Abstract: A system for forming a hollow modular candle filter includes: a first filter portion having at least one open end; a hollow second filter portion having at least one open end; a sleeve configured to fit within the open end of the first filter portion and the open end of the second filter portion; and an adhesive configured to bind the sleeve to each of the first filter portion and the second filter portion.

Abstract: A method of making a motor having a shaft; a pair of end plates arranged to be spaced apart from each other on the shaft; a magnet disposed between the pair of end plates; and a rotor case which surrounds the outer peripheries of the pair of end plates and the outer periphery of the magnet and is made of a synthetic resin material, wherein each of the pair of end plates includes: a flange part, one surface of which faces the magnet; and a cylinder part protruding in a direction opposite to the magnet from the flange part, and the flange part includes a tapered part having an outer diameter which decreases toward the cylinder part.

Abstract: The present disclosure relates to a lithium secondary battery having improved safety. In the lithium secondary battery, the property of a bimetal bent in one direction at high temperature under an abnormal operating condition is used to cause a disconnection between an electrode tab and an electrode lead and to increase the internal resistance of a unit cell, thereby improving the safety of a lithium secondary battery.

Abstract: Dual alloy Gas Turbine Engine (GTE) rotors and method for producing GTE rotors are provided. In one embodiment, the method include includes arranging bladed pieces in an annular grouping or ring formation such that shank-to-shank junctions are formed between circumferentially-adjacent bladed pieces. A first or bonding alloy is deposited along the shank-to-shank junctions utilizing a localized fusion deposition process to produce a plurality of alloy-filled joints, which join the bladed pieces in a bonded blade ring. The bonding alloy is preferably selected to have a ductility higher than and a melt point lower than the alloy from which the bladed pieces are produced. After deposition of the first alloy and formation of the alloy-filled joints, a hub disk is inserted into the central opening of the bonded blade ring. The hub disk and blade ring are then bonded utilizing, for example, a Hot Isostatic Pressing process.

Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.

Abstract: Bladed Gas Turbine Engine (GTE) rotors including deposited transition rings are provided, as are embodiments of methods for manufacturing bladed GTE rotors. In one embodiment, the method includes providing an outer blade ring having an inner circumferential surface defining a central opening, and depositing a deposited transition ring on the inner circumferential surface of the outer blade ring. The outer blade ring can be a full bladed ring or an annular grouping of individually-fabricated bladed pieces. After deposition of the transition ring, a hub disk is inserted into the central opening such that the transition ring extends around an outer circumferential surface of the hub disk. The transition ring is then bonded to the outer circumferential surface of the hub disk utilizing, for example, a hot isostatic pressing technique to join the transition ring and the outer blade ring thereto.

Abstract: A method for depositing a layer includes repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (A) placing the deposition target in a chamber, (B) providing a non-oxidizing gas atmosphere or a vacuum atmosphere in the chamber, (C) depositing the layer on the deposition target by a cold spray process in the non-oxidizing gas atmosphere or the vacuum atmosphere, and (D) heat treating the deposition target after the depositing.

Abstract: An exhaust pipe flange with an exhaust gas pipe and with a flange plate fastened to the exhaust gas pipe, wherein the flange plate has an inner side which can be turned toward a cylinder head with a sealing surface which can be placed directly or indirectly against a cylinder head, and a seat in which the exhaust gas pipe is received. The exhaust gas pipe is joined to the flange plate and sealed in the region of the seat on the inner side by a welded connection.

Abstract: Dual alloy turbine rotors and methods for manufacturing the same are provided. The dual alloy turbine rotor comprises an assembled blade ring and a hub bonded to the assembled blade ring. The assembled blade ring comprises a first alloy selected from the group consisting of a single crystal alloy, a directionally solidified alloy, or an equi-axed alloy. The hub comprises a second alloy. The method comprises positioning a hub within a blade ring to define an interface between the hub and the blade ring. The interface is a non-contacting interface or a contacting interface. The interface is enclosed by a pair of diaphragms. The interface is vacuum sealed. The blade ring is bonded to the hub after the vacuum sealing step.

Abstract: A motor assembly includes two cap bodies, a stator body, a rotor body and a fixing mechanism. Each cap body has a bearing holder and a plurality of positioning portions radially extended from the bearing holder. Each bearing holder has a bearing received. A shaft passes through a center part of the rotor body, and two ends of the shaft sleeved in the two bearings respectively. The stator body has a plurality of stator units aligned around an outer periphery of the rotor body. Under this arrangement, the stator units of the stator body is axially sandwiched by the positioning portions of the two cap bodies, and the stator body and the two cap bodies are fixed together via the fixing mechanism. The motor assembly simplifies the coil winding procedure for the stator body, so that the manufacturing costs of the stator body and the motor assembly are significantly reduced.

Abstract: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material.

Abstract: A method of manufacturing an electronic component module and the electronic component module manufactured by the manufacturing method includes bumps, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness and formed on one surface of the substrate. When looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on a side of a corresponding outer terminal closer to a center of the electronic component and the thinner portion is positioned on the opposite side of the corresponding outer terminal. In the plan view, joining portions joining the outer terminals respectively to the bumps are formed such that a height of each joining portion on the opposite side is lower than a height of the joining portion on the side closer to the center of the electronic component.

Abstract: The present application includes a rotor blade having an erosion protective coating, the coating being a cermet material configured to protect against erosion during the operation of the rotor blade. Further, the present application includes a method of selectively applying the erosion protective coating, a method of selectively repairing/reapplying the erosion protective coating, and a process of developing an erosion surface model map of an optimized erosion protective coating pattern and thickness.

Abstract: A process for manufacturing a one-piece axisymmetric part includes: superposition, around a rotating cylindrical mandrel of at least respectively inner and outer metal-coated composite fibrous structures, wound in first and second crossed directions on the mandrel; arranging, between the crossed inner and outer fibrous structures, at least one layer of metallic wire; then placing a blank of the part, formed by the fibrous structures and the layer of metallic wire, in a tool to apply to the blank a hot isostatic pressing treatment, and to obtain the part.

Abstract: An axle assembly with a banjo beam and a coverpan. The banjo beam has an upper and lower beam members that are welded together to define a central carrier portion and a pair of tubes. The upper beam member has a pair of upper spring seats that are disposed on opposite sides of the central carrier portion. The lower beam member has a pair of lower spring seats that are disposed on opposite sides of the central carrier portion. The coverpan includes a weld flange and a cover portion. The weld flange is welded to the central carrier portion via a fillet weld to close a first aperture formed in the central carrier portion. The cover portion includes a wall member into which a pair of strengthening protrusions are formed. The strengthening protrusions are disposed on opposite lateral sides of a centerline of the central carrier portion.

Abstract: A dissimilar material joint is formed by arranging a plurality of joint segments consecutively in a longitudinal direction. Each joint segment is formed by joining and integrating together a first member, an intermediate member, and a second member by explosive welding. A groove is formed in a joint end face of each joint segment, the joint end face being joined to another one of the segments, the groove spacing apart an end face of the first member and an end face of the second member from each other in a stacking direction. In the dissimilar material joint, the end faces of the respective first members of the joint segments that are adjacent to each other are joined together by welding, and the end faces of the respective second members of the joint segments that are adjacent to each other are joined together by welding.

Abstract: A weld joint (30) having asymmetric sides and providing reduced restraint of weld metal shrinkage and a reduced propensity for weld centerline cracking. The weld joint may have a first side (38) formed at an angle (A1) of 35-60° relative to the component surface (36), and a second side (40) formed at an angle (A2) of 10-35° relative to the surface. The sides may be extended to intersect (44) without the necessity for a flat bottom surface (20) as is typical for prior art weld joints (10). The inventive weld joint may be formed by moving an end mill tool (60) into and along the surface with its axis of rotation (64) being transverse to the surface.

Abstract: A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can be nanocopper, which can be either push/pull into the holes on the electronic board or a combination of push and pull. The push/pull can be performed by using a mechanical device or by a person. A capping layer can be on both side of the via. The vias formed by using the nanomaterials provides a high efficient vertical heat transferring path from one side of the electronic board to the other side of the electronic board.

Abstract: A brazing method is disclosed. The brazing method includes providing a substrate, providing at least one groove in the substrate, providing a support member, positioning the support member over the at least one groove in the substrate, providing a braze material, applying the braze material over the support member to form an assembly, and heating the assembly to braze the braze material to the substrate. Another brazing method includes providing a preform, providing a wire mesh, pressing the wire mesh into the preform, heating the preform to form a braze material including the wire mesh, providing a substrate, providing at least one groove in the substrate, applying the braze material over the at least one groove in the substrate, then brazing the braze material to the substrate.

Abstract: A method for making a projection on a metal panel includes providing a lower die having a recess in the shape of the desired projection, laying the metal panel atop the lower die, positioning a filler material atop the metal panel, and lowering an upper die onto the filler material so that the filler material is forced into the metal panel and in turn forces the metal panel into the recess of the lower die whereby a projection is formed and the projection is filled with the filler material.

Abstract: A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI includes a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A solder ball is over the PPI. A compound includes a portion adjoining the solder ball and the polymer layer, wherein the compound includes flux and a polymer.

Abstract: An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.

Abstract: A method of attaching two wafers in a seismometer comprising the steps of forming a patterned wetting metal layer on a first wafer and forming a plurality of cavities mirroring the pattern of the wetting metal layer on the first wafer. The steps further include pouring a plurality of solder balls on the surface of an alignment wafer, pouring off excess solder balls, aligning the first wafer with the alignment wafer, and connecting the first wafer with the alignment wafer. The solder balls are immobilized on the wetting metal layer by performing a partial reflow onto the wetting metal layer and removing the alignment wafer. The first and second wafers are aligned so that each solder ball is immobilized between the first and second wafer. The wafers are then bonded together.

Abstract: Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: An apparatus includes a slider structure having a waveguide and a cavity configured to align a laser to the waveguide. The cavity includes a plurality of solder bumps on a bottom of the cavity configured to electrically and thermally couple the laser to the slider. At least one mechanical stopper is disposed in the cavity to facilitate vertical alignment between an output of the laser and an input of the waveguide. At least one solder bump is disposed on the mechanical stopper to facilitate lateral alignment between the output of the laser and the input of the waveguide in response to a reflow of the solder bumps.

Abstract: A cathodic protection device enclosing a reference cell and a conductive media and having two coupon assemblies mounted, facing opposing direction, on an exterior surface thereof is disclosed. The coupon assemblies each have a disc-shaped coupon seated in a coupon jacket and are electrically coupled to a wire. The coupon jacket is generally patch-sized and defines a pocket in a first surface and a groove in a second, opposing surface thereof. The disc-shaped coupon is seated in the pocket and the wire is seated in the groove with the electrical junction therebetween aligned with an aperture connecting the pocket to the groove. A sealing material is used to form a watertight seal between the disc-shaped coupon and the pocket and fills the groove. The device includes a hydrophilic porous member having a first surface in communication with the conductive media and a second surface in communication with an external environment.

Abstract: A novel method for attaching a hosel to a putter head is disclosed. A hosel having a hole is inserted into a putter head cavity and the cavity and hole in the hosel are filled with a fixative configured to permanently attach the hosel shaft to the putter head.

Abstract: Methods of forming coreless package structures comprising backside land side capacitors (LSC) and dual sided solder resist are described. Those methods and structures may include forming a nickel coating on a first and second side of a core, forming a conductive plating on the nickel coating, forming building up layers on the conductive plating to form two panels on the core, de-paneling the panels from the core to form two coreless substrates, forming a laminate on the first and second sides of the coreless substrates, and forming an LSC on a backside of the coreless substrates.

Abstract: A oscillator device includes: a first substrate that has a first surface, a second surface, and a through hole extending between the first surface and the second surface; a crystal oscillator that is disposed on the first surface of the first substrate, the crystal oscillator including an electrode; a second substrate that is disposed on the crystal oscillator; a through electrode that is disposed in the through hole, that has a diameter smaller than a diameter of the through hole, that is electrically coupled to the electrode, and that extends between the first surface and the second surface; and a filling member with which an area between an inner wall of the through hole and the through electrode is filled.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

Abstract: There are provided a plate welding-type anchor channel that is buried when concrete is poured at the time of constructing a building to fix various external installations to a concrete structure later, and a method for the same. The anchor channel includes a stem plate (40) and an anchor head plate (50) that are coupled to be fixed, and can further improved anchorage performance as compared to the related art and to easily produce products of various standards. As a configuration of the plate welding-type anchor channel, a lower end (42) of the stem plate (40) of an anchor (30) is coupled to a top surface (24) of a channel (20) through welding to have a length (L1) in a direction perpendicular to the top surface (24) of the channel (20). Further, the anchor head plate (50) has a predetermined length (L2) and width (w2), and an upper end (44) of the stem plate (40) is coupled to a bottom surface (52) through welding to be perpendicular to a length (L1) direction of the stem plate (40).

Abstract: A railing support post with threaded holes or receivers for receiving threaded hardware, such as might be used for tensioned cable railing. A decorative sleeve or post cover may be used to at least partially enclose the railing support post. The railing support post may be manufactured, for example, by providing an elongated member of a prescribed length, drilling a plurality of holes spaced along the length of the elongated member, and tapping the plurality of holes to form a plurality of threaded receivers. The threaded receivers are configured to receive rail fittings or other fittings.

Abstract: A thermocompression bonding structure includes a first member and a second member having a linear expansion coefficient different from that of the first member; and metal fine particles interposed between the first and second members as a bonding material to thermocompression bond the two members. The two members are disposed to apply thermal stress generating between the first member and the second member as pressurizing force on a bonding surface between the two members, and to increase temperature to thermocompression bond the first member and the second member.

Abstract: A method of joining a plurality of parts to form a unitary body. At least two sintered parts are provided. At least one of the sintered parts has at least one internal channel. Each of the parts is formed of a hard metal composition of material. The at least two sintered parts are assembled into the shape of a unitary body. Each of the at least two sintered parts has a joining surface and when each joining surface is brought into contact the surfaces form a bonding interface therebetween. The assembled parts are subjected to a vacuum or gas atmosphere, without the application of external pressure, and to a temperature sufficient to fuse the at least two sintered parts together at the bonding interface to form the unitary body.

Abstract: A method of joining a plurality of parts to form a unitary body. At least two sintered parts are provided. At least one of the sintered parts has at least one internal cavity. Each of the parts is formed of a hard metal composition of material. The at least two sintered parts are assembled into the shape of a unitary body. Each of the at least two sintered parts has a joining surface and when each joining surface is brought into contact the surfaces form a bonding interface therebetween. The assembled parts are subjected to a vacuum or gas atmosphere, without the application of external pressure, and to a temperature sufficient to fuse the at least two sintered parts together at the bonding interface to form the unitary body.

Abstract: Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Abstract: A method of forming a fully consolidated joint between first and second components comprising the steps of forming a slot in the first component; inserting at least part of the second component into the slot; inserting a powder material into the slot; heating the powder material to form a pressure tight skin; and applying hot isostatic pressure to the pressure tight skin to form a fully consolidated joint. Also a method of repairing a component.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A method of manufacturing turbine engine casings having at least one boss includes, in one exemplary embodiment, forming an engine casing having an outer wall, machining a tapered opening through the casing outer wall, and machining a tapered portion in a metal plug where the tapered portion is sized to mate with the tapered opening in the casing outer wall. The method also includes inserting the metal plug into the tapered opening in the casing outer wall, and welding the metal plug to the casing.

Abstract: A chip bonding structure at least includes a first substrate, a second substrate opposite to the first substrate, and a copper bonding structure sandwiched in between the first and the second substrates. A Cu—Cu bonding interface is within the copper bonding structure and is characterized with combinations of protrusions and recesses, and the copper crystallization orientation at one side of the Cu—Cu bonding interface is different from that at another side.

Abstract: Nickel-base radiant tube includes straight and curved elbow tube sections. The straight tube section has constant inner and outer radii. The elbow tube section has a constant inner radius and variable outer radius. The inner diameter of the elbow tube section is equal the inner radius of the straight tube section. Mating end portion of the elbow tube section has an outer radius equal to the outer radius of the straight tube section. Method for making the radiant tube comprises the steps of positioning a mating end portion of the straight tube section adjacent to and aligned with the mating end portion of the elbow tube section so that end faces of the straight and elbow tube sections face each other to define a circumferentially extending weld groove, and butt welding the mating end portions of the straight and elbow tube sections together at the weld groove.

Abstract: A substrate structure having a component-disposing area and a process thereof are provided. The substrate structure having a component-disposing area includes a core layer, a first dielectric-layer, a laser-resistant metallic-pattern and a second dielectric-layer. The core layer includes a first surface, a component-disposing area and a patterned metallic-layer disposed on the first surface and including multiple pads, and the pads are located within the component-disposing area. The first dielectric-layer is disposed on the core layer and includes multiple openings to respectively expose the pads. The laser-resistant metallic-pattern is disposed on the first dielectric-layer and surrounds a projection area of the first dielectric-layer which the component-disposing area is orthogonally projected on.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.

Abstract: A plurality of conductor bars are positioned within slots of a laminated electric steel disc stack, and the ends of the conductor bars are brazed to end rings to manufacture a rotor. The method includes inserting the conductor bars into the slots of the disc stack, providing the end rings with slots for receiving the ends of the conductor bars; positioning spacers of braze material adjacent each end of each of the conductor bars to create a gap between the end rings and the steel disc stack; and applying heat to melt the braze material of the spacers whereby braze material is furnished by the spacers of braze material to braze the first and second ends of the conductor bars to the first and second end rings. Channels are provided in the face of the end rings facing the steel disc stack to drain away excess braze material.

Abstract: A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and the conductive pattern and having an opening portion exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening portion of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern and the portion of the interlayer insulation layer exposed through the opening portion of the solder-resist layer, and a bump structure formed in the opening portion of the solder-resist layer such that the bump structure is formed on the metal layer in the opening portion of the solder-resist layer.

Abstract: A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and conductive pattern and having opening exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern exposed through the opening of the solder-resist layer, and a bump formed in the opening of the solder-resist layer such that the bump is on the metal layer in the opening of the solder-resist layer. The opening of the solder-resist layer has space formed with side surface of the bump, inner wall of the solder-resist layer and the portion of the interlayer insulation layer in the opening of the solder-resist layer.

Abstract: A braze joint is made between two workpieces by first forming a thermal shrink fit region between the two workpieces adjacent to, or around, a braze or filler region in which a filler metal is located adjacent to, or within. The filler metal is suitably heated so that it flows in the braze or filler region to form the braze joint of the two workpieces. Cutouts may be formed in the thermal shrink fit region adjacent to the braze or filler region to extend the braze joint region or provide paths for gas byproducts in the brazing process.

Abstract: A printed circuit board is disclosed. The printed circuit board includes a solder mask area and at least one chip attachment area. The at least one chip attachment area has an isolation solder mask layer such that the chip attachment area forms a plurality of chip sub-attachment areas to reduce an area of a solder paste smeared on the chip attachment area, and the isolation solder mask layer has at least one hole.

Abstract: To produce pretinned strips of connectors for PV cells, a metal foil (30) is guided through a roll gap (46) of a rolling mill in which at least one work roll (48) has a surface with a corrugated structure with the result that a corrugated structure which has crests or peaks and troughs is embossed into at least one side of the metal foil (30), soldering tin in the form of solder preforms (54) is applied to the side of the metal foil (30) with the embossed corrugated structure, wherein the soldering flux necessary for pretinning has been applied in advance to the solder preforms or the metal foil, the solder preforms (54) are connected to the metal foil (30) or applied to it and melted on and the pretinned metal foil (30) with the embossed corrugated structure is separated into parallel ribbons. The solder preforms (54) are sufficiently thick for the corrugated structure to be at least full after the solder preforms (54) have been melted on.

Abstract: Various embodiments of the disclosure include a component, methods of forming components, and methods of cooling components. In some embodiments, a component is disclosed including: a body; a microchannel extending through a portion of the body; a thermal barrier coating (TBC) covering a portion of the microchannel; and a marker member extending from the microchannel through the TBC or from an end of the microchannel, the marker member indicating a location of the microchannel in the body.