Muffle-type Enclosure Patents (Class 219/390)
  • Patent number: 8796589
    Abstract: In a first aspect, a first substrate processing system is provided that includes (1) a chamber having a plurality of opening through which a substrate may be transported; (2) a substrate carrier opener coupled to a first one of the plurality of openings; (3) a thermal processing chamber coupled to a second one of the plurality of openings; and (4) a wafer handler contained within the chamber, having a substrate clamping blade and a blade adapted to transport high temperature substrates.
    Type: Grant
    Filed: July 13, 2002
    Date of Patent: August 5, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Efrain Quiles, Mehran Behdjat, Robert B. Lowrance, Michael Robert Rice, Brent Vopat
  • Patent number: 8777610
    Abstract: For a simplified method for heating a pre-warmed muffle used for dental ceramics in a dental furnace, wherein a saving of time in heating before the pressing and also a parallel heating of the muffles should be made possible, the following steps are suggested: a) heating of the muffle to a maximal temperature (Tmax), which is above the pressing temperature (Tpress), in which pressing is carried out, b) possibly keeping the muffle at a maximal temperature (Tmax) during a first pause (t-1), c) cooling of the muffle to a minimal temperature (Tmin), which is at most as high as the pressing temperature (Tpress), and d) keeping the muffle at a minimal temperature (Tmin) during a second pause (t2). In addition, a corresponding control device for the dental furnace and a furnace equipped with this kind of control device are produced.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: July 15, 2014
    Assignee: Zubler Geratebau GmbH
    Inventor: Kurt Zubler
  • Patent number: 8779334
    Abstract: An integrated apparatus able to condition a dry low-temperature environment in a baking process includes a baking unit, a drying unit, and at least a dry air introducing part. The baking unit has a heating unit to heat a first room at a baking period. The drying unit includes a dryer for dehumidifying a second room thereof at a dry low-temperature environment-conditioning period by providing the second room a dry low-temperature air. The dry air introducing part located between the first room and the second room is to separate the first room and the second room at the baking period, and to introduce the dry low-temperature air from the second room to the first room at the dry low-temperature environment-conditioning period.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: July 15, 2014
    Assignee: Ace Dragon Corp.
    Inventor: Min-Jen Tsao
  • Patent number: 8772682
    Abstract: Methods and apparatus for controlling the temperature of multi-zone heater in a process chamber are provided herein. In some embodiments, a method is provided to control a multi-zone heater disposed in a substrate support, wherein the multi-zone heater has a first zone and a second zone. In some embodiments, the method may include measuring a current drawn by the first zone at a first time; measuring a voltage drawn by the first zone at the first time; calculating the resistance of the first zone based upon the measured current and voltage drawn by the first zone at the first time; determining a temperature of the first zone based upon a predetermined relationship between the resistance and the temperature of the first zone; and adjusting the temperature of the first zone in response to the temperature determination.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: July 8, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Hari Kishore Ambal, Uwe Paul Haller, Jianhua Zhou
  • Patent number: 8748780
    Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 10, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Shouken Moro, Yasuhiro Takaki, Masatoshi Kaneda
  • Patent number: 8742298
    Abstract: The invention relates to a dental firing or press furnace (10) that enables the production of at least one dental restoration part (62). The dental firing or press furnace is provided with a firing space (12) that is heatable with the aid of a heating device (22), preferably, a resistance heating device. A heat-conducting element (50) having a specific thermal conductivity of at least 100 W/mK is arranged on the floor of the firing space (12).
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: June 3, 2014
    Assignee: Ivoclar Vivadent AG
    Inventor: Rudolf Jussel
  • Publication number: 20140113237
    Abstract: The invention relates to a dental furnace comprising a firing hood equipped with a heating device that is movably supported for the opening and closing of the dental furnace relative to a base intended for receiving a dental restoration part, and further comprising a heat detection device that is directed towards an area above the base, in particular towards one or more dental restoration parts, and further comprising a control or regulating device for the dental furnace that is coupled to the heat detection device, wherein the heat detection device is configured as a thermal imaging camera (30) which is directed towards the area above the base while the firing hood (12) is partially or completely opened, and which feeds an at least two-dimensional image in the form of a matrix of the one or more inserted dental restoration parts (60) to the control or regulating device and/or to a muffle (26) that is intended for the generation of the dental restoration parts (60).
    Type: Application
    Filed: December 20, 2013
    Publication date: April 24, 2014
    Inventors: Gottfried ROHNER, Rudolf JUSSEL
  • Patent number: 8698048
    Abstract: A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: April 15, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Alexander N. Lerner, Blake Koelmel, Mehran Behdjat
  • Patent number: 8698049
    Abstract: Embodiments of a lamphead and apparatus utilizing same are provided. In some embodiments, a lamphead for thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage, wherein the at least one heat transfer member extends into each coolant passage up to the full height of each coolant passage. The lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: April 15, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Joseph M. Ranish, Khurshed Sorabji, Kedarnath Sangam, Alexander Lerner
  • Patent number: 8692161
    Abstract: An infrared firing furnace includes a case-integrated cooling system to provide high performance cooling as the first step in the cooling process. The cooling system includes a cooling manifold integrated into, and made from, the same case material as the adjacent firing zone. As the cooling system is made from the same material as the rest of the case, it can handle being exposed to higher temperatures. The cooling system is positioned such that the plane of its outlet is at a specific clearance level relative to the product passing underneath. High pressure cooling jets of air are directed downward toward the products as they pass under the cooling manifold in order to quickly bring the temperature of the products down from the much higher firing temperature, and minimize the dwell time of the product at the higher temperature.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: April 8, 2014
    Assignee: BTU International, Inc.
    Inventors: Timothy R Doherty, Derek J Butland
  • Patent number: 8669496
    Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: March 11, 2014
    Assignee: Mattson Technology, Inc.
    Inventor: Paul Janis Timans
  • Patent number: 8658947
    Abstract: A method and apparatus for thermally processing a substrate is provided. In one embodiment, a method for thermally treating a substrate is provided. The method includes transferring a substrate at a first temperature to a substrate support in a chamber, the chamber having a heating source and a cooling source disposed in opposing portions of the chamber, heating the substrate to a second temperature during a first time period while the substrate is disposed on the substrate support, heating the substrate to a third temperature during a second time period while the substrate is disposed on the substrate support, and cooling the substrate in the chamber to a fourth temperature that is substantially equal to the second temperature during the second time period.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: February 25, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Khurshed Sorabji, Alexander N. Lerner
  • Patent number: 8658945
    Abstract: A apparatus and method of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP). An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. The front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. The wafer is thermally monitored for temperature and reflectivity from the side of the reflector. When the lamps are above the wafer, an edge ring supports the wafer in its edge exclusion zone. Alternatively, a reactor includes upwardly directed lamps and a reflector above and facing the front side of the wafer.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: February 25, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Wolfgang Aderhold, Sundar Ramamurthy, Aaron Hunter
  • Patent number: 8629376
    Abstract: An oven rack is received in an oven above a lower surface of the chamber and having a bake element mounted in the chamber either above or below the lower surface. The oven rack is configured to support cooking ware on one of the lower surface of the oven chamber or on rack shelf portions provided in sidewalls of the chamber. The rack includes a first portion having a substantially planar top surface, a second portion having a substantially planar lower surface spaced from the top surface and it is also configured to support the rack in one of the rack shelf portions or on the lower surface of the oven chamber. First and second walls extend between these first and second portions whereby the walls have a first dimension slightly greater than a height from the bottom surface of the oven chamber to a top of the bake element when the bake element is mounted above the lower surface.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 14, 2014
    Assignee: General Electric Company
    Inventors: Srinivasa Palla, Philip Barber, Michael Gallant, Jonathan Sprigler
  • Patent number: 8624165
    Abstract: When a semiconductor wafer is preheated by halogen lamps, the temperature of a peripheral portion of the semiconductor wafer is lower than that of a central portion thereof. A laser light emitting part disposed immediately under the center of the semiconductor wafer is rotated about the center line of the semiconductor wafer, while laser light is directed from the laser light emitting part toward the peripheral portion of the semiconductor wafer. Thus, the irradiation spot of the laser light exiting the laser light emitting part swirls around along the peripheral portion of the back surface of the semiconductor wafer so as to draw a circular trajectory. As a result, the entire peripheral portion of the semiconductor wafer at a relatively low temperature is uniformly heated. This achieves a uniform in-plane temperature distribution of the semiconductor wafer.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: January 7, 2014
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Tatsufumi Kusuda, Toshiaki Aotani, Shinji Miyawaki
  • Patent number: 8624167
    Abstract: A device for making a muffle, with which dental restoration parts can be produced with the aid of an embedding compound, at least one press blank and a pressing device, the device having a muffle base, a tubular sleeve surrounding the muffle base and at least one muffle insert which is arranged on the muffle base and can be separated from it. At least two cylindrical press-channel forming elements (16, 18, 20) extend parallel to one another and spaced apart from one another from a flat-formed portion of the muffle insert (12), which can be burned out at least with respect to the forming elements, which elements are formed in a closed manner, and in particular with thin walls, at least on one free end face opposite from the flat-formed portion (14).
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: January 7, 2014
    Assignee: Ivoclar Vivadent AG
    Inventor: Diethard Bertsch
  • Patent number: 8618446
    Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a substrate support surface and a shaft; an RF electrode disposed in the substrate support proximate the substrate support surface to receive RF current from an RF source; a heater disposed proximate the substrate support surface to provide heat to a substrate when disposed on the substrate support surface, the heater having one or more conductive lines to provide power to the heater; a thermocouple to measure the temperature of a substrate when disposed on the substrate support surface; and a conductive element having an interior volume with the one or more conductive lines and the thermocouple disposed through the interior volume, the conductive element coupled to the RF electrode and having an electric field of about zero in the interior volume when RF current is flowed through the conductive element.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: December 31, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Yu Chang, Gwo-Chuan Tzu, Anqing Cui, William W. Kuang, Olkan Cuvalci
  • Patent number: 8618442
    Abstract: A nozzle housing assembly, which is used in a convection heating furnace for a heat treatable glass sheet. The nozzle housing assembly comprises an elongated enclosure, at least one elongated heating resistance in the enclosure for heating convection air, and orifices in a bottom surface of the enclosure for blasting heated convection air against the glass sheet. The enclosure is divided with a flow-throttling partition into a top supply duct and a bottom nozzle box, the heating resistances being housed in the latter. Flow-throttling openings present in the partition are positioned to comply with the location and shape of the heating resistances.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: December 31, 2013
    Assignee: Glaston Services Ltd. Oy
    Inventor: Mikko Rantala
  • Patent number: 8610033
    Abstract: A rapid thermal process reactor includes a vessel having a dome assembly. The vessel bounds a reactor chamber for rapid thermal processing of one or more substrates. The dome assembly includes a low profile dome and a flange surrounding and abutting the low profile dome. The flange includes a top surface; a bottom surface, removed from and opposite the top surface; an outer circumferential edge surface connecting the top surface and the bottom surface; and an inner edge surface, opposite and removed from said outer circumferential edge, including a portion abutting said low profile dome. The rapid thermal process reactor also includes a radiant heat source; a gas ring mounted about a sidewall of the vessel; a gas ring shield mounted as part of the sidewall of the vessel; a clamp ring to clamp the dome assembly in place; and a clamp ring shield mounted on the clamp ring.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: December 17, 2013
    Assignee: Moore Epitaxial, Inc.
    Inventors: Gary M. Moore, Katsuhito Nishikawa, Steven C. Beese
  • Patent number: 8591224
    Abstract: A substrate processing apparatus includes heat treatment apparatus blocks each comprised of stacked heat treatment apparatuses HP each having temperature adjustment mechanism 70 configured to be able to move a substrate to a heating mechanism and adjust the temperature of the substrate, and includes a cooling liquid supply mechanism 81 that supplies a cooling liquid set for a predetermined temperature to be supplied for each of the heat treatment apparatus blocks HPB, a supply mechanism 99 which branches the cooling liquid supplied from cooling liquid supply mechanism 81 and supplies the cooling liquid to each temperature adjustment mechanism 70 of heating mechanisms in one of the heat treatment apparatus blocks.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: November 26, 2013
    Assignee: Tokyo Electron Limited
    Inventor: Kim Dong-Hun
  • Patent number: 8581153
    Abstract: A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table 3, in which a heater 6a, 6b is disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heater 6a, 6b or information about a measured temperature of the substrate table 3, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: November 12, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Chino, Satoshi Gomi, Koichi Miyashita, Minoru Nagasawa, Yoshie Eda
  • Patent number: 8582963
    Abstract: Apparatus and methods for detecting substrate warping during RTP processing are provided. In one embodiment, one or more beams of light are provided above and across the substrate being processed. In this embodiment, the amount of beam blockage correlates to the amount of substrate warping. In another embodiment, a beam of light is reflected off of a substrate during processing. In this embodiment, the amount of movement of the beam correlates to the amount of substrate warping. In yet another embodiment, a region of a substrate is illuminated during processing. In this embodiment, images of the illuminated region are analyzed to determine the amount of substrate warping.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: November 12, 2013
    Assignee: Applied Materials, Inc.
    Inventor: Jiping Li
  • Patent number: 8552346
    Abstract: Methods and apparatus for controlling the temperature of multi-zone heater in a process chamber are provided herein. In some embodiments, a method is provided to control a multi-zone heater disposed in a substrate support, wherein the multi-zone heater has a first zone and a second zone. In some embodiments, the method may include measuring a current drawn by the first zone at a first time; measuring a voltage drawn by the first zone at the first time; calculating the resistance of the first zone based upon the measured current and voltage drawn by the first zone at the first time; determining a temperature of the first zone based upon a predetermined relationship between the resistance and the temperature of the first zone; and adjusting the temperature of the first zone in response to the temperature determination.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: October 8, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Hari Kishore Ambal, Uwe Paul Haller, Jianhua Zhou
  • Patent number: 8536492
    Abstract: A method and apparatus for rapid thermal annealing comprising a plurality of lamps affixed to a lid of the chamber that provide at least one wavelength of light, a laser source extending into the chamber, a substrate support positioned within a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber. A method and apparatus for rapid thermal annealing comprising a plurality of lamps comprising regional control of the lamps and a cooling gas distribution system affixed to a lid of the chamber, a heated substrate support with magnetic levitation extending through a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: September 17, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Sundar Ramamurthy, Andreas G. Hegedus, Randhir Thakur
  • Patent number: 8536491
    Abstract: A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system is provided that includes a plurality of rotatable heaters arranged and operative to heat the chamber. In one embodiment, spacing between the sidewall heaters is adjustable. The heating system controls temperature variations within the chamber and promotes uniform film deposit thickness on the wafers.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: September 17, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zin-Chang Wei, Hsin-Hsien Wu, Chun-Lin Chang
  • Patent number: 8525418
    Abstract: An electrostatic chuck including a metal base having a through hole; a ceramic body covering the through hole; a suction electrode provided in the ceramic body; and a heating element provided in the ceramic body. A projection region defined by projecting the through hole toward the ceramic body is differentiated from an outer region which is determined by magnifying the projection region at a similarity ratio of three while setting an areal center of gravity of the projection region as a center of similarity, but excluding an interior of the projection region. Furthermore, the heating element is arranged such that a heating value per unit area in the projection region is 50% or less of a heating value per unit area in the outer region.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: September 3, 2013
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Naotoshi Morita, Ryosuke Kameyama
  • Publication number: 20130186877
    Abstract: A vacuum oven or vacuum furnace is disclosed having a heat distribution sleeve that conforms to the shape of an interior heating chamber. The heat distribution sleeve may be of generally annular shape, like a ring, and located in a substantially regularly spaced and offset relationship from a heating element located within walls adjacent the interior heating chamber. The heat distribution sleeve includes a thermal conductive material which absorbs and re-radiates heat emitted from the heating element, thereby providing more consistent and regular radiation fields for heating treating a work piece that is loaded on a work holding tray and, upon the vacuum oven being in an operational position, the work piece is located within the furnace chamber.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Inventors: Daniel F. Serrago, James D. Emmons
  • Patent number: 8487220
    Abstract: A vacuum oven or vacuum furnace is disclosed having a heat distribution sleeve that conforms to the shape of an interior heating chamber. The heat distribution sleeve may be of generally annular shape, like a ring, and located in a substantially regularly spaced and offset relationship from a heating element located within walls adjacent the interior heating chamber. The heat distribution sleeve includes a thermal conductive material which absorbs and re-radiates heat emitted from the heating element, thereby providing more consistent and regular radiation fields for heating treating a work piece that is loaded on a work holding tray and, upon the vacuum oven being in an operational position, the work piece is located within the furnace chamber.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: July 16, 2013
    Inventors: Daniel F. Serrago, James D. Emmons
  • Patent number: 8476560
    Abstract: A thermal processing furnace comprises: a tubular heat insulation member 4 surrounding a processing vessel 3 for receiving and thermally processing an object to be processed w; a heating resistor 5 helically arranged on an inner circumferential surface of the heat insulation member 4; and a support member 13 disposed on the inner circumferential surface of the heat insulation member 4, the support member 13 supporting the heating resistor 5 such that the heating resistor 5 can be thermally expanded and thermally shrunk. The thermal processing furnace further comprises: a movement prevention member 15 disposed on the heating resistor 5 to be in contact with one side surface of the support member 13 so as to prevent a downward movement of the heating resistor 5.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: July 2, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Kobayashi, Kenichi Yamaga, Ken Nakao
  • Patent number: 8470092
    Abstract: A method (and structure) of thermally treating a magnetic layer of a wafer, includes annealing, for a predetermined short duration, a magnetic layer of a single wafer.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: June 25, 2013
    Assignee: International Business Machines Corporation
    Inventors: Ulrich Karl Klostermann, Wolfgang Raberg, Philip Trouilloud
  • Publication number: 20130153561
    Abstract: The invention relates to a dental firing or press furnace (10) that enables the production of at least one dental restoration part (62). The dental firing or press furnace is provided with a firing space (12) that is heatable with the aid of a heating device (22), preferably, a resistance heating device. A heat-conducting element (50) having a specific thermal conductivity of at least 100 W/mK is arranged on the floor of the firing space (12).
    Type: Application
    Filed: February 28, 2012
    Publication date: June 20, 2013
    Applicant: IVOCLAR VIVADENT AG
    Inventor: Rudolf Jussel
  • Publication number: 20130146580
    Abstract: A heater unit includes a power source, a plurality of heaters, and a power supply position-switching device. The power source includes a first power source terminal and a second power source terminal. The plurality of heaters are each connected to one another in series and include a first heater and a second heater. The power supply position-switching device is configured to switch between a first state and a second state. In the first state, the first power source terminal is connected with a first heater terminal of the first heater, and the second power source terminal is connected with a third heater terminal of the second heater. In the second state, the first power source terminal is connected with a second heater terminal of the first heater, and the second power source terminal is connected with a fourth heater terminal of the second heater.
    Type: Application
    Filed: December 4, 2012
    Publication date: June 13, 2013
    Applicant: IBIDEN CO., LTD.
    Inventor: Ibiden Co., Ltd.
  • Patent number: 8459816
    Abstract: A lighting device for an oven having an oven muffle defining an oven muffle chamber is provided. The lighting device includes one light source configured for illuminating the muffle chamber and one partition for separating the light source from the muffle chamber. The lighting device also includes insulation material disposed between the partition and the at least one light source.
    Type: Grant
    Filed: September 12, 2006
    Date of Patent: June 11, 2013
    Assignees: BSH Bosch und Siemens Hausgeraete GmbH, Bayerisches Zentrum für Angewandte Energieforschung e.V.
    Inventors: Hans-Peter Ebert, Werner Körner, Martin Meier, Michaela Reim, Helmut Weinlälader
  • Patent number: 8457479
    Abstract: A rapid thermal processing apparatus comprises a processing chamber which subjects a semiconductor substrate to rapid thermal processing. A substrate support part is arranged in the processing chamber and supports the substrate. A lamp part optically irradiates the substrate supported by the substrate support part and heats the substrate. A thermo sensor is provided to measure a temperature of the substrate. A temperature computing part computes the temperature of the substrate based on an output signal of the thermo sensor. A control part controls an irradiation intensity of the lamp part according to the temperature computed by the temperature computing part. In this apparatus, the control part is provided to correct a control parameter of the irradiation intensity of the lamp part based on a measured reflectivity of a surface of the substrate.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: June 4, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventor: Tomohiro Kubo
  • Patent number: 8455293
    Abstract: A method for processing solar cells comprising: providing a vertical furnace to receive an array of mutually spaced circular semiconductor wafers for integrated circuit processing; composing a process chamber loading configuration for solar cell substrates, wherein a size of the solar cell substrates that extends along a first surface to be processed is smaller than a corresponding size of the circular semiconductor wafers, such that multiple arrays of mutually spaced solar cell substrates can be accommodated in the process chamber, loading the solar cell substrates into the process chamber; subjecting the solar cell substrates to a process in the process chamber.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: June 4, 2013
    Assignee: ASM International N.V.
    Inventors: Chris G. M. de Ridder, Klaas P. Boonstra, Adriaan Garssen, Frank Huussen
  • Patent number: 8450657
    Abstract: A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, a substrate support opposing the temperature controlled support base and configured to support the substrate, and one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature. An erosion resistant thermal insulator disposed between the temperature controlled support base and the substrate support, wherein the erosion resistant thermal insulator includes a material composition configured to resist halogen-containing gas corrosion.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: May 28, 2013
    Assignee: Tokyo Electron Limited
    Inventor: Yuji Tsukamoto
  • Patent number: 8450658
    Abstract: An output-history storing unit stores past and present measurement data input to a measurement-data input unit while distinguishing the measurement data for each of output sources. An output-fluctuation monitoring unit monitors, based on the measurement data stored in the output-history storing unit, output fluctuation in each of the output sources. An output control unit separately controls, based on the output fluctuation monitored by the output-fluctuation monitoring unit, outputs from the output sources.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: May 28, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Masaki Kamimura
  • Patent number: 8404499
    Abstract: Embodiments of the present invention pertain to substrate processing equipment and methods incorporating light emitting diodes (LEDs) for thermally processing substrates. Such light sources offer a variety of advantages including higher efficiency and more rapid response times. Pulse widths are selectable down to under a millisecond but can be for long pulses up to and exceeding a second. LEDs are preferable to tungsten-halogen lamps even in circumstances that allow longer processing times, since LEDs produce light with greater than 50% efficiency and tungsten-halogen lamps operate with less than 5% efficiency.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: March 26, 2013
    Assignee: Applied Materials, Inc.
    Inventor: Stephen Moffatt
  • Patent number: 8383990
    Abstract: A chilled arm that transports a substrate to and from a heating plate for performing a heating process on the substrate is formed with a flow passage pipe therein, and cools the entire holding area thereof opposed to the substrate held by the chilled arm to a predetermined reference temperature by supplying circulating cooling water through the flow passage pipe. Six polyimide heaters are affixed to the holding area to control the temperature of at least a portion of the holding area at a temperature different from the reference temperature. These two temperature control mechanisms intentionally provide a temperature distribution to the holding area to thereby provide an intentional temperature distribution to the substrate before and after the heat treatment by the heating plate. This reduces the nonuniformity of a temperature distribution which typically occurs in the heating plate to accomplish a uniform heat treatment throughout the heat treatment process step.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: February 26, 2013
    Assignee: Sokudo Co., Ltd.
    Inventors: Akihiko Morita, Kenichi Oyama, Koji Nishi
  • Patent number: 8372684
    Abstract: The method and system for selenization in fabricating CIS and/or CIGS based thin film solar cell overlaying cylindrical glass substrates. The method includes providing a substrate, forming an electrode layer over the substrate and depositing a precursor layer of copper, indium, and/or gallium over the electrode layer. The method also includes disposing the substrate vertically in a furnace. Then a gas including a hydrogen species, a selenium species and a carrier gas are introduced into the furnace and heated to between about 350° C. and about 450° C. to at least initiate formation of a copper indium diselenide film from the precursor layer.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: February 12, 2013
    Assignee: Stion Corporation
    Inventors: Robert D. Wieting, Steven Aragon, Chester A. Farris, III
  • Patent number: 8367550
    Abstract: A conductive layer may be fabricated on a semiconductor substrate by loading a silicon substrate in to a chamber whose inside temperature is at a loading temperature in the range of approximately 250° C. to approximately 300° C., increasing the inside temperature of the chamber from the loading temperature to a process temperature, and sequentially stacking a single crystalline silicon layer and a polycrystalline silicon layer over the silicon substrate by supplying a silicon source gas and an impurity source gas in to the chamber, where the chamber may be, for example, a CVD chamber or a LPCVD chamber.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: February 5, 2013
    Assignee: SK Hynix Inc.
    Inventors: Jong Bum Park, Chun Ho Kang, Young Seung Kim
  • Patent number: 8367983
    Abstract: Methods and apparatus for processing substrates and measuring the temperature using radiation pyrometry are disclosed. A reflective layer is provided on a window of a processing chamber. A radiation source providing radiation in a first range of wavelengths heats the substrate, the substrate being transparent to radiation in a second range of wavelengths within the first range of wavelengths for a predetermined temperature range. Radiation within the second range of wavelength is reflected by the reflective layer.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: February 5, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Joseph M. Ranish, Aaron M. Hunter, Blake R. Koelmel, Bruce E. Adams
  • Patent number: 8357878
    Abstract: An ultraviolet (UV) LED-based lamp for UV curing lamp assemblies is disclosed. An array of UV emitting LEDs are packaged together and arranged along the length of a cylindrical lens to form a UV LED-based optical component assembly. The UV LED-based optical component assembly may be made to be modular. A UV LED lamp assembly may comprise a plurality of UV LED-based optical component assemblies arranged around a workpiece tube. The workpiece tube may be filled with an inert gas and may be made of quartz or glass. One or more curved back reflectors may be placed opposite the LED UV LED-based optical component assemblies to collect UV light escaping the workpiece tube and refocus the light to the other side of the workpiece. The UV LEDs may be arranged on a single surface or a multi-level tiered platform.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: January 22, 2013
    Assignee: Fusion UV Systems
    Inventors: Darrin Leonhardt, Charles H. Wood, Pradyumna K. Swain
  • Patent number: 8346068
    Abstract: Disclosed is a substrate rotating and oscillating apparatus for a rapid thermal process (RTP), that oscillates an oscillation plate using an oscillation motor moved by an elevating unit. Rotational shafts of the oscillation motor comprise lower and upper center rotational shafts mounted on a central axis of the motor, and an eccentric shaft mounted between the lower and the upper center rotational shafts as deviated from the central axis. An oscillation cam is mounted to the eccentric cam. The oscillation plate has an oscillation hole for inserting the oscillation cam therein. A bearing is mounted between the oscillation cam and the eccentric shaft such that the oscillation cam rotates independently from the eccentric shaft. The oscillation plate supports the whole multipole-magnetized magnetic motor or maglev motor. Accordingly, the substrate can be uniformly heated by both rotating and all-directionally oscillating the substrate.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: January 1, 2013
    Assignee: Asia Pacific Systems Inc.
    Inventors: Jang Woo Shim, Sang Seok Lee, Woon Ki Cho, Jun Her
  • Patent number: 8341819
    Abstract: Embodiments of the invention provide a thermal processing system and methods for uniformly heating and/or cooling a semiconductor wafer. Embodiments of the invention may be applied to provide a more uniform temperature profile when processing 300 mm and larger wafers having different curvature profiles that occur at the same and/or different points in a manufacturing cycle. Wafer curvature can be dependent on the number and thickness of the metal layers.
    Type: Grant
    Filed: July 1, 2012
    Date of Patent: January 1, 2013
    Assignee: Tokyo Electron Limited
    Inventor: Andrew Wallmueller
  • Patent number: 8334481
    Abstract: A mounting table body made of ceramic includes power-receiving conductor portions and buried therein. A surface of mounting table body is formed with a recessed connection hole and a connection terminal electrically jointed to the power-receiving conductor portion and exposed into the connection hole, the connection terminal being made of a high-melting-point metal, an alloy thereof or a compound thereof. A power-feeding line member provided with a power-feeding connector portion is inserted at its leading end portion into the connection hole to feed electricity to the power-receiving conductor portion. A stress relaxing member is interposed between the connection terminal and the power-feeding connector portion. The stress relaxing member and the connection terminal are jointed together by a brazing material. The stress relaxing member is made of a metal free from cobalt and nickel or an alloy thereof.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: December 18, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Tomohito Komatsu, Hirohiko Yamamoto, Daisuke Toriya
  • Patent number: 8328942
    Abstract: In one of the many embodiments, an apparatus for processing a substrate is provided which includes a substrate processing chamber where the substrate is positioned within the substrate processing chamber so the substrate at least partially separates the substrate processing chamber into a first chamber and a second chamber. The apparatus further includes a first chamber inlet configured to input a first fluid of a first temperature into the first chamber at a first pressure and a second chamber inlet configured to input a second fluid of a second temperature into the second chamber at a second pressure wherein the first pressure and the second pressure are substantially equal. The second temperature is capable of being utilized to manage substrate temperature.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: December 11, 2012
    Assignee: Lam Research Corporation
    Inventors: Ben Mooring, John Parks, Diane J. Hymes
  • Patent number: 8294068
    Abstract: Embodiments of a lamphead and apparatus utilizing same are provided herein. In some embodiments, a lamphead for use in thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage. In some embodiments, the lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
    Type: Grant
    Filed: September 10, 2008
    Date of Patent: October 23, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Joseph M. Ranish, Khurshed Sorabji, Kedarnath Sangam, Alexander Lerner
  • Patent number: 8283607
    Abstract: Methods and apparatus for processing substrates and measuring the temperature using radiation pyrometry are disclosed. A reflective layer is provided on a window of a processing chamber. A radiation source providing radiation in a first range of wavelengths heats the substrate, the substrate being transparent to radiation in a second range of wavelengths within the first range of wavelengths for a predetermined temperature range. Radiation within the second range of wavelength is reflected by the reflective layer.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: October 9, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Joseph M. Ranish, Aaron M. Hunter, Blake R. Koelmel
  • Patent number: 8283606
    Abstract: A substrate stage includes a stage upon which a wafer is placed, a heater element installed within the stage, an upright support that ranges upright from a bottom of a processing chamber and includes a tubular member that includes a small tube portion, a large tube portion and a middle portion attached to and joins the small tube portion and the large tube portion to one another, an outer heat shield plate disposed so as to surround the outer side of the small tube portion and an inner heat shield plate. The outer heat shield plate and the inner heat shield plate are disposed so that an inner edge of the outer heat shield plate and an outer edge of the inner heat shield plate overlap along the entire circumference.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: October 9, 2012
    Assignee: Tokyo Electron Limited
    Inventor: Daisuke Hayashi