and at least one fiber structure, preferably a wound fiber structure, disposed on the outer side of the at least one graphite foil. The (wound) fiber structure has a degree of coverage of less than 100%. A high-temperature furnace or gas converter having a heat shield is also provided.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: May 17, 2022
    Assignee: SGL Carbon SE
    Inventors: Sebastian Frommelt, Markus Schroeder, Martin Reinthaler, Peter Pfaller, Karl Hingst
  • Patent number: 11289344
    Abstract: When a carrier storing a plurality of dummy wafers therein is transported into a heat treatment apparatus, the carrier is registered as a dummy carrier exclusive to the dummy wafers. A dummy database in which a treatment history of each of the dummy wafers is associated with the carrier is held in a storage part. The treatment history of each of the dummy wafers registered in the dummy database is displayed on a display part of the heat treatment apparatus. An operator of the heat treatment apparatus views the displayed information to thereby appropriately grasp and manage the treatment history of each of the dummy wafers.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: March 29, 2022
    Assignee: SCREEN HOLDINGS CO., LTD.
    Inventors: Tomohiro Ueno, Kazuhiko Fuse, Mao Omori
  • Patent number: 11234296
    Abstract: A heat treatment apparatus includes a processing container extended in a vertical direction; a heater provided around the processing container; a temperature sensor provided along a longitudinal direction of the processing container either in the processing container or in a space between the processing container and the heater; and a pair of first partitions provided in the space across a half line that extends from a central axis of the processing container and passes through the temperature sensor, and extending along the longitudinal direction of the processing container.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 25, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masayoshi Masunaga, Yutaka Sasaki
  • Patent number: 11201054
    Abstract: According to one aspect of the technique described herein, there is provided a technique including: forming a film on a substrate by performing a cycle a predetermined number of times, wherein the cycle includes sequentially performing: (a) supplying source gas to a substrate accommodated in a reaction tube; (b) exhausting the source gas remaining in the reaction tube through an exhaust pipe connected to the reaction tube; (c) supplying a reactive gas reacting with the source gas to the substrate; and (d) exhausting the reactive gas remaining in the reaction tube through the exhaust pipe, wherein at least in (a) and (c), a temperature of the reaction tube is set to a first temperature lower than a thermal decomposition temperature of the source gas and higher than a condensation temperature of the source gas and a temperature of the exhaust pipe is set to a second temperature equal to or higher than the first temperature.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: December 14, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventor: Noriyuki Isobe
  • Patent number: 11195732
    Abstract: Methods and systems for providing a short-duration anneal are provided. In one example, the methods and systems can include placing a workpiece in a thermal processing chamber. The workpiece can include a device side surface and an opposing non-device side surface. The methods and systems can include delivering an energy pulse from at least one heat source to the non-device side surface of the workpiece. In another example, the methods and systems can include depositing a layer of semiconductor material onto the semiconductor workpiece at the device side of the semiconductor workpiece. The methods and systems can include doping the layer of semiconductor material with a doping species and annealing the layer for crystallization using solid phase epitaxy.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: December 7, 2021
    Inventor: Paul J. Timans
  • Patent number: 11183403
    Abstract: A semiconductor wafer held by a susceptor in a chamber is irradiated with halogen light radiated from a plurality of halogen lamps to be heated. A stainless steel block having an opening in a cylindrical shape is provided between the chamber and the halogen lamps. This reduces a distance from a light emitting portion in a light source region in which the plurality of halogen lamps is arranged, throughout the entire circumference of the opening in a cylindrical shape, so that the amount of reflected light from the inner wall surface of the opening toward the peripheral portion of the semiconductor wafer becomes uniform. This causes a uniform increase in illuminance of the peripheral portion of the semiconductor wafer, where temperature tends to decrease, at the time of light irradiation from the halogen lamps, so that in-plane temperature distribution of the semiconductor wafer can be made uniform.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: November 23, 2021
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Masashi Furukawa, Yoshio Ito
  • Patent number: 11177146
    Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume; a first heating device configured to heat a substrate to a first temperature; a carrier configured to support the substrate while the substrate is being heated using the first heating device to the first temperature and transfer the substrate to and from each of the first processing volume and the second processing volume; a second heating device configured to maintain the substrate at or near the first temperature; and a chuck configured to receive the substrate from the carrier, and comprising an outer zone and an inner zone having independent variable pressure control to apply a chucking force at the outer zone that is different from a chucking force provided at the inner zone.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: November 16, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Puay Han Tan
  • Patent number: 11166348
    Abstract: In one embodiment of the invention, there is provided a tool for annealing a magnetic stack. The tool includes a housing defining a heating chamber; a holding mechanism to hold at least one wafer in a single line within the heating chamber, a heating mechanism to heat the at least one wafer; and a magnetic field generator to generate a magnetic field whole field lines pass through the single line of wafers during a magnetic annealing process; wherein the holding mechanism comprises a wafer support of holding the single line of wafers between the heating mechanism and the magnetic field generator.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 2, 2021
    Assignee: III Holdings 1, LLC
    Inventor: Krishnakumar Mani
  • Patent number: 11154386
    Abstract: A dental furnace for firing dental-ceramic compounds comprises a firing chamber for receiving ceramic elements to be fired. Further, a heating device for heating and firing the ceramic element is provided. The heating device comprises at least one heating element for producing IR radiation in the range of 0.8-5 ?m.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: October 26, 2021
    Assignee: VITA ZHAN FABRIK H. RAUTER GMBH & CO. KG
    Inventor: Thomas Baholzer
  • Patent number: 11089657
    Abstract: A semiconductor wafer held by a holding part in a chamber is irradiated and heated with halogen light emitted from a plurality of halogen lamps. A cylindrical louver and an annular light-shielding member, both made of opaque quartz, are provided between the halogen lamps and the semiconductor wafer. The outer diameter of the light-shielding member is smaller than the inner diameter of the louver. Light emitted from the halogen lamps and passing through a clearance between the inner wall surface of the louver and the outer circumference of the light-shielding member is applied to a peripheral portion of the semiconductor wafer where a temperature drop is likely to occur. On the other hand, light travelling toward an overheat region that has a higher temperature than the other region and appears in the surface of the semiconductor wafer when only a louver is installed is blocked off by the light-shielding member.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: August 10, 2021
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Makoto Abe, Hikaru Kawarazaki, Hideaki Tanimura, Masashi Furukawa
  • Patent number: 11067589
    Abstract: An automatic analysis device is provided with a storage chamber for adjusting the temperature of and storing a container in which liquid is stored, an opening provided in a portion of the storage chamber, and a loader mechanism for bringing the container in and out of the storage chamber by moving the container through the opening, and is characterized in that the loader mechanism and storage chamber are closed by an elastic body. In the present invention, attaching a sealing member for sealing to an upper part from among overlapping parts makes it difficult for debris and dust to adhere to the sealing member and makes it possible to maintain the sealed state of a reagent storage chamber over a long period of time.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: July 20, 2021
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Yoshiteru Hirama, Tatsuya Fukugaki
  • Patent number: 10995992
    Abstract: Disclosed is a sintering furnace comprising a furnace body and a lifting device, wherein the furnace body comprises a furnace chamber (10) and a furnace mouth (20), the furnace chamber (10) is connected with the furnace mouth (20), wherein the sintering furnace further comprises a sealing member (30) provided at the lifting device; when the sintering furnace is in a loading or unloading condition, the sealing member (30) blocks the furnace mouth (20). When the sintering furnace is in an unloading condition, the sealing member (30) can block the furnace mouth (20), the furnace chamber (10) does not contact with the outside directly, thus the temperature in the furnace chamber (10) will not drop sharply, and the service life of the sintering furnace will be increased.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 4, 2021
    Assignee: LIAONING UPCERA CO., LTD
    Inventors: Lingling He, Wanting Xia, Ying Guo, Yingying Bai, Chengwei Han, Dapeng Yuan
  • Patent number: 10971411
    Abstract: A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: April 6, 2021
    Assignee: TEL Epion Inc.
    Inventors: Joshua LaRose, Brian D. Pfeifer, Vincent Lagana-Gizzo, Noel Russell
  • Patent number: 10943847
    Abstract: A semiconductor device includes a semiconductor chip having an electrode portion and a joining member electrically connected to the electrode portion to allow an electric current to flow in the semiconductor chip through the joining member. The joining member contains a protective material that has a positive temperature coefficient of resistivity, and the positive temperature coefficient of resistivity has a larger value in a temperature range higher than a threshold temperature than in a temperature range lower than the threshold temperature, the threshold temperature being a predetermined temperature lower than a breakdown temperature of the semiconductor chip. The electrode portion of the semiconductor chip may contain the protective material.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: March 9, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuhiko Sugiura, Tomohito Iwashige, Jun Kawai
  • Patent number: 10814503
    Abstract: A heat dissipating system of movable robot is provided. The heat dissipating system includes a movable robot and at least one wind resistance structure. The movable robot includes a housing, at least one airflow passage and plural first air holes. The housing defines an inner space, the airflow passage is disposed in the inner space, and the first air holes are disposed on the housing and are in communication with the airflow passage respectively. When the movable robot moves, an air current is generated accordingly. The air current partially flows into the airflow passage through the first air hole acted as an inlet, and the air current in the airflow passage is released from the first air hole acted as an outlet. The wind resistance structure is configured for guiding the air current into the first air hole acted as the inlet.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: October 27, 2020
    Assignee: DELTA ELECRTONICS, INC.
    Inventors: Chi-Huan Shao, Chi-Shun Chang, Hung-Sheng Chang
  • Patent number: 10816730
    Abstract: An optical fiber coating removal device which heats a coating of an optical fiber with a heater and removes the coating with a blade includes a communicator which receives information based on optical fiber type information to specify an optical fiber type selected by a user from among a plurality of optical fiber types, transmitted from an external device to which the optical fiber type information has been input, and a heater which heats a coating of an optical fiber using the received information based on the optical fiber type information. The heater can heat a coating under a plurality of conditions according to the optical fiber type information.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: October 27, 2020
    Assignee: Fujikura Ltd.
    Inventor: Noriyuki Kawanishi
  • Patent number: 10786982
    Abstract: A method for separating different types of material layers of a composite component that has at least one material layer that is transparent for visible light and at least one further material layer, is provided, wherein the light from an external source falls through the at least one transparent material layer into the at least one further material layer and there is at least partially absorbed. With the help of at least one gas discharge lamp, the light-absorbing material layer is heated in less than one second to separate material layers of the composite component. A device that can be used for this method comprises at least one separation chamber and therein at least one gas discharge lamp suitable for irradiation.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: September 29, 2020
    Inventors: Leander Kilian Gross, Mascha Elly Gross
  • Patent number: 10757760
    Abstract: An infrared heater 10 includes a heating element 40 that emits infrared radiation when heated and that is capable of absorbing infrared radiation in a predetermined reflection wavelength range, and a filter unit 50 that is disposed so as to be separated by a first space 47, which is open to an outside space, from the heating element 40. The filter unit 50 includes one or more transmission layers (a first transmission layer 51) that transmit at least a part of the infrared radiation from the heating element 40, and a reflective section (the first transmission layer 51) that reflects infrared radiation in the reflection wavelength range toward the heating element 40.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: August 25, 2020
    Assignee: NGK Insulators, Ltd.
    Inventors: Takeshi Komaki, Taiki Kinnan, Yoshio Kondo
  • Patent number: 10636676
    Abstract: When pressure in a chamber is once reduced lower than that when a flash of light is emitted and is maintained, after a flash lamp irradiates a semiconductor wafer accommodated in the chamber with the flash of light, a portion in the chamber, where gas is liable to remain, is eliminated. Then, when a flow rate of nitrogen gas to be supplied into the chamber is increased to discharge gas in the chamber, particles flying in the chamber due to flash irradiation can be smoothly discharged. As a result, the particles flying in the chamber can be prevented from being attached to an additional semiconductor wafer.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: April 28, 2020
    Assignee: SCREEN HOLDINGS CO., LTD.
    Inventors: Yukio Ono, Kaoru Matsuo, Kazuhiko Fuse
  • Patent number: 10596286
    Abstract: The present invention relates to a device that eliminates germs and bacteria from your hands. The device is especially designed to achieve total asepsis of the hands of people working and/or should have access to certain sectors of industries manufacturing and/or fractionation of food, medicinal products, testing laboratories industry biological, chemical industries in general, operating rooms, etc. where it is required to maintain strict hygiene and asepsis conditions.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: March 24, 2020
    Inventor: Carlos Maxwell Casares
  • Patent number: 10518986
    Abstract: A method for conveying a reaction tube unit including a vertical reaction tube and a gas supply pipe provided at a distance from an inner wall of the vertical reaction tube along a longitudinal direction thereof, the method includes: arranging a buffer inside the reaction tube between the inner wall and the gas supply pipe to alleviate a collision; placing the reaction tube unit attached with the buffer on a carriage via a vibration isolator; and conveying the reaction tube unit by moving the carriage.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: December 31, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Masahiro Kobayashi, Tamotsu Hatakeyama, Harunari Hasegawa, Michihiro Takahashi, Daisuke Yamanaka
  • Patent number: 10522333
    Abstract: A vacuum processing apparatus includes a vacuum processing chamber, an upper electrode, a lower electrode, a first high-frequency power source, a second high-frequency power source, a first matching box, a second matching box, a copper plate for connecting an electrode shaft of the lower electrode with the second matching box, a drive base on which the electrode shaft of the lower electrode and the second matching box are mounted, a drive unit for ascending or descending the drive base, and an exhaust unit disposed at a position equally distanced from an exhaust outlet by a distance.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: December 31, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yusaku Sakka, Hiromichi Kawasaki, Tsutomu Iida, Hiromitsu Terauchi, Masahiro Nagatani, Yasushi Sonoda
  • Patent number: 10490465
    Abstract: A susceptor is preheated through light irradiation by a halogen lamp before the first semiconductor wafer of a lot as a processing target is transferred into a chamber. The temperature of the susceptor is measured by a radiation thermometer. A control unit is configured to control the output of the halogen lamp so that the temperature of the susceptor reaches a stable temperature based on a result of the measurement of the temperature of the susceptor by the radiation thermometer. The stable temperature of the susceptor is the temperature of the susceptor when the temperature of the susceptor is risen to a constant temperature by continuously performing light irradiation heating on a plurality of semiconductor wafers in the chamber without heating the susceptor.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: November 26, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Yukio Ono
  • Patent number: 10488115
    Abstract: A multi-chamber heat treatment device according to the present disclosure in which heating chambers are disposed with an intermediate transport chamber interposed therebetween in a top view, and a treatment object is stored in a heating chamber via the intermediate transport chamber, wherein the multi-chamber heat treatment device includes a gas cooling chamber which cools the treatment object using a cooling gas; and a cooling gas circulation device which includes an gas inlet and a gas outlet.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: November 26, 2019
    Assignees: IHI CORPORATION, IHI MACHINERY AND FURNACE CO., LTD.
    Inventors: Kazuhiko Katsumata, Kaoru Isomoto, Akira Nakayama
  • Patent number: 10415136
    Abstract: A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: September 17, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Motoya Takewaki, Tetsuya Kosugi, Masaaki Ueno
  • Patent number: 10385474
    Abstract: A vapor phase growth apparatus according to an embodiment includes, n reactors performing a deposition process for a plurality of substrates at the same time, a first main gas supply path distributing a predetermined amount of first process gas including a group-III element to the n reactors at the same time, a second main gas supply path distributing a predetermined amount of second process gas including a group-V element to the n reactors at the same time, a controller controlling a flow rate of the first and second process gas, on the basis of control values of the flow rates of the first and second process gas supplied to the n reactors, and independently controlling predetermined process parameter independently set for each of the n reactors on the basis of control values, rotary drivers, and a heater.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: August 20, 2019
    Assignee: NuFlare Technology, Inc.
    Inventors: Yuusuke Sato, Hideshi Takahashi, Hideki Ito, Takanori Hayano
  • Patent number: 10365256
    Abstract: A flexible, foldable light-weight gas chromatography transfer line suitable for connecting a gas chromatograph (GC) to a spectrometer, such as a mass spectrometer or optical spectrometer, in particular to the ion source of the spectrometer, such as an inductively coupled plasma (ICP) ion source. The transfer line has a heating arrangement that allows maintaining an even temperature profile, which improves quality of spectra. The transfer line has low thermal mass and the heating can be controlled with the control unit of the GC.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: July 30, 2019
    Assignee: Thermo Fisher Scientific (Bremen) GmbH
    Inventors: Antonella Guzzonato, Heinz Mehlmann, Hans-Juergen Schlueter
  • Patent number: 10354908
    Abstract: A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location, and unloading the wafer from the robot arm.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: July 16, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzung-Chen Wu, Tzu Wei Yu, Cheng Yu Wu
  • Patent number: 10347512
    Abstract: Light is applied for preheating from a halogen lamp to a lower surface of a semiconductor wafer supported on a susceptor within a chamber. Thereafter, flash light is applied for flash heating from a flash lamp to an upper surface of the semiconductor wafer. High-temperature treatment gas heated by a heater is supplied into the chamber to preheat a structure inside the chamber including a susceptor before heat treatment for an initial semiconductor wafer of a lot starts. By raising the temperature of the structure inside the chamber to a temperature substantially equivalent to a temperature of the structure during steady treatment, all semiconductor wafers constituting the lot are supportable on the susceptor maintained at a constant temperature without the necessity of dummy running. Accordingly, a temperature history is equalized for all the semiconductor wafers.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: July 9, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hideaki Tanimura, Kazuhiko Fuse
  • Patent number: 10340174
    Abstract: A mounting table includes an electrostatic chuck having a mounting surface and a backside opposite to the mounting surface, a first through hole being formed in the mounting table; a base joined to the backside of the electrostatic chuck and having a second through hole in communication with the first through hole; a lifter pin which is received in a pin hole formed by the first through hole and the second through hole, the lifter pin being movable up and down to protrude beyond and retract below the mounting surface. An upper end portion of the lifter pin has a shape in which a diameter decreases toward a lower end of the lifter pin to correspond to a shape of the upper end portion of the pin hole. The upper end portion of the lifter pin is in surface contact with the upper end portion of the pin hole.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: July 2, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shin Yamaguchi, Daisuke Hayashi, Yasuhisa Kudo
  • Patent number: 10297514
    Abstract: A susceptor is preheated through light irradiation by a halogen lamp before the first semiconductor wafer of a lot as a processing target is transferred into a chamber. The temperature of the susceptor is measured by a radiation thermometer. A control unit is configured to control the output of the halogen lamp so that the temperature of the susceptor reaches a stable temperature based on a result of the measurement of the temperature of the susceptor by the radiation thermometer. The stable temperature of the susceptor is the temperature of the susceptor when the temperature of the susceptor is risen to a constant temperature by continuously performing light irradiation heating on a plurality of semiconductor wafers in the chamber without heating the susceptor.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: May 21, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Yukio Ono
  • Patent number: 10283379
    Abstract: Apparatus and methods for heating and cooling a plurality of substrate wafers are provided. LED lamps are positioned against the back sides of a plurality of cold plates. In some embodiments, wafers are supported on a wafer lift which can move all wafers together. In some embodiments, wafers are supported on independent lift pins which can move individual wafers for heating and cooling. Some embodiments of the disclosure provide for decreased time between wafer switching in a processing chamber.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: May 7, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Jason M. Schaller, Robert Brent Vopat, Paul E. Pergande, Benjamin B. Riordon, David T. Blahnik, William T. Weaver
  • Patent number: 10278426
    Abstract: A vaporizer with a modular body design is disclosed. The vaporizer may include an atomizer with a bowl and a heating element. The heating element may be formed of glass. The vaporizer may be formed with an open architecture, such that various components may be interchangeably removed or modified. The vaporizer may be modified with different airways, batteries, atomizers or other suitable devices. The vaporizer may be formed with a slim profile to fit unobtrusively into a pocket.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: May 7, 2019
    Inventor: Alexander Gadas
  • Patent number: 10273572
    Abstract: A heating chamber and a semiconductor processing apparatus are provided. The heating chamber includes: a heating barrel (17) disposed in the heating chamber and located above a substrate transferring window; an annular heating device (15) disposed around an inner side of the heating barrel and configured to radiate heat from a periphery to an interior of the heating barrel; a substrate cassette (14) configured to bear multiple layers of substrates and allow the multiple layers of substrates to be arranged at intervals in an axial direction of the heating barrel; and a substrate cassette lifting device (13) configured to drive the substrate cassette to move up into an internal spare defined by the annular heating device, or move down to a position corresponding to the substrate transferring window.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: April 30, 2019
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Qiang Jia, Mengxin Zhao
  • Patent number: 10262819
    Abstract: Disclosed is a vacuum circuit breaker (1) including a vacuum interrupter (3) accommodated in a ground tank (2) filled with insulating gas. At least one of a fixed electrode (10) and a movable electrode (11) of the vacuum interrupter (3) uses an electrode material in which particles containing a solid solution of a heat resistant element and Cr are finely and uniformly dispersed and in which Cu textures as a high conductive component are finely and uniformly dispersed. The electrode material contains 20 to 70% by weight of Cu, 1.5 to 64% by weight of Cr and 6 to 76% by weight of the heat resistant element relative to a weight of the electrode material. The particles of the solid solution in the electrode material have an average particle size of 20 ?m or smaller.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: April 16, 2019
    Assignee: MEIDENSHA CORPORATION
    Inventors: Kazuhiro Nagatake, Kaoru Kitakizaki, Keita Ishikawa, Shota Hayashi, Kosuke Hasegawa
  • Patent number: 10254046
    Abstract: Disclosed is a magnetic annealing apparatus including a processing container having a horizontally-elongated tubular shape and configured to perform a magnetic annealing processing on a plurality of substrates accommodated therein in a magnetic field; a heating unit provided to cover at least a part of a surface of the processing container that extends in a longitudinal direction, from outside; a magnet provided to cover the heating unit from the outside of the heating unit; a substrate holder configured to hold the plurality of substrates within the processing container; and a heat shielding plate provided to surround a part of the substrate holder.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: April 9, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Mitsuru Yamazaki, Barry Clarke, Ian Colgan, George Eyres, Ioan Domsa
  • Patent number: 10237917
    Abstract: A heater according to an embodiment of the present disclosure includes a heater element including a flat heat generating body, a linear slit formed in a linearly opened manner with one end arranged at an outer circumference of the heat generating body and the other end arranged in the turnover portion of the heat generating body, and a turnover portion formed in an opened manner to continue from the other end, an opening diameter of the turnover portion being larger than a slit width of the linear slit, the heater element generating heat by electrification, and a pair of electrodes connected to a predetermined face of the heater element, a voltage being applied on the electrodes during electrification of the heater element.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: March 19, 2019
    Assignee: NuFlare Technology, Inc.
    Inventors: Hiroshi Furutani, Yuusuke Sato, Kunihiko Suzuki
  • Patent number: 10236224
    Abstract: An apparatus and a method for reducing wafer warpage are provided. The method includes positioning a mold wafer structure on a stage. The mold wafer structure includes a mold layer and a stack structure positioned on a wafer. The stage includes a center region and an edge region adjacent the center region. Warpage information of the mold wafer structure is obtained. The mold wafer structure is heated by the stage based on the warpage information to reduce a warpage of the mold wafer structure. A temperature of the center region and a temperature of the edge region are different from each other. An operation test is performed on the stack structure.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Chang Ho Kim
  • Patent number: 10186446
    Abstract: An electrostatic chuck for clamping workpieces having differing diameters is provided. A central electrostatic chuck member associated with a first workpiece and a first peripheral electrostatic chuck member associated with a second workpiece are provided. An elevator translates the first peripheral electrostatic chuck member with respect to central electrostatic chuck member between a retracted position and an extended position. In the retracted position, the first workpiece contacts only the first surface. In the extended position, the second workpiece contacts the first surface and the second surface. A first peripheral shield generally shields the second surface when the first peripheral electrostatic chuck member is in the retracted position. Additional peripheral electrostatic chuck members and peripheral shields can be added to accommodate additional workpiece diameters.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 22, 2019
    Assignee: Axcelis Technology, Inc.
    Inventor: Allan D. Weed
  • Patent number: 10163670
    Abstract: The present invention relates to a device for heat treating an object, in particular a coated substrate, with an in particular gas-tightly sealable housing that encloses a hollow space, wherein the hollow space has a separating wall, by which the hollow space is divided into a process space for accommodating the object and an intermediate space, wherein the separating wall has one or a plurality of openings, which are implemented such that the separating wall acts as a barrier for the diffusion out of the process space into the intermediate space of a gaseous substance generated in the process space by the heat treatment of the object. The housing has at least one housing section coupled to a cooling device for its active cooling, wherein the separating wall is arranged between the object and the coolable housing section. The invention further relates to the use of a separating wall as a diffusion barrier in a device for heat treating an object as well as a corresponding method for heat treating an object.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: December 25, 2018
    Assignee: Bengbu Design & Research Institute for Glass Industry
    Inventors: Martin Fürfanger, Stefan Jost, Jörg Palm
  • Patent number: 10126790
    Abstract: Embodiments described herein generally relate to a temperature control system for a substrate support assembly disposed in a substrate processing system. In one embodiment, a temperature control system is disclosed herein. The temperature control system includes a remote fluid source and a main frame system. The remote fluid source includes a first reservoir and a second reservoir. The main frame system includes a first fluid loop and a second fluid loop. The first fluid loop is coupled to, and configured to receive a first fluid from, the first reservoir. The second fluid loop is coupled to and configured to receive a second fluid from the second reservoir. The first proportioning valve has a first inlet in communication with the first fluid loop and a second inlet in communication with the second fluid loop. The first proportioning valve has an outlet configured to flow a third fluid.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: November 13, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventor: John M. White
  • Patent number: 10109509
    Abstract: A semiconductor manufacturing apparatus, which is provided with a first storage chamber that stores a substrate to be processed, a second storage chamber that stores a dummy substrate, a substrate support apparatus with a heating function that supports a substrate, and a substrate transport apparatus that transports the substrates between the storage chambers and the substrate support apparatus, is further provided with a controller which, in the event that the temperature of substrate processing in a preceding substrate processing step is higher than the temperature of substrate processing in a subsequent substrate processing step, operates the substrate transport apparatus to transport the dummy substrate, whose temperature is lower than the temperature of substrate processing in the preceding substrate processing step, prior to carrying out the subsequent substrate processing step.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 23, 2018
    Assignee: NISSIN ION EQUIPMENT CO., LTD.
    Inventor: Kunifumi Takaoka
  • Patent number: 10109514
    Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: October 23, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kim Vellore, Dinesh Kanawade, Stephen Moffatt, Aaron Miller, Leonid M. Tertitski, Norman L. Tam, Michael Liu, Colin Fox
  • Patent number: 10101088
    Abstract: The invention relates to a sintering furnace for components consisting of sintering material, especially dental components and in particular components consisting of ceramic, and a method for sintering such components. The sintering furnace 1 comprises a heatable furnace chamber 2 for the component 9 to be sintered, the furnace chamber 2 having a wall section 6 to be opened for inserting the component 9 to be sintered into the furnace chamber 2. Drive means 10 are provided for mechanized opening and closing of the wall section 6, and a control 11 is provided for the drive means 10 that has an actuation element 12 for the drive means 10. Furthermore, a heating device 5 for the furnace chamber 2 is provided, and the control 11 causes the furnace chamber 2 to be heated. Actuating the control element 12 triggers the loading sequence of the control 11, and the drive means 10 are automatically actuated by the control 11 corresponding to the loading sequence.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: October 16, 2018
    Assignee: Sirona Dental Systems GMBH
    Inventors: Christian Schmidt, David Figge, Siegfried Gleditzsch, Peter Fornoff
  • Patent number: 10006716
    Abstract: The invention concerns a dental furnace, with a furnace base and with a furnace hood, wherein the furnace hood includes a firing chamber for the accommodation of dental restorations, with a temperature sensor that records the temperature of the dental restoration and which is connected to a control device which controls the dental furnace, and the dental furnace (10) includes a drive unit (18) for the furnace hood (16) and the control device (30) controls the drive unit (18) based on the temperature recorded by the temperature sensor (20), namely opens the furnace hood.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 26, 2018
    Assignee: Ivoclar Vivadent AG
    Inventor: Rudolf Jussel