Forming Channel, Groove, Or Aperture For Reception Of Filler Material Patents (Class 228/165)
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Publication number: 20100258537Abstract: Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.Type: ApplicationFiled: April 9, 2009Publication date: October 14, 2010Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.Inventors: David R. Sigler, James G. Schroth, Xiaohong Q. Gayden, Yen-Lung Chen
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Publication number: 20100254858Abstract: Patterned layers including height control features are stacked and bonded to form microchannels in a micro-fluidic device. The heights of the microchannels are determined by the height control features of the patterned layers. Side walls of the microchannels are partially formed or completely formed by the height control features. Layers are bonded together with a bonding agent disposed between the layers and outside the microchannels near the microchannel side walls. This approach provides numerous significant advantages. Material consumption can be reduced by up to 50%. Mass production can be made easier. Lateral dimensions of microchannels can be more readily controlled. Erosion of the bonding agent by flow through the microchannels can be greatly reduced.Type: ApplicationFiled: November 13, 2008Publication date: October 7, 2010Inventors: Prawin Paulraj, Brian K. Paul
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Patent number: 7757928Abstract: A system and method of forming a continuous strip from a plurality of strips, each strip having a leading end and a trailing end. Embodiments can include a forming apparatus that chamfers at least one of the leading and trailing ends of each strip. The chamfered trailing ends may then be positioned against chamfered leading ends of successive ones of the plurality of strips. Once a leading end and a trailing end are positioned against one another, a first welding apparatus may weld on a first side, from above, the trailing and leading ends positioned against each other to form weld joints. Once at least two strips have been welded together, the strips can constitute the continuous strip. An inverting apparatus can then invert the continuous strip and weld joints. The inversion of the weld joints can be done so as not to create a reverse bend in the continuous strip. A second welding apparatus can then weld on a second side opposite the first side, from above, the inverted weld joints to form weld junctions.Type: GrantFiled: December 21, 2007Date of Patent: July 20, 2010Assignee: Welspun Gujarat Stahl Rohren, Ltd.Inventors: Balkrishan Goenka, Braja Mishra, Prasantakumar Mukherjee
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Publication number: 20100170937Abstract: Systems and methods are disclosed for joining two or more parts together via cold spraying. In one embodiment, a first part and second part may be aligned together to create a joint. The parts are joined by cold spraying a material on the first metal part and the second metal part to create a bond at the joint.Type: ApplicationFiled: January 7, 2009Publication date: July 8, 2010Applicant: General Electric CompanyInventor: Eklavya Calla
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Patent number: 7743499Abstract: A method to produce a catalytic bed is initiated by forming apertures in a predetermined pattern on a strip or segment of thin foil. A pattern of desired channels is formed into the apertured foil, for example, as a herringbone pattern. The patterned foil is heat treated, and the surfaces of the foil are provided with at least one washcoat and at least one catalyzed coat, and cured. Cured foil in strip form is rolled into a multi-layer coil, or cured foil in segment form is stacked in multiple segment layers, to produce a desired geometric shape of the catalytic bed. The channels between layers of foil are offset in each successive layer to preclude channel nesting. The offset channels and apertures provide turbulent longitudinal and radial flow of a desired material throughout the catalytic bed.Type: GrantFiled: December 20, 2004Date of Patent: June 29, 2010Inventors: William H Pettit, Gerald E Voecks
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Publication number: 20100134996Abstract: An integrated circuit package comprising at least two printed circuit boards each comprising a substrate coated with metallic layers on both sides and having plated through-holes for electrical and thermal connection to the metallic layers, at least two of the printed circuit boards being diffusion-bonded at an interface between their respective metallic layers, the bonded metallic layers forming an hermetic seal between the opposed external surfaces of the integrated circuit package.Type: ApplicationFiled: December 2, 2009Publication date: June 3, 2010Applicant: THALES HOLDINGS UK PLCInventor: Emmanuel Loiselet
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Patent number: 7726023Abstract: In order to create titanium components with a titanium composite insert, a method is provided whereby an initial pre form 1 has a groove 2 formed in it. An encapsulating member 4 is then provided about the groove 2 in order to create a cavity 5 which is filled with titanium alloy powder 6. This titanium alloy powder 6 is densified and then accurately machined in order to create a groove insert form 7 which can accommodate a titanium composite material pre form insert 8 and further titanium alloy powder 9 such that through a high temperature isostatic pressing (HIP) process, the insert 8 is embedded. The original component form 1 can then be machined in order to create the final component elements such as aerofoils 13.Type: GrantFiled: June 15, 2006Date of Patent: June 1, 2010Assignee: Rolls-Royce PLCInventor: John Gareth Pursell
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Publication number: 20100129255Abstract: A method of forming a fully consolidated joint between first and second components comprising the steps of forming a slot in the first component; inserting at least part of the second component into the slot; inserting a powder material into the slot; heating the powder material to form a pressure tight skin; and applying hot isostatic pressure to the pressure tight skin to form a fully consolidated joint. Also a method of repairing a component.Type: ApplicationFiled: May 23, 2008Publication date: May 27, 2010Applicant: ROLLS-ROYCE PLCInventors: Wayne E. Voice, Thomas P. Jarvis, Junfa Mei
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Publication number: 20100086739Abstract: A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Applicant: International Business Machines CorporationInventors: Russell A. Budd, Bing Dang, William S. Graham, Peter Alfred Gruber, Richard Levine, Da-Yuan Shih
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Publication number: 20100038123Abstract: A board unit includes an electronic component having electrodes; a printed circuit board that has board electrodes each disposed at a position corresponding to a respective one of the electrodes, and that mounts thereon the electronic component; recesses each arranged from the center of a respective one of the board electrodes toward the inside thereof; and joining members that are filled in the respective recesses, and that project from the respective board electrodes upon being heated.Type: ApplicationFiled: July 9, 2009Publication date: February 18, 2010Applicant: FUJITSU LIMITEDInventor: Takahiro KITAGAWA
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Patent number: 7650964Abstract: An arrangement of parts having a first part in the form of sheet metal which is in contact with the second part along an edge and is fixedly connected to the second part via at least one weld. To reduce stress peaks at the ends of welds, the first part has a slot in a section adjacent to the respective end of the weld, the slot beginning at the edge and extending to its end with a curved profile a curve bent by at least 180° up to its end.Type: GrantFiled: April 2, 2007Date of Patent: January 26, 2010Assignee: J. Eberspaecher GmbH & Co. KGInventor: Arnulf Spieth
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Patent number: 7617605Abstract: In a method for reducing “blow-out” of annular welds for attaching components in a fuel injector, a relief region is formed on radially-facing surfaces of the components. The relief region is adjacent to a press-fit region. The components are then pressed together, and a weld is made in the relief region. A sealed gap is thereby formed in the relief region between the weld and the press-fit region. The sealed gap provides for the expansion of trapped gases that could otherwise “blow out” the liquid weld bead.Type: GrantFiled: June 15, 2006Date of Patent: November 17, 2009Assignee: Continental Automotive Systems US, Inc.Inventors: James Paul Fochtman, Jack David Oliver
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Patent number: 7600666Abstract: The present invention is a low heat energy input repair system. The system utilizes a V-shaped feedstock that conforms to the shape of grooves in damaged parts. The V-shape of the feedstock conforms closely to the damaged region of various components and reduces the heat input needed to bond the surfaces. The repair system is deployable onsite, at a military depot, industrial manufacturing facility or other location where a mobile repair system would be beneficial. The present system provides onsite, in-situ, low heat input repair of wear, fatigue and corrosion cracks, or impact surface damage of large components. The present invention is particularly useful for components with thin walls and results in low distortion.Type: GrantFiled: May 27, 2003Date of Patent: October 13, 2009Inventor: Joshua E. Rabinovich
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Publication number: 20090220818Abstract: The object is to provide a functional composite material which is adaptable to environmental changes. The present invention provides a method for producing a functional composite material comprising a step wherein an insert layer is formed on a first metal substrate having a groove; a step wherein a piezoelectric fiber having a metal core is placed on the first metal substrate; and a step wherein a second metal substrate and the first metal substrate are hot-pressed. The present invention can provide a functional composite material which is adaptable to environmental changes.Type: ApplicationFiled: March 2, 2006Publication date: September 3, 2009Inventors: Hiroshi Asanuma, Naohiro Takeda, Hiroshi Sato
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Publication number: 20090179066Abstract: A method of forming a container having a lid and a container body which define an inside space, and a material containing an organic compound provided in the inside space. The method includes forming a groove and a communication member for communicating the groove with an outside space, in at least one of the lid and the container body, providing the material in the inside space, welding the lid and the container body to each other, and exhausting the organic compound vaporized by welding heat to the outside space through the groove and the communication member.Type: ApplicationFiled: January 22, 2009Publication date: July 16, 2009Applicant: CANON KABUSHIKI KAISHAInventors: Hirofumi Fujii, Mitsuo Nishimura
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Patent number: 7516548Abstract: A method of manufacturing a fibre reinforced metal matrix composite article, the method comprising placing metal coated (18) fibers (14) between a first metal ring (30) and a second metal ring (36). Each of the metal-coated (18) fibres (14) having a glue (22) to hold the metal-coated (18) fibers (14) in position. A solvent is supplied to the glue (22) on the metal-coated (18) fibers (14) to soften the glue (22) and pressure is applied to allow the metal-coated (18) ceramic fibers (14) to become more closely packed. Thereafter the glue (22) is removed and the metal coated (18) fibers (14) and first and second metal rings (30, 36) are consolidated and diffusion bonded together.Type: GrantFiled: November 16, 2004Date of Patent: April 14, 2009Assignee: Rolls-Royce plcInventor: Edwin S Twigg
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Patent number: 7480992Abstract: The present invention is a cooling plate including a groove, which becomes a passage of a coolant, inside a body, wherein one or more fins are provided inside the groove, wherein the groove is covered with a lid having width larger than the groove, wherein the lid is joined to the body by friction stir welding, and wherein a weld bead formed by: the joining is outside the passage, and the weld bead formed by the joining is formed within the body and further, is characterized by a manufacturing method of a cooling plate that has a first groove, which becomes a passage of a coolant, and a second groove, which has width larger than the first groove and receives a lid on the first groove, inside a body, receives the lid on the second groove, and is joined to the body, the manufacturing method of a cooling plate wherein, while the lid and the body are joined together by the friction stir welding owing to insertion of a-rotation tool having a shoulder and a pin, the joining is performed so that a weld bead formed bType: GrantFiled: March 29, 2007Date of Patent: January 27, 2009Assignees: Hitachi, Ltd., HItachi Cable, Ltd.Inventors: Kazutaka Okamoto, Masayuki Doi, Hisanori Okamura, Yasuhisa Aono, Manabu Kagawa, Satoshi Hirano, Kinya Aota
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Patent number: 7478742Abstract: A method for producing a brazed joint having at least one of a metal/ceramic joint and a ceramic/ceramic joint. The method includes forming bores in at least one ceramic surface to be brazed, and the bores have an average diameter of greater than 550 ?m. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.Type: GrantFiled: October 15, 2004Date of Patent: January 20, 2009Assignee: EADS SPACE Transportation GmbHInventors: Steffen Beyer, Stephan Schmidt, Jan Hauptmann, Gunter Kirchhoff, Erich Lugscheider
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Patent number: 7467741Abstract: A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.Type: GrantFiled: October 21, 2003Date of Patent: December 23, 2008Assignee: Cabot CorporationInventors: Charles E. Wickersham, Jr., David P. Workman
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Patent number: 7438523Abstract: A blade for a turbine engine is described, having a base body, made from a titanium alloy, with a first and a second component piece, which are connected in the connection region by means of a bonding process. A groove with a groove wall runs through the connection region, to prevent local concentration of tension, such that the above borders directly on the second component piece and forms therewith a connection angle greater than 70 degrees.Type: GrantFiled: July 24, 2002Date of Patent: October 21, 2008Assignee: Siemens AktiengesellschaftInventors: Ursula Pickert, Iris Oltmanns, legal representative, Peter Tiemann, incapacitated
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Publication number: 20080230587Abstract: A method for manufacturing electrical connections in wafer is provided. A plurality of openings is formed on the upper surface of a wafer by dry etching or laser drilling and then solder paste is applied to the openings. Next, the wafer is positioned in a vacuum environment and is heated to soften the solder paste. Subsequently, the vacuum is suddenly broken to have the pressure upon the upper surface of the wafer greater than that in the openings thereby pressing the molten solder paste into the openings.Type: ApplicationFiled: March 11, 2008Publication date: September 25, 2008Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Hsueh An Yang
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Publication number: 20080213612Abstract: Improved methods of bonding solid materials include a step of fabricating a micro-column array (MCA) on at least one surface to be bonded. The MCA formation process can be modified to cause and/or prevent chemical alteration of the surface being treated or to deposit a coating on the surface. In a preferred embodiment, the MCA is fabricated by laser treating the surface, such as by laser ablation.Type: ApplicationFiled: August 10, 2007Publication date: September 4, 2008Inventors: David Starikov, Abdelhak Bensaoula
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Publication number: 20080185713Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.Type: ApplicationFiled: April 3, 2008Publication date: August 7, 2008Inventors: Ashay A. Dani, Sabina J. Houle, Christopher L. Rumer, Thomas J Fitzgerald
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Publication number: 20080166585Abstract: A method for welding to a superalloy material without causing cracking of the material. The method includes the steps of depositing a weld strip (18) of a weldable material onto a superalloy substrate material (12) using a spray deposition process (20) and then forming a weldment (26) to the weld strip. None or a controlled amount of the substrate material (12) is melted during the weld in order to maintain the concentration of strengthening elements in the local melt within a zone of weldability. The spray deposition process may be a thermal process such as HVOF or a cold spray process. A groove (16) may be formed in a surface (10) of the superalloy substrate material to receive the weld strip. A diffusion heat treatment step may be used to improve adhesion between the weld strip and the superalloy material.Type: ApplicationFiled: January 4, 2007Publication date: July 10, 2008Inventors: David B. Allen, Allister W. James, David W. Hunt
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Patent number: 7373857Abstract: A composite metal article from two dissimilar metals is prepared. A metal base is comprised of a first metal and having first and second opposing surfaces and a least one longitudinally-positioned depression in each of the first and second opposing surfaces for receiving a wire. An elongated metal element comprised of a second metal is introduced into each of the at least one first and second depressions of the metal base to form a composite assembly, and the composite assembly is heated under pressure to urge the adjacent surfaces of the second metal elements and the depressions together to form a bonded article.Type: GrantFiled: July 29, 2002Date of Patent: May 20, 2008Assignee: William Engineering LLCInventors: Paul Armand Dion, Gregg Anthony Dion
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Patent number: 7132173Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.Type: GrantFiled: June 27, 2003Date of Patent: November 7, 2006Assignee: Advanced Bionics CorporationInventor: Jay Daulton
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Patent number: 7121586Abstract: A frame assembly for a motor vehicle comprises a forward module and a rearward module. The forward module comprises a pair of forward side rail portions, which are interconnected by a cross portion. The forward side rail portions are angularly disposed with respect to one another such that they have an increasing distance therebetween as they extend rearwardly. Rearward ends of the forward side rail portions are connected to associated forward ends of the rearward side rail portions. At least one of the forward and rearward side rail portions has a notch formed therein permitting an end portion thereof to be bent laterally to permit interface with the associated side rail portion connected thereto. The end portion is then bent back and is welded to the associated side rail portion connected thereto.Type: GrantFiled: January 10, 2002Date of Patent: October 17, 2006Assignee: Magna International Inc.Inventor: John T. McNally
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Patent number: 7051917Abstract: Preparation of a weld between a structural I-beam end and a beam-to-column attaching end component wherein no beam flange material is removed to participate in the creation of a weld trough. Instead, the space for a weld trough is created in the end component, and this trough is prepared with enough all-over length to establish run-on and run-off regions for molten weld material, which regions extend laterally outwardly from the opposite transverse ends of a flange. Full-section welds between a beam's flanges and the attaching end component are achieved without the need to use any run-on and run-off tabs, and also without the need to employ any traditionally-used backing bars.Type: GrantFiled: November 3, 2003Date of Patent: May 30, 2006Inventor: Robert J. Simmons
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Patent number: 7047640Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.Type: GrantFiled: March 1, 2005Date of Patent: May 23, 2006Assignee: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
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Patent number: 6966188Abstract: The present invention provides a plate-like body connecting method in which functions such that cooling capability is not reduced. There is provided a plate-like body connecting method for connecting at least two plate-like bodies each having passages that extend along at least one of opposite surfaces thereof and between the opposite surfaces, comprising the steps of disposing the plate-like bodies so that edges of the plate-like bodies are abutted with each other; connecting the plate-like bodies along the edges; forming a groove in the one surfaces of the plate-like bodies along the edges; and attaching a closure to and along the groove.Type: GrantFiled: August 1, 2002Date of Patent: November 22, 2005Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Norihide Hirota, Kazuyuki Kimura
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Patent number: 6960738Abstract: A method of connecting a metal (1) with a ceramic material (2) comprises the steps of providing a through-hole (3) in the ceramic material and positioning the metal (1) to be connected to the ceramic material (2) proximate to the ceramic material (2) with the through-hole (3). Subsequently, the metal (1) is melted (7) proximate to the through-hole (3). A pressure difference prevails between the side of the ceramic (2) remote from the metal and the side of the metal (1) remote from the ceramic material (2). A larger pressure prevails at the side of the metal (1) remote from the ceramic material (2). The pressure difference causes the melt (7) to be pressed into the through-hole (3) in the ceramic material (2). The through-hole (3) has such a shape that, after solidification, the solidified material (14) and the through-hole (3) have a complementary locking form.Type: GrantFiled: May 24, 2002Date of Patent: November 1, 2005Assignee: Koninklijke Philips Electronics N.V.Inventors: Johannus Wilhelmus Weekamp, Durandus Kornelius Dijken, Theodorus Johannes Maria Jacobus Van Gennip
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Patent number: 6951125Abstract: A system and method is disclosed for aligning an integrated circuit die on an integrated circuit substrate. A plurality of deposits of deformable material are placed on the substrate where the integrated circuit die is to be aligned. In one advantageous embodiment a stamping tool is indexed to a first tooling hole and to a second tooling hole in the substrate. The stamping tool imprints the deposits of deformable material to a tolerance of less than one hundred microns with respect to the first and second tooling holes. The imprinted portions of the deposits a form a pocket for receiving the integrated circuit die. This enables the integrated circuit die to be precisely aligned on the substrate in three dimensions.Type: GrantFiled: January 31, 2002Date of Patent: October 4, 2005Assignee: STMicroelectronics, Inc.Inventors: Harry Michael Siegel, Anthony M. Chiu
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Patent number: 6910618Abstract: A steel pipe is welded to a threaded connector that has an end with a desired nominal inner diameter. A swage is forced over an end of the pipe, reducing an outer diameter and an initial inner diameter of the end of the pipe. A die is then forced into the end of the pipe, the die having an outer diameter sized to increase the inner diameter of the end of the pipe to the nominal inner diameter of the end of the connector. A weld groove is machined on the end of the pipe and the ends are abutted and welded at the weld grooves.Type: GrantFiled: March 12, 2003Date of Patent: June 28, 2005Assignee: The Technologies Alliance, Inc.Inventor: Kevin Gendron
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Patent number: 6889889Abstract: A component which has a surface crevice or crack and contaminants on at least one face of the opening is welded. The weld is effected by first plastically deforming the surface of the component to close the surface opening to a predetermined depth less than the depth of the opening and contaminated faces defining the opening to form a sealed ligament. The sealed ligament leaves unclosed a portion of the crack below the sealed ligament. The closed surface is hermetically sealed by fusion-welding to a depth of penetration equal to or less than the predetermined depth of the sealed ligament to minimize or eliminate expulsion of contaminants in the sealed ligament.Type: GrantFiled: June 5, 2003Date of Patent: May 10, 2005Assignee: General Electric CompanyInventors: Henry P. Offer, Siamak Bourbour
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Patent number: 6845900Abstract: Methods of welding two pieces of metal to produce a weld joint having excellent fracture toughness are provided. Two pieces of metal are positioned for welding so as to form a narrow weld groove having two sidewalls with bevel angles of less than about 10°. Two or more layers are applied to the weld groove to produce the weld joint such that the heat-affected-zone of the weld joint is substantially free of rogue grains.Type: GrantFiled: May 19, 2003Date of Patent: January 25, 2005Assignee: ExxonMobil Upstream Research CompanyInventors: Douglas P. Fairchild, Ali M. Farah, Daniel B. Lillig
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Patent number: 6844522Abstract: An article suitable for laser-welded metallurgical bonding, the article having a first part having a lower surface, and a second part having an upper surface is disclosed. The lower surface of the first part is disposed at the upper surface of the second part to provide for a faying surface thereat. The faying surface has a plurality of channels with a depth equal to or greater than about 1 micron and equal to or less than about 1000 microns. The article is suitable for laser-welded metallurgical bonding at the faying surface. The plurality of channels has a repetitive pattern of channels arranged along a path of the faying surface in a direction of the metallurgical bonding action.Type: GrantFiled: May 4, 2004Date of Patent: January 18, 2005Assignee: General Motors CorporationInventors: Pei-Chung Wang, Hai-Lung Tsai, Louis G. Hector, Jr.
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Patent number: 6811073Abstract: A method for connecting conductive members includes a step of providing a first conductive member, a step of providing a second conductive member, and a step of jetting droplets of molten metal so as to form a connecting portion which electrically connects the first conductive member to the second conductive member.Type: GrantFiled: November 4, 2002Date of Patent: November 2, 2004Assignee: Yazaki CorporationInventors: Hitoshi Ohashi, Hitoshi Ushijima
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Patent number: 6799713Abstract: Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.Type: GrantFiled: September 3, 2003Date of Patent: October 5, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Joo-Hoon Lee, Duk-Yong Choi, Dong-Su Kim
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Patent number: 6793122Abstract: A method for the production of reinforced hollow sections with a continuous periphery. In order to provide in a simple manner, hollow sections with selective local reinforcement at points subject to high mechanical loads, an opening is formed in the periphery of the hollow section and a reinforcing plate is inserted into the opening, such that it at least projects into the hollow section. The reinforcing plate is then joined to the hollow section in the region of the edge of the opening.Type: GrantFiled: June 21, 2001Date of Patent: September 21, 2004Assignee: DaimlerChrysler AGInventor: Uwe Hardtke
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Patent number: 6786389Abstract: A method of manufacturing a fiber reinforced metal disc comprises forming an annular groove in an axial face of a first metallic ring. A plurality of metal coated fibers are arranged in spiral preforms and a plurality of metallic wires are arranged in spiral preforms. The metal coated fiber preforms and the metallic wire preforms are arranged in the groove. An annular projection is formed on an axial face of a second metallic ring. The annular projection on the second metallic ring is aligned with the annular groove in the first metallic ring. Heat and pressure is applied to axially consolidate the metal coated fiber preforms and metallic wire preforms and to bond the first metal ring, the second metal ring, and the preforms to form a unitary composite disc. The use of metal coated fibers and metallic wires allows the mechanical properties to be tailored.Type: GrantFiled: July 29, 2002Date of Patent: September 7, 2004Assignee: Rolls-Royce plcInventor: John G Pursell
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Patent number: 6774339Abstract: The interfacial joint area of a target/backing plate assembly is sealed so as to inhibit the migration of air and/or water vapor that may be present or trapped along the interfacial surfaces. A pool or bead of molten solder is placed along the interfacial joint and moved continuously around the full 360° circumference of the assembly so as to cover and seal the boundary area. The solder is melted, preferably, by e-beam welding in a vacuum or the like.Type: GrantFiled: August 19, 2002Date of Patent: August 10, 2004Assignee: Tosoh SMD, Inc.Inventors: David B. Smathers, Dorian Heimanson, Michael Gutkin
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Patent number: 6754945Abstract: A method of forming a stress isolating joint on a dump body of on an off-highway rubber-tired haulage vehicle includes providing a first plate having an elongated edge, a top side, and a face, and providing a second plate including an elongated edge. Overlapping the first and second plates to define a widened seam bounded at least in part by the elongated edges of the respective plates, and welding along the elongated edge of the first plate to join the elongated edge of the first plate to an adjacent surface of the second plate. The weld and at least a portion of the second plate disposed along the widened seam cooperate to permit the second plate to apply a resisting load to the face of the first plate in response to the application of a load against an opposing face of the first plate.Type: GrantFiled: March 27, 2003Date of Patent: June 29, 2004Inventors: Steven J. Fujan, William R. Borthick
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Publication number: 20040089699Abstract: Preparation of a weld between a structural I-beam end and a beam-to-column attaching end component wherein no beam flange material is removed to participate in the creation of a weld trough. Instead, the space for a weld trough is created in the end component, and this trough is prepared with enough all-over length to establish run-on and run-off regions for molten weld material, which regions extend laterally outwardly from the opposite transverse ends of a flange. Full-section welds between a beam's flanges and the attaching end component are achieved without the need to use any run-on and run-off tabs, and also without the need to employ any traditionally-used backing bars.Type: ApplicationFiled: November 3, 2003Publication date: May 13, 2004Inventor: Robert J. Simmons
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Patent number: 6725522Abstract: A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of male projections (8) are formed in one member (2) of the assembly with a plurality of corresponding female recesses (9) formed in the other member (4). The assembly is bonded by conventional techniques around the peripheral boundary (25) that surrounds the male and female portions (8,9). The assembly is then pressure consolidated at low temperature so that the projections (8), circumscribed by the bonded zone, are force fit into the female recesses (9).Type: GrantFiled: January 9, 2002Date of Patent: April 27, 2004Assignee: Tosoh SMD, Inc.Inventors: Eugene Y. Ivanov, Harry W. Conard
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Patent number: 6688000Abstract: In attempting to reduce deformity when joining vehicle frame components, a riveting/brazing process has been proposed. This process includes joining tubular members, such as hydroformed parts, by cutting at least one flange into one end of a first body member, shaped in conformance with the surface of a second body member. Location holes are formed into each flange as well as into the surface of the second member in suitable alignment with each other. A brazing filler material is fixed into a side of the flange, usually within a pocket, intending to lie on the surface of the second member when the two structures are attached. The flange(s) are initially attached to the surface of the second member by means of a rivet to formed an actual vehicle body assembly. Heat is then applied to the assembly to form a brazed T-joint.Type: GrantFiled: November 13, 2001Date of Patent: February 10, 2004Assignee: General Motors CorporationInventors: Pei-Chung Wang, Peter C. Sun, Chih-Chang Chen
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Publication number: 20030209589Abstract: A method for forming a channel within a coated, metal-based substrate is described. In one technique, a channel-forming material is first deposited on the substrate, followed by the deposition of a bonding agent, such as a braze. One or more coatings can then be applied over the substrate. In one embodiment, the channel is formed when the channel-forming material is subsequently removed. In another embodiment, the channel is formed due to the lack of adhesion between particular channel-forming materials and the overlying bonding agent. Related articles are also described, e.g., gas turbine components which include protective coatings and a pattern of cooling channels.Type: ApplicationFiled: May 7, 2002Publication date: November 13, 2003Applicant: General Electric CompanyInventors: Wayne Charles Hasz, Venkat S. Venkataramani, Ching-Pang Lee
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Patent number: 6631838Abstract: A method for fabricating a printed circuit board includes the steps of: fabricating a printed circuit board having at least one collapsed portion; depositing a first solder resist in the collapsed portion; exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time; coating a second solder resist on the entire surface of the printed circuit board; and drying and hardening the first and the second solder resists. With this method, when a solder resist is coated, since an air space does not remain in a blind via hole, the reliability of the attachment between a printed circuit board and the solder resist layer is increased.Type: GrantFiled: April 11, 2001Date of Patent: October 14, 2003Assignee: LG Electronics Inc.Inventors: Nam-Jin Kim, Young-Cheol Ahn, Won-Jae Kim
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Publication number: 20030178472Abstract: A steel pipe is welded to a threaded connector that has an end with a desired nominal inner diameter. Initially, the inner diameter of the steel pipe may be out of a tolerance range of the nominal inner diameter of the connector. A swage is forced over an end of the pipe, reducing an outer diameter and an initial inner diameter of the end of the pipe. The swage is dimensioned to provide the end of the pipe with an inner diameter that is less than the nominal inner diameter of end of the connector. A die is then forced into the end of the pipe, the die having an outer diameter sized to increase the inner diameter of the end of the first tubular member to the nominal inner diameter of the end of the second tubular member. A weld groove is machined on the end of the pipe and the ends are abutted and welded at the weld grooves.Type: ApplicationFiled: March 12, 2003Publication date: September 25, 2003Inventor: Kevin Gendron
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Patent number: 6599405Abstract: The method manufactures sputter target assemblies. It first includes the step of manufacturing a target insert. The target insert has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface. Then a backing plate is manufactured. The backing plate has a cylindrical recess that corresponds to the diameter of the target insert. The cylindrical recess has a depth less than the height of the target insert and a yield strength less than the yield strength of the target insert. Finally, pressing the target insert into the cylindrical recess of the backing plate bonds the target insert to the backing plate to form a target assembly. The pressed target assembly contains the target insert with the conical-shaped rear surface.Type: GrantFiled: May 30, 2001Date of Patent: July 29, 2003Assignee: Praxair S.T. Technology, Inc.Inventors: Thomas J. Hunt, Holger J. Koenigsmann, Paul S. Gilman
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Patent number: 6589671Abstract: A method for joining a first part to a second part wherein the first part comprises machine cast iron and the second part comprises case-hardened steel comprises abrading a surface on each of the parts which are to be welded together with a groove, fitting the abraded surfaces together to form a welding groove and high-energy beam welding within austenitic welding wire for joining the parts together.Type: GrantFiled: April 24, 2001Date of Patent: July 8, 2003Assignee: Steyr-Daimler-Puch Fahrzeugtechnik AG & Co. KGInventor: Oskar Kehrer